CN1690154A - Double component adhesive for double-ply board - Google Patents
Double component adhesive for double-ply board Download PDFInfo
- Publication number
- CN1690154A CN1690154A CN 200410023970 CN200410023970A CN1690154A CN 1690154 A CN1690154 A CN 1690154A CN 200410023970 CN200410023970 CN 200410023970 CN 200410023970 A CN200410023970 A CN 200410023970A CN 1690154 A CN1690154 A CN 1690154A
- Authority
- CN
- China
- Prior art keywords
- component
- double
- ply board
- add
- tackiness agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to an adhesive agent with bi-component used specifically for double boards, especially for boards of slate material and ceramic veneer. The invention includes component A and B, the former is modified epoxide resin, while the latter is curing agent that the subject is oligoamide. Some extender and diluents can be added in component A, and aliphatic ammonia curing agent, curing accelerator, coupling agent, extender, diluents, titanium dioxide and flexibilizer can be added in component B. The product by the invention is provided with fine water resistance, resistance to high temperature and low temperature, which can be used in the line process of slate material and ceramic veneer double boards.
Description
Technical field
The present invention relates to a kind of double-ply board special dual-component tackiness agent, particularly a kind of two component adhesive that is used for stone slab-ceramic double-ply board.
Background technology
Along with the development of construction industry and architectural decoration industry, more and more higher to the requirement of stone slab class, because lithotome has uniqueness, extremely people's favor.Be protection limited natural resource, CN94242441.7 discloses a kind of ultrathin decorative board that is bonded by marble, granite and enhancing plasterboard, thereby has proposed a kind of combined type product that can effectively utilize lithotome.CN97246141.8 discloses a kind of novel stone material composite decorating board subsequently, this decorative sheet mainly is composited by ceramic matrix and natural stone sheet material, use pottery to be ground, strengthened marmorean mechanical property, can save building stones more than 50%, reduce cost, improved value of exploiting and utilizing Nonrenewable resources.Above prior art does not all propose feasible technical scheme to adhesive layer.
CN02147833.3 discloses a kind of stone adhesive and preparation thereof, mainly is applicable to the splicing of stone material site operation.But fail to satisfy the requirement of stone material double-ply board process line, also fail to satisfy double-ply board and under 80～150 ℃ hot environment, use.
Summary of the invention
The objective of the invention is a kind of stone material double-ply board special dual-component tackiness agent of developing according to the requirement of stone material double-ply board process line, satisfied the needs of stone slab-ceramic double-ply board process line, the stone slab of its production-ceramic double-ply board can be satisfied with under 80～150 ℃ the hot environment and use.
The technical scheme that realizes the object of the invention is:
A kind of double-ply board special dual-component tackiness agent comprises A component and B component, it is characterized in that the A component is a modified epoxy, and the B component is that Versamid is the solidifying agent of main body.
Described A component and B component, the proportioning when it uses is: A component: B component=100: 25～100.The modified epoxy of described A component is the bisphenol A type epoxy resin of known various models, phenolic resin modified Resins, epoxy etc.
Described B component Versamid is known commodity 650,651 and 300 polymeric amide by name, 703, epoxy curing agent such as T-31, and consumption is 10～50% of a weight epoxy.
Can add a spot of aliphatics Ammonia solidifying agent in described B component, can be diethylenetriamine, triethylene tetramine, polyethylene polyamine, preferred triethylene tetramine, and its add-on is 5～15% of a weight epoxy.Can regulate curing speed.
Can add a spot of curing catalyst in described B component, can be various tertiary amine compounds, glyoxaline compound and carbamide compounds, and its add-on is 0.5～10% of a weight epoxy, preferred 1～2%.
Can add titanium dioxide in described B component, titanium dioxide can be anatase titanium dioxide or rutile-type, and add-on is 0～10% of a weight epoxy.Help improving the whiteness of tackiness agent.
Can add silane coupling agent and titanate coupling agent in described B component, wherein silane coupling agent can be commodity KH-550, KH-560 by name etc., and add-on is 5～10% of a weight epoxy.Be used to guarantee the water tolerance after constituent solidifies.
Described B component can add toughner, and add-on is 0～20% of a weight epoxy.Help improving bonding mechanical property.
In described A component and B component, can add filler respectively, the add-on of filler is 0～100% of a weight epoxy, preferred 20～50%, filler can be: one or more are compound for silicon oxide, kaolin, silica powder, talcum powder, potter's clay powder, silicon powder, aluminium powder, cenosphere, lime carbonate etc.The adding of filler can reduce cost significantly, and can improve heat resistance.
Can add thinner respectively in described A component and B component, add-on is 0～20% of a weight epoxy.Help strengthening the flowability of tackiness agent, improve workability.
The proportioning that contains of the present invention (weight in Resins, epoxy is 100 parts) is:
A component: B component:
Modified epoxy 100 Versamids 10～50
Filler 0～100 (preferred 20～50) aliphatics Ammonia solidifying agent 5～15
Thinner 0～20 curing catalyst 0.5～10 (preferred 1～2%)
Coupling agent 5～10
Filler 0～100 (preferred 20～50)
Thinner 0～20
Titanium dioxide 0～10
Toughner 5～10
Preparation method of the present invention mixes respectively by the raw material of above-mentioned various proportionings with A component and B component, obtains A component and B component, and press the A component during use: B component=100: 25～100 mixed get final product.
The stone slab that the present invention developed has excellent water tolerance, high temperature resistant and resistance to low temperature with-ceramic double-ply board special-purpose adhesive, can be applied to the production of stone slab and-ceramic double-ply board industrial flow-line.Product is through lab investigation, and main performance index is as follows:
| Embodiment one | Embodiment two | Embodiment three | |
| Compression shear strength (Mpa) | 8 (wood destructions) | 8 (wood destructions) | 8 (wood destructions) |
| 100 ℃ of 96h compression shear strengths of constant temperature oven (Mpa) | 7 (glue-line destructions) | 8 (wood destructions) | 8 (wood destructions) |
| Soak 24h compression shear strength (Mpa) in the room temperature water | 8 (wood destructions) | 8 (wood destructions) | 8 (wood destructions) |
| -40 ℃ of 30min～-150 of freeze thawing test ℃ 10 destruction situations of 30min circulation | There is not obscission | There is not obscission | There is not obscission |
Embodiment
Embodiment one:
By following proportioning (weight in Resins, epoxy is 100 parts) mix A component and B component.
A B component component
The Versamid 50 of commodity E-44 Resins, epoxy 100 commodity by name 650 by name
Filler 10 triethylene tetramines 8
Thinner 5 triethylamines (curing catalyst) 1.5
Commodity are called KH-550 silane coupling agent 5
Filler 20
Thinner 10
Titanium dioxide 5
Toughner 10
Press the A component during use: B component=100: 100 mixed.
Embodiment two:
By following proportioning (weight in Resins, epoxy is 100 parts) mix A component and B component
A B component component
The Versamid 30 of commodity E-51 Resins, epoxy 100 commodity by name 651 by name
Filler 10 triethylene tetramines 12
Commodity are called DMP-30 (curing catalyst) 2
Commodity are called KH-560 silane coupling agent 7.5
Filler 50
Thinner 20
Titanium dioxide 5
Press the A component during use: B component=100: 80 mixed.
Embodiment three:
By following proportioning (weight in Resins, epoxy is 100 parts) mix A component and B component.
A B component component
The Versamid 30 of commodity E-44 epoxy resins 100 commodity by name 651 by name
The epoxy hardener 10 of filler 15 commodity by name 703
Thinner 20 triethylene tetramines 5
Commodity are called DMP-30 (curing catalyst) 2
Commodity are called KH-560 silane coupling agent 7.5
Filler 30
Thinner 20
Titanium dioxide 6
Press the A component during use: B component=100: 75 mixed.
Claims (11)
1, a kind of double-ply board special dual-component tackiness agent comprises A component and B component, it is characterized in that the A component is a modified epoxy, and the B component is that Versamid is the solidifying agent of main body.
2, a kind of double-ply board special dual-component tackiness agent according to claim 1 is characterized in that described A component and B component, and the proportioning when it uses is: A component: B component=100: 25～100.
3, a kind of double-ply board special dual-component tackiness agent according to claim 1, the modified epoxy that it is characterized in that described A component is the bisphenol A type epoxy resin of known various models, phenolic resin modified Resins, epoxy etc.
4, a kind of double-ply board special dual-component tackiness agent according to claim 1, it is characterized in that described B component Versamid is known commodity 650,651 and 300 polymeric amide by name, 703, epoxy curing agent such as T-31, consumption is 10～50% of a weight epoxy.
5, a kind of double-ply board special dual-component tackiness agent according to claim 1, it is characterized in that in described B component, can adding a spot of aliphatics Ammonia solidifying agent, can be diethylenetriamine, triethylene tetramine, polyethylene polyamine, preferred triethylene tetramine, its add-on is 5～15% of a weight epoxy.
6, a kind of double-ply board special dual-component tackiness agent according to claim 1, it is characterized in that in described B component, can adding a spot of curing catalyst, can be various tertiary amine compounds, glyoxaline compound and carbamide compounds, its add-on is 0.5～10% of a weight epoxy, preferred 1～2%.
7, a kind of double-ply board special dual-component tackiness agent according to claim 1 is characterized in that can adding titanium dioxide in described B component, and titanium dioxide can be anatase titanium dioxide or rutile-type, and add-on is 0～10% of a weight epoxy.
8, a kind of double-ply board special dual-component tackiness agent according to claim 1, it is characterized in that in described B component, can adding silane coupling agent and titanate coupling agent, wherein silane coupling agent can be commodity KH-550, KH-560 by name etc., and add-on is 5～10% of a weight epoxy.
9, a kind of double-ply board special dual-component tackiness agent according to claim 1 is characterized in that described B component can add toughner, and add-on is 0～20% of a weight epoxy.
10, a kind of double-ply board special dual-component tackiness agent according to claim 1, it is characterized in that in described A component and B component, can adding filler respectively, the add-on of filler is 0～100% of a weight epoxy, preferred 20～50%, filler can be: one or more are compound for silicon oxide, kaolin, silica powder, talcum powder, potter's clay powder, silicon powder, aluminium powder, cenosphere, lime carbonate etc.
11, a kind of double-ply board special dual-component tackiness agent according to claim 1, its feature can add thinner respectively in described A component and B component, and add-on is 0～20% of a weight epoxy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410023970 CN1690154A (en) | 2004-04-28 | 2004-04-28 | Double component adhesive for double-ply board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410023970 CN1690154A (en) | 2004-04-28 | 2004-04-28 | Double component adhesive for double-ply board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1690154A true CN1690154A (en) | 2005-11-02 |
Family
ID=35345915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410023970 Pending CN1690154A (en) | 2004-04-28 | 2004-04-28 | Double component adhesive for double-ply board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1690154A (en) |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100391996C (en) * | 2006-06-29 | 2008-06-04 | 广州市东风化工实业有限公司 | Epoxy resin solidification agent and its preparation method |
| CN101845287A (en) * | 2010-05-10 | 2010-09-29 | 华烁科技股份有限公司 | Intermediate temperature-cured epoxy adhesive for coverlay of flexible printed circuit and preparation method thereof |
| CN102153977A (en) * | 2011-03-11 | 2011-08-17 | 中南林业科技大学 | Anti-seepage leak-stopping epoxy adhesive and preparation method thereof |
| CN102492386A (en) * | 2011-11-30 | 2012-06-13 | 东北林业大学 | Epoxy resin adhesive for binding polyethylene wood-plastic composite material |
| CN102807732A (en) * | 2012-05-07 | 2012-12-05 | 苏州市胶粘剂厂有限公司 | Plugging putty and preparation method thereof |
| CN102850986A (en) * | 2012-10-05 | 2013-01-02 | 王崇高 | Novel halogen-free flame retardant epoxy resin sealing glue |
| CN103113841A (en) * | 2012-12-07 | 2013-05-22 | 北京航天试验技术研究所 | Preparation method of strong-acid-resistant epoxy resin quick plugging agent |
| CN103409090A (en) * | 2013-06-05 | 2013-11-27 | 武汉市科达云石护理材料有限公司 | Epoxy caulk compound used in humid environment |
| CN101717609B (en) * | 2009-12-24 | 2014-03-26 | 北京北科双元涂料科技有限公司 | Anticorrosion glue tape for pipeline and preparation process |
| CN103756610A (en) * | 2013-05-13 | 2014-04-30 | 湖南柯盛新材料有限公司 | Double-component yellowing resistance epoxy resin adhesive and preparation method thereof |
| CN105037690A (en) * | 2015-06-17 | 2015-11-11 | 牛无畏 | Low-temperature epoxy resin curing agent and preparation method thereof |
| CN105086907A (en) * | 2015-09-30 | 2015-11-25 | 佛山市日丰企业有限公司 | Mildew-proof sealant and preparation method thereof |
| CN105238313A (en) * | 2015-11-04 | 2016-01-13 | 深材科技（深圳）有限公司 | High-strength epoxy structural adhesive for adhering carbon fiber composite materials |
| CN106281172A (en) * | 2016-09-12 | 2017-01-04 | 珠海圣菲玛滤清器有限公司 | A kind of two component adhesive and preparation method thereof |
| CN106497474A (en) * | 2016-10-29 | 2017-03-15 | 张静 | A kind of preparation method of epoxy resin adhesive |
| CN108865032A (en) * | 2018-06-29 | 2018-11-23 | 李坚 | A kind of craftwork plate and preparation method thereof |
| CN111040700A (en) * | 2019-12-28 | 2020-04-21 | 长沙索康新材料科技有限公司 | Epoxy daub for repairing high-strength concrete |
| CN115305015A (en) * | 2022-08-30 | 2022-11-08 | 共享智能装备有限公司 | Gap filler for 3D printing product and preparation method |
| CN117887418A (en) * | 2024-01-22 | 2024-04-16 | 内蒙古美筑新型材料有限公司 | Quick-setting ceramic tile adhesive and preparation method thereof |
-
2004
- 2004-04-28 CN CN 200410023970 patent/CN1690154A/en active Pending
Cited By (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100391996C (en) * | 2006-06-29 | 2008-06-04 | 广州市东风化工实业有限公司 | Epoxy resin solidification agent and its preparation method |
| CN101717609B (en) * | 2009-12-24 | 2014-03-26 | 北京北科双元涂料科技有限公司 | Anticorrosion glue tape for pipeline and preparation process |
| CN101845287A (en) * | 2010-05-10 | 2010-09-29 | 华烁科技股份有限公司 | Intermediate temperature-cured epoxy adhesive for coverlay of flexible printed circuit and preparation method thereof |
| CN101845287B (en) * | 2010-05-10 | 2012-11-28 | 华烁科技股份有限公司 | Intermediate temperature-cured epoxy adhesive for coverlay of flexible printed circuit and preparation method thereof |
| CN102153977B (en) * | 2011-03-11 | 2013-11-06 | 中南林业科技大学 | Anti-seepage leak-stopping epoxy adhesive and preparation method thereof |
| CN102153977A (en) * | 2011-03-11 | 2011-08-17 | 中南林业科技大学 | Anti-seepage leak-stopping epoxy adhesive and preparation method thereof |
| CN102492386A (en) * | 2011-11-30 | 2012-06-13 | 东北林业大学 | Epoxy resin adhesive for binding polyethylene wood-plastic composite material |
| CN102492386B (en) * | 2011-11-30 | 2013-10-30 | 东北林业大学 | Application of epoxy resin adhesive |
| CN102807732B (en) * | 2012-05-07 | 2015-11-25 | 苏州市胶粘剂厂有限公司 | A kind of sealing leakage glue is greasy and preparation method thereof |
| CN102807732A (en) * | 2012-05-07 | 2012-12-05 | 苏州市胶粘剂厂有限公司 | Plugging putty and preparation method thereof |
| CN102850986A (en) * | 2012-10-05 | 2013-01-02 | 王崇高 | Novel halogen-free flame retardant epoxy resin sealing glue |
| CN103113841A (en) * | 2012-12-07 | 2013-05-22 | 北京航天试验技术研究所 | Preparation method of strong-acid-resistant epoxy resin quick plugging agent |
| CN103113841B (en) * | 2012-12-07 | 2015-08-05 | 北京航天试验技术研究所 | A kind of preparation method of the epoxy resin of resistance to strongly-acid agent to rapidly block up leakage |
| CN103756610B (en) * | 2013-05-13 | 2015-08-05 | 湖南柯盛新材料有限公司 | A kind of two component color inhibition epoxyn and preparation method thereof |
| CN103756610A (en) * | 2013-05-13 | 2014-04-30 | 湖南柯盛新材料有限公司 | Double-component yellowing resistance epoxy resin adhesive and preparation method thereof |
| CN103409090A (en) * | 2013-06-05 | 2013-11-27 | 武汉市科达云石护理材料有限公司 | Epoxy caulk compound used in humid environment |
| CN103409090B (en) * | 2013-06-05 | 2015-01-14 | 武汉市科达云石护理材料有限公司 | Epoxy caulk compound used in humid environment |
| CN105037690A (en) * | 2015-06-17 | 2015-11-11 | 牛无畏 | Low-temperature epoxy resin curing agent and preparation method thereof |
| CN105086907B (en) * | 2015-09-30 | 2017-07-18 | 日丰企业集团有限公司 | A kind of mildewproof sealant and preparation method thereof |
| CN105086907A (en) * | 2015-09-30 | 2015-11-25 | 佛山市日丰企业有限公司 | Mildew-proof sealant and preparation method thereof |
| CN105238313A (en) * | 2015-11-04 | 2016-01-13 | 深材科技（深圳）有限公司 | High-strength epoxy structural adhesive for adhering carbon fiber composite materials |
| CN105238313B (en) * | 2015-11-04 | 2018-01-05 | 深材科技（深圳）有限公司 | A kind of high-strength epoxy structure glue for being used to be bonded carbon fibre composite |
| CN106281172A (en) * | 2016-09-12 | 2017-01-04 | 珠海圣菲玛滤清器有限公司 | A kind of two component adhesive and preparation method thereof |
| CN106281172B (en) * | 2016-09-12 | 2020-01-10 | 珠海圣菲玛滤清器有限公司 | Bi-component adhesive and preparation method thereof |
| CN106497474A (en) * | 2016-10-29 | 2017-03-15 | 张静 | A kind of preparation method of epoxy resin adhesive |
| CN108865032A (en) * | 2018-06-29 | 2018-11-23 | 李坚 | A kind of craftwork plate and preparation method thereof |
| CN111040700A (en) * | 2019-12-28 | 2020-04-21 | 长沙索康新材料科技有限公司 | Epoxy daub for repairing high-strength concrete |
| CN115305015A (en) * | 2022-08-30 | 2022-11-08 | 共享智能装备有限公司 | Gap filler for 3D printing product and preparation method |
| CN117887418A (en) * | 2024-01-22 | 2024-04-16 | 内蒙古美筑新型材料有限公司 | Quick-setting ceramic tile adhesive and preparation method thereof |
| CN117887418B (en) * | 2024-01-22 | 2024-09-27 | 内蒙古美筑新型材料有限公司 | Quick-setting ceramic tile adhesive and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1690154A (en) | Double component adhesive for double-ply board | |
| CN1301855C (en) | Compound tile having having a natural stone visible face and fabrication process | |
| CN1288220C (en) | High strong adhesive and method for preparing same | |
| CN101067053A (en) | Inner and outer wall putty interface glue | |
| CN1498162A (en) | Compound product | |
| CN1179902C (en) | Patching material in quick modified polymer | |
| CN108424067A (en) | A kind of preparation method of the composite artificial stone of function admirable | |
| CN100343191C (en) | Composite resin plate | |
| CN1216114C (en) | Structural glue containing nano material | |
| CN1309675C (en) | Desalting sea sand high-performance concreet mixing materials and preparing method thereof | |
| CN1303034C (en) | Quick repairing polymer cement base material and its preparing method | |
| CN1274626C (en) | Epoxy resin mortar and preparation method | |
| CN1546416A (en) | Polymer cement based self-levelling materials and preparation method thereof | |
| CN1183055C (en) | Patching material in ultra-tast for hard road | |
| CN1903929A (en) | Waste gum powder flexible acrylic acid water gap filling material and its preparation method | |
| CN112059936B (en) | Dry-wet dual-purpose polishing grinding tool and preparation method thereof | |
| CN1272398C (en) | Polymeric adhesive for exposed wall thermal-insulation | |
| CN1793207A (en) | Silicomethane coupling agent containing cyanide and secondary amino and its preparation process and application thereof | |
| CN1282771A (en) | Dual-component structural adhesive of epoxy resin for buildings | |
| CN1903930A (en) | Flexible acrylic acid waste polyurethane water composite joint filling material and its preparation method | |
| CN1180023C (en) | Interface treating agent of unsaturated polyester mortar as concrete repairing material | |
| CN1100018C (en) | Material and building method of highway bed | |
| CN1800077A (en) | Emulated white marble and its preparation process | |
| CN1184274C (en) | Powder binder | |
| CN1199715A (en) | Light fireproof acoustic decoration board and its production process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |