CN1661798A - Heat elimination module and preparation method - Google Patents
Heat elimination module and preparation method Download PDFInfo
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- CN1661798A CN1661798A CN 200410015528 CN200410015528A CN1661798A CN 1661798 A CN1661798 A CN 1661798A CN 200410015528 CN200410015528 CN 200410015528 CN 200410015528 A CN200410015528 A CN 200410015528A CN 1661798 A CN1661798 A CN 1661798A
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- radiator
- heat pipe
- heat
- radiation module
- metal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
Heat elimination module in use for electronic device includes a radiator and a heat pipe. The heat pipe through metal coating layer in high heat conductivity such as copper, silver and gold etc. is connected to the radiator so as to reduce integral thermal resistance of heat elimination module and raise heat-conducting property. The method for preparing the module includes following steps: first, preparing the radiator and establishing channel to accommodate heat pipe; close fitting heat pipe inside the said channel; forming a coating layer in high heat conductivity to form fixed connection between heat pipe and radiator through electroplate method.
Description
[technical field]
The present invention relates to a kind of heat radiation module that is used for the heat-generating electronic elements heat radiation, relate in particular to a kind of heat radiation module that contains heat pipe and preparation method thereof.
[background technology]
Radiator is the requisite heat radiation cooling-part of computer cpu (CPU), and along with the arithmetic speed of CPU is more and more faster, its power and caloric value also increase severely thereupon.And the space of computer housing is more and more littler, makes Design of for heat sinks also tend to the miniaturization development.
Traditional typical heat sink is the aluminium extruded type fin, this fin fabricating technology maturation, and aluminum metallic material itself is softer, is easy to processing, and with low cost.But because the softer cause of mould and aluminum metal, the thickness of aluminium extruded type radiating fin and aspect ratio must not surpass 1: 18, and the aluminum metal conductive coefficient is lower, and heat transferred speed is slow, thereby has largely limited the radiating effect of radiator.
For improving the slow shortcoming of above-mentioned radiator heat transfer rate, copper billet is applied in the radiator, and it is embedded into the central authorities of aluminum metal radiating fin, forms the radiator of aluminum bronze combination.The conductive coefficient of copper metal is very high, this radiator that combines copper and aluminium makes full use of this advantage of copper metal, utilize copper billet that heat is passed to the aluminum metal radiating fin from thermal source apace, and copper billet is to utilize principle of expanding with heat and contracting with cold to fill in aluminum metal radiating fin central authorities, do not have other at interval between the two, effectively reduce the radiator integral thermal resistance.
But this radiator still has its limitation, and promptly the position of radiator can't change, and can only be close to the surface of thermal source.This shortcoming is to be difficult to accept for notebook computer particularly for the small size cabinet.
Along with heat pipe is applied to radiator, people utilize the fireballing advantage of adopting heat pipes for heat transfer, the position of radiator, direction can be adjusted according to size, position and the direction of cabinet, make radiator can indiscriminately ad. as one wishes be arranged in the inside or the outside of computer housing, thereby ideally solved the problems referred to above.
Heat pipe mainly is by the metal sealed tube of copper, hollow in it, and be filled with hydraulic fluid, and inner tubal wall is formed with capillary structure, and its principle is to utilize phase change to conduct heat, and its heat transfer rate is very fast.Usually heat pipe is by scolding tin and the directly fixing welding of radiating fin.But directly welding only can be fixed on heat pipe the outer surface of radiating fin, makes heat pipe only have the part outer surface to contact with radiator, fails to make full use of the surface area of heat pipe.
See also Fig. 8, on January 11st, 2003 application and on July 23rd, 2003 disclosed Chinese patent application disclose a kind of heat radiation module that contains heat pipe and preparation method thereof No. 03112683.9.This heat radiation module comprises a heat pipe 12 and many radiating fins 14.The shape of this radiating fin 14 can be different shape, as tabular.Each radiating fin 14 offers coaxial perforation respectively, the quantity of perforation is identical with the quantity of heat pipe 12, its aperture is a bit larger tham the external diameter of heat pipe 12, perforated edge one side is extended with ring limit 20 outward, not have a side on ring limit against living adjacent another radiating fin 14, so make between each radiating fin 14 interval 24 that forms certain distance, increase the contact area of radiating fin 14 and air.Heat pipe 12 1 ends pass the passage that described perforation forms, and are connected to one by tack coat 26.Described tack coat 26 is silica gel or tin cream.
The preparation method of above-mentioned heat radiation module comprises the following steps: with suitable instrument these radiating fins 14 to be arranged by aforementioned manner, forms passage and interval 24; Then binding agent is painted on the inboard tack coat 26 that forms of passage; At last heat pipe 12 1 ends are penetrated in this passage, treat that heat pipe 12 and radiating fin 14 bondings are fixed as one, and promptly finish the preparation of heat radiation module.
Above-mentioned heat radiation module mainly is by binding agent that heat pipe 12 and radiating fin 14 bondings is fixing, and the shape of radiating fin 14 does not limit, the shape of heat pipe 12 also can have multiple, heat pipe 12 outer surfaces can be fully and radiating fin 14 contact with each other, so can increase heat transfer efficiency.When this heat radiation module used, the other end of heat pipe 12 was connected with the thermal source contact, the heat of thermal source can be delivered to radiating fin 14 fast through heat pipe 12, was dispersed in the air then, thereby realized the heat radiation cooling purpose.
But, be to utilize silica gel or tin cream bonding to fix between above-mentioned heat pipe and the radiating fin, and the conductive coefficient of silica gel or tin cream is respectively 3-25W/mK and 60-65W/mK, though heat pipe and radiating fin are to be made by high-termal conductivity copper metal or aluminum metal, yet, the heat radiation module that is connected to form with the series connection form between this heat pipe, binding agent and the radiating fin, its overall thermal resistance depends primarily on poor thermal conductivity, silica gel or tin cream that thermal resistance is big, so the integral heat sink performance reality of heat radiation module does not improve yet.
In view of this, provide a kind of overall thermal resistance less, heat abstractor of excellent radiation performance and preparation method thereof is real to be necessary.
[summary of the invention]
For overcoming the shortcoming that the prior art heat transfer efficiency is poor, thermal resistance is bigger, it is good to the purpose of this invention is to provide a kind of heat-transfer effect, and overall thermal resistance is less, has the heat radiation module of good heat dispersion.
Another object of the present invention provides that a kind of heat-transfer effect is good, and overall thermal resistance is less, has the preparation method of the heat radiation module of good heat dispersion.
For achieving the above object, the invention provides a kind of heat radiation module, it comprises: a radiator, and it has a plurality of radiating fins; An and heat pipe; Wherein, this heat pipe one end is to link to each other with this radiator and be fixed as one by a high-termal conductivity coat of metal.Described high-termal conductivity metal comprises copper, silver, gold or aluminium, is preferably copper; Heat pipe and radiator can have multiple link position and mode.
The present invention also provides the preparation method of above-mentioned heat radiation module, comprises the following steps:
At first, the preparation radiator, and offer the passage that holds heat pipe thereon;
Then, heat pipe is close in this passage, it is a binding combination that itself and radiator temporarily are fixedly linked;
At last, the binding of this heat pipe and radiator combination is immersed in the electrolyte, as negative electrode, electroplates the formation high-termal conductivity coat of metal between heat pipe and radiator as anode with the high-termal conductivity metal with heat pipe and radiator.
With respect to prior art, the present invention's module that dispels the heat utilizes electro-plating method to form a high-termal conductivity coat of metal between heat pipe and radiator, as coats of metal such as copper, silver, its thermal conductivity ratio tin cream or the high several times of silica gel, thereby the thermal resistance of the module integral body that reduces to dispel the heat improves heat radiation module heat conductivility greatly.Preparation method of the present invention only needs to utilize electroplating technology commonly used, technology maturation, and technology is simple, realizes easily, and is with low cost.
[description of drawings]
Fig. 1 is the schematic perspective view of the first embodiment of the present invention.
Fig. 2 is the profile of Fig. 1 along the II-II hatching line.
Fig. 3 is the schematic perspective view of second embodiment of the invention.
Fig. 4 is the profile of Fig. 3 along the IV-IV hatching line.
Fig. 5 is the schematic perspective view of third embodiment of the invention.
Fig. 6 is the cut-away view of Fig. 5 along the VI-VI hatching line.
Fig. 7 is the schematic diagram that the present invention is used to form the electroplating technology of the coat of metal.
Fig. 8 is the generalized section of prior art heat radiation module.
[embodiment]
Below in conjunction with the drawings and the specific embodiments the present invention is described in further detail.
Please consult Fig. 1 and Fig. 2 at first together, the heat radiation module 100 of first embodiment of the invention comprises an orderly radiating fin of a plurality of arrangements 120 and a heat pipe 110.The shape of described radiating fin 120 and arrangement mode are similar substantially to prior art, and concrete shape and arrangement mode are described below: the shape of radiating fin 120 is tabular, but the present invention is not as limit.Radiating fin 120 centers offer a perforation (figure does not indicate), and its diameter is bigger slightly than the external diameter of heat pipe 110, is formed with the edge 122 of vertical protrusion around this perforation.Adjacent radiating fin 120 is to arrange against the mode of living last radiating fin 120 with this edge 122, and like this, these perforation can form a passage that penetrates, but heating tube 110 inserts.The edge 122 of these radiating fins 120 promptly constitutes the inwall of this penetration channel.Be formed with a coat of metal 130 between described heat pipe 110 and this inwall, described heat pipe 110 can be fixed as one with these radiating fins 120 by this coat of metal 130, thus the heat radiation module 100 of formation present embodiment.The described coat of metal 130 is metals of high thermal conductivity coefficient, as copper (conductive coefficient is 401W/mK), silver (conductive coefficient is 429W/mK), gold (conductive coefficient is 317W/mK), aluminium (conductive coefficient is 237W/mK) etc.For conductive coefficient and cost consideration, be good generally with copper, silver, preferably select copper for use.The heat pipe 110 of present embodiment passes from radiating fin 120 centers, is surrounded by the edge 122 of radiating fin 120 fully, makes heat pipe 110 all outer surfaces that pass this passage fully to contact with edge 122, so, help increasing the heat transfer area of heat pipe 110; Because the coat of metal 130 is metal formations of high thermal conductivity coefficient, reduced the thermal resistance of heat radiation module 100 on the whole again,, improved the heat transfer and the heat dispersion of heat radiation module 100 greatly with respect to prior art.
The preparation method of this heat radiation module 100 is as follows: at first prepare radiating fin 120, and a plurality of radiating fins 120 are arranged the formation passage in a manner described; Then, heat pipe 110 is inserted in this passage, be close to inwall and temporarily that radiating fin 120 and heat pipe 110 is fixing with anchor clamps; At last, temporarily fixing heat pipe 110 and radiating fin 120 are put into electroplating bath as negative electrode, as anode, feed direct current and electroplate, form the coat of metal 130 with high-thermal conductive metal (for example copper).
Please consult Fig. 3 and Fig. 4 together, second embodiment of the invention heat radiation module 200 comprises a radiator 201 and a heat pipe 210.This radiator 201 has a base 240 and from this base 240 a plurality of radiating fins 220 that extend out.Be formed with interval 226 between the described radiating fin 220, in order to circulation of air.Described base 240 centers offer a through hole that penetrates (figure does not indicate), and its internal diameter is big slightly than the external diameter of heat pipe 210.Be formed with a coat of metal 230 between heat pipe 210 and the through-hole wall, thereby heat pipe 210 and this radiator 201 are fixed as one.The described coat of metal 230 is metals of high thermal conductivity coefficient, as copper, silver, gold, aluminium etc.Examining filter for conductive coefficient and cost, is good with copper, silver generally, preferably selects copper for use.Present embodiment penetrates insertion with heat pipe 210 from base, except that the advantage with first embodiment, also can avoid being formed centrally the edge of projection in radiating fin 220, so helps the preparation of radiating fin 220.
The dispel the heat preparation method of module 200 of this embodiment is as follows: at first prepare radiator 201, and offer the through hole that penetrates in its base 240 central authorities; Then, heat pipe 210 is inserted in this through hole, and it is temporarily fixing to be close to through-hole wall; Heat pipe 210 and radiator 201 are put into electroplating bath as negative electrode, as anode, feed direct current and electroplate, form the coat of metal 230 with the metal (for example copper) of high thermal conductivity coefficient.
Please consult Fig. 5 and Fig. 6 together, the heat radiation module 300 of third embodiment of the invention, itself and second embodiment are basic identical, comprise a radiator 301 and a heat pipe 310.Described radiator 301 has a base 340 and from this base 340 a plurality of radiating fins 320 that extend out.Be formed with interval 326 between the described radiating fin 320, in order to circulation of air.Lower surface 342 central authorities of described base 340 are formed with semi-cylindrical recesses (figure does not indicate), and described heat pipe 310 is close in this groove, and is fixed in base 340 by a coat of metal 330.Present embodiment only needs to offer semi-cylindrical recesses in base 340 lower surfaces 342, realizes easily, and its shortcoming is the contact area that this mode can reduce heat pipe 310 and base 340, but still bigger than the contact area of the direct welding manner of prior art.
The preparation method of present embodiment heat radiation module 300 is as follows: at first prepare radiator 301, and offer a groove that is shaped as semi-cylindrical in lower surface 342 centre of its base 340; Then heat pipe 310 being close in this groove, and being placed in the electroplating bath, is negative electrode with heat pipe 310 and radiator 301, is that anode is electroplated with high-termal conductivity metal (for example copper); Form the base 340 that the coat of metal 330 is fixed in heat pipe 310 in radiator 301 at last.
With first embodiment module 100 that dispels the heat is example, when the module use is dispelled the heat in the present invention, the other end of heat pipe 110 can be close to thermal source (being generally the CPU of computer), then the heat of thermal source by heat pipe 110, the coat of metal 130 be passed to the heat radiation module 100 radiating fin 120, diffuse in the air then.
See also Fig. 7, the present invention uses electro-plating method to form the schematic diagram of the coat of metal.Be filled with electrolyte 530 in the electroplating bath 500, be generally copper sulphate (CuSO
4).With the 3rd embodiment is example, and negative electrode 520 is heat pipe 310 and the radiator 301 among the embodiment, and anode 510 is a high-conductive metal, is generally the copper metal bar.After with lead negative electrode and anode being connected to power turn-on, electroplating bath generation electrochemical reaction, Cu
2+Ion is reduced to Cu in negative electrode, forms the copper coat of metal 330; The oxidized formation of the copper metal bar Cu of anode
2+Ion is dissolved in the electrolyte.
Those of ordinary skills should be understood that, the shape of the used heat pipe of the present invention, quantity and riding position thereof are not limited to the foregoing description and describe, for example: can increase heat pipe quantity, perhaps use the heat pipe of other shape or curved shape, perhaps with heat pipe arragement direction, spread pattern adjustment, the shape that need adjust heat pipe passage of living in or groove simultaneously matches with it and gets final product, and these all belong to those of ordinary skills' variation that the easy full of beard of spirit reaches according to the present invention.
Claims (14)
- One kind the heat radiation module, it comprises: a radiator, it has a plurality of radiating fins; And at least one heat pipe; It is characterized in that an end of heat pipe is that the coat of metal by a high thermal conductivity coefficient links to each other with this radiator and is fixed as one.
- 2. heat radiation module as claimed in claim 1 is characterized in that the metal of this high thermal conductivity coefficient comprises copper, silver, gold and aluminum metal.
- 3. heat radiation module as claimed in claim 1 is characterized in that the central authorities of this radiating fin offer penetrated through via holes, and this heat pipe is to penetrate to be inserted in this through hole, and the coat of metal and radiating fin by this high thermal conductivity coefficient are fixedly linked.
- 4. heat radiation module as claimed in claim 3 is characterized in that the through hole of each radiating fin is formed with the edge of vertical protrusion on every side.
- 5. heat radiation module as claimed in claim 1, it is characterized in that this radiator has a base, these radiating fins are from this base vertical extent, and this base center offers through hole, this heat pipe is to penetrate to insert in this through hole, and is fixedly linked by the coat of metal and this base of this high thermal conductivity coefficient.
- 6. heat radiation module as claimed in claim 5 is characterized in that the diameter of this through hole is bigger slightly than the external diameter of heat pipe.
- 7. heat radiation module as claimed in claim 1, it is characterized in that wherein this radiator has a base, these radiating fins are from this base vertical extent, and this base lower surface offers groove, this heat pipe is to be close in the groove, and is fixed in this groove by the coat of metal of this high thermal conductivity coefficient.
- 8. heat radiation module as claimed in claim 7 is characterized in that this groove is to be half-cylindrical.
- 9. the preparation method of the module that dispels the heat is characterized in that comprising the following steps: to prepare radiator, and offers the passage that holds heat pipe on radiator; Heat pipe is close in this passage, and it is a binding combination that itself and radiator temporarily are fixedly linked; The binding of this heat pipe and radiator combination is immersed in the electrolyte, as negative electrode, electroplates the coat of metal of formation high thermal conductivity coefficient between heat pipe and radiator as anode with the metal of high thermal conductivity coefficient with heat pipe and radiator.
- 10. the preparation method of heat radiation module as claimed in claim 9, the metal that it is characterized in that this high thermal conductivity coefficient is copper, silver, gold or aluminium.
- 11. the preparation method of heat radiation module as claimed in claim 10 is characterized in that this electrolyte contains the ion of high thermal conductivity coefficient metal.
- 12. the preparation method of heat radiation module as claimed in claim 9 is characterized in that this radiator comprises a plurality of radiating fins, described passage is to penetrate these radiating fin centers and form.
- 13. the preparation method of heat radiation module as claimed in claim 9 is characterized in that this radiator comprises a base, described passage is to penetrate this base center and form.
- 14. the preparation method of heat radiation module as claimed in claim 9 is characterized in that this radiator comprises a base, described passage is the lower surface that is opened in base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100155282A CN100358135C (en) | 2004-02-27 | 2004-02-27 | Heat elimination module and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100155282A CN100358135C (en) | 2004-02-27 | 2004-02-27 | Heat elimination module and preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1661798A true CN1661798A (en) | 2005-08-31 |
| CN100358135C CN100358135C (en) | 2007-12-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2004100155282A Expired - Fee Related CN100358135C (en) | 2004-02-27 | 2004-02-27 | Heat elimination module and preparation method |
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| CN (1) | CN100358135C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103961210A (en) * | 2013-06-09 | 2014-08-06 | 深圳市天时威电子有限公司 | Head-mounted bag-type miniature semiconductor cooling ice belt |
| CN106324027A (en) * | 2016-10-14 | 2017-01-11 | 东莞市迈泰热传科技有限公司 | Adjustable angle thermal resistance test fixture for heat pipe radiator |
| CN111326949A (en) * | 2018-12-15 | 2020-06-23 | 深圳市中光工业技术研究院 | Laser chip manufacturing method and laser chip |
| CN115461816A (en) * | 2020-04-10 | 2022-12-09 | 惠普发展公司，有限责任合伙企业 | Thermal module with solderless thermal bond |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102543219A (en) * | 2010-12-08 | 2012-07-04 | 昆山广禾电子科技有限公司 | Improved structure of heat radiating fin module |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0650796B2 (en) * | 1987-08-29 | 1994-06-29 | 日本電気株式会社 | Electronic component mounting device |
| CN2344875Y (en) * | 1998-09-30 | 1999-10-20 | 铁道部株洲电力机车研究所 | Heat pipe radiator for power semiconductor device |
| JP2001051084A (en) * | 1999-08-13 | 2001-02-23 | Nippon Alum Co Ltd | Heat sink and its production method |
| JP2002151635A (en) * | 2000-11-07 | 2002-05-24 | Fujikura Ltd | Connecting structure of metal fin to metal base |
| CN2484643Y (en) * | 2001-04-06 | 2002-04-03 | 超众科技股份有限公司 | Forming structure of radiating fins |
| CN1442900A (en) * | 2002-03-05 | 2003-09-17 | 吴鸿平 | Integrated radiator of radiating fin, heat pipe or cellular pipe, mother board metal |
| CN2572561Y (en) * | 2002-08-29 | 2003-09-10 | 建准电机工业股份有限公司 | Radiation fin combining structure |
-
2004
- 2004-02-27 CN CNB2004100155282A patent/CN100358135C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103961210A (en) * | 2013-06-09 | 2014-08-06 | 深圳市天时威电子有限公司 | Head-mounted bag-type miniature semiconductor cooling ice belt |
| CN106324027A (en) * | 2016-10-14 | 2017-01-11 | 东莞市迈泰热传科技有限公司 | Adjustable angle thermal resistance test fixture for heat pipe radiator |
| CN111326949A (en) * | 2018-12-15 | 2020-06-23 | 深圳市中光工业技术研究院 | Laser chip manufacturing method and laser chip |
| CN115461816A (en) * | 2020-04-10 | 2022-12-09 | 惠普发展公司，有限责任合伙企业 | Thermal module with solderless thermal bond |
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| Publication number | Publication date |
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| CN100358135C (en) | 2007-12-26 |
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