CN1615067A - Differential wire assembling method for eliminating high speed board interferes - Google Patents
Differential wire assembling method for eliminating high speed board interferes Download PDFInfo
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- CN1615067A CN1615067A CN 200310112096 CN200310112096A CN1615067A CN 1615067 A CN1615067 A CN 1615067A CN 200310112096 CN200310112096 CN 200310112096 CN 200310112096 A CN200310112096 A CN 200310112096A CN 1615067 A CN1615067 A CN 1615067A
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- differential
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Abstract
The invention consists of first differential pair and second differential pair. Each group of differential wire is composed of two wires. The array of the first differential pair and second differential pair appears geometry polygon. At least there is the wire one differential pair locating at different dielectric constant routing layer of high speed digital circuit. The wire of same differential pair can also locate at routing layer with same dielectric constant in high speed digital circuit. The first and second differential pair all can be taken as interference source or interference object.
Description
[technical field]
The invention relates to a kind of differential pair wire laying mode of high-speed digital circuit, refer to especially a kind ofly can eliminate the differential conductor compound mode of crosstalking in the high speed circuit board.
[background technology]
The cause of crosstalking is because a signal when transmitting on transmission channel, because of electromagnetic coupled exerts an influence to adjoining transmission line, shows as on disturbed signal and injected certain coupled voltages and couple current.In the Design of Digital Circuit field, crosstalking widely exists, and along with the raising and the product shape size of signal rate are more and more littler, digital system is always crosstalked also sharply to be increased, excessive crosstalking can have influence on systematic function, even causes the false triggering of circuit, causes the system can't operate as normal.
At this situation, one of common method that adopts of industry is to utilize the differential type wire laying mode, one of usual way has 130 liang of first differential pair 120 and second differential pairs group differential pair as shown in Figure 1 among the figure, these two groups of differential pairs are to be positioned at that same wiring layer is parallel to arrange.If the differential conductor with 100 ohm is an example, its live width is 5 mils (mil), and then distance maintains about 10 mils between the differential conductor.And in the reality differential pair and between placement rule need big as far as possible at interval, can reduce differential pair with between mutual interference mutually, even in 20 mils, then on pcb board in this manner two groups of differential pairs of layout also need the space of 80 mils at least, this with obviously can not be compatible when the intensive requirement of the layout of pcb board, though, also can take to reduce the way of differential conductor width, but, can promote the difficulty on the manufacture craft like this, increase industrial cost.
Therefore, if think effectively to eliminate crosstalking in the high speed circuit board, the wiring arrangement mode of differential pair has played crucial effects.United States Patent (USP) announces the 6th, 017, and 247 have disclosed a kind of differential pair wire laying mode, and every pair of differential pair bends once at least, thus can with adjacent differential pair staggered positions, avoid crosstalking.But this wire laying mode need satisfy certain line length relation, can effectively eliminate and crosstalk, and can make wiring become more intricate so undoubtedly, increases the length and the density of wiring, is not suitable for the electrical circuit pattern of high-density wiring.
Therefore, be necessary to provide a kind of more rational difference wire laying mode of high density high speed circuit board and layout that is applicable in fact, with the influence of effective elimination crosstalk signal.
[summary of the invention]
One of purpose of the present invention is to provide a kind of differential pair arrangement mode that can be used for high speed circuit board that need not be subjected to any length of arrangement wire restriction.
Two of purpose of the present invention is to provide a kind of differential pair that can effectively be weakened even can offset in some cases of crosstalking to arrange, thereby can obtain that suffered crosstalking levels off to zero expected results on the differential pair.
Three of purpose of the present invention is to provide a kind of can will crosstalk under the prerequisite of not damaging the internal driving compatibility that to subdue be zero conductor arrangement mode.
The length of arrangement wire that the invention is characterized in the differential conductor of this first differential pair and second differential pair is not subjected to any restriction, and four parallel all the time distributions of differential conductor, looks from the longitudinal profile of high speed circuit board, and four differential conductor systems are how much polygons and arrange.The spread geometry of this first differential pair and second differential pair has multiple combination and variation, and the lead that can have a pair of differential pair at least is the DIELECTRIC CONSTANT that is positioned at high speed circuit board
rThe various wirings layer can also be positioned at DIELECTRIC CONSTANT with the lead of a pair of differential pair
rThe wiring layer of identical high speed circuit board is positioned at high speed circuit board medium dielectric constant microwave medium ε
rThe lead of various wirings layer difference can occur because of its conductor widths of problem such as impedance matching sigal transfering lag and thickness.Wherein, first differential pair and second differential pair all can be used as interference source or disturbed object.By appropriate position deploying, interference source acts on crosstalking on the disturbed object and can be subdued to minimum even be zero in the differential pair.
The invention has the advantages that can be when effectively saving wiring space, will crosstalk to be reduced to minimum even to be zero, complied with the demand of high speed circuit board development.
[description of drawings]
The present invention is further illustrated in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is existing differential pair arrangement mode.
Fig. 2 is that the present invention is in DIELECTRIC CONSTANT
rThe differential pair of rectangular arrangement is arranged schematic diagram in the identical material.
Fig. 3 is that the present invention is in DIELECTRIC CONSTANT
rThe differential pair of arranging that assumes diamond in shape in the identical material is arranged schematic diagram.
Fig. 4 is that the present invention is in DIELECTRIC CONSTANT
rBe the differential pair of being inverted trapezoidal arrangement in the different materials and arrange schematic diagram.
Fig. 5 is that the present invention is in DIELECTRIC CONSTANT
rThe differential pair that is triangularly arranged in the different materials is arranged schematic diagram.
Fig. 6 is that the present invention is in DIELECTRIC CONSTANT
rBe the differential pair arrangement schematic diagram that del is arranged in the different materials.
[embodiment]
In high speed circuit board, the size of crosstalking and the wiring between spacing be inversely proportional to, with the wiring between parallel length be directly proportional, the factor that influence is simultaneously crosstalked also comprises: the width of lead, the thickness of lead, the dielectric constant of medium, the thickness of medium, the thickness of pad, wiring that the path of ground wire and wiring are peripheral or the like, therefore, in wiring, synthesize and coordinate many-sided factor, obtain finally that to reduce to crosstalk even make it be zero effect.
One of preferred embodiment of this case as shown in Figure 2, this figure is in DIELECTRIC CONSTANT
rThe differential pair of rectangular arrangement is arranged in the identical material, wherein, have 230 liang of groups of first differential pair 220 and second differential pair differential pair among this figure, wherein this first differential pair 220 is made up of differential conductor 221,222, and this second differential pair 230 is made up of differential conductor 231,232.These two groups of differential pairs disturb each other, on each differential conductor suffered string around show as other adjacent each bar lead to its string around synthesis result.As, with first differential pair 220 as interference source (Aggressor), second differential pair 230 is analyzed as disturbed object (Victim), so, the differential conductor 231 of disturbed object is subjected to going here and there around showing as from the synthesis result on interference source differential conductor 221 and the interference source differential conductor 222, and, because differential conductor 221 is in positive phase, and differential conductor 222 is in minus phase, its the two sense of putting on the differential conductor 231 of disturbed object is opposite, the differential conductor 231 and the interference source differential conductor 221 of its size and disturbed object, distance between the interference source differential conductor 222 and interference source differential conductor 221 all have relation with mutual edge distance mutually between the interference source differential conductor 222, also with the differential conductor 231 of disturbed object, interference source differential conductor 221, interference source differential conductor 222 conductor width and thickness separately is relevant, therefore, can be by adjusting the differential conductor 231 of disturbed object, mutual alignment between interference source differential conductor 221 and the interference source differential conductor 222 concerns makes interference source differential conductor 221,222 put on the differential conductor 231 of disturbed object string around value close even equal, the string that puts on the differential conductor 231 of disturbed object because of interference source difference line 221 and interference source differential conductor 222 is opposite around sense again, so just can make the comprehensive string that is subjected on the differential conductor 231 of disturbed object around cancelling out each other to very little even be zero, it is identical and direction is opposite crosstalks equally, also can to obtain size on disturbed object differential conductor 232.Again because of the differential pair that adjoins interferes with each other, thus interference source difference line 221,222 also can be subjected on it disturbed object differential conductor 231,232 string around, analogize according to above-mentioned principle, its synthesis result too will be very little even levels off to zero.
Please referring to Fig. 3, this figure is in DIELECTRIC CONSTANT
rThe differential pair that assumes diamond in shape in the identical material and arrange, first differential pair 320 and second differential pair 330 that disturb each other among the figure are in respectively on the perpendicular bisector of the other side's differential pair position line, because the position of this symmetry relation, make string that each differential conductor is subjected to around all being opposite sign but equal magnitude, the balance counteracting is zero mutually, therefore, the suffered string of the every pair of differential pair is around finally being zero.
As shown in Figure 4, this figure is in DIELECTRIC CONSTANT
rBe the differential pair of being inverted trapezoidal arrangement in the different materials, wherein, same group of differential conductor 421,422 and 431,432 is in the DIELECTRIC CONSTANT of high speed circuit board respectively in first differential pair 420 and second differential pair 430
rIn the different materials, because of taking into account problems such as impedance matching related in the wiring and radiation propagation hysteresis, difference can appear with physical conditions such as the live width of a pair of differential pair lead and thickness, in case of necessity, also need to change the wiring layer of lead, be distributed in DIELECTRIC CONSTANT in order to remedy by the via hole on the pcb board (Via)
rProblem such as different wiring layers caused radiation delivery lag time is inconsistent.Because of the asymmetry relation of positional alignment, the string that is subjected on each differential conductor still can obtain string suffered on each differential conductor around leveling off to zero result around offsetting fully.
See also Fig. 5 and Fig. 6, this two figure is in DIELECTRIC CONSTANT
rDifferential pair is arranged in the different materials, be that with Fig. 4 institute difference the differential conductor 531,532 of second differential pair 530 in interactional two pairs of differential pairs is distributed in same one deck, the differential conductor 521,522 of first differential pair 520 then lays respectively at the various wirings layer of high speed circuit board, and first differential pair 520 that is positioned at the various wirings layer is to be positioned on the perpendicular bisector of distribution with second differential pair 530 of one deck.Obviously, for suffered crosstalking on each differential conductor 521,522 on first differential pair 520 from second differential pair 530 because of its opposite sign but equal magnitude, balance is offset mutually, and on each differential conductor 531,532 of second differential pair 530 be subjected to respectively can not balance offsetting from crosstalking of first differential pair 520, but regard an integral body as if will put in order group second differential pair 530, it is suffered crosstalks comprehensively that then can to obtain to offset fully be zero effect.The analysis situation of Fig. 6 also is like this.Take an overall view of above-described embodiment, may be in concrete utilization because of the needs of actual conditions, near relevant differential conductor, add and connect bottom (not indicating among the figure), the effect of this ground plane is the effective impedance that is used for adjusting entire circuit, while also can crosstalk by masked segment, thereby satisfies the requirement of high speed circuit board signal integrity.
Claims (8)
1. eliminate the differential lines compound mode that the high speed plate is crosstalked for one kind, comprise one first differential pair and one second differential pair, described first differential pair further is made up of first differential conductor and second differential conductor, described second differential lines further is made up of the 3rd differential conductor and the 4th differential conductor, it is characterized in that: described first differential pair and second differential pair are how much polygons to be arranged, and the differential conductor that has one group of differential pair at least is the various wirings layer that is positioned at high speed circuit board.
2. eliminate the differential lines compound mode that the high speed plate is crosstalked according to claim 1, it is characterized in that: the DIELECTRIC CONSTANT of the wiring layer material of described first differential pair and second high speed circuit board that differential pair distributes
γIdentical, and all identical with physical characteristics such as the live width of a pair of differential pair lead and thickness.
3. the differential lines compound mode of crosstalking as elimination high speed plate as described in the claim 2, it is characterized in that: described first differential pair and second differential pair are to be quadrangular array.
4. the differential lines compound mode of crosstalking as elimination high speed plate as described in the claim 2, it is characterized in that: described first differential pair and second differential pair are the arrangements that assumes diamond in shape.
5. eliminate the differential lines compound mode that the high speed plate is crosstalked according to claim 1, it is characterized in that: the DIELECTRIC CONSTANT of the wiring layer material of described first differential pair and second high speed circuit board that differential pair distributes
γDifference, and it is incomplete same to be distributed in physical characteristics such as the live width of differential conductor of same differential pair of various wirings layer and thickness.
6. the differential lines compound mode of crosstalking as elimination high speed plate as described in the claim 5, it is characterized in that: described first differential pair and second differential pair are to be to be inverted trapezoidal arrangement.
The 7 differential lines compound modes of crosstalking as elimination high speed plate as described in the claim 5, it is characterized in that: described first differential pair and second differential pair are to be triangularly arranged.
8. the differential lines compound mode of crosstalking as elimination high speed plate as described in the claim 5, it is characterized in that: described first differential pair and second differential pair are to be inverted rounded projections arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101120962A CN100396165C (en) | 2003-11-08 | 2003-11-08 | Differential wire assembling method for eliminating high speed board interferes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101120962A CN100396165C (en) | 2003-11-08 | 2003-11-08 | Differential wire assembling method for eliminating high speed board interferes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1615067A true CN1615067A (en) | 2005-05-11 |
| CN100396165C CN100396165C (en) | 2008-06-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101120962A Expired - Fee Related CN100396165C (en) | 2003-11-08 | 2003-11-08 | Differential wire assembling method for eliminating high speed board interferes |
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| CN (1) | CN100396165C (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100531511C (en) * | 2005-05-28 | 2009-08-19 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board with improved differential via |
| CN101090599B (en) * | 2006-06-16 | 2010-05-26 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| CN108885925A (en) * | 2016-03-15 | 2018-11-23 | 罗森伯格高频技术有限及两合公司 | It is used for transmission the cable of electric signal |
| CN112788832A (en) * | 2021-01-11 | 2021-05-11 | 中山大学 | PCB differential via hole arrangement optimization method |
| CN117293111A (en) * | 2023-11-24 | 2023-12-26 | 湖北芯擎科技有限公司 | V-shaped pin arrangement structure and high-speed differential signal chip |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19708798A1 (en) * | 1997-03-05 | 1998-09-24 | Krone Ag | Arrangement of contact pairs to compensate for the near crosstalk |
| CN1259812C (en) * | 2002-12-19 | 2006-06-14 | 台达电子工业股份有限公司 | Method for eliminating noise and its disturbance by printing circuit board ground wiring |
-
2003
- 2003-11-08 CN CNB2003101120962A patent/CN100396165C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100531511C (en) * | 2005-05-28 | 2009-08-19 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board with improved differential via |
| CN101090599B (en) * | 2006-06-16 | 2010-05-26 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| CN108885925A (en) * | 2016-03-15 | 2018-11-23 | 罗森伯格高频技术有限及两合公司 | It is used for transmission the cable of electric signal |
| CN108885925B (en) * | 2016-03-15 | 2019-11-19 | 罗森伯格高频技术有限及两合公司 | It is used for transmission the cable of electric signal |
| CN112788832A (en) * | 2021-01-11 | 2021-05-11 | 中山大学 | PCB differential via hole arrangement optimization method |
| CN112788832B (en) * | 2021-01-11 | 2022-07-26 | 中山大学 | PCB differential via hole arrangement optimization method |
| CN117293111A (en) * | 2023-11-24 | 2023-12-26 | 湖北芯擎科技有限公司 | V-shaped pin arrangement structure and high-speed differential signal chip |
| CN117293111B (en) * | 2023-11-24 | 2024-02-27 | 湖北芯擎科技有限公司 | V-shaped pin arrangement structure and high-speed differential signal chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100396165C (en) | 2008-06-18 |
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Granted publication date: 20080618 Termination date: 20161108 |