CN1674266A - Heat releasing structure for semiconductor chip - Google Patents
Heat releasing structure for semiconductor chip Download PDFInfo
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- CN1674266A CN1674266A CN 200410021462 CN200410021462A CN1674266A CN 1674266 A CN1674266 A CN 1674266A CN 200410021462 CN200410021462 CN 200410021462 CN 200410021462 A CN200410021462 A CN 200410021462A CN 1674266 A CN1674266 A CN 1674266A
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- semiconductor chip
- radiator
- movable axis
- heat radiation
- radiation structure
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Abstract
A heat radiation structure of semiconductor chip consists of radiator support fixed on top side of semiconductor chip, movable shaft set at certain position deviating from geometrical centre of radiator support, fitting radiator on movable shaft to rotate the radiator in using movable shaft as rnotary cetre.
Description
Technical field
The present invention is an invention about the heat radiation structure of the semiconductor chip that produces high temperature.Be exactly that in the power parts such as (I.C) that produces a lot of high temperature, it is smooth and easy to make high temperature pass through heat loss through convection, thereby eliminates semi-conductive anomaly particularly.Especially, semiconductor chip of the present invention can adapt to the flat-panel monitor under horizontal or vertical state, makes to obtain better effect.
Background technology
Flat-panel monitor has liquid crystal LCD watch-dog or plasma sheet distribution board etc., and these flat-panel monitors can be installed in any place, so utilization rate is more and more higher because of thinner thickness.And, because dull and stereotyped characteristic, can arbitrarily be set to above-mentioned flat-panel monitor laterally, vertically or the direction that tilts use.
Traditional flat-panel monitor generally for electricity consumption road plate displayed image, uses semiconductor chip miscellaneous.As: sound equipment amplification semiconductor chip, scanning drive chip etc. need to consume the semiconductor chiop of a lot of electric power.
A radiator for cooling of semiconductor element, is adorned on semiconductor chip top in traditional flat-panel monitor inside, absorbs heat with radiator, again toward the outside heat extraction of semiconductor chip.
Fig. 1 is the heat radiation structure figure of traditional semiconductor chip.
With reference to Fig. 1, the heat radiation structure of semiconductor chip comprises: flat-panel monitor 1 and flat-panel monitor 1 be inner be provided with can displayed image and send the circuit board 2 of sound equipment; The semiconductor chip 21 that on circuit board 2, is provided with; For getting rid of the above-mentioned semiconductor chip 21 inner set metal heat sinks 23 of high temperature that produce attached to semiconductor chip 21 tops; Formed blow vent 25 between above heat release pin 24 that swells at least two places and the heat release pin 24 is set above the above-mentioned radiator 23.Particularly, above-mentioned heat release pin 24 is into the linear of vertical direction.
As mentioned above, the effect of the heat radiation structure of traditional semiconductor chip is, in order to operate flat-panel monitor 1, operates above-mentioned semiconductor chip 21, and semiconductor chip 21 will produce high temperature.
And the high temperature in that above-mentioned semiconductor chip 21 produces can be absorbed by radiator 23, and the heat that is absorbed can pass to heat release pin 24, is discharged to the outside.By the high heat that heat release pin 24 is got rid of, be to discharge by flow air about formed blow vent 25 relies between heat release pin 24.
Particularly, be exactly vertical direction by heat release pin 24, enter the cold air of blow vent 25 downsides, after the hot-air heating that heat release pin 24 is got rid of, be discharged to top.That is: above-mentioned heat release pin 24 be set to consistent with the vertical direction of the air that moves according to convection current, can be smooth and easy thereby make by the heat radiation of heat release pin 24.
So, above-mentioned heat release pin 24 direction is set if not vertical, but during situation such as horizontal, because of not making heat radiation unimpeded, the temperature that can only make heat release pin 24 so the heat release pin 24 of high temperature will influence the rolling of semiconductor chip 21, causes the deterioration of semiconductor chip 21 performances toward rising.
On the other hand, for flat-panel monitor, be benchmark with the horizontally set, when forming semiconductor chip 21 and heat release pin 24 etc., when flat-panel monitor becomes vertically, heat release pin 24 just can not normal operation.
Fig. 2 is set to traditional flat-panel monitor to scheme longitudinally.
With reference to Fig. 2, when flat-panel monitor 1 is set to when vertical, heat release pin 24 can become laterally, and owing to this reason, heat release pin 24 will lose original heat sinking function.
So semiconductor chip 21 will be built up high temperature, therefore, semiconductor chip can not normal operation, can produce a series of faults.
Although, for solving above-mentioned heat dissipation problem, also attempted being provided with a coldplate, because the noise that at this moment coldplate caused has brought a lot of inconvenience to the user, also have in addition, need drawbacks such as rolling power supply.
Summary of the invention
The product of initiating in order to address the above problem is being regardless of the direction that is provided with of semiconductor chip, and the exothermal efficiency that improves semiconductor chip is a goal of the invention.
Particularly, because of using flat-panel monitor, obviously the radiating effect of the semiconductor chip that raising can conversion direction with this, guarantees the normal operation of semiconductor chip.The present technique problem is exactly, and is purpose with the heat radiation structure of inventing the semiconductor chip that is fit to this flat-panel monitor.
In order to achieve the above object, the heat radiation structure of semiconductor chip of the present invention comprises: be fixed on the radiator bearer above the semiconductor chip; Upwards prolong formed movable axis from the assigned position of radiator bearer; Inserting movable axis from the position that geometric center departs from slightly, is the radiator of center rotation with above-mentioned movable axis.
The present invention, the heat radiation structure of the semiconductor chip of another comprises: be fixed on the radiator bearer above the semiconductor chip; The movable axis that upwards prolongs from the assigned position of radiator bearer; Insert above-mentioned movable axis, be provided with the radiator that tilts to the center of gravity direction of highdensity weight hammer from geometric center to the position that the direction of heat release pin departs from slightly.
According to said structure, can solve the heat dissipation problem of semiconductor chip, especially can be in the flat-panel monitor of arbitrarily changing direction, no matter direction is set how changes hot gas on the abundant cooling of semiconductor element.
Advantage of the present invention: according to the present invention, the heat radiation structure of semiconductor chip can cool off the high heat that is created on the semiconductor chip rapidly.
But also have, flat-panel monitor be provided with the position can the situation of conversion under, and be fixed on the advantage that under vertical or horizontal, the situation about tilting the high heat in the semiconductor chip is fully dispersed be arranged to of semiconductor chip on the circuit board.
Description of drawings
Fig. 1 is the key diagram of conventional semiconductors chip structure.
Fig. 2 is the state diagram with vertical setting of traditional flat-panel monitor.
Fig. 3 is the heat radiation structure figure of semiconductor chip of the present invention.
Fig. 4 is the profile of the heat radiation structure of semiconductor chip of the present invention.
Fig. 5 is the operation principles figure of the heat radiation structure of semiconductor chip of the present invention.
The explanation of important sign among the relevant figure:
1: flat-panel monitor 2: circuit board 21: semiconductor chip
23: radiator 24: heat release pin 25: blow vent
30: radiator bearer 31: movable axis 32: contrary bearing
40: radiator 41: blow vent 42: the heat release pin
43: the center of gravity 44 of radiator: groove 50: ball bearing
Embodiment
It below is the concrete example of reflection inventive concept.
Fig. 3 is the heat radiation structure figure of semiconductor chip of the present invention.
With reference to Fig. 3 as can be known, flat-panel monitor 1 and the flat-panel monitor 1 inner circuit board 2 that forms, it is the same to reach being provided with prior art of semiconductor chip 21.Yet the present invention, the heat radiation structure of semiconductor chip also comprises: the radiator bearer 30 on semiconductor chip 21 tops; In the certain position of the upside of radiator bearer 30, prolong formed movable axis 31; Insert the radiator 40 of above-mentioned movable axis 31 in the upside formation of radiator bearer 30.And, swelled plural heat release pin 42 at the upside of radiator 40, between heat release pin 42, formed the blow vent 41 that can make air flows.
Specify and be: it would be desirable that above-mentioned radiator bearer 30 should be with semiconductor chip 21 onesize or slightly bigger again youngsters, thereby can absorb the hot gas that produces in the semiconductor chip 21 rapidly.Secondly, the material of radiator bearer 30 and radiator is metal material preferably, and for example aluminum can absorb heat rapidly from semiconductor chip 21.And above-mentioned movable axis 31 is preferably circular, thereby above-mentioned radiator 40 can be rotated.And radiator bearer 30 should be media with the silicone, makes it can be fixed on the upside of above-mentioned semiconductor chip 21.
And, insert in place that above-mentioned movable axis 31 is contacted with radiator 40 bearing (with reference to Fig. 4 50), radiator 40 can be rotated freely.
Because said structure, above-mentioned radiator 40 can be that the center rotates with movable axis 31, so just can be positioned at the vertical direction of center of gravity 43 and movable axis 31 of the radiator of radiator 40.When that is: even flat-panel monitor and semiconductor chip 21 are positioned at the situation of horizontal or vertical or inclination, radiator 40 also can be to the vertical direction rotation of heat release pin 42, so the direction of blow vent 41 and air can be vertical to flow path direction.
On the other hand, can discharge rapidly, preferably do more greatly than semiconductor chip 21 above-mentioned radiator 40 for the ease of the hot gas in the semiconductor chip 21.
Fig. 4 is the profile of the heat radiation structure of semiconductor chip of the present invention.
With reference to Fig. 4, the heat radiation structure of semiconductor chip comprises: semiconductor chip 21 and attached to the radiator bearer 30 of semiconductor chip 21 upsides; At the assigned position of the above-mentioned radiator bearer 30 circular movable axis 31 that forms of protuberance and insert the radiator 40 that movable axis 31 is fixed upwards.Also increased insertion movable axis 31, in the inner periphery of groove because of subsiding formed groove 44 and insert above-mentioned groove 44 formed ball bearings 50.
Above-mentioned ball bearing 50 contacts with the inboard of movable axis 31 and groove 44, in the time of can suppressing radiator 40 rotations, and the formed rolling friction because movable axis 31 and radiator 40 contact.
And, in the upper end of above-mentioned movable axis 31, be provided with contrary bearing 32, make radiator 40 can not break away from the outside of movable axis 31.
According to said structure, radiator 40 can rotate freely in radiator bearer 30 upper ends that are fixed, and can make radiator 40 heat extraction effectively.
Fig. 5 is the operation principles figure of the heat radiation structure of semiconductor chip of the present invention.
With reference to Fig. 5, this situation is that flat-panel monitor be that benchmark tilts with the horizontal plane is that the α angle of regulation forms, and according to this configuration, semiconductor chip 21 and the radiator bearer 30 that is provided with attached to semiconductor chip 21 tops are too with the α angle tilt.
, radiator 40 is positioned at the gravity direction (vertically) that the center of gravity 43 of movable axis 31 and radiator forms a line, can make by the formed hot-air of convection current, by blow vent 41 and heat release pin 42 can be swimmingly up side shifting discharge again.
Further specify as follows: the cold air that enters from downside is by 42 heating of heat release pin, and the air of heating then lightens, and by about 42 on heat release pin, discharges by convection action, so above-mentioned heat release pin 42 can not only be dispersed heat, and can also allow air unimpeded.
So, can rotate in order to make above-mentioned radiator 40, just can not make the movable axis 31 that connects radiator bearer 30 and radiator 40 consistent with the center of gravity 43 of the radiator of radiator 40.
Center of gravity 43 positions of radiator that specify above-mentioned movable axis 31 and radiator 40 are as follows: suggested as drawing, form the position of above-mentioned movable axis 31, be not geometric center at radiator 40, but at the center of radiator 40 along with heat release pin 42 apart from having on the position of necessarily departing from.
According to this structure, in radiator 40 rotation, the radiator center of gravity 43 of radiator 40 and movable axis 31 vertical arrangements vertically, the weight rotation that radiator 40 can be on one's own account.
Can not only do like this, can also not change the position of movable axis 31,, use the material bigger to make the weight hammer of regulation, the forcibly center of gravity 43 of mobile radiator than the density of radiator 40 at the certain position of radiator 40.The position of the center of gravity of optimal above-mentioned radiator is, is benchmark with the geometric center of radiator 40, promptly in the position opposite with movable axis 31, and also will form on the position of necessarily departing from along heat release pin 42.
As mentioned above, the position of movable axis 31 and the center of gravity of radiator 43 distances are far away more, and radiator 40 can be got over running swimmingly, can eliminate friction by ball bearing 50 again, so reach smooth operation more on original basis.
Optimal state is, as shown in the figure, in the scope of the miscellaneous part that can not influence circuit board 2, when radiator 40 rotates with the angle of regulation, can all cover the upside of semiconductor chip 21, thereby make all sites of semiconductor chip 21 can discharge hot gas.
Design of the present invention can not only limit to above-mentioned example, can also give more straightaway explanation according to other examples or to interpolation, change, the deletion of inscape.
Claims (8)
1. the heat radiation structure of a semiconductor chip is characterized in that it comprises:
Be fixed on the radiator bearer above the semiconductor chip;
Assigned position at above-mentioned radiator bearer upwards prolongs formed movable axis;
At the certain position that geometric center departs from slightly, insert above-mentioned movable axis, with the movable axis radiator of center rotation.
2. the heat radiation structure of semiconductor chip according to claim 1 is characterized in that the face that touches mutually of described movable axis and radiator is provided with bearing.
3. the heat radiation structure of semiconductor chip according to claim 1 is characterized in that described radiator bearer is attached to above the above-mentioned semiconductor chip.
4. the heat radiation structure of semiconductor chip according to claim 1 is characterized in that the upper end of described movable axis is provided with the contrary bearing that above-mentioned radiator is broken away from.
5. the heat radiation structure of semiconductor chip according to claim 1, it is characterized in that being provided with the geometric center in the described radiator is benchmark, at the rightabout of the above-mentioned movable axis weight hammer with the formation deviation in driction certain distance of heat release pin.
6. the heat radiation structure of semiconductor chip according to claim 1 is characterized in that described radiator bearer and radiator, for metal material is adopted in rapid heat extraction.
7. the heat radiation structure of semiconductor chip according to claim 1, the position that it is characterized in that described movable axis from the geometric center of radiator to the certain place of heat release pin deviation in driction.
8. the heat radiation structure of a semiconductor chip, it is characterized in that it comprises: be fixed on above the semiconductor chip radiator bearer and at the assigned position of radiator bearer, prolong formed movable axis to upside, insert above-mentioned movable axis, be provided with the radiator to the gravity direction inclination of highdensity weight hammer in geometric center to the position of heat release pin deviation in driction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410021462 CN1674266A (en) | 2004-03-25 | 2004-03-25 | Heat releasing structure for semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410021462 CN1674266A (en) | 2004-03-25 | 2004-03-25 | Heat releasing structure for semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1674266A true CN1674266A (en) | 2005-09-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410021462 Pending CN1674266A (en) | 2004-03-25 | 2004-03-25 | Heat releasing structure for semiconductor chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111223401A (en) * | 2018-11-27 | 2020-06-02 | 乐金显示有限公司 | Display device |
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2004
- 2004-03-25 CN CN 200410021462 patent/CN1674266A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111223401A (en) * | 2018-11-27 | 2020-06-02 | 乐金显示有限公司 | Display device |
| CN111223401B (en) * | 2018-11-27 | 2021-12-03 | 乐金显示有限公司 | Display device |
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