CN1615071A - Casing of electronic device and its producing method and apparatus - Google Patents

Casing of electronic device and its producing method and apparatus Download PDF

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Publication number
CN1615071A
CN1615071A CN 200310112103 CN200310112103A CN1615071A CN 1615071 A CN1615071 A CN 1615071A CN 200310112103 CN200310112103 CN 200310112103 CN 200310112103 A CN200310112103 A CN 200310112103A CN 1615071 A CN1615071 A CN 1615071A
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CN
China
Prior art keywords
electronic device
mould
injector
device housing
screen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 200310112103
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Chinese (zh)
Inventor
吕昌岳
余泰成
陈杰良
黄全德
黄文正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN 200310112103 priority Critical patent/CN1615071A/en
Publication of CN1615071A publication Critical patent/CN1615071A/en
Pending legal-status Critical Current

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The case of the electronic device consists of a plastic layer and a shielding layer. The shielding layer is composed of large numbers of shielding powder, which combines with plastic layer into a one-body moulding. The manufacturing equipment of the case of electronic device consists of two one-mouth injection machines and a conveyer set between the two injection machines. Each injection machine consists of a feeder, a barrel, an injection mouth, a mould and a manipulator. The mould is used in forming a material layer. The different materials are loaded into the injection machine and then are heated to melt. First, one kind material is injected into the mould from one injection, and is taken out and is put into another injection machine, in that another material is injected into and combines with the above material layer into one-body. After cooling the case of electronic device is acquired.

Description

Electronic device housing and manufacture method thereof and equipment
[technical field]
The invention relates to a kind of electronic device housing, be meant the electronic device housing of the anti-electromagnetic interference performance of a kind of one-body molded and tool especially, and the manufacture method of this electronic device housing and equipment.
[background technology]
The electromagnetic wave phenomenon is because the dynamically exchange or the variation of electricity, magnetic energy, exists with the form of fluctuation or shows, along with variation electromagnetic wave in medium of time propagation spurious signal signal phenomenon that interacts is called electromagnetic interference.
For eliminating external electromagnetic interference, make the internal electrical components operate as normal, the electronic device housing of anti-electromagnetic interference generally is equipped with in the electronic installation outside.These electronic device housings are realized the means of anti-electromagnetic interference normally after the electronic device housing manufacturing is finished, and at its electroplating surface or evaporation (coat) layer of metal layer, as United States Patent (USP) the 4th, 826, No. 631 described again; Or paste one deck conductive layer at the electronic device housing outer surface and realize, as described in Taiwan patent announcement No. 507524 and No. 526704.But these two kinds of methods all have bigger weak point, as operation variously cause cost to increase, more easy to wearly cause that anti-electromagnetic interference performance reduces, service time long more easily come off etc.
[summary of the invention]
The purpose of this invention is to provide a kind of one-body molded, anti-electromagnetic interference performance and stablize lasting electronic device housing and manufacture method and equipment.
Electronic device housing of the present invention comprises a plastic layer and a screen, and this screen is made up of plastics and a large amount of shielding particulate and is one-body molded with this plastic layer.
The manufacture method of this electronic device housing may further comprise the steps:
Step 1: form former by two injector, each injector is assembled a mould, and each mould correspondence is used for wherein one deck of this shell of moulding;
Step 2: in two injector, load one first material and one second material respectively, and heating makes its fusion;
Step 3: will be injected into by fusion first material that step 2 obtains in the mould of corresponding injector and obtain the semi-finished product of this shell;
Step 4: treat that the semi-finished product cooling back taking-up that is obtained by step 3 is sent to another injector place and puts into its mould;
Step 5: the described mould of closed step 4;
Step 6: will be injected in the mould of step 5 by fusion second material that step 2 obtains;
Step 7: after treating this shell finished product cooling forming, the mould of opening step 5 takes out this shell finished product.
The manufacturing equipment of this electronic device housing comprises two injection mouth injector and is erected at conveyer between this two injector.Each injector comprises that a feed arrangement, includes the barrel of screw rod, a nozzle, a mould and a manipulator, and these moulds are used for moulding one material layers respectively.Wherein these injector load different materials and heating and melting respectively, at first wherein an injector penetrates a kind of material in its mould, treat the material layers cooling back taking-up that this material forms, put into the mould of another injector and inject another kind of material, make itself and last material layers form an integral body, can obtain this electronic device housing product after the cooling.
Effect of the present invention is: shielding material and electronic installation plastic casing is one-body molded, reduces plating, evaporation or pastes the operation of screen, the operate as normal of avoiding the wearing and tearing of screen or coming off and cause shielding the inefficacy and influence the electronic installation internal electrical components.
[description of drawings]
The invention will be further described in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is the schematic diagram of electronic device housing of the present invention.
Fig. 2 is the schematic diagram of the manufacturing equipment of electronic device housing of the present invention.
Fig. 3 is the manufacture method flow chart of electronic device housing of the present invention.
[embodiment]
Please refer to Fig. 1, electronic device housing 60 of the present invention comprises a screen 62 and a plastic layer 66.This screen 62 is by plastics and shield the mixed layer that particulate 64 is formed in a large number, and these shielding particulates 64 can be the powder or the thin slice of metal (as aluminium, copper, iron etc.).For reaching better anti-electromagnetic interference effect, can in screen 62, add nano carbon microsphere (Carbon Nanocapsule) or CNT (carbon nano-tube) (CarbonNano-tube).So external electromagnetic wave is reflected fully or absorbs at screen 62 places of this electronic device housing 60, and can not see through the operate as normal that this electronic device housing 60 interferes with electronic building brick in it.Screen 62 and plastic layer 66 are one-body molded during fabrication, do not need subsequent handling such as plating or evaporation or paste screen, so there is not the secret worry that screen is frayed or come off.
Please refer to Fig. 2, this electronic device housing 60 is to use a kind of injection molding equipment 1 to produce, and this injection molding equipment 1 comprises that two injection mouth injector 10,30 and are erected at the conveyer 50 of 10,30 of these injector.
This injection mouth injector 10 comprises that barrel 16, that a feed arrangement 12, includes screw rod 14 is positioned at nozzle 18, a mould 20 of barrel 16 front ends and is positioned at the manipulator 22 of these injector 10 tops.
Another injection mouth injector 30 is identical with this injection mouth injector 10, comprises that also barrel 36, that a feed arrangement 32, includes screw rod 34 is positioned at nozzle 38, a mould 40 of barrel 36 front ends and is positioned at the manipulator 42 of these injector 30 tops.
This conveyer 50 is erected at the side top of two injector 10,30, and this conveyer 50 comprises a horizontal conveying belt 52, outside this conveyer belt 52 an airtight dustproof translucent cover 54 is arranged.
These moulds 20,40 are formed one group to the plastic layer 66 that should electronic device housing 60 and the set of molds of screen 62, promptly this mould 20 is used for this plastic layer 66 of moulding, and this mould 40 is used for this screen 62 of moulding, and after its die cavity is put into the ejaculation semi-finished product of preceding one deck material, can reserve certain space, be used in this space, injecting back one deck material.
Please jointly with reference to Fig. 3, during moulding, at first the feed arrangement by injector 10 advanced plastic material A in 12 years, advanced made from mixed materials B in 32 years by the feed arrangement of injector 30, and this made from mixed materials B is the mixture of plastics and metal dust or thin slice.In injector 10, this plastic material A through screw rod 14 revolve material enter barrel 16 and therein heating and melting after inject the semi-finished product that form an electronic device housing 60 in the closed mould 20 by nozzle 18.Injector 30 also uses screw rod 34 with in the made from mixed materials B precession barrel 36 and heating and melting.
Treat that the plastics semi-finished product in the mould 20 cool off a period of time to form solid shape, die sinking then takes out these semi-finished product and be placed on this conveyer belt 52 with manipulator 22.This conveyer belt 52 is sent to another injector 30 places with these semi-finished product.
These semi-finished product are put into the mould 40 of this injector 30 and fix with artificial or this manipulator 42.Mold closing is injected made from mixed materials B in this mould 40 via nozzle 38 then, and this made from mixed materials B is full of die cavity and combines with these semi-finished product and form the shaped article of this electronic device housing 60.After treating the shaped article cooling and shaping of this electronic device housing 60, taking-up gets final product.
Repeat said process, can produce this electronic device housing 60 in a large number.
Application the present invention produces double-deck electronic device housing product and has following advantage: this kind injection molding equipment 1 is that the logical injection mouth injector 10,30 of two Daeporis combines, need not on an injector, add new equipment and carry and change two moulds 20,40, can reduce equipment cost, and two moulds of this kind equipment are not subjected to spatial limitation, can produce larger-size product.The transmission semi-finished product process of carrying out in the middle of the double injection process is the process that semi-finished product adapt to external temperature simultaneously, these semi-finished product externally space cooling shrink and can guarantee that its faying face with second kind of material does not produce contractive action in this second kind of material ejection formation contraction yet, thereby guarantee that this two-layer material combines closely, improve the quality of products.
For satisfying needs to the higher electronic device housing of anti-electromagnetic interference effect requirements, electronic device housing 60 of the present invention also can be designed to have multilayer screen layer 62, the forming method of its employed former and above-mentioned two-layered, formed used equipment and method are similar, adopt many injection mouth injector to form, each injector is assembled a mould and each corresponding moulding one material layers of these moulds.

Claims (10)

1. the electronic device housing that can prevent electromagnetic interference comprises a plastic layer and a screen, it is characterized in that: this screen is made up of plastics and a large amount of shielding particulate, and this screen is the one ejection formation with this plastic layer.
2. electronic device housing as claimed in claim 1 is characterized in that: this shielding particulate is metal dust or thin slice.
3. electronic device housing as claimed in claim 2 is characterized in that: this shielding particulate also comprises nano carbon microsphere or CNT (carbon nano-tube).
4. the manufacture method of an electronic device housing, this electronic device housing comprises a plastic layer and a screen, this screen is made up of plastics and a large amount of shielding particulates, and this screen is the one ejection formation with this plastic layer, and the manufacture method of this electronic device housing may further comprise the steps:
Step 1: form former by two injector, each injector is assembled a mould, and each mould correspondence is used for wherein one deck of this shell of moulding;
Step 2: in two injector, load one first material and one second material respectively, and heating makes its fusion;
Step 3: will be injected into by fusion first material that step 2 obtains in the mould of corresponding injector and obtain the semi-finished product of this shell;
Step 4: treat that the semi-finished product cooling back taking-up that is obtained by step 3 is sent to another injector place and puts into its mould;
Step 5: the described mould of closed step 4;
Step 6: will be injected in the mould of step 5 by fusion second material that step 2 obtains;
Step 7: after treating this shell finished product cooling forming, the mould of opening step 5 takes out this shell finished product.
5. the manufacture method of electronic device housing as claimed in claim 4, it is characterized in that: this first material is a plastic material, this second material is the made from mixed materials of plastics and shielding particulate.
6. the manufacture method of electronic device housing as claimed in claim 4 is characterized in that: this first material is the made from mixed materials of plastics and shielding particulate, and this second material is a plastic material.
7. the manufacture method of electronic device housing as claimed in claim 4 is characterized in that: these semi-finished product are to utilize a manipulator to take out and be placed on the conveyer belt, and this conveyer belt is sent to described another injector place with these semi-finished product.
8. the manufacturing equipment of an electronic device housing, this electronic device housing comprises a plastic layer and a screen, this screen is made up of plastics and a large amount of shielding particulate, and this screen and this plastic layer are the one ejection formations, the manufacturing equipment of this electronic device housing comprises two injection mouth injector, each injector comprises a feed arrangement, one includes the barrel of screw rod, one nozzle, one mould and a manipulator, it is characterized in that: the mould of this two injector is used for moulding one material layers respectively, and this equipment comprises that also one is erected at the conveyer between this two injector; Wherein this two injector loads different materials and heating and melting respectively, at first wherein an injector penetrates a kind of material in its mould, treat the material layers cooling back taking-up that this material forms, be sent to another injector place and put into its mould by this conveyer, then inject another kind of material, make itself and last material layers form an integral body.
9. the manufacturing equipment of electronic device housing as claimed in claim 8 is characterized in that: after this last material layers is put into the mould of this another injector, this mould reserve one with the back identical space of a material layers shape.
10. the manufacturing equipment of electronic device housing as claimed in claim 8, it is characterized in that: this conveyer comprises a horizontal conveying belt, and airtight translucent cover is installed around this horizontal conveying belt.
CN 200310112103 2003-11-08 2003-11-08 Casing of electronic device and its producing method and apparatus Pending CN1615071A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200310112103 CN1615071A (en) 2003-11-08 2003-11-08 Casing of electronic device and its producing method and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200310112103 CN1615071A (en) 2003-11-08 2003-11-08 Casing of electronic device and its producing method and apparatus

Publications (1)

Publication Number Publication Date
CN1615071A true CN1615071A (en) 2005-05-11

Family

ID=34759606

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200310112103 Pending CN1615071A (en) 2003-11-08 2003-11-08 Casing of electronic device and its producing method and apparatus

Country Status (1)

Country Link
CN (1) CN1615071A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102202473A (en) * 2010-03-23 2011-09-28 深圳富泰宏精密工业有限公司 Electronic device shell and manufacturing method thereof
CN102371644A (en) * 2010-08-05 2012-03-14 和硕联合科技股份有限公司 In-mold molding method and housing produced therewith
CN101808483B (en) * 2009-02-16 2013-04-10 三星电机株式会社 Electronic device manufactured by molding, method and mold for manufacturing the same, and electronic application using the same
WO2013134969A1 (en) * 2012-03-13 2013-09-19 深圳市华星光电技术有限公司 Backlight module and liquid crystal display
WO2015143952A1 (en) * 2014-03-23 2015-10-01 柳超 Equipment for manufacturing germicidal mobile phone protective case

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101808483B (en) * 2009-02-16 2013-04-10 三星电机株式会社 Electronic device manufactured by molding, method and mold for manufacturing the same, and electronic application using the same
CN102202473A (en) * 2010-03-23 2011-09-28 深圳富泰宏精密工业有限公司 Electronic device shell and manufacturing method thereof
CN102371644A (en) * 2010-08-05 2012-03-14 和硕联合科技股份有限公司 In-mold molding method and housing produced therewith
WO2013134969A1 (en) * 2012-03-13 2013-09-19 深圳市华星光电技术有限公司 Backlight module and liquid crystal display
WO2015143952A1 (en) * 2014-03-23 2015-10-01 柳超 Equipment for manufacturing germicidal mobile phone protective case

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