CN1307856C - Portable electronic device casing and its manufacturing method - Google Patents

Portable electronic device casing and its manufacturing method Download PDF

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Publication number
CN1307856C
CN1307856C CNB031401325A CN03140132A CN1307856C CN 1307856 C CN1307856 C CN 1307856C CN B031401325 A CNB031401325 A CN B031401325A CN 03140132 A CN03140132 A CN 03140132A CN 1307856 C CN1307856 C CN 1307856C
Authority
CN
China
Prior art keywords
plastic layer
electronic equipment
portable case
die
metallic particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB031401325A
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Chinese (zh)
Other versions
CN1582097A (en
Inventor
吕昌岳
余泰成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CNB031401325A priority Critical patent/CN1307856C/en
Publication of CN1582097A publication Critical patent/CN1582097A/en
Application granted granted Critical
Publication of CN1307856C publication Critical patent/CN1307856C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The present invention provides a portable electronic device casing and a manufacturing method thereof. The portable electronic device casing comprises a first plastic layer and a second plastic layer, wherein the surface layer of the first plastic layer is a mixing layer containing metal particles or flakes and plastics. The present invention is formed in an injection molding method. As the metal particles and plastic particles are evenly mixed and are combined closely, the present invention is not easy to abrade, and has the advantages of easy manufacture process and high productive efficiency.

Description

Portable case of electronic equipment and manufacture method thereof
[technical field]
The invention relates to a kind of portable case of electronic equipment and manufacture method thereof.
[background technology]
Electromagnetic interference is one of electronic equipment FAQs, portable electron device such as personal digital assistant (PDA, Personal Digital Assistant) development such as rapidly, its function is also more and more strong, and the electromagnetic interference problem of portable electric appts is more and more serious, and therefore being necessary for portable electron device provides a kind of shell that prevents electromagnetic interference.
For reducing the electromagnetic interference of portable electron device, a metallic aluminium thin slice is set on the shell of portable electron device normally.As United States Patent (USP) the 6th, 207, No. 089, for being reduced in portable electron device electromagnetic interference on every side, eliminate accumulation of static electricity, it is bonded to the superplastic alloy thin slice on the inner surface of plastic casing by binding agent.But when using this method,, make alloy sheet easily come off or wrinkling, and easily make thin slice break, be out of shape during matched moulds, and cause it easily to come off because of alloy sheet and plastic casing adhesion are not strong.
[summary of the invention]
The object of the present invention is to provide a kind of portable case of electronic equipment, its sound construction is applicable to the shell that can prevent electromagnetic radiation on the portable electron device.
Another object of the present invention is to provide a kind of manufacture method of portable case of electronic equipment, this method technology is simple, and efficient is higher.
This shell comprises the two layers of plastic layer, and the top layer of first plastic layer is the mixed layer that contains metallic particles or thin slice and plastics, and internal layer is pure plastics, and second plastic layer is pure plastics.
The present invention adopts injection forming method to form, and the die of its mould therefor is the zirconium dioxide (ZrO by sintering 2), alundum (Al (Al 2O 3), titanium boride metal oxides such as (TiB) makes.In die, immerse metallic particles or thin slice before the jet-out plastic; plastics divide two sections ejaculations; the ground floor plastics penetrate the back pressurization and squeeze out die interior metallic particles or thin slice; make metallic particles or thin slice combine with the ground floor plastic surface layer; inject second layer plastics then, can make shell of the present invention.
Because metallic particles or thin slice combine closely with plastics, compare existing ELECTROMAGNETIC OBSCURANT housing, this shell is difficult for frayed, and manufacturing process is simple, cost is lower, production efficiency is high.
[description of drawings]
Fig. 1 is the stereogram of portable case of electronic equipment of the present invention.
Fig. 2 is that Fig. 1 is along II-II direction cutaway view.
Fig. 3 is the enlarged drawing at III place among Fig. 2.
Fig. 4 is a portable electronic device casing manufacturing installation schematic diagram of the present invention.
[embodiment]
In conjunction with reference to Fig. 1 and Fig. 2, portable electron device of the present invention (as PDA, mobile phone etc.) shell 1 comprises first plastic layer 10 and second plastic layer 12, and this second plastic layer 12 is to be coated on outside first plastic layer 10.First plastic layer 10 comprises that one contains the mixed layer 102 of metallic particles or thin slice and plastics, and internal layer 101.
Metallic particles in the mixed layer 102 or thin slice quite small (with reference to Fig. 3); the diameter of metallic particles is about 0.2nm~1mm; height of sheet metal (h) and width (d) are about 0.1 μ m~2mm; metallic particles or sheet metal in this mixed layer 102 can reach the effect of covering electromagnetic radiation; metal material can be aluminium, copper or its alloy, but is not defined as above-mentioned metal or its alloy.And internal layer 101 is the plastic layers with second plastic layer, 12 same compositions, does not have metallic particles or thin slice in it.
The plastic material of above-mentioned first plastic layer 10 and second plastic layer 12 can be and is selected from polyvinyl chloride, PETG (Polyethylene Terephthalate), acrylonitrile-styrene-butadiene copolymer compound (Acrylonitrile-Butadiene-Styrene, ABS), Merlon (polycarbonate), polyimides (Polyimide, PI), liquid crystal polymer, Polyetherimide (Polyetherimide), polyphenylene sulfide (polyphenylene sulfide, PPS), polysulfones (polysulfone), polystyrene (polystyrene, PS), glycol-modified polyester (glycol-modified polyester), polypropylene (polypropylene, PP) mixture of one or more formations in the polymer such as grade.
Outside the internal layer 101 because of first plastic layer 10 second plastic layer 12 is arranged; and both are same compositions; so in conjunction with tight; and second plastic layer 12 can effectively be protected first plastic layer 10; make portable electron device in use; its mixed layer 102 can anti-knock shock resistance, and is difficult for frayed and makes metallic particles or the platelet exfoliation that wherein comprises, and reaches the effect of effectively covering electromagnetic radiation.
The manufacturing installation of shell 1 (with reference to Fig. 4) comprises cover ejection shaping die, single-revolution dish 20 and a fixed disk 22, this mould comprises a male model 23, two master molds 24,25,26,27 and two running channels 28,29 of two Materials hoppers, this male model 23 is fixed on the rotary disk 20, fix 26,27 and two running channels 28,29 of 24,25, two Materials hoppers of two master molds on the fixed disk 22.The die of this mould is the zirconium dioxide (ZrO by sintering 2), alundum (Al (Al 2O 3), metal oxide with porous loose structure such as titanium boride (TiB) makes.The size and the assemble sequence of male and female mould are set on demand.The manufacture method of portable case of electronic equipment 1 of the present invention may further comprise the steps:
(1) die with mould immerses the solution that contains metallic particles or thin slice, makes metallic particles or thin slice evenly be adsorbed in the die;
(2) choose plastics as raw material, an amount of plastics are thrown in to first Materials hopper 26 and second Materials hopper 27, heating makes plastics be in molten condition;
(3) by first running channel 28 the melted pure plastics of first Materials hopper 26 are injected in first male model 23 and the die cavity that master mold 24 cooperates;
(4) pressurization is extruded metallic particles in the mould die or thin slice and is entered the top layer of plastic layer, forms a mixed layer 102;
(5) rotate back to rotating disk 23, the plastics in second Materials hopper 27 are injected in the male model 23 and second master mold, 25 die cavities that has mixed layer 102, form second plastic layer 12 by second running channel 29;
(6) cooling, the demoulding is taken out and just can be got portable case of electronic equipment 1.
Portable case of electronic equipment 1 of the present invention also can omit second plastic layer 12, only comprises first plastic layer 10, and this moment, first plastic layer 10 should have certain thickness.At this moment, the manufacturing installation of portable case of electronic equipment 1 comprises a cover ejection shaping die, and this mould comprises a male model, a master mold, a Materials hopper and a running channel.The die of this mould is the zirconium dioxide (ZrO by sintering 2), alundum (Al (Al 2O 3), metal oxide with porous loose structure such as titanium boride (TiB) makes.The size and the assemble sequence of male and female mould are set on demand.This moment, the manufacture method of portable case of electronic equipment 1 of the present invention may further comprise the steps:
(1) die with mould immerses the solution that contains metallic particles or thin slice, makes metallic particles or thin slice evenly be adsorbed in the die;
(2) choose plastics as raw material, an amount of plastics are thrown in to Materials hopper, heating makes plastics be in molten condition;
(3) by running channel the melted pure plastics of Materials hopper are injected in male model and the die cavity that master mold cooperates;
(4) pressurization is extruded metallic particles in the mould die or thin slice and is entered the top layer of plastic layer, forms a mixed layer 102;
(5) cooling, the demoulding is taken out and just can be got portable case of electronic equipment 1.

Claims (9)

1. a portable case of electronic equipment comprises one first plastic layer and second plastic layer, it is characterized in that: this second plastic layer is coated on outside first plastic layer, and this first plastic layer includes metallic particles or thin slice.
2. portable case of electronic equipment as claimed in claim 1 is characterized in that: the diameter of described metallic particles is about 0.2nm~1mm, and the height of sheet metal and width are about 0.1 μ m~2mm.
3. portable case of electronic equipment as claimed in claim 1 is characterized in that: described metallic particles is copper, aluminium and alloy thereof.
4. portable case of electronic equipment as claimed in claim 1 is characterized in that: the plastic material of described first plastic layer and second plastic layer can be the mixture of one or more formations in the polymer such as being selected from polyvinyl chloride, PETG, acrylonitrile-styrene-butadiene copolymer compound, Merlon, polyimides, liquid crystal polymer, Polyetherimide, polyphenylene sulfide, polysulfones, polystyrene, glycol-modified polyester, polypropylene.
5. the manufacture method of a portable case of electronic equipment adopts jetting formation process to form, and may further comprise the steps:
The die of mould is immersed the solution that contains metallic particles or thin slice, make metallic particles or thin slice evenly be adsorbed in the die;
Choose plastics as raw material, an amount of plastics are thrown in to first Materials hopper and second Materials hopper, heating makes plastics be in molten condition;
By first running channel melted pure plastics of first Materials hopper are injected in male model and the die cavity that first master mold cooperates, formed one first plastic layer;
Pressurization is extruded metallic particles in the mould die or thin slice and is entered the top layer of first plastic layer, forms a mixed layer;
Rotate back to rotating disk, the plastics in second Materials hopper are injected in the die cavity of the male model that has mixed layer and second master mold, outside first plastic layer, form second plastic layer by second running channel;
Cooling, the demoulding, taking-up can get portable case of electronic equipment.
6. the manufacture method of portable case of electronic equipment as claimed in claim 5, it is characterized in that: the die of described ejection shaping die is the zirconium dioxide (ZrO by sintering 2), alundum (Al (Al 2O 3), metal oxide with porous loose structure such as titanium boride (TiB) makes.
7. the manufacture method of portable case of electronic equipment as claimed in claim 5 is characterized in that: can receive metallic particles or thin slice in the die of described ejection shaping die.
8. the manufacture method of portable case of electronic equipment as claimed in claim 5, it is characterized in that: described male model is fixed on the rotary disk.
9. the manufacture method of portable case of electronic equipment as claimed in claim 5, it is characterized in that: described first master mold and second master mold are fixed on the fixed disk.
CNB031401325A 2003-08-06 2003-08-06 Portable electronic device casing and its manufacturing method Expired - Fee Related CN1307856C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB031401325A CN1307856C (en) 2003-08-06 2003-08-06 Portable electronic device casing and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB031401325A CN1307856C (en) 2003-08-06 2003-08-06 Portable electronic device casing and its manufacturing method

Publications (2)

Publication Number Publication Date
CN1582097A CN1582097A (en) 2005-02-16
CN1307856C true CN1307856C (en) 2007-03-28

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101374392B (en) * 2007-08-23 2011-05-18 华硕电脑股份有限公司 Electronic equipment case, preparation method thereof and electronic device containing the case

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102441962B (en) * 2010-10-09 2014-04-09 广达电脑股份有限公司 Method for manufacturing electronic device shell
CN103507383A (en) * 2012-06-25 2014-01-15 曾平安 Process of composite material product

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1283214A (en) * 1997-11-03 2001-02-07 赫尔穆特·卡尔 Plastic material and conductive plastic object
CN1419403A (en) * 2001-11-13 2003-05-21 鸿富锦精密工业(深圳)有限公司 Method for making casing of electronic device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1283214A (en) * 1997-11-03 2001-02-07 赫尔穆特·卡尔 Plastic material and conductive plastic object
CN1419403A (en) * 2001-11-13 2003-05-21 鸿富锦精密工业(深圳)有限公司 Method for making casing of electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101374392B (en) * 2007-08-23 2011-05-18 华硕电脑股份有限公司 Electronic equipment case, preparation method thereof and electronic device containing the case

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