CN1642395A - Method for forming package protective structure - Google Patents
Method for forming package protective structure Download PDFInfo
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- CN1642395A CN1642395A CN 200410001270 CN200410001270A CN1642395A CN 1642395 A CN1642395 A CN 1642395A CN 200410001270 CN200410001270 CN 200410001270 CN 200410001270 A CN200410001270 A CN 200410001270A CN 1642395 A CN1642395 A CN 1642395A
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- protective layer
- resilient coating
- protection structure
- packaging protection
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Abstract
The invention discloses a method for forming package protecting structure of organic electro- luminescent (EL) component applied to organic electro-luminescent display (OELD), able to be completed in the same reaction cavity. It includes the below steps: placing an organic EL component in a plasma reaction cavity; forming a first buffer layer on the organic EL component; forming a first protective layer on the first buffer layer; forming a second buffer layer on the first protective layer; and forming a second protective layer on the second buffer layer.
Description
Technical field
The present invention relates to the method for the packaging protection structure of a kind of formation organic illuminating element (organic EL), relate in particular to a kind of method that is applied to the formation packaging protection structure of organic light emitting display (OLED).
Background technology
Along with the arriving of information age, display has become the necessary element of electric equipment, and for example notebook computer, mobile phone, information household electrical appliances (IA) and PDA(Personal Digital Assistant) etc. need display device mostly.In general, gently, thin, power saving is the basic demand to display, but be subject to visual angle, answer speed, brightness, picture quality and to the requirements such as stability of temperature, in a new generation's display technology, organic light emitting display element (Organic Light Emitting Device, OLED) because have self-luminosity (need not use backlight), superperformance such as the visual angle is wide, answer speed is fast, manufacturing process is simple, power consumption is low, become one of ordinary skill in the art's active research development product at present.
Because the history of organic light emitting display development is long not enough, present technology still faces some problems that remain to be broken through.Especially, aqueous vapor in the atmosphere and oxygen are easy to cause the cathode oxidation of organic light emitting display element (abbreviation organic EL) and organic compound interface phenomenon such as to peel off, make organic EL very easily produce dim spot (darkspot), not only reduce the good rate of display and the briliancy of being sent, also shortened the useful life of display simultaneously.For fear of above-mentioned defective, traditional technology is many avoids electrode layer material and organic layer material in the organic light emitting display element to contact with external environment with the packaging protection of metallic packaging jar or glass packaging jar.Yet the metallic packaging jar has Heavy Weight, easy shortcoming such as oxidized on making, the glass packaging jar have the processing of being difficult for, frangible, volume big and shortcoming such as Heavy Weight.And; the then property of metal and glass flatness poor, the element bonding place requires high again; very easily stress is uneven and cause and peel off phenomenon in the encapsulation, moreover along with the trend that adopts plastic base to make organic EL, may not re-use metal or glass packaging protection structure in the future.Therefore, reach lighter, thinner in order to make organic EL, and the development that adapts to following overall plasticization of organic EL, the packaging protection structure plating mode that compactness is high should be actively to strengthen the emphasis of research and development.
See also Fig. 1, this figure is the sectional schematic diagram of existing organic EL encapsulating structure.As shown in Figure 1, organic EL 10 generally includes a substrate 101, one first conductive layer 102, a luminous organic material sandwich construction 103, one second conductive layer 104.Wherein, substrate 101 is generally glass substrate or metal substrate; first conductive layer 102 is tin indium oxide (ITO) conductive transparent film or indium zinc oxide (IZO) film; 104 of second conductive layers can be metal or metallic compound or tin indium oxide (ITO) conductive transparent film or indium zinc oxide (IZO) film etc.; for electrode layer material and the organic layer material that blocks in the organic light emitting display element contacts with external environment; must form a packaging protection structure 11 on organic EL 10, below be the steps necessary that traditional organic EL forms the packaging protection structure:
At first; utilize the heat sublimation mode plating as the macromolecular material of acryl precursor and so on organic EL 10; make high molecular polymerization form one first resilient coating 111 in the irradiation mode; and utilize sputter (sputtering) or chemical vapor deposition (CVD) method; in reaction cavity, form first protective layer (passivation) 112 with inorganic or ceramic material; this protective layer is filled up fully on first resilient coating 111; substrate 101 is recycled to the macromolecule deposition chamber, forms one second resilient coating 113 again on first protective layer 112.Then, whole base plate 101 is sent back in the reaction cavity of inorganic or ceramic material, form second protective layer (passivation) 114 on second resilient coating 113, the demand of looking is again made sandwich construction repeatedly.
In the process of making packaging protection structure 11; because whole base plate 101 must back and forth transmit between the heat sublimation cavity of the reaction cavity of making protective layer and making resilient coating; manufacturing process is complicated, if element upper plate luminous (Top emission) type element need consider then whether irradiation can impact organic material.
So, how to come easier, the lower-cost packaging protection structure of designing and manufacturing technique at organic EL, the problem that should be studied at present really.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of method that forms the packaging protection structure of organic EL; this method can be finished the manufacture process of packaging protection structure in same reaction cavity; and can be applicable to have glass substrate, the organic illuminating element of metal substrate and plastic base, and make the packaging protection structure (passivation layer) of organic illuminating element (organic EL) lighter, thinner and compactness is high.
In view of the above, the method that is applied to the formation packaging protection structure on the organic light emitting display (OLED) provided by the present invention comprises: organic illuminating element is placed in the plasma reaction chamber, utilize plasma reinforced chemical vapour deposition (PECVD) method on organic illuminating element, to form one first resilient coating (buffer layer), and need be with the irradiation mode with the macromolecule precursor cures; On first resilient coating, form one first protective layer (passivation layer); On first protective layer, form one second resilient coating (bufferlayer); And on second resilient coating, form one second protective layer (passivation layer).Wherein, first resilient coating, first protective layer, second resilient coating and second protective layer all form in the plasma polymerization mode in same plasma reaction chamber.
According to design of the present invention, wherein the plasma polymerization method can be plasma reinforced chemical vapour deposition (PECVD) or high density plasma chemical vapor deposition (HDPCVD) or induces in conjunction with PCVD chemical gaseous phase depositing process such as (ICPCVD).
According to design of the present invention, when wherein forming resilient coating and protective layer, look surface treatment (surface treatment) step or cleaning step (self-clean) that process requirements can be carried out organic element or resilient coating or protective layer.
According to design of the present invention, wherein first protective layer and second protective layer are made of class diamond carbon film (Diamond-like Carbon) material.
According to design of the present invention, wherein first resilient coating and second resilient coating are the macromolecule membrane that forms with the macromolecule precursor, and described macromolecule precursor can be selected from styrene (Styrene), acetylene (Acetylene), ethene (Ethylene) or toluene (Methylbenzene, C
6H
5CH
3One of), form as polymer electrolyte diamond-like carbon film film macromolecule membranes such as (Polymer like Diamond-like Carbon).
According to design of the present invention, wherein organic illuminating element can be passive organic illuminating element, also can be active organic illuminating element.And can be luminous active organic illuminating element or luminous active organic illuminating element down up.
According to design of the present invention, wherein organic illuminating element comprises: a substrate; One is formed at first conductive layer on the substrate; One is formed at the luminous organic material sandwich construction on first conductive layer; One is formed at second conductive layer on the luminous organic material sandwich construction.
According to design of the present invention, wherein substrate can be glass substrate or plastic substrate.
Description of drawings
Fig. 1 is existing organic EL encapsulating structure sectional schematic diagram;
Fig. 2 A to 2D is the formation packaging protection structural approach flow chart of the preferred embodiment for the present invention.
Description of reference numerals
Organic EL 10 substrates 101
First conductive layer, 102 luminous organic material sandwich constructions 103
Second conductive layer, 104 packaging protection structures 11
First resilient coating, 111 first protective layers 112
Second resilient coating, 113 second protective layers 114
Organic illuminating element 20 packaging protection structures 21
First resilient coating, 211 first protective layers 212
Second resilient coating, 213 second protective layers 214
Embodiment
The method of formation packaging protection structure provided by the invention is applied on the organic illuminating element (organic EL).Organic illuminating element is divided into two kinds of passive type and active formulas haply, though below further specify technical scheme of the present invention with the passive type organic illuminating element as execution mode, yet other organic illuminating element, for example luminous down or luminous up active organic light-emitting element all are suitable for.In addition, to the organic illuminating element substrate also without limits, glass substrate or plastic base all can be applicable in the technical scheme of the present invention.
See also Fig. 2 A to 2D, these accompanying drawings are the flow chart of the formation packaging protection structural approach of the preferred embodiment for the present invention.Shown in Fig. 2 A; at first; one passive type organic illuminating element 20 is positioned over (not shown) in the plasma reaction cavity; on organic illuminating element 20, form one first resilient coating 211; then shown in Fig. 2 B; utilize the plasma polymerization mode, on first resilient coating 211, fill up forming first protective layer 212.Next, shown in Fig. 2 C, in same plasma reaction chamber, utilize plasma polymerization mode (plasma polymerlization) once more, on first protective layer 212, form second resilient coating 213.Afterwards, shown in Fig. 2 D, form second protective layer 214 in the plasma polymerization mode once more, optionally can repeat the making of resilient coating and protective layer.If need composition (pattern), then can utilize mask (shadow mask) will not need the part of plating to block (not shown), so finish the manufacture process of whole packaging protection structure 21.
In the manufacture process of packaging protection structure 21, that plasma polymerization mode used in the present invention adopts is plasma reinforced chemical vapour deposition method (PECVD), with methane (CH
4) or toluene (Methylbenzene, C
6H
5CH
3) or C
4F
8Deng for key reaction gas; in plasma reaction chamber; form first protective layer 212 and second protective layer 214; employed material is diamond-like-carbon (Diamond-like Carbon); in addition; in manufacture process; also can adjust different parameters according to demand as needs; some metal material for example mixes; titanium (Ti) for example; niobium (Nb); tantalum (Ta); chromium (Cr); molybdenum (Mo); tungsten (W); ruthenium (Ru); iron (Fe); cobalt (Co); nickel (Ni); aluminium (Al); copper (Cu); gold (Au); silver (Ag) etc.; or some nonmetallic materials of mixing, for example III-V family element etc. in silicon (Si) atom etc. or the periodic table.Certainly, other plasma polymerization mode also can be applicable in the technical scheme of the present invention, for example high density plasma CVD method (HDPCVD) etc.In addition, the material of employed formation first resilient coating 211 and second resilient coating 213 can adopt macromolecule precursor (precursor) to be used as reacting gas among the present invention, wherein, described macromolecule precursor can be selected from for example styrene (Styrene), acetylene (Acetylene), ethene (Ethylene) or toluene (Methylbenzene, C
6H
5CH
3) or C
4F
8One of; form macromolecule membrane; as polymer electrolyte diamond-like carbon film (Polymer likeDiamond-like Carbon) etc., so that first resilient coating 211 and second resilient coating 213 can form in same plasma reaction chamber with first protective layer 212 and second protective layer 214.Certainly, if needed, also can on second protective layer 214, form another resilient coating (not shown) again, add another protective layer (not shown) afterwards, so that organic illuminating element 20 is further isolated with external environment.
Technical scheme of the present invention mainly is to form first resilient coating 211, first protective layer 212, second resilient coating 213 and second protective layer 214 respectively in regular turn by means of the plasma polymerization method on the surface of organic illuminating element 20 in same plasma reaction chamber.So, just, traditional organic illuminating element 20 can be overcome and the shortcoming that is just formed the packaging protection structure must be between the differential responses cavity, back and forth transported.In addition, if want to improve the cleannes of packaging protection structure, before carrying out each plasma polymerization operation, reaction cavity inside can be carried out cleaning step (self-clean) earlier, so, can guarantee the cleaning of packaging protection structure.
Because; the purpose of manufacturing and encapsulation protection structure (passivation) 21 is exactly that organic layer material in the organic illuminating element 20 and electrode layer material and external environment are isolated fully; therefore employed material also need effectively be discharged the heat energy that organic illuminating element works long hours and produced, and preferably uses density high and have the material of thermal conductive resin again on the material of packaging protection structure.Diamond-like carbon film used in the present invention (DLC) is compared to present general employed organic material or ceramic material, have preferable attrition resistance and high thermal conductivity, simultaneously moisture also there is lower penetration by water rate, and along with the difference of preparation method, impurity and parameter, the characteristic of diamond-like-carbon can be by the minimum soft macromolecule membrane of stress to noncrystalline diamond-like carbon film hard or extreme hardness, and its color all can to transparent by brown.Therefore, of the present inventionly can effectively completely cut off contacting of organic illuminating element and external environment by the formed packaging protection structure of diamond like carbon material with carbon element.In addition, the outermost layer of packaging protection structure 21 of the present invention is formed second protective layer 214 of diamond like carbon material with carbon element, also can increase the attrition resistance of organic illuminating element 20, makes that the life-span of organic illuminating element 20 is more permanent.
In sum; technical scheme of the present invention is to utilize plasma polymerization method and diamond like carbon material with carbon element to form first protective layer and second protective layer; in same plasma reaction chamber, form resilient coating with plasma polymerization method and macromolecule precursor material again between two protective layers; to absorb the stress between first protective layer and second protective layer; make whole packaging protection structure (passivation) be able in same reaction cavity, make; overcome traditional organic illuminating element shortcoming that repetitiousness transports between reaction cavity; make manufacturing step simple; reduced manufacturing cost, and can effectively realize isolated organic illuminating element and external environment contact completely cut off.Add; density height, the electrical insulation capability of the packaging protection structure of diamond like carbon material with carbon element (passivation layer) is good, heat conductivity is good, the abrasion resisting performance is good, high rigidity, corrosion resistance are good; these all meet the demand of packaging protection structure; therefore, technical scheme of the present invention is a kind of practicality, novelty and progressive technical scheme for the packaging protection structure manufacturing process of organic illuminating element.
Remodeling that those skilled in the art make in design of the present invention and protection range and modification all will fall into the scope that appended claims is asked for protection.
Claims (10)
1. method that is applied to the formation packaging protection structure of organic light emitting display, this method comprises the steps:
In a plasma reaction cavity, place an organic illuminating element;
On described organic illuminating element, form one first resilient coating;
On described first resilient coating, form one first protective layer;
On described first protective layer, form one second resilient coating; And
On described second resilient coating, form one second protective layer.
2. the method for formation packaging protection structure as claimed in claim 1 wherein, repeats to make described resilient coating and protective layer, and described resilient coating and protective layer formation order can be adjusted.
3. the method for formation packaging protection structure as claimed in claim 1, wherein, described first resilient coating, first protective layer, second resilient coating and second protective layer form with the plasma polymerization method in same plasma reaction chamber.
4. the method for formation packaging protection structure as claimed in claim 3; wherein, described plasma polymerization method comprises plasma reinforced chemical vapour deposition method, high density plasma chemical vapor deposition method and induces in conjunction with one of plasma chemical vapor deposition process.
5. the method for formation packaging protection structure as claimed in claim 1 wherein, comprises a surface treatment or a cleaning step.
6. the method for formation packaging protection structure as claimed in claim 1, wherein, described first protective layer and second protective layer are formed by the diamond-like-carbon membrane material.
7. the method for formation packaging protection structure as claimed in claim 1, wherein, described first resilient coating and second resilient coating comprise the macromolecule membrane that forms with the macromolecule precursor.
8. the method for formation packaging protection structure as claimed in claim 7, wherein, described macromolecule precursor is selected from styrene, acetylene, ethene or toluene or C
4F
8One of.
9. the method for formation packaging protection structure as claimed in claim 1, wherein, described organic illuminating element is a kind of passive type organic illuminating element or active organic light-emitting element.
10. the method for formation packaging protection structure as claimed in claim 1, wherein, described organic illuminating element comprises:
One substrate;
One is formed at first conductive layer on the described substrate;
One is formed at the luminous organic material sandwich construction on described first conductive layer; And
One is formed at second conductive layer on the described luminous organic material sandwich construction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100012700A CN1328936C (en) | 2004-01-05 | 2004-01-05 | Method for forming package protective structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100012700A CN1328936C (en) | 2004-01-05 | 2004-01-05 | Method for forming package protective structure |
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| Publication Number | Publication Date |
|---|---|
| CN1642395A true CN1642395A (en) | 2005-07-20 |
| CN1328936C CN1328936C (en) | 2007-07-25 |
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ID=34867083
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100012700A Expired - Fee Related CN1328936C (en) | 2004-01-05 | 2004-01-05 | Method for forming package protective structure |
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| Country | Link |
|---|---|
| CN (1) | CN1328936C (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1971940B (en) * | 2005-11-22 | 2010-05-19 | 精工爱普生株式会社 | Light-emitting device and electronic apparatus |
| CN105679969A (en) * | 2016-03-17 | 2016-06-15 | 深圳市华星光电技术有限公司 | Package method of organic light-emitting diode (OLED) device and an OLED package structure |
| CN106654045A (en) * | 2016-12-19 | 2017-05-10 | 武汉华星光电技术有限公司 | OLED (Organic Light Emitting Diode) encapsulation method and OLED encapsulation structure |
| WO2018113005A1 (en) * | 2016-12-19 | 2018-06-28 | 武汉华星光电技术有限公司 | Oled packaging method and oled packaging structure |
| WO2020237753A1 (en) * | 2019-05-28 | 2020-12-03 | 深圳市华星光电半导体显示技术有限公司 | Organic light-emitting diode display panel and encapsulation method therefor |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6146225A (en) * | 1998-07-30 | 2000-11-14 | Agilent Technologies, Inc. | Transparent, flexible permeability barrier for organic electroluminescent devices |
| US7288420B1 (en) * | 1999-06-04 | 2007-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing an electro-optical device |
| US6605826B2 (en) * | 2000-08-18 | 2003-08-12 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and display device |
-
2004
- 2004-01-05 CN CNB2004100012700A patent/CN1328936C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1971940B (en) * | 2005-11-22 | 2010-05-19 | 精工爱普生株式会社 | Light-emitting device and electronic apparatus |
| CN105679969A (en) * | 2016-03-17 | 2016-06-15 | 深圳市华星光电技术有限公司 | Package method of organic light-emitting diode (OLED) device and an OLED package structure |
| CN106654045A (en) * | 2016-12-19 | 2017-05-10 | 武汉华星光电技术有限公司 | OLED (Organic Light Emitting Diode) encapsulation method and OLED encapsulation structure |
| WO2018113007A1 (en) * | 2016-12-19 | 2018-06-28 | 武汉华星光电技术有限公司 | Oled encapsulation method and oled encapsulation structure |
| WO2018113005A1 (en) * | 2016-12-19 | 2018-06-28 | 武汉华星光电技术有限公司 | Oled packaging method and oled packaging structure |
| US20190157616A1 (en) * | 2016-12-19 | 2019-05-23 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Oled package method and oled package structure |
| CN106654045B (en) * | 2016-12-19 | 2019-12-24 | 武汉华星光电技术有限公司 | OLED packaging method and OLED packaging structure |
| WO2020237753A1 (en) * | 2019-05-28 | 2020-12-03 | 深圳市华星光电半导体显示技术有限公司 | Organic light-emitting diode display panel and encapsulation method therefor |
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| Publication number | Publication date |
|---|---|
| CN1328936C (en) | 2007-07-25 |
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Granted publication date: 20070725 Termination date: 20190105 |