CN1182346A - Method for applying conductive shielding to non-conductive part - Google Patents
Method for applying conductive shielding to non-conductive part Download PDFInfo
- Publication number
- CN1182346A CN1182346A CN97121264A CN97121264A CN1182346A CN 1182346 A CN1182346 A CN 1182346A CN 97121264 A CN97121264 A CN 97121264A CN 97121264 A CN97121264 A CN 97121264A CN 1182346 A CN1182346 A CN 1182346A
- Authority
- CN
- China
- Prior art keywords
- conductive layer
- conductive
- mold cavity
- finished part
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0011—Electromagnetic wave shielding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3431—Telephones, Earphones
- B29L2031/3437—Cellular phones
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Telephone Set Structure (AREA)
Abstract
The conductive layer is vacuum formed to produce a vacuum formed part. The vacuum formed part is loaded into a mold cavity of a mold machine. The mold cavity and the vacuum formed part have a predetermined shape being substantially the same. Non-conductive material is injected into the mold cavity between the conductive layer and a surface of the mold cavity to permit the non-conductive material to bond to the conductive layer to form a finished part having the predetermined shape. The finished part has the non-conductive material on an outer surface of the finished part and the conductive layer on an inner surface. The finished part is ejected from the mold cavity. The invention reduces processing time, reduces piece part cost and improves the conductive shield's placement and effectiveness.
Description
The present invention is broadly directed to the processing of moulding part, relates in more detail adding the method for conductive shield in non-conductive parts.
Parts are molded to be provided for the housing as the various products of electronic equipment.An example of electronic equipment is a radio.For example, radio comprises radio telephone and beep-pager.Be used for wireless housing and include radio circuit, be used to transmit and receive signal, provide wireless telecommunications to wireless user.
The housing that is used for wireless device generally needs conductive shield to be used for several known purposes, comprises reducing following influence: electromagnetic interference (EMI), radio frequency interference (RFI) and static discharge (SD).Housing generally is a plastics dielectric material at its outer surface, so that artistic outward appearance to be provided.Housing surface within it generally has conductive shield, so that the protection to EMI, RFI and SD to be provided.
Housing is injection molding molded usually.The conventional method that forms conductive shield at the inner surface of injection molding housing comprises: vacuum metallizing, electrically-conducting paint spraying, adhere to paper tinsel, plating, plasma jet and thermometal spraying.Known by this area for the whole bag of tricks that electronic circuit system is grounding to conductive shield.
The shortcoming of vacuum metallizing, electrically-conducting paint spraying, plating, plasma jet and thermometal spraying method is that the inner surface of injection molding housing must crested.Hide the worn-out outer surface that hinders at the injection molding housing and receive conductive shield.Hiding us only allows to receive conductive shield at the inner surface of injection molding housing.Cover that processing is usually manual to be used for each parts, and elapsed time and increase manufacturing expense thus.Further, if hide worn-out unsuitable location, conductive shield may lose efficacy.
The shortcoming of adhering to the conductive foil method is to adhere to the manual usually inner surface that is used for the injection molding housing of paper tinsel.Therefore, this method also is elapsed time and increases manufacturing expense.Further, if the conductive foil that adheres to is not suitably located, conductive shield may lose efficacy.
The purpose of this invention is to provide and add the method for conductive shield, reduce process time, reduce the layout and the effectiveness of component costs and improvement conductive shield in non-conductive parts.
The invention provides and add the method for conductive shield, comprise step in non-conductive moulding part:
The conductive layer that is roughly the plane is provided;
Form described conductive layer to produce the parts that form;
The parts that load described formation are in the mold cavity of die apparatus, and the parts of described mold cavity and described formation have essentially identical reservation shape;
Inject electrically non-conductive material to the described mold cavity between the surface of described conductive layer and described mold cavity, to allow that described electrically non-conductive material is attached to described conductive layer, be formed with the finished part of described reservation shape, described finished part, outer surface in described finished part has described electrically non-conductive material, form described non-conductive moulding part, and described conductive layer is arranged, form conductive shield at the inner surface of described finished part; With
Eject finished part from described mold cavity.
Advantage of the present invention is: add conductive shield rapidly, accurately and efficiently in non-conductive parts.
Accompanying drawing is briefly described
Fig. 1 is the front view that is used for the equipment of moulding part according to of the present invention;
Fig. 2 is the flow chart of describing according to the present invention by the step of the method for equipment operation shown in Figure 1;
Fig. 3 is the profile of the plane conductive layer that provides according to step shown in Fig. 2 flow chart;
Fig. 4 is according to step shown in Fig. 2 flow chart, and plane conductive layer as shown in Figure 3 is used for the profile of the non-conductive layer in plane;
Fig. 5 is according to step shown in Fig. 2 flow chart, and the plane conductive layer that forms according to the reservation shape vacuum is used for the profile of the non-conductive layer in plane as shown in Figure 3;
Fig. 6 is according to step shown in Fig. 2 flow chart, the profile of the parts that form of vacuum as shown in Figure 5, and the non-conductive layer of its midplane uses injection molding processing over-molded, with the finished part of production with non-conductive skin and conduction internal layer;
Fig. 7 is the perspective view of the housing that assembles, and it is used for the portable radio telephone bandset, comprises upper shell and the lower house made according to step shown in Fig. 2 flow chart.
Fig. 1 is the front view that is used for the equipment 10 of moulding part according to of the present invention.Equipment 10 generally includes vacuum forming mould 14 and injection mold 16 and 18, comprises mobile terminal mould template 16 and stiff end mould template 18.Mobile terminal mould template 16 and the stiff end mould template 18 common mold cavities 20 that form are to be molded with the parts of reservation shape.Charging hopper 24 is stored the resin 22 that forms electrically non-conductive material, and it is injected into mold cavity 20 by stiff end mould template 18.With reference to the described method of Fig. 2, the mobile paper tinsel 12 of metallized heat forms the conductive layer of being processed by equipment 10 according to hereinafter.When the mobile paper tinsel of metallized heat is made as shown in Figure 6 finished part 27 by equipment 10 processing, according to the position and the process time of vacuum forming mould 14 and injection mold 16 and 18, control device 26 transmits, locatees and aim at the mobile paper tinsel 12 of metallized heat.
Fig. 2 is flow process Figure 28, describe shown in Figure 1 according to the present invention, by the step of the method for equipment 10 operation.Flow process Figure 28 described as shown in Figure 6 add the method for conductive shield 12 in non-conductive moulding part.In preferred embodiments, to non-conductive moulding part, conductive shield 12 is for providing shield shell as wireless electronic equipment.In preferred embodiments, shield shell is used for cell phone.In other words, shield shell can be used to any radio device, for example beep-pager or two-way land portable radio apparatus.
Method is from step 29, and method proceeds to step 30, and the conductive layer 12 that provides is the plane substantially.Preferably, conductive layer 12 on the carrier layer shown in Fig. 3-6 31, and is formed for the conductive shield of finished part 27 as shown in Figure 6 by appendix.In the mould process process, carrier layer 31 provides the method that transmits conductive layer 12.In whole mould process process, carrier layer 31 preferred maintenances are attached to conductive layer 12, eject from mold cavity up to finished part.Therefore, in the mould process process, carrier layer 31 advantageously provides the automatic processing of conductive layer 12.In preferred embodiments, conductive layer 12 is metal levels.The resistance of conductive layer 12 preferred thickness 0.0005-0.001 inches and preferred 0.2 ohm every square.Yet, can use any other conductive layer that suitable electric conductivity and intensity are arranged, as the thin slice of spraying.
In preferred embodiments, method proceeds to step 33, provides substantially also to be the non-conductive layer 32 on plane shown in Fig. 3-6.Non-conductive layer 32 preferred thin slice are in order to support conductive layer 12.In other words, non-conductive layer 32 can be the thin layer of non-conductive resin, for example the 0.0005-0.001 inch.Importantly non-conductive layer 32 has suitable material behavior, self arrives conductive layer 12 and electrically non-conductive material 22 with additional suitably.In other words, electrically non-conductive material can be directly used in conductive layer 12 in the injection molding course of processing.
Method proceeds to step 34, add conductive layer 12 in non-conductive layer 32 to form sandwich construction 36.Before the process that forms finished part, conductive layer 12 and non-conductive layer 32 preferred combination are together.Sandwich construction 36 generally will be provided by another seller (Vendor) except that the seller (Vendor) of the finished part that forms.In other words, if wish, sandwich construction 36 can form in the process that forms finished part.
Method proceeds to step 38, transmits location and aligning sandwich construction 36.These steps are provided by control device 26.In the process of making finished part, transfer step transmits sandwich construction 36 by equipment 10.Mould process comprises the step with vacuum forming as described below, filling, injection electrically non-conductive material, ejection finished part and carrier of separating layer 31.In the process of making finished part, positioning step is located sandwich constructions 36 to increase progressively distance by equipment 10.In the process of making finished part, alignment procedures is adjusted sandwich construction 36 and the vacuum forming mould 14 of equipment 10 and the mold cavity 20 of injection mold 16 and 18.In the automatic processing procedure of the conductive layer 12 in the mould process process, the step 38 that transmits, locatees and aim at sandwich construction 36 advantageously provides the accurate location of conductive layer 12 on finished part.The accurate location of conductive layer 12 on finished part increased the validity of its shielding properties.
Method proceeds to step 40, with the sandwich construction 36 that vacuum forming mould 14 vacuum form, and the parts 42 that the vacuum that producing has reservation shape forms.Reservation shape near but less than the reservation shape of finished part,, and allow the space of the additional materials of injection molding on the parts 42 of vacuum formation so the parts 42 that vacuum forms can cooperate with mold cavity 20 easily.In the injection molding course of processing, vacuum forming mould 14 advantageously forms sandwich construction 36 with reservation shape, if carry out the shaping of sandwich construction 36 in injection mold 16 and 18, these reservation shapes have infeasible extreme shape and profile.
Method proceeds to step 44, and the parts 42 that the filling vacuum forms are gone in the mold cavity 20 of equipment 10, so that non-conductive layer 32 surface 46 towards mold cavity 20.The parts 42 that mold cavity 20 and vacuum form have essentially identical reservation shape, receive the parts 42 that vacuum forms to allow mold cavity 20.
Method proceeds to step 48, and between the surface 50 of non-conductive layer 32 and mold cavity 20, the electrically non-conductive material 22 that injects as plastic resin arrives mold cavity 20, is attached to non-conductive layer 32 to allow electrically non-conductive material 22, is formed with the finished part 27 of reservation shape.Make in the embodiment excellent, the electrically non-conductive material 22 that forms plastic resin is Merlon.Finished part 27 has electrically non-conductive material 22 on the outer surface 52 of finished part 27, and on the inner surface 54 of finished part 27 conductive layer 12 is arranged.
Method proceeds to step 56, ejects finished part 27 from mold cavity 20.Use traditional approach, for example use ejection rod, by opening mold cavity 20 and causing that finished part 27 ejects mold cavity 20 and finishes Eject step 56.
Method ends at step 58, from conductive layer 12 carrier of separating layers 31, so that from finished part 27 carrier of separating layers 31.At this moment, finished part has been finished molded and shielding processing.In preferred embodiments, finished part 27 is upper shell or lower houses of portable radio telephone bandset.What illustrate is the housing of portable radio telephone bandset that can be made according to the method for the present invention, for example, and at United States Patent (USP) D350, in 348 and D348,665.The conductive layer 12 that forms shielded surfaces is added expediently need not any cover operation or hand labour.Therefore, be lowered the process time that is used for finished part, therefore actual each component costs of making finished part 27 that reduces.Further, the step of the transmission of step 38, location and aligning sandwich construction 36 guarantees that expediently conductive layer 12 is suitably aimed at the electrically non-conductive material 22 on the outer surface 52 of finished part 27, so that stabilizing effective shielding to be provided.
Fig. 3 is section Figure 58 of the basic conductive layer 12 for the plane that provides according to step shown in Fig. 2 flow process Figure 28.Illustrate substantially and the carrier layer 31 that is attached to above the conductive layer 12 is arranged for the conductive layer 12 on plane.In preferred embodiments, carrier layer 31 is preferably made by polyester.
Fig. 4 is according to Fig. 2 flow process step shown in Figure 28, and plane conductive layer 12 is used for section Figure 60 of the non-conductive layer 32 in plane as shown in Figure 3.Illustrating substantially has still by additional carrier layer 31 for the conductive layer 12 on plane.In preferred embodiments, the non-conductive layer 32 of formation plastic resin is a Merlon.
Fig. 5 is according to step shown in Fig. 2 flow chart, is used for substantially being the non-conductive layer 32 on plane and section Figure 62 with the plane conductive layer 12 of the parts 42 that produce vacuum formation of forming according to the reservation shape vacuum thereafter as shown in Figure 3.The part that the vacuum mold 14 that the parts 42 that form from vacuum separate a little is shown is for reference.Please note that parts 42 shape in this application that vacuum forms is arbitrarily, and can adopt any shape of wanting.
Fig. 6 is according to Fig. 2 flow process step shown in Figure 28, section Figure 64 of the parts 42 that form of vacuum as shown in Figure 5, wherein use the non-conductive layer 32 in injection moldings processing over-molded (overmold) planes with electrically non-conductive material 22, with production with non-conductive outer 22 and the finished part 27 of conduction internal layer 12.The part that the mold cavity between injection mold template 16 and 18 20 that separates a little from finished part 27 is shown for your guidance.The shape that please notes finished part 27 is arbitrarily in this application, and can adopt any shape of wanting.
Fig. 7 is the perspective view of the housing 70 that assembled, and it is used for the portable radio telephone bandset, comprises upper shell 72 and lower house 74.Upper shell 72 and lower house 74 are used the aforesaid mould process manufacturing of the present invention, with the production finished part.Finished part 27 shown in Figure 6 is represented upper shell 72 or lower house 74.In a preferred embodiment of the invention, the molded and shielding processing quilt of Fig. 2 is in making portable radio telephone bandset housing 70.
Claims (5)
1. add the method for conductive shield, comprise step in non-conductive moulding part:
The conductive layer that is roughly the plane is provided;
Form described conductive layer to produce the parts that form;
The parts that load described formation are in the mold cavity of die apparatus, and the parts of described mold cavity and described formation have essentially identical reservation shape;
Inject electrically non-conductive material to the described mold cavity between the surface of described conductive layer and described mold cavity, to allow that described electrically non-conductive material is attached to described conductive layer, be formed with the finished part of described reservation shape, described finished part, outer surface in described finished part has described electrically non-conductive material, form described non-conductive moulding part, and described conductive layer is arranged, form conductive shield at the inner surface of described finished part; With
Eject finished part from described mold cavity.
2. the method for claim 1 further comprises step:
Basic non-conductive layer for the plane is provided; With
Add described conductive layer in described non-conductive layer, with the parts of the described formation that is formed with sandwich construction;
Wherein said filling step further comprises step: the parts that load described formation are gone in the mold cavity of described die apparatus, so that described non-conductive aspect is to the described surface of described mold cavity; With
Wherein said implantation step further comprises step: inject electrically non-conductive material to the described mold cavity between the surface of described non-conductive layer and described mold cavity, to allow described electrically non-conductive material to be attached to described non-conductive layer, to be formed with the described finished part of described reservation shape, described finished part, described electrically non-conductive material is arranged and described conductive layer is arranged at the described outer surface of described finished part at the described inner surface of described finished part.
3. method as claimed in claim 1 or 2 further comprises step:
Described step process in the shaping that provides, filling, injection and ejection transmits, locatees and aim at described conductive layer.
4. as claim 1,2 or 3 described methods, wherein said forming step further comprises described vacuum-formed step.
5. as claim 1,2,3 or 4 described methods, further comprise step:
Load described conductive layer on carrier layer; With
After described Eject step is finished, from the described carrier layer of described conductive layers apart.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US74188796A | 1996-10-31 | 1996-10-31 | |
| US741887 | 1996-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1182346A true CN1182346A (en) | 1998-05-20 |
Family
ID=24982617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97121264A Pending CN1182346A (en) | 1996-10-31 | 1997-10-30 | Method for applying conductive shielding to non-conductive part |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPH10135680A (en) |
| KR (1) | KR100259950B1 (en) |
| CN (1) | CN1182346A (en) |
| BR (1) | BR9706688A (en) |
| DE (1) | DE19744176C2 (en) |
| GB (1) | GB2318758A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2360011B (en) * | 2000-03-10 | 2004-08-11 | Nokia Mobile Phones Ltd | A component with a metallic foil secured to an injection moulded substrate |
| SE517854C2 (en) * | 2000-09-25 | 2002-07-23 | Nolato Silikonteknik Ab | Method of manufacturing housing for electromagnetic shielding |
| US6807731B2 (en) * | 2002-04-02 | 2004-10-26 | Delphi Technologies, Inc. | Method for forming an electronic assembly |
| US9343939B2 (en) | 2010-12-23 | 2016-05-17 | General Electric Company | Electric motor structure to minimize electro-magnetic interference |
| FR3076975B1 (en) * | 2018-01-16 | 2020-02-07 | Amphenol - Air Lb | PROCESS FOR ISOLATING AN ELECTRICAL CONNECTION DEVICE HOUSING FROM ELECTROMAGNETIC WAVES AND HOUSING OBTAINED BY IMPLEMENTING THIS METHOD |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US348665A (en) * | 1886-09-07 | Demijohn | ||
| US350348A (en) * | 1886-10-05 | Edwaed n | ||
| NL179527C (en) * | 1977-05-20 | 1986-09-16 | Philips Nv | METHOD AND APPARATUS FOR MANUFACTURING A REFLECTOR WITH A PLASTIC SUPPORT BODY |
| JPS60132717A (en) * | 1983-12-21 | 1985-07-15 | Toshiba Chem Corp | Preparation of electromagnetic wave shielding case |
| JPS6345014A (en) * | 1986-08-13 | 1988-02-26 | Showa Denko Kk | Preforming of part material constituting lid of can-like container |
| US4944908A (en) * | 1988-10-28 | 1990-07-31 | Eaton Corporation | Method for forming a molded plastic article |
| JPH053390A (en) * | 1991-06-24 | 1993-01-08 | Mitsubishi Electric Corp | Electronic equipment and its manufacture |
| SE504039C2 (en) * | 1994-06-14 | 1996-10-21 | Ericsson Telefon Ab L M | Way to injection mold plastic |
| JP2776753B2 (en) * | 1994-11-24 | 1998-07-16 | 埼玉日本電気株式会社 | Plastic shielded housing |
-
1997
- 1997-09-22 GB GB9720010A patent/GB2318758A/en not_active Withdrawn
- 1997-10-07 BR BR9706688A patent/BR9706688A/en not_active IP Right Cessation
- 1997-10-07 DE DE19744176A patent/DE19744176C2/en not_active Expired - Fee Related
- 1997-10-15 JP JP9297738A patent/JPH10135680A/en active Pending
- 1997-10-30 CN CN97121264A patent/CN1182346A/en active Pending
- 1997-10-31 KR KR1019970057001A patent/KR100259950B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| GB9720010D0 (en) | 1997-11-19 |
| KR100259950B1 (en) | 2000-06-15 |
| KR19980033374A (en) | 1998-07-25 |
| BR9706688A (en) | 1999-04-06 |
| DE19744176A1 (en) | 1998-05-07 |
| DE19744176C2 (en) | 2001-02-15 |
| GB2318758A (en) | 1998-05-06 |
| JPH10135680A (en) | 1998-05-22 |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |