CN1680793A - Measuring method and device for temperature distribution of slot - Google Patents
Measuring method and device for temperature distribution of slot Download PDFInfo
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- CN1680793A CN1680793A CN 200410033128 CN200410033128A CN1680793A CN 1680793 A CN1680793 A CN 1680793A CN 200410033128 CN200410033128 CN 200410033128 CN 200410033128 A CN200410033128 A CN 200410033128A CN 1680793 A CN1680793 A CN 1680793A
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Abstract
A method for testing temperature distribution of plug - in slot includes structuring two - dimensional matrix by multiple temperature detection points to cover tested single board surface in plug in slot, measuring temperature data at air thin layer of single board surface with said detection points and then obtaining temperature distribution state of plug in slot. The test device consists of testboard including temperature detection array and control circuit connected to external temperature signal processing unit.
Description
Technical field
The present invention relates to the measuring technology of the communications field, be specifically related to a kind of method and apparatus of test socket Temperature Distribution.
Background technology
All based on forms of the composition such as rack, interpolation frame, veneers, promptly a rack comprises a plurality of interpolation frames to the hardware configuration of large-scale communication products at present, and an interpolation frame can insert the polylith veneer.Because the circuit of equipment becomes increasingly complex, and the volume of customer requirements equipment is the smaller the better, therefore, veneer quantity in each interpolation frame is a lot, cause the gap between slot very little, and the device density of every veneer and thermal value are all more and more higher, like this, just to veneer in the interpolation frame heat dissipation problem very high requirement has been proposed.Accompanying drawing 1 is the composition structure of interpolation frame veneer when work and the mode of heat radiation, among the figure, arranges in the interpolation frame 1 and inserts pluggable veneer A, between the veneer A in the interpolation frame 1 the slot gap is arranged, and does not show among the figure.Cold wind enters by under the interpolation frame, takes away heat by discharging above the interpolation frame.
On the other hand, needing to carry out a large amount of ambient air temperatures in the slot of veneer in the real work and the residing interpolation frame of veneer in the performance history of communication products measures.Can find by measuring whether the whole or part of veneer is in superheat state; Whether ambient air temperature is in superheat state in the residing slot of veneer; Whether there are temperature distributing disproportionation or heat radiation dead angle in the interpolation frame; Whether the air flow field design of the Natural Heat Convection of veneer environment of living in or air blast cooling heat radiation is reasonable or the like.The result of test can be used as the foundation of improving interpolation frame or veneer thermal design, also can be used as a kind of actual verification after thermal design is finished.
Prior art has mainly proposed four kinds of solutions, be used for slot Temperature Distribution in the test cabinet interpolation frame, yet these four kinds of solutions all has many deficiencies, are introduced respectively below.
One of prior art: general multi-point temperature measurement system.
It is to the test of slot or veneer temperature, generally be by general multi way temperature tester 21, be bonded at a plurality of temp probes on a plurality of devices of tested single board with fixing glue, all probe lines are drawn by limited gap between the front panel Handle Bar of two veneers, thereby test out the temperature value of company headquarters of probe institute position, as shown in Figure 2.
This solution is a general multi way temperature tester, and its structure is not suitable for the slot in the subrack is carried out the Temperature Distribution test.Following shortcoming is specifically arranged:
1, temperature sensing point limited amount can't reflect the Temperature Distribution in tested zone.Owing to be subjected to the restriction of structure and connection, generally test in this way, counting of test is limited, the temperature of several points on can only testing single-board, and can't grasp Temperature Distribution intuitively, also can't understand the Temperature Distribution of veneer top layer air flow field, and the air flow field Temperature Distribution can reflect the cross-ventilation state of forced air cooling, the heat radiation dead angle that discovery may exist.
2, its probe adopts the thermopair of finishing simple temperature sensing function usually, promptly temperature just is converted to corresponding electric signal, each probe links to each other with controller by two high temperature wires at least, must coat fixing glue during test probe is fixed on the place that will test, measurand is had certain destructiveness.
3, temp probe is fixed with to be connected work loaded down with trivial details when test, to different groove positions during with different single-board testing, and need pop one's head in again fixing and being connected, testing efficiency is low.
Two of prior art: dot matrix infrared radiation temperature technology, as the super temperature measurer of the infrared full video of TJ-200.
Such temperature measurer is made up of with camera part built-in temperature survey part, and the temperature survey part is made up of 64 unit thermal sensing element arrays and silicon lens, and camera part then is equipped with the CMOS color sensor of 300,000 pixels.By 3.8 inches liquid crystal panels of temperature measurer, 64 measurement point correspondences can be shown on the captured image, demonstrate the temperature of each measurement point by different colors, come thereby depict the temperature profile of measuring target.This product is lined up 64 unit thermal sensing element arrays with 64 infrared radiation thermal sensing elements by vertical 8 * horizontal 8, can measure the temperature of 64 sensing points simultaneously.Record data only need button gently if desired, just can become the CSV formatted data to preserve the JPEC format-pattern data-switching of 64 points.
Same close other products such as the MP50 series temperature measurer that adopts this type of technology, MP50 series temperature measurer can provide the monitoring temperature of accurate edge-to-edge by the measurement to 256 temperature spots on every sweep trace.It is to collect infrared energy by the optical system of a rotation in 90 ° visual field to finish to the temperature survey of multiple spot.Its same infrared radiation sensor spare that adopts, different is to utilize the scanning set optical lens of machinery to collect the temperature radiation of tested pilot.
The shortcoming of this solution specifically comprises:
1, this technology is fit to object or the regional temperature distributing measuring that carries out at 64 to the visual angle visible range, but because be a closed system in the interpolation frame, it can't be used for Temperature Distribution test of slot in the interpolation frame.
2, sensing point only is 64 square matrixs that 8 rows 8 indulge, and the sensing point lazy weight is to reflect complete Temperature Distribution.
3, this system integrates Temperature Distribution test and image taking, adopts the principle of hot focus to carry out long-range noncontact detection simultaneously, and the total system cost is higher.
Three of prior art: infrared thermal imaging technique, as IR-100 type infra-red thermal imaging instrument.
Such thermal imaging system is a kind of intelligent thermal imaging system of versatility, its principle is to adopt the high sensitivity infrared eye, convert the heat radiation of scenery to picture intelligence by optical mechaical scanning, after handling through single-chip microcomputer, the last temperature distribution image that on TV screen, shows object.It is applied to temperature monitoring and control, the equipment thermal fault detection in the production run, the temperature field measurement in the engineering test, the flaw detection of special material etc. industrial.Medically be applied to superficial tumors such as diagnosing mammary cancer, thyroid cancer, vascular diseases such as vasculitis and cerebral thrombus, Chinese medicine meridian qigong research etc.Also can be used for simultaneously in industry, the scientific research temperature survey to the normal temperature object.
Three shortcoming of prior art specifically comprises:
1, it is fit to temperature distributing measuring is carried out in the object or the zone of visual angle visible range, but because be a closed system in the slot, so can't be used for the Temperature Distribution test of subrack slot.
2, adopt the infrared thermal imagery sensing device, with high costs.
Four of prior art: the test board technology of German Rittal GmbH
Germany Rittal GmbH (its English name RITTAL) is the supporting a kind of test board of its enclosure product, this is measure-alike CPCI (the Compact PeripheralComponent Interconnect: the testing single-board of the standard compact Peripheral Component Interconnect) of one and actual veneer, lay several temperature sensors above, several air velocity transducers and a certain amount of heating resistor, the situation of energising back heating resistor analog veneer heating, then the many piece such test boards suitable with actual veneer quantity are inserted in the interpolation frame, just can test out the temperature and the wind speed of the difference in cabinet, its objective is whether the air channel design of check cabinet in the structural design of CPCI cabinet is reasonable.
Four shortcoming of prior art specifically comprises:
Whether 1, this test board can only be tested the air channel design of subrack integral body under routine and the standard design situation reasonable, layout owing to components and parts on the actual product single board has nothing in common with each other, aeration structure in each slot has nothing in common with each other, and this test board is not suitable for slot Temperature Distribution in the test cabinet interpolation frame.
2, the purpose of this test board is to understand the preliminary air channel design evaluation that carries out under the prerequisite of ignoring veneer practical structures difference, test to temperature, each slot has only several sensing points, therefore can not be as the Temperature Distribution test of slot, also can't test actual veneer distribution situation of temperature in the slot in the groove position time.
3, this test board is installed in the front of test board with temp probe and air velocity transducer, all is used to test this groove position.
4, this test board is mainly used in the air channel design verification of whole subrack, and the product single board of reality does not participate in during test, therefore in use, abundant this kind test board must be inserted subrack, could constitute test environment, so cost is higher.
5, only at the subrack of CPCI standard, applicability is single for this testing single-board.
Summary of the invention
The present invention proposes a kind of method and apparatus of test socket Temperature Distribution, in order to overcome the shortcoming that the testing efficiency that exists in the prior art is low, cost is high.
The invention provides a kind of method of test socket Temperature Distribution, this method comprises following steps:
A, a plurality of temperature sensing points of employing constitute the two-dimensional matrix that covers tested single board surface in the slots;
B, the temperature sensing point that passes through on this two-dimensional matrix are measured the temperature test data of the thin layer of air on veneer surface, and then obtain the temperature distribution state of slot.
Wherein, this method also comprises:
C, with the temperature test data of obtaining, deliver to computing machine by serial ports or network interface, demonstrate the temperature distribution state of the thin layer of air on tested single board surface by computing machine.
Demonstration among the described step C is meant to be adopted the numerical value explicit representation or adopts the colourity explicit representation.
The Temperature Distribution that computing machine demonstrates the thin layer of air on tested single board surface of passing through among the described step C is specially:
The coordinate of described temperature test data by institute's test zone is presented on the corresponding position, and the regional available interpolation algorithm between two temperature sensing points is made Fuzzy Processing, to reduce the numerical value gradient that causes because of the sampled point deficiency.
The invention provides a kind of device of realizing above-mentioned test socket Temperature Distribution method, this device includes the test board of or similar size same with tested single board, wherein:
This test board comprises: the temperature sensing point array, the Temperature Distribution test control circuit that are made of bus type temperature sensing chip; This temperature sensing point array distribution on described test board with the tested single board homonymy, be laid with this Temperature Distribution test control circuit in the another side of described test board, this Temperature Distribution test control circuit is connected with outside processes temperature signal device.
Described processes temperature signal device refers to it is computing machine or other character and picture output units.
Described test board is to have and the printed board of tested single board with spline structure and size, adopt standard printed board size and the panel Handle Bar the same with tested single board, temperature sensor is the big or small very low surface mounting component of height that is similar to the Surface Mount filter capacitor of common loose side, and described Temperature Distribution test control circuit is connected with computing machine by serial ports, the network interface that is arranged on the test plate surface Handle Bar.
The implementation of described temperature sensing point array is: adopt a kind of parallel bus structure of having only an I/O port line, be one-line bus-structured temperature sensing digit chip, or other bus-structured temperature sensing digit chip that more easily carries out cascaded design constitute the temperature detection lattice array.
The method that apparatus of the present invention can adopt veneer newspaper to substitute in use when promptly testing the groove position air themperature of right side veneer, need replace with Temperature Distribution test board of the present invention to the left side veneer.
Certainly, realize that the method for the invention also can be at Temperature Distribution test board on retention temperature sensing point array, control circuit is moved on to beyond the veneer, and the number of minimizing check point, like this, the temperature test plate just can be done very thinly, and the vacant part of veneer is hollowed out, and just can adopt the method that veneer substitutes and directly this test thin plate is placed between two veneers.But doing a lot of shortcomings like this under the technical conditions at present, the one, sampled point is very few, be not enough to reflect Temperature Distribution, the 2nd, bigger to the air flow field influence of slot, the 3rd, fixing inconvenience, need to remove the panel Handle Bar of tested groove position veneer simultaneously, four is that gap between two veneers hour can't be used very much.If technical progress can realize test board and sensing point and ultra-thinization of bus and ultraminiaturization, above-mentioned shortcoming will be overcome.
Temperature Distribution proving installation of the present invention be designed to one with the identical or similar plate of standard-sized veneer size, temperature sensing point with One's name is legion is arranged in the back side that matrix is placed in test board simultaneously, test by the method that the groove position substitutes, promptly when test target groove position, its adjacent groove position is replaced by this deblocking temperature distribution tests plate, so the residing position of temperature sensing point just in time is arranged in the air blanketing of tested experimental tank position on the Temperature Distribution test board.Because adopted the temperature sensing point of sufficient amount to constitute two-dimentional matrix, therefore, the result of test can reflect the Temperature Distribution of tested groove position.Adopt the Temperature Distribution test board of this programme, with low cost, and be applicable to all products that adopt same normal structure, therefore high cost performance and stronger versatility are arranged.When using it for the test of adopting another kind of standard-sized interpolation frame, as long as the arrangement that changes the size of printed board and sensing point matrix is with adaptive such machine frame, the present invention goes for nearly all interpolation frame formula constructed products.
Particularly, it has following advantage:
1, make Temperature Distribution test be easy to realize at this small space of slot in the interpolation frame;
2,, reach the function that the tested regional temperature of test distributes by abundant sampled point;
3, the test environment structure is convenient, is convenient to carry out the test of repeatability, also is convenient to test in any groove position, can not destroy original heat radiation and air channel structure simultaneously;
4, adopt low-cost mode to realize the test of Temperature Distribution.
Description of drawings
Fig. 1 is the composition structure of interpolation frame veneer when work in the prior art and the synoptic diagram of radiating mode;
Fig. 2 is the structural representation of multi-point temperature measurement system in the prior art;
Fig. 3 is the process flow diagram of the inventive method;
Fig. 4 A is the schematic perspective view of the described Temperature Distribution test board of the embodiment of the invention;
The synoptic diagram of the air blanketing that constitutes between two veneers when Fig. 4 B is a system works of the present invention;
Fig. 5 is the electrical structure synoptic diagram of the described Temperature Distribution test board of the embodiment of the invention;
Fig. 6 is the user mode reference view of the described Temperature Distribution test board of the embodiment of the invention;
Fig. 7 is the structure synoptic diagram of the described Temperature Distribution test board of the embodiment of the invention.
Embodiment
Be the process flow diagram of the described method of the embodiment of the invention as shown in Figure 3, it at first is inserted in the interpolation frame of rack by the described Temperature Distribution test board of embodiment of the invention device, and the temperature sensing point that has formed sufficient amount constitutes the two-dimensional matrix that covers tested single board surface in the slot; Measure the temperature test data of the thin layer of air on veneer surface then by the temperature sensing point on this two-dimensional matrix, obtain the temperature distribution state of slot in view of the above; At last with the temperature test data of obtaining, deliver to by serial ports or network interface and to be used for the computing machine that Temperature Distribution shows, demonstrate temperature distribution state with the thin layer of air on tested single board surface by computing machine.
Fig. 4 A is the schematic perspective view of the described Temperature Distribution test board of the embodiment of the invention; The synoptic diagram of the air blanketing that constitutes between two veneers when Fig. 4 B is a system works of the present invention.Number in the figure is represented: A1 is the veneer front, and A2 is a loose side, and A3 is a handle, and A4 is the device in veneer front; Different color blocks among the B1 is represented Temperature Distribution different in the air blanketing.
Introduce the basic condition of this veneer below, the left side of every veneer A, be that veneer front surface A 1 is main device side, the device A4 that all monster chips and volume are bigger concentrates on this face, the heat of veneer mainly sends from this face, therefore when every veneer A all is positioned at interpolation frame, just constituted the main heat dissipation channel B of right side veneer, the air ambient of the right side veneer groove of living in position that the air blanketing that Fig. 4 B describes just is meant between the front surface A 1 of the adjacent veneer of back side A2 and right side of left side veneer.The present invention wants the purpose that reached, test the Temperature Distribution of this air ambient exactly, because of the thickness of this thin layer of air in fact is very little, therefore in the length and width direction, three-dimensional Temperature Distribution is reduced to the Temperature Distribution of planar herein, makes convenient test, quick and with low cost simultaneously.
Be the electrical structure synoptic diagram of the described Temperature Distribution test board of the embodiment of the invention as shown in Figure 5; Number in the figure is represented: 4, Temperature Distribution test board, 5, the temperature sensing array, 8, control bus, 9, temperature acquisition controller (cpu system), 10, serial port circuit, 11, Serial Port Line, 12, network port circuit, 13 network interface lines, 14, computing machine, 15, the power supply and other auxiliary circuit.Block diagram in the maximum square frame in right side is the electrical block diagram of Temperature Distribution test board 4, and this Temperature Distribution test board 4 comprises: temperature sensing array 5, Temperature Distribution test control circuit; And this temperature sensing array 5 is distributed on the described test board and the tested single board homonymy, be laid with this Temperature Distribution test control circuit in the another side of described test board, this Temperature Distribution test control mainly partly is made of temperature acquisition controller 9 (in fact it is exactly a system control cpu), serial port circuit 10, network port circuit 12, power supply and auxiliary circuit 15, bus 8, temperature sensing array 5 etc.; Temperature data sends computing machine 14 displays temperature distribution situations to by Serial Port Line 11 or network interface line 13.
Wherein this bus type temperature sensing array 5 is made of by bus 8 parallel waies the temperature sensing digit chip 7 of 10 rows, 20 row, but it is the one-line bus temperature sensing digit chip of networking.Temperature acquisition controller 9 is finished the function that temperature sensing array 5 is carried out data acquisition on the one hand, finishes on the other hand by serial ports 10 and network interface 12 and background computer 14 and carries out the function that data transmit.And power supply and auxiliary circuit 15 are finished the function of supplying power of test board and are guaranteed the stable basic function of test board.
Temperature Distribution test board 4 is mainly finished obtaining temperature test data in the machine frame, whole temperature test data of obtaining, deliver to by serial ports 10 or network interface 12 and to be used for the computing machine 14 that Temperature Distribution shows, demonstrate Temperature Distribution with veneer practical layout institute corresponding region by computing machine.Temperature Distribution shows the employing dual mode, be respectively numerical value explicit representation and colourity explicit representation, the numerical value explicit representation is about to Temperature Distribution test board 4 detected temperature values and is presented on the corresponding position by the coordinate of institute's test zone, (temperature that measures as adjacent two test points is respectively that 25 degree and 27 are spent and the regional available interpolation algorithm between two monitoring points is made Fuzzy Processing, then in the centre position of 2 institute's respective coordinates, but interpolation intermediate value 26 degree are as the temperature of this point), to reduce the numerical value gradient that causes because of the sampled point deficiency.Distribute according to shown Temperature numerical, can reflect the trend of interior temperature distribution state of actual slot and air flow field.Colourity shows that rule represents different temperature values with different colourity, and Fuzzy Processing also can be made by interpolation algorithm in the zone between two check points, and the colourity explicit representation makes the demonstration of Temperature Distribution more directly perceived and perceptual.
Fig. 6 is the user mode reference view of the described Temperature Distribution test board of present embodiment, and its method that adopts test board to substitute the veneer of adjacent position, groove to be measured position is carried out the Temperature Distribution test.Number in the figure is expressed as: 61a, interpolation frame front, 61b, the interpolation frame back side, 62, the veneer in the interpolation frame, 4, Temperature Distribution test board, 63, control circuit on the Temperature Distribution test board, 5, the array of temperature sensor that constitutes of temperature sensing digit chip, 64, the network interface and the serial ports that are provided with on the test board panel Handle Bar, be used for that the temperature test data are sent to computing machine and carry out Temperature Distribution and show.Fig. 7 is the synoptic diagram at Temperature Distribution test board 4 back sides, and number in the figure is expressed as: 5, array of temperature sensor, 7, surface-pasted one-line bus temperature sensing digit chip.
In the present embodiment, tested groove position is 6# groove position, as shown in Figure 6, therefore the veneer of 5# groove position is extracted from slot, and what replace it is the Temperature Distribution test board 4 with same size and panel Handle Bar, from Fig. 4 A, find out, because of the printed board and the panel Handle Bar of same size are arranged, after Temperature Distribution test board 4 inserts, guaranteed that original groove position radiator structure is not destroyed, bigger change does not take place in the heat-dissipating space of promptly tested groove position and air channel structure because of the existence of Temperature Distribution test board 4 or because of pulling out of 5# groove position veneer.From Fig. 5, also can see, the left side of Temperature Distribution test board 4 (being its front) is a control circuit 63, the right (being its back side) is the sensing point array 5 that is made of the temperature sensing digit chip, because used temperature sensing digit chip is small-sized surface mount device 7, the surface mount filter capacitor that its height and replaced veneer are placed in the back side is close, thereby also can not produce big influence to original heat dissipation environment.The data that the temperature test plate is gathered are drawn by serial ports on the front panel Handle Bar and network interface connector 64, after its data are imported computing machine into, are carried out the demonstration of Temperature Distribution again by computing machine.
The sensing point array 5 that Fig. 7 shows can be realized the Temperature Distribution test of big sampled point and remove building of complicated test environment from, makes test be easy to realize fast and can repeat.
In the embodiment of the invention device, to substituting of Temperature Distribution test board internal sensor devices, promptly available other bus-structured temperature sensing digit chip or other forms of temperature sensor constitute temperature sensing point array.Control mode between Temperature Distribution test board and the background computer, can also adopt the Temperature Distribution test board scheme of off-line operation, it is the participation that does not need background computer in the test process of Temperature Distribution, can break away from background computer and isolated operation, after finishing test, can again Temperature Distribution test board and computing machine be linked, the result who tests is shown or printing by computing machine.
Embodiment of the invention technical scheme has realized goal of the invention, and brings useful effect:
1, because adopted the temperature sensing point of One's name is legion to constitute the detection matrix, therefore can test out the Temperature Distribution of air blanketing between veneer and the veneer preferably, thereby the Temperature Distribution situation to whole veneer has grasp more intuitively, can find the heat radiation dead angle of system, can grasp whether temperature sensor is in safe working environment on the veneer.Therefore can reduce the equipment life that brings because of thermal design problem and the risk on the safety.
2, the grasp by the interlayer air themperature is distributed can be recognized whether the air flow field trend of tested experimental tank position is reasonable, thereby thermal design is verified preferably, has improved the accuracy of design and has reduced the risk of doing over again.
3, because of the board plug type structure makes test very convenient, can improve the coverage rate and the comprehensive and testing efficiency of test, as cover each groove position, or when veneer and structure generation slight change, also can test at any time.Reduced in the past and only key position or great change had just been done the risk of testing and may cause, and promoted reliability of products.
Claims (8)
1, a kind of method of test socket Temperature Distribution is characterized in that: this method may further comprise the steps:
A, a plurality of temperature sensing points of employing constitute the two-dimensional matrix that covers tested single board surface in the slots;
B, the temperature sensing point that passes through on this two-dimensional matrix are measured the temperature test data of the thin layer of air on veneer surface, and then obtain the temperature distribution state of slot.
2, the method for test socket Temperature Distribution as claimed in claim 1 is characterized in that, this method also comprises:
C, with the temperature test data of obtaining, deliver to computing machine by serial ports or network interface, demonstrate the temperature distribution state of the thin layer of air on tested single board surface by computing machine.
3, the method for test socket Temperature Distribution as claimed in claim 2 is characterized in that, the demonstration among the described step C is meant to be adopted the numerical value explicit representation or adopt the colourity explicit representation.
4, the method for test socket Temperature Distribution as claimed in claim 2 is characterized in that, the Temperature Distribution that computing machine demonstrates the thin layer of air on tested single board surface of passing through among the described step C is specially:
The coordinate of described temperature test data by institute's test zone is presented on the corresponding position, and the regional available interpolation algorithm between two temperature sensing points is made Fuzzy Processing, to reduce the numerical value gradient that causes because of the sampled point deficiency.
5, a kind of device of realizing test socket Temperature Distribution method as claimed in claim 1, this device includes the test board of or similar size same with tested single board, it is characterized in that:
This test board comprises: the temperature sensing point array, the Temperature Distribution test control circuit that are made of bus type temperature sensing chip; This temperature sensing point array distribution on described test board with the tested single board homonymy, be laid with this Temperature Distribution test control circuit in the another side of described test board, this Temperature Distribution test control circuit is connected with outside processes temperature signal device.
6, the device of test socket Temperature Distribution as claimed in claim 5 is characterized in that: described processes temperature signal device refers to it is computing machine or other character and picture output units.
7, the device of test socket Temperature Distribution as claimed in claim 6, it is characterized in that: described test board is to have and the printed board of tested single board with spline structure and size, adopt standard printed board size and the panel Handle Bar the same with tested single board, temperature sensor is the big or small very low surface mounting component of height that is similar to the Surface Mount filter capacitor of common loose side, and described Temperature Distribution test control circuit is connected with computing machine by serial ports, the network interface that is arranged on the test plate surface Handle Bar.
8, the device of test socket Temperature Distribution as claimed in claim 5, it is characterized in that: the implementation of described temperature sensing point array is, adopt a kind of parallel bus structure of having only an I/O port line, be one-line bus-structured temperature sensing digit chip, or other bus-structured temperature sensing digit chip that more easily carries out cascaded design constitute the temperature detection lattice array.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100331284A CN100501357C (en) | 2004-04-05 | 2004-04-05 | Measuring method and device for testing temperature distribution of slot |
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| CNB2004100331284A CN100501357C (en) | 2004-04-05 | 2004-04-05 | Measuring method and device for testing temperature distribution of slot |
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| CN1680793A true CN1680793A (en) | 2005-10-12 |
| CN100501357C CN100501357C (en) | 2009-06-17 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102507026A (en) * | 2011-11-09 | 2012-06-20 | 江苏弘润光电科技控股集团有限公司 | Method and device for measuring average temperature of multiple points |
| CN106776192A (en) * | 2016-12-28 | 2017-05-31 | 上海埃威航空电子有限公司 | Multifunction emulation bus test equipment |
| CN110430625A (en) * | 2019-06-10 | 2019-11-08 | 深圳桐源科技有限公司 | Aerosol generating system, heating module, temperature checking method and device |
| CN111367328A (en) * | 2018-12-26 | 2020-07-03 | 北京铂阳顶荣光伏科技有限公司 | Co-evaporation equipment and temperature monitoring method |
| CN114563444A (en) * | 2022-03-02 | 2022-05-31 | 湖南博匠信息科技有限公司 | VPX equipment heat dissipation performance test method and system |
| CN116736089A (en) * | 2023-08-16 | 2023-09-12 | 北京智芯微电子科技有限公司 | High-low temperature reliability test equipment and method for chip |
-
2004
- 2004-04-05 CN CNB2004100331284A patent/CN100501357C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102507026A (en) * | 2011-11-09 | 2012-06-20 | 江苏弘润光电科技控股集团有限公司 | Method and device for measuring average temperature of multiple points |
| CN106776192A (en) * | 2016-12-28 | 2017-05-31 | 上海埃威航空电子有限公司 | Multifunction emulation bus test equipment |
| CN106776192B (en) * | 2016-12-28 | 2023-09-19 | 上海埃威航空电子有限公司 | Multifunctional simulation bus test equipment |
| CN111367328A (en) * | 2018-12-26 | 2020-07-03 | 北京铂阳顶荣光伏科技有限公司 | Co-evaporation equipment and temperature monitoring method |
| CN110430625A (en) * | 2019-06-10 | 2019-11-08 | 深圳桐源科技有限公司 | Aerosol generating system, heating module, temperature checking method and device |
| CN114563444A (en) * | 2022-03-02 | 2022-05-31 | 湖南博匠信息科技有限公司 | VPX equipment heat dissipation performance test method and system |
| CN116736089A (en) * | 2023-08-16 | 2023-09-12 | 北京智芯微电子科技有限公司 | High-low temperature reliability test equipment and method for chip |
| CN116736089B (en) * | 2023-08-16 | 2023-10-10 | 北京智芯微电子科技有限公司 | High-low temperature reliability test equipment and method for chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100501357C (en) | 2009-06-17 |
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