CN1619803A - 流路构成体 - Google Patents

流路构成体 Download PDF

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Publication number
CN1619803A
CN1619803A CN200410095812.5A CN200410095812A CN1619803A CN 1619803 A CN1619803 A CN 1619803A CN 200410095812 A CN200410095812 A CN 200410095812A CN 1619803 A CN1619803 A CN 1619803A
Authority
CN
China
Prior art keywords
flow
constituting body
path constituting
stream
bonding region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200410095812.5A
Other languages
English (en)
Chinese (zh)
Inventor
横泽满雄
高泽清继
杉原广志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Instruments Corp
Original Assignee
Sankyo Seiki Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sankyo Seiki Manufacturing Co Ltd filed Critical Sankyo Seiki Manufacturing Co Ltd
Publication of CN1619803A publication Critical patent/CN1619803A/zh
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F28F3/14—Elements constructed in the shape of a hollow panel, e.g. with channels by separating portions of a pair of joined sheets to form channels, e.g. by inflation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • F28F21/065—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material the heat-exchange apparatus employing plate-like or laminated conduits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/26—Safety or protection arrangements; Arrangements for preventing malfunction for allowing differential expansion between elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
CN200410095812.5A 2003-11-18 2004-11-18 流路构成体 Pending CN1619803A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003387663A JP2005150501A (ja) 2003-11-18 2003-11-18 流路構成体
JP2003387663 2003-11-18

Publications (1)

Publication Number Publication Date
CN1619803A true CN1619803A (zh) 2005-05-25

Family

ID=34649755

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200410095812.5A Pending CN1619803A (zh) 2003-11-18 2004-11-18 流路构成体

Country Status (4)

Country Link
US (1) US20050126750A1 (ja)
JP (1) JP2005150501A (ja)
CN (1) CN1619803A (ja)
TW (1) TWI278978B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107906834A (zh) * 2017-10-13 2018-04-13 青岛海尔股份有限公司 一种冷量导引组件及配备有该组件的冰箱系统

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK1923771T3 (en) 2003-11-07 2015-06-01 Asetek As Cooling system for a computer system
DE202005021675U1 (de) 2005-05-06 2009-10-01 Asetek A/S Kühlsystem für ein Computersystem
US20070133171A1 (en) * 2005-12-08 2007-06-14 Kioan Cheon Cooling system for electronic components
JP4901283B2 (ja) * 2006-04-21 2012-03-21 学校法人同志社 スタック及びその製造方法
US9844167B2 (en) 2015-06-26 2017-12-12 Microsoft Technology Licensing, Llc Underwater container cooling via external heat exchanger
US9801313B2 (en) * 2015-06-26 2017-10-24 Microsoft Technology Licensing, Llc Underwater container cooling via integrated heat exchanger
JP6953145B2 (ja) * 2017-02-24 2021-10-27 昭和電工パッケージング株式会社 熱交換ラミネートシート
JP6939066B2 (ja) * 2017-05-01 2021-09-22 大日本印刷株式会社 冷却装置
EP4354071A1 (en) * 2021-05-18 2024-04-17 Resonac Corporation Heat exchanger, structure, and method for producing structure

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2992545A (en) * 1959-05-27 1961-07-18 Gen Motors Corp Refrigerating apparatus
US3612059A (en) * 1970-03-05 1971-10-12 Robert A Ersek Heat exchanger for blood during transfusions
US4738119A (en) * 1987-02-09 1988-04-19 Westinghouse Electric Corp. Integral cooling garment for protection against heat stress
US5245693A (en) * 1991-03-15 1993-09-14 In-Touch Products Co. Parenteral fluid warmer apparatus and disposable cassette utilizing thin, flexible heat-exchange membrane
US7000682B2 (en) * 2001-06-25 2006-02-21 Chambers Paul A Personal cooling or warming system using closed loop fluid flow

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107906834A (zh) * 2017-10-13 2018-04-13 青岛海尔股份有限公司 一种冷量导引组件及配备有该组件的冰箱系统
CN107906834B (zh) * 2017-10-13 2020-05-26 青岛海尔股份有限公司 一种冷量导引组件及配备有该组件的冰箱系统

Also Published As

Publication number Publication date
TW200524116A (en) 2005-07-16
US20050126750A1 (en) 2005-06-16
TWI278978B (en) 2007-04-11
JP2005150501A (ja) 2005-06-09

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Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication