CN1328936C - Method for forming package protective structure - Google Patents

Method for forming package protective structure Download PDF

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CN1328936C
CN1328936C CN 200410001270 CN200410001270A CN1328936C CN 1328936 C CN1328936 C CN 1328936C CN 200410001270 CN200410001270 CN 200410001270 CN 200410001270 A CN200410001270 A CN 200410001270A CN 1328936 C CN1328936 C CN 1328936C
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protective
organic light
layer
light emitting
forming
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CN 200410001270
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CN1642395A (en
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陈光荣
蔡耀铭
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统宝光电股份有限公司
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Abstract

本发明公开了一种形成应用于有机发光显示器(OLED)上的有机发光元件(有机EL元件)的封装保护结构的方法,该方法可在同一反应腔体中完成。 The present invention discloses a method for packaging an organic light emitting element of the protective structure (organic EL element) on the organic light emitting display (OLED) applied to the formation, the process can be completed in the same reaction chamber. 其包括下述步骤:将一有机发光元件置于一等离子体反应腔体内;在有机发光元件上形成一第一缓冲层;在第一缓冲层上形成一第一保护层;在第一保护层上形成一第二缓冲层;以及在第二缓冲层上形成一第二保护层。 Comprising the steps of: an organic light emitting element is placed in a plasma reaction chamber; a first buffer layer formed on the organic light emitting element; a first protective layer formed on the first buffer layer; a first protective layer a second buffer layer formed; and forming a second protective layer on the second buffer layer.

Description

形成封装保护结构的方法 The method of forming a package of the protective structure

技术领域 FIELD

本发明涉及一种形成有机发光元件(有机EL元件)的封装保护结构的方法,尤其涉及一种应用于有机发光显示器(OLED)的形成封装保护结构的方法。 The present invention relates to a method for encapsulating an organic light emitting element of the protective structure (organic EL element) is formed, in particular, relates to a method of packaging the protective structure is formed organic light emitting display (OLED) is applied.

背景技术 Background technique

随着信息时代的来临,显示器已成为电气设备的必要元件,例如笔记型电脑、移动电话、资讯家电(IA)以及个人数字助理(PDA)等,大多需要显示器元件。 With the advent of the information age, displays have become an essential element of electrical equipment, such as notebook computers, mobile phones, information appliances (IA) and personal digital assistants (PDA), etc., most of them require the display elements. 一般来说,轻、薄、省电是对显示器的基本要求,但受限于视角、应答速度、亮度、图像质量以及对温度的稳定性等要求,新一代显示器技术中,有机发光显示器元件(Organic Light Emitting Device,OLED)由于具有自发光性(不需使用背光源)、视角广、应答速度快、制造工艺简单、耗电低等良好特性,目前已成为所属领域技术人员积极研究开发的产品。 In general, light, thin, power-saving is a basic requirement of the display, but limited viewing angle, response speed, brightness, image quality and the stability of the temperature requirements, a new generation of display technologies, an organic light emitting display device ( Organic Light emitting Device, OLED) (without using a backlight), wide viewing angle, fast response speed, simple manufacturing process, low power consumption good characteristics, has become ordinary skill in the art of active research and development because of the self-emitting products .

由于有机发光显示器发展的历史还不够长,目前的技术尚面临一些有待突破的问题。 Due to historical development of organic light emitting display is not long enough, the current technology still faces some problems to be breakthroughs. 尤其是,大气中的水气与氧气很容易造成有机发光显示器元件(简称有机EL元件)的阴极氧化以及有机化合物介面剥离等现象,使得有机EL元件极易产生暗点(darkspot),不但降低显示器的良好率以及所发出的辉度,同时亦缩短了显示器的使用寿命。 In particular, atmospheric oxygen, moisture and oxidation of a cathode phenomenon is likely to cause organic light emitting display device (organic EL element referred to), and an organic compound interface peeling, so that the organic EL element is easy to produce dark spots (darkspot), not only reduces the display good rates and luminance emitted, but also shorten the life of the display. 为了避免上述缺陷,传统的技术多以金属封装罐或玻璃封装罐的封装保护来避免有机发光显示器元件中的电极层材料以及有机层材料与外界环境接触。 In order to avoid the above drawbacks, conventional encapsulation techniques to protect the plurality of metal packaging cans or glass packaging can be avoided electrode material layer in the organic light emitting display device and an organic material layer in contact with the external environment. 然而,金属封装罐在制造上具有重量重、易被氧化等缺点,玻璃封装罐具有不易加工、易碎、体积大以及重量重等缺点。 However, the metal packaging can have a heavy weight, disadvantages susceptible to oxidation and the like, can not easily processed glass package, fragile, bulky and heavy weight disadvantages in manufacturing. 而且,金属与玻璃的接着性差、元件粘合处的平坦度要求又高,封装上极易因应力不均而造成剥离现象,况且随着采用塑料基板来制作有机EL元件的趋势,将来可能不再使用金属或玻璃封装保护结构。 Furthermore, metal and glass Next poor flatness requirements and high at the bonding element, the package vulnerable to stresses caused by uneven peeling Moreover, as the trend to use a plastic substrate made of an organic EL element, in the future may not re-encapsulated using a metal or glass protective structure. 因此,为了能够使有机EL元件达到更轻、更薄,以及适应未来有机EL元件全塑化的发展,致密性高的封装保护结构镀覆方式应是积极加强研究发展的重点。 Accordingly, in order to achieve the organic EL element can be lighter, thinner, and future-proof plasticized whole organic EL element, high denseness protective structure encapsulation plating should be positive way to strengthen the focus of research and development.

请参阅图1,该图为现有的有机EL元件封装结构的断面示意图。 Please refer to FIG. 1, a schematic cross section of a conventional organic EL device package structure of the graph. 如图1所示,有机EL元件10通常包括一基板101、一第一导电层102、一有机发光材料多层结构103、一第二导电层104。 As shown, the organic EL element 10 generally includes a substrate 101, a first conductive layer 102, an organic light emitting material, a multilayer structure 103, a second conductive layer 1041. 其中,基板101通常为玻璃基板或金属基板,第一导电层102为氧化铟锡(ITO)导电透明膜或氧化铟锌(IZO)薄膜,第二导电层104则可为金属或金属化合物或氧化铟锡(ITO)导电透明膜或氧化铟锌(IZO)薄膜等,为了阻绝有机发光显示器元件中的电极层材料以及有机层材料与外界环境接触,必须形成一封装保护结构11于有机EL元件10上,以下为传统有机EL元件形成封装保护结构的必要步骤:首先,利用热升华方式将如丙稀酸(酯)前体之类的高分子材料镀着在有机EL元件10上,以照光方式使高分子聚合形成一第一缓冲层111,并利用溅射(sputtering)或化学气相沉积(CVD)方法,在反应腔体中以无机或陶瓷材料形成第一保护层(passivation)112,该保护层完全填补于第一缓冲层111上,将基板101回送至高分子沉积腔体,再形成一第二缓冲层113于第一保护层112上。 Wherein the substrate 101 is generally a glass substrate or a metal substrate, a first conductive layer 102 is indium tin oxide (ITO) transparent conductive film or an indium zinc oxide (IZO) oxide film, a second conductive layer 104 may be a metal oxide or a metal compound or indium tin oxide (ITO) conductive transparent film or indium zinc oxide (IZO) film, etc., in order to block the electrode layer material for the organic light emitting display element and an organic layer material with the external environment in contact, necessary to form a package protecting structure 11 of the organic EL element 10 , the following necessary steps to form the package structure is protected by a conventional organic EL element: first, a polymer material such as dye sublimation manner acrylic (ester) precursor and the like plating on the organic EL element 10, in a light type the polymer polymerized to form a first buffer layer 111, and by sputtering (sputtering) or chemical vapor deposition (CVD) method, in a reaction chamber to form a first ceramic material or an inorganic protective layer (passivation) 112, the protective on the first layer is completely fill the buffer layer 111, the substrate 101 back to the polymer deposition chamber, and then a second buffer layer 113 is formed on the first protective layer 112. 接着,将整个基板101传送回无机或陶瓷材料的反应腔体中,形成第二保护层(passivation)114于第二缓冲层113上,再视需求反复制作多层结构。 Subsequently, the entire substrate 101 is transferred back to the reaction chamber or an inorganic ceramic material, a second protective layer (passivation) 114 on the second buffer layer 113, and then repeated as needed to produce the multilayered structure.

在制作封装保护结构11的过程中,由于整个基板101必须在制作保护层的反应腔体与制作缓冲层的热升华腔体间往复传送,制造工艺较复杂,元件若为上板发光(Top emission)型元件则需考虑到照光是否会对有机材料造成影响。 In the process of making the package 11 of the protective structure, since the entire substrate 101 to be reciprocally transferred between the sublimation chamber and the reaction chamber making the buffer layer made of the protective layer, the manufacturing process is relatively complicated, the light emitting element when the upper plate (Top emission ) device need to consider whether the illumination would affect the organic material.

所以,如何针对有机EL元件来设计制造工艺较简便、成本较低的封装保护结构,的确是目前应加以研究的课题。 Therefore, how to design for the organic EL element manufacturing process is relatively simple, low-cost package protection structure is indeed subject should be studied.

发明内容 SUMMARY

本发明要解决的技术问题是提供一种形成有机EL元件的封装保护结构的方法,该方法可在同一反应腔体中完成封装保护结构的制造过程,且可应用于具有玻璃基板、金属基板以及塑料基板的有机发光元件,并使有机发光元件(有机EL元件)的封装保护结构(passivation layer)更轻、更薄以及致密性高。 The present invention is to solve the technical problem is to provide a method for encapsulating the organic EL element of the guard structure is formed, the method may complete fabrication of the package structure is protected in the same reaction chamber, and may be applied to a glass substrate, a metal substrate, and the organic light emitting device plastic substrate, and the organic light emitting element (organic EL element) that is packaged protective structure (passivation layer) lighter, thinner and high denseness.

据此,本发明所提供的应用于有机发光显示器(OLED)上的形成封装保护结构的方法包括:将有机发光元件置于等离子体反应腔体内,利用等离子增强化学气相沉积(PECVD)方法在有机发光元件上形成一第一缓冲层(buffer layer),而不需用照光方式将高分子前体固化;在第一缓冲层上形成一第一保护层(passivation layer);在第一保护层上形成一第二缓冲层(bufferlayer);以及在第二缓冲层上形成一第二保护层(passivation layer)。 Accordingly, the method of forming a package of the protective structure applied to the organic light emitting display (OLED) according to the present invention include: an organic light emitting element is placed in a plasma reaction chamber by plasma enhanced chemical vapor deposition (PECVD) method in an organic a first light emitting element is formed on the buffer layer (buffer layer), without the required light type curing the polymer precursor; forming a first protective layer (passivation layer) on the first buffer layer; on the first protective layer forming a second buffer layer (bufferlayer); and forming a second protective layer (passivation layer) on the second buffer layer. 其中,第一缓冲层、第一保护层、第二缓冲层以及第二保护层都在同一等离子体反应腔体内以等离子体聚合方式形成。 Wherein the first buffer layer, a first protective layer, a second buffer layer, and a second protective layer is formed in a plasma polymerization in the same manner as the plasma reaction chamber.

根据本发明的构思,其中等离子体聚合方法可为等离子增强化学气相沉积(PECVD)或高密度等离子化学气相沉积(HDPCVD)或诱导结合等离子化学气相沉积(ICPCVD)等化学气相沉积方法。 According to the inventive concept, wherein the plasma polymerization process may be a plasma enhanced chemical vapor deposition (PECVD), or high density plasma chemical vapor deposition (HDPCVD) or Inductively Coupled Plasma Chemical Vapor Deposition (ICPCVD) chemical vapor deposition method.

根据本发明的构思,其中形成缓冲层与保护层时,视工艺需求可进行有机元件或缓冲层或保护层的表面处理(surface treatment)步骤或清洗步骤(self-clean)。 According to the inventive concept, wherein the buffer layer and the protective layer is formed, depending on the process requirements may be surface-treated (surface treatment) step or a cleaning step (self-clean) element or an organic buffer layer or the protective layer is performed.

根据本发明的构思,其中第一保护层以及第二保护层由类金钢石碳膜(Diamond-like Carbon)材料构成。 According to the inventive concept, wherein the first protective layer and the second protective layer is made of diamond-like carbon film (Diamond-like Carbon) material.

根据本发明的构思,其中第一缓冲层与第二缓冲层为以高分子前体形成的高分子薄膜,且所述高分子前体可选自苯乙烯(Styrene)、乙炔(Acetylene)、乙烯(Ethylene)或甲苯(Methylbenzene,C6H5CH3)之一,形成如高分子型类金刚石碳膜薄膜(Polymer like Diamond-like Carbon)等高分子薄膜。 According to the inventive concept, wherein the first buffer layer and second buffer layer is a polymer precursor to a polymer film is formed, and the polymer precursors can be selected from styrene (Styrene), acetylene (Acetylene), ethylene (Ethylene) or toluene (methylbenzene, C6H5CH3), one of a polymer film is formed as diamond-like carbon film polymer (polymer like diamond-like Carbon) and the like.

根据本发明的构思,其中有机发光元件可为无源有机发光元件,亦可为有源有机发光元件。 According to the inventive concept, wherein the organic light emitting element may be a passive organic light emitting element, the organic light emitting element may also be active. 且可为朝下发光的有源有机发光元件或朝上发光的有源有机发光元件。 The organic light emitting element may be active and an active organic light emitting element emits light downward or upward emission.

根据本发明的构思,其中有机发光元件包括:一基板;一形成于基板上的第一导电层;一形成于第一导电层上的有机发光材料多层结构;一形成于有机发光材料多层结构上的第二导电层。 According to the inventive concept, wherein the organic light emitting element comprising: a substrate; a first conductive layer formed on a substrate; an organic light emitting material is a multilayer structure formed on the first conductive layer; forming a multilayer organic light-emitting material a second conductive layer on the structure.

根据本发明的构思,其中基板可为玻璃基板或塑胶基板。 According to the inventive concept, in which the substrate may be a glass substrate or a plastic substrate.

附图说明 BRIEF DESCRIPTION

图1为现有的有机EL元件封装结构断面示意图;图2A至2D为本发明优选实施方式的形成封装保护结构方法流程图。 FIG 1 is a conventional organic EL device package structure schematic cross sectional view; FIGS. 2A to 2D for forming a package of the present method of protecting structure flowchart of a preferred embodiment of the invention.

附图标记说明有机EL元件 10 基板 101 SIGNS LIST 10 substrate the organic EL element 101 to the accompanying drawings

第一导电层 102 有机发光材料多层结构 103第二导电层 104 封装保护结构 11第一缓冲层 111 第一保护层 112第二缓冲层 113 第二保护层 114有机发光元件 20 封装保护结构 21第一缓冲层 211 第一保护层 212第二缓冲层 213 第二保护层 214具体实施方式本发明提供的形成封装保护结构的方法应用于有机发光元件(有机EL元件)上。 The organic light emitting element 114 of the first conductive layer 102 of organic light emitting material a multilayer structure 103 of the second conductive layer 104 of the first package 11 protecting structure 111 of the first buffer layer a second buffer layer 112, protective layer 113, a second protective layer 20 of encapsulation structure 21 is protected the method of forming a package structure of a protective buffer layer 211 of the first protective layer a second buffer layer 212 protective layer 213 of the second embodiment of the present invention 214 is applied to provide the organic light emitting element (organic EL element). 有机发光元件大致上分为无源式与有源式两种,以下虽以无源式有机发光元件作为实施方式进一步说明本发明的技术方案,然而其它有机发光元件,例如朝下发光或是朝上发光的有源式有机发光元件均适用。 The organic light emitting device would be divided into two kinds of active and passive, to further illustrate the technical solutions of the present invention is the following although a passive organic light emitting device as an embodiment, however, other organic light emitting element, for example down towards the light emitting or active matrix organic light emitting element emitting apply. 此外,对有机发光元件基板也没有限制,玻璃基板或塑料基板皆可应用于本发明的技术方案中。 Further, there is no limitation on the organic light emitting element substrate, a glass substrate or a plastic substrate applied Jieke aspect of the present invention.

请参见图2A至2D,这些附图为本发明优选实施方式的形成封装保护结构方法的流程图。 See Figs. 2A to 2D, a flowchart of a method of forming a package of these figures the preferred embodiment of the protective structure of the present invention. 如图2A所示,首先,将一无源式有机发光元件20放置于一等离子体反应腔体内(未示出),在有机发光元件20上形成一第一缓冲层211,接着如图2B所示,利用等离子体聚合方式,在第一缓冲层211上填补形成第一保护层212。 2A, first, a passive matrix organic light emitting element 20 is placed in a plasma reaction chamber (not shown), a first buffer layer 211 is formed on the organic light emitting element 20, then as shown in FIG. 2B shown, by a plasma polymerization method, a first buffer layer 211 on the first protective layer 212 is formed to fill. 接下来,如图2C所示,在同一等离子体反应腔体内,再次利用等离子体聚合方式(plasma polymerlization),在第一保护层212上形成第二缓冲层213。 Subsequently, as shown in FIG. 2C, in the same plasma reaction chamber, again using a plasma polymerization method (plasma polymerlization), the second buffer layer 213 is formed on the first protective layer 212. 之后,如图2D所示,再次以等离子体聚合方式形成第二保护层214,视需要可重复缓冲层与保护层的制作。 Thereafter, as shown in FIG. 2D, a plasma polymerization method again to form a second protective layer 214, may be repeated as needed buffer layer and the protective layer is produced. 若需构图(pattern),则可利用掩模(shadow mask)将不需镀覆的部分挡住(未图示),如此完成整个封装保护结构21的制造过程。 For patterning (pattern), you may use a mask (shadow mask) the blocking portion without plating (not shown), thus to complete the entire manufacturing process of the package 21 of the protective structure.

在封装保护结构21的制造过程中,本发明所使用的等离子体聚合方式采用的是等离子增强化学气相沉积法(PECVD),以甲烷(CH4)或甲苯(Methylbenzene,C6H5CH3)或C4F8等为主要反应气体,在等离子体反应腔体中,形成第一保护层212以及第二保护层214,所使用的材料为类金刚石碳(Diamond-like Carbon),此外,在制造过程中,如需要还可根据需求调整不同参数,譬如掺杂某些金属材料,例如钛(Ti)、铌(Nb)、钽(Ta)、铬(Cr)、钼(Mo)、钨(W)、钌(Ru)、铁(Fe)、钴(Co)、镍(Ni)、铝(Al)、铜(Cu)、金(Au)、银(Ag)等,或掺杂某些非金属材料,例如硅(Si)原子等或者周期表内III-V族元素等。 In the fabrication of the package protected structure 21, the plasma polymerization method used in the present invention uses a plasma enhanced chemical vapor deposition (PECVD), methane (CH4) or toluene (Methylbenzene, C6H5CH3), or the like C4F8 as the main reaction gas in a plasma reaction chamber, forming a first protective layer 212 and the second protective layer 214, the material used is a diamond-like carbon (diamond-like carbon), in addition, in the manufacturing process, as may be required in accordance with We need to adjust various parameters, such as certain metal-doped materials, such as titanium (Ti), niobium (Nb), tantalum (Ta), chromium (Cr), molybdenum (Mo), tungsten (W), ruthenium (Ru), iron (Fe), cobalt (Co), Nickel (Ni), aluminum (Al), copper (Cu), gold (Au), silver (Ag), etc., or doped with certain non-metallic material, such as silicon (Si) atoms or the like in the periodic table group III-V element or the like. 当然,其它等离子体聚合方式亦可应用于本发明的技术方案中,例如高密度等离子体化学气相沉积法(HDPCVD)等。 Of course, also be applied to other plasma polymerization method aspect of the present invention, such as high density plasma chemical vapor deposition (HDPCVD) and the like. 此外,本发明中所使用的形成第一缓冲层211与第二缓冲层213的材料可采用高分子前体(precursor)当作反应气体,其中,所述高分子前体可选自例如苯乙烯(Styrene)、乙炔(Acetylene)、乙烯(Ethylene)或甲苯(Methylbenzene,C6H5CH3)或C4F8之一,形成高分子薄膜,如高分子型类金刚石碳薄膜(Polymer likeDiamond-like Carbon)等,以使第一缓冲层211与第二缓冲层213能与第一保护层212以及第二保护层214在同一等离子体反应腔体中形成。 Further, the present invention is formed in a first buffer layer 211 and the material used in the second buffer layer 213 can be polymer precursor (precursor) as a reaction gas, wherein said polymer precursor selected from styrene e.g. (Styrene) acetylene (acetylene) ethylene (ethylene) or toluene (methylbenzene, C6H5CH3), or one of the,, C4F8, to form a polymer film such as diamond-like carbon film polymer (polymer likeDiamond-like carbon), etc., so that the first a buffer layer 211 and the second buffer layer 213 can be formed with the first protective layer 214 and the second protective layer 212 in the same plasma reaction chamber. 当然,如有需要,还可在第二保护层214上再形成另一缓冲层(未示出),之后再加上另一保护层(未图示),以使有机发光元件20与外界环境进一步隔离。 Of course, if necessary, may be further formed another buffer layer (not shown) on the second protective layer 214, then coupled with another protective layer (not shown), so that the organic light emitting element 20 and the external environment further isolation.

本发明的技术方案主要是在同一等离子体反应腔体内借助于等离子体聚合方法分别依序在有机发光元件20的表面上形成第一缓冲层211、第一保护层212、第二缓冲层213以及第二保护层214。 Aspect of the present invention is primarily plasma polymerization method respectively a first buffer layer 211 are sequentially formed on the surface of the organic light emitting element 20 by means of the same plasma reaction chamber, a first protective layer 212, the second buffer layer 213, and The second protective layer 214. 如此,便可克服传统的有机发光元件20必须在不同反应腔体间往复运送才得以形成封装保护结构的缺点。 Thus, it can overcome the conventional organic light emitting element 20 to be reciprocally transported between different reaction chamber was able to form a protective structure encapsulation disadvantages. 另外,如果想要提高封装保护结构的清洁度,在进行每一等离子体聚合工序前,反应腔体内部可先进行清洗步骤(self-clean),如此,可确保封装保护结构的清洁。 Further, if you want to increase the cleanliness of the package protective structure, each of the plasma polymerization step is performed before the internal reaction chamber cleaning step may be performed first (self-clean), so, to ensure that the package clean protective structure.

由于,制造封装保护结构(passivation)21的目的就是要使有机发光元件20中的有机层材料及电极层材料与外界环境完全隔离,所使用的材料还需有效排出有机发光元件长时间工作所产生的热能,因此在封装保护结构的材料上最好使用致密度高且又具有良好导热性的材料。 Due to manufacturing packaging protective structure (passivation) to make the object 21 is completely isolated from the organic light emitting element 20 and the electrode layer of an organic material layer material with the external environment, the material used needs to effectively discharge the generated long working organic light emitting element thermal energy, it is preferable to use a high density material in the package and because the protective structure of a material having good thermal conductivity. 本发明所使用的类金刚石碳膜(DLC)相较于目前一般所使用的有机材料或陶瓷材料来说,具有较佳的抗磨耗性以及高热传导性,同时对湿气也有较低的水穿透率,而且随着制备方法、掺杂杂质以及参数的不同,类金刚石碳的特性可由应力极小软性的高分子薄膜到硬的或硬度极高的非晶质类金刚石碳膜,其颜色由褐色至透明皆可。 Used in the present invention, diamond-like carbon (DLC) as compared to a ceramic material or organic material present is generally used, it has better attrition resistance and high thermal conductivity, but also has low moisture through water penetration rate, and with the preparation method, and a different impurity doping parameters, characteristics of diamond-like carbon may be little stress to the flexible polymer film or a high hardness of the hard amorphous diamond-like carbon film, its color from brown to clear can be. 因此,本发明的由类金刚石碳材料所形成的封装保护结构能有效隔绝有机发光元件与外界环境的接触。 Thus, the package protection structure diamond-like carbon material of the present invention can be formed effectively isolate the organic light emitting element is in contact with the external environment. 此外,本发明的封装保护结构21的最外层为类金刚石碳材料所形成的第二保护层214,还可增加有机发光元件20的抗磨耗性,使得有机发光元件20的寿命更为长久。 Further, the second protective layer package structure of the present invention, the protective outermost layer 21 is formed by diamond-like carbon material 214 may increase the abrasion resistance of the organic light emitting element 20, so that the lifetime of the organic light emitting element 20 is more permanent.

综上所述,本发明的技术方案是利用等离子体聚合方法以及类金刚石碳材料来形成第一保护层以及第二保护层,两保护层间又用等离子体聚合方法以及高分子前体材料于同一等离子体反应腔体中形成缓冲层,以吸收第一保护层以及第二保护层间的应力,使得整个封装保护结构(passivation)得以在同一反应腔体中制成,克服了传统有机发光元件于反应腔体间反覆运送的缺点,使制造步骤简单、降低了制造成本,并能有效实现隔绝有机发光元件与外界环境的接触的隔绝。 In summary, the technical solution of the present invention is to form the first protective layer and the second protective layer using the plasma polymerization method, and a diamond-like carbon material, and a protective layer between the two plasma polymerization method, and a polymer precursor material in in the same plasma reaction chamber forming a buffer layer to absorb the stress between the first protective layer and the second protective layer, so that the entire protective structure encapsulation (passivation) to be formed in the same reaction chamber, to overcome the conventional organic light emitting element in the reaction chamber between disadvantage conveyed repeatedly, the manufacturing process is simple, manufacturing costs are reduced, and can effectively achieve isolation insulating contacts organic light emitting element with the external environment. 再加上,类金刚石碳材料的封装保护结构(passivation layer)的致密度高、电绝缘性能良好、热传导性佳、抗磨耗性能良好、高硬度、耐腐蚀性佳,这些都符合封装保护结构的需求,因此,本发明的技术方案对于有机发光元件的封装保护结构制造工艺来说是一种实用、新颖且进步的技术方案。 Plus, the package protective structure (passivation layer) of diamond-like carbon material and high density, good electrical insulation properties, good thermal conductivity, good anti-wear performance, high hardness, good corrosion resistance, which are in line with the structure of the package protected demand, therefore, the technical solution of the present invention is a practical, novel and progressive aspect of the manufacturing process for packaging protection structure for an organic light emitting element.

本领域技术人员在本发明构思和保护范围内作出的改型和修饰都将落入所附权利要求书请求保护的范围。 Variations and modifications made by those skilled in the range of the spirit and the protection of the present invention will fall within the scope of the appended claims requested protection.

Claims (9)

1.一种应用于有机发光显示器的形成封装保护结构的方法,该方法包括下述步骤:在一等离子体反应腔体内放置一有机发光元件;在所述有机发光元件上形成一第一缓冲层;在所述第一缓冲层上形成一第一保护层;在所述第一保护层上形成一第二缓冲层;以及在所述第二缓冲层上形成一第二保护层,所述形成第一缓冲层、第一保护层、第二缓冲层和第二保护层在所述等离子体反应腔体内以等离子体聚合方法进行。 A protective structure applied to the formation method of packaging an organic light emitting display, the method comprising the steps of: placing an organic light-emitting element in a plasma reaction chamber; forming a buffer layer on the first organic light emitting element ; forming the first buffer layer on a first protective layer; forming a second buffer layer on the first protective layer; and forming a second protective layer on the second buffer layer, forming a a first buffer layer, a first protective layer, the second buffer layer and the second protective layer to a plasma polymerization process in the plasma reaction chamber.
2.如权利要求1所述的形成封装保护结构的方法,其中,重复制作所述缓冲层与保护层,且所述缓冲层与保护层形成顺序可调整。 2. The method of forming a protective structure encapsulation claim, wherein said repeated production buffer layer and the protective layer, and the buffer layer and the protective layer are formed sequentially adjustable.
3.如权利要求1所述的形成封装保护结构的方法,其中,所述等离子体聚合方法包括等离子增强化学气相沉积方法、高密度等离子化学气相沉积方法及诱导结合等离子化学气相沉积方法之一。 The method of claim 1 forming a packaging protective structure as claimed in claim 3, wherein said plasma polymerization process comprises one of a plasma enhanced chemical vapor deposition, plasma chemical vapor deposition method, a high density plasma chemical vapor deposition process induced binding and the like.
4.如权利要求1所述的形成封装保护结构的方法,其中,包括一表面处理或一清洗步骤。 The method of claim 1 forming a packaging protective structure as claimed in claim 4, wherein the surface treatment comprises a cleaning step or a.
5.如权利要求1所述的形成封装保护结构的方法,其中,所述第一保护层以及第二保护层由类金刚石碳膜材料形成。 5. The method of forming a protective structure encapsulation claim, wherein said first protective layer and the second protective layer is formed of diamond-like carbon material.
6.如权利要求1所述的形成封装保护结构的方法,其中,所述第一缓冲层与第二缓冲层包括以高分子前体形成的高分子薄膜。 6. The method of forming a protective structure encapsulation claim, wherein the first buffer layer and second buffer layer comprises a polymer film is formed in a polymer precursor.
7.如权利要求6所述的形成封装保护结构的方法,其中,所述高分子前体选自苯乙烯、乙炔、乙烯或甲苯或C4F8之一。 7. The method of forming the protective package structure according to claim 6, wherein said polymer precursor is selected from styrene, acetylene, ethylene, one or toluene or C4F8.
8.如权利要求1所述的形成封装保护结构的方法,其中,所述有机发光元件为一种无源式有机发光元件或有源式有机发光元件。 8. The method of claim 1 wherein the package protective structure is formed, the organic light emitting element is a passive device or an active matrix organic light-emitting organic light emitting device as claimed in claim.
9.如权利要求1所述的形成封装保护结构的方法,其中,所述有机发光元件包括:一基板;一形成于所述基板上的第一导电层;一形成于所述第一导电层上的有机发光材料多层结构;以及一形成于所述有机发光材料多层结构上的第二导电层。 9. The method of forming a protective structure encapsulation claim, wherein the organic light emitting element comprising: a substrate; a first conductive layer formed on said substrate; a first conductive layer formed in the the organic light emitting material on the multilayer structure; and a second conductive layer formed on the organic light emitting material of the multilayer structure.
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