CN1613149A - Chip module - Google Patents

Chip module Download PDF

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Publication number
CN1613149A
CN1613149A CN 03802039 CN03802039A CN1613149A CN 1613149 A CN1613149 A CN 1613149A CN 03802039 CN03802039 CN 03802039 CN 03802039 A CN03802039 A CN 03802039A CN 1613149 A CN1613149 A CN 1613149A
Authority
CN
China
Prior art keywords
chip
reinforcement
chip carrier
edge
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN 03802039
Other languages
Chinese (zh)
Other versions
CN100380638C (en
Inventor
H·-G·门斯奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of CN1613149A publication Critical patent/CN1613149A/en
Application granted granted Critical
Publication of CN100380638C publication Critical patent/CN100380638C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

In the area of the connecting section between the chip module and the card body of a chip card, the chip support (1) is provided with an optionally structured layer that is intended as a reinforcement (3). In this manner, the mechanical properties and the surface properties of the chip support can be selectively adapted to the fastening border of the chip body in the area of connection of the chip module to the card body. The layer on the fastening border of the chip support may especially be a metallization layer applied to the side of the chip support facing the card body.

Description

Chip module
Narration
Chip module
The present invention system is about the chip module of chip card.
Chip card, for example multimedia memory card or smart card, comprise by plastics and be inserted in the card body of semiconductor chip manufacturing therebetween, this semiconductor chip can be used as chip module, wherein actual chips is then on chip carrier, use chip carrier, chip is inserted in the groove of card body.The also special tool of this chip carrier is to the end points contact of the external connector of calculating punch.This chip carrier tool is the zone then, and this semiconductor chip then covers it with encapsulating material thereon and generally.Around this encapsulating material is that the protrusion of chip carrier is followed the edge, and it is the then edge that is connected at the groove of the card body that is intended to be used for chip with sticking together, and this edge is refunded slightly from the upper side of this card body.
Connection between this chip carrier and this card body is preferably by adhesive agent and produces, and Jia Gong cold adhesive agent at room temperature, or heat melts adhesive agent (using this to stick together key makes at higher temperature and under the contact pressure of increase) and is used to this purpose.For carrying out this purpose, this chip carrier is wanted the enough mechanical stabilities of tool; So at least 100 microns chip carrier thickness is preferable.This chip carrier is followed the edge and will be a kind of essence on the then surface at edge of the groove of card body, makes that they guarantee sticking together for good adhesive agent as far as possible as connecting the surface.Well sticking together of adhesive agent then by coarse connection surfaction.
The suitable especially carrier material that is used as of glass fabric of a kind of epoxy-resin-cohere.If the more cheap material and the chip carrier of less thickness are used, the problem of sticking together key stability takes place.Crucial especially is actual method for implantation in this regard, and wherein chip module is implanted this card body with getting adhered, and high temperature and high contact pressure make the chip carrier material deformation.
The object of the invention is to stipulate a kind of low cost structure of chip module of chip card, uses this enough lasting key that sticks together at this card body to produce.
This purpose can reach by the chip module of tool according to the 1st feature of claim, and this interdependent claim gives particulars.
The zone of the tie point between this chip module and this card body, this chip carrier are provided with tool and are intended to be used as the layer of strengthening and can being patterned.This makes that at the join domain of this chip module to this card body, the surface nature of this engineering properties and this card carrier can optionally be suitable for the engagement edge of this card body.Layer at the engagement edge of this card carrier can be in particular the metallization that is applied in the face of this chip carrier side of this card body.This kind metallization can be used for electrically contacting of semiconductor chip in addition, and this chip carrier can be metallized in one or both sides, as the copper that may use nickel/Jin Moguang by tool through using and patterned layer.
Hereinafter be more being described in detail based on the chip module of the represented example of the 1st to 5 figure.
1st, 3 and 4 figure display plane views; The 2nd and 5 figure show the cross section section of example specific embodiment.
The 1st plan view left-hand side represented be a kind of chip module, wherein by ejection formation and be packaged in encapsulating material 6 as the semiconductor chip of peripheral or encapsulation in middle section then in chip carrier 1.Yet unrestricted on the form of chip and encapsulation and the structure principle, the outside of chip carrier is followed edge (it is intended to be used as this chip module following at the card body) and is provided with the reinforcement 3 that tool is used with layer.The right-hand side of the 1st figure by the thin portion enlarged drawing of sign rectangle pattern, represented have at a part of encapsulating material 6 and strengthen the part of the chip carrier 1 between 3, contains then edge 5 herein.
The 2nd figure represented be the cross section section of chip card, hence one can see that, and how chip module is inserted on the card body.This chip module comprises the chip carrier 1 of tool semiconductor chip 2, its be applied on the chip carrier 1 and by ejection formation in this encapsulating material 6.At the edge of chip carrier 1 then edge 5 is arranged, it is provided with tool and strengthens 3.Have this and strengthen 3, this chip module is used adhesive agent 4 and closely then in the edge of following of the groove that is present in this card body 7 with sticking together.Being provided with tool away from this side of the chip carrier 1 of this semiconductor chip 2 can be and cover or the layer 10 of contact layer.
The 3rd figure represented be further example specific embodiment, wherein should strengthen the jagged internal edge of 3 tools, this is because if this reinforcement critically is positioned at the whole surface area in the zone of this adhesion layer 4, is easy to especially break in the reinforced region and the transition between interior zone of this chip carrier.Based on this reason, the internal edge that does not make this reinforcement 3 is straight and rule, and as shown in the 1st figure, for more convenient, but the internal edge that forms in the face of the reinforcement of this semiconductor chip 2 makes that it is jagged, that wriggle, curve or irregular.The 3rd figure represented be thin portion enlarged drawing at right-hand side pattern that rectangle indicates, wherein strengthen 3 edge 8, it is jagged in this example, for obviously as seen.
Further favourable specific embodiment is shown in the 4th figure.In this example, this reinforcement 9 is patterned in one way and makes it be repeated to interrupt along following edge 5.This is well to stick together character because be applied as what the layer of strengthening purpose must tool be relevant to this adhesion layer 4.If the character of sticking together on the surface of this reinforcement 3 still is not enough to be used for this purpose, patterning can produce a kind of improvement, and this is that it significantly improves this tackness because this patterning increase is relevant to the surface of the connection of this adhesion layer 4.
Under the situation that this reinforcement 9 is formed by the metal level of using, patterning is preferably by optical lithography and follow-up etching step and is undertaken.The mistake of following is cut is in particular and is desired, this kind mistake cut tool be intended to be used as this reinforcement 9 a layer tool part side dimension for apart from the surface of this reinforcements 9 of this chip carrier one segment distance for few, at least in the effect of direct direction at this chip carrier 1.This reinforcement is chain with this adhesion layer 4 in this way.In the 4th figure, be illustrated as example being relevant to this patterning of following this reinforcement 9 of the transversely arranged indivedual bands in edge 5.
Illustrate with the cross section section at the 5th figure and well to stick together character and how produce at the example specific embodiment of the 4th figure, some that suppose herein that this strengthens 9 parts crossed to cut and taken place, so directly to strengthen 9 parts be narrow at the upper side in the face of this card body 7 to this on this chip carrier 1.Under the situation of the 5th figure example, suppose that this reinforcement 9 is located immediately at this card body 7, or between this reinforcement 9 and this card body 7, only have extremely thin adhesion layer at least.This adhesion layer 4 is only reaching the connection that is created in this way between this chip carrier 1 and this card body 7 basically between the part of this reinforcement 9.If exist the mistake of this reinforcement 9 to cut, this is created in the sawtooth between this reinforcing section and this adhesion layer 4 parts.Because of this reinforcement 9 is applied on this chip carrier 1, this produces particularly significantly the improveing of situation that well is not attached to the material of this chip carrier and is attached to the material of this card body (it generally is made up of plastic material) sticking together of this adhesion layer 4.
During use, this chip card is subjected to mechanical load, for example reverses and or bending.Decide according to the geometry of being made up of this card body and chip module, the durability of sticking together key must meet the increase requirement in some direction of card.So this one patterned through using reinforcement is applied to increase the direction of load.
Reference list
1 chip carrier
2 semiconductor chips
3 strengthen
4 adhesion layers
5 follow the edge
6 encapsulating materials
7 card bodies
8 edges of strengthening
9 strengthen
10 layers

Claims (4)

1. the chip module of the chip card of a tool chip carrier (1), then in the semiconductor chip (2) of this chip carrier and the then edge (5) of this chip carrier, protrude from this semiconductor chip side, it is characterized in that this then is provided with tool and is intended to the reinforcement (3 that is made in this chip carrier (1) side that is provided with this semiconductor chip of tool (2) in edge (5); 9) layer.
2. according to the chip module of the 1st of claim, wherein be intended to be used as layer (3) tool jagged, that wriggle, curve or irregular inside edge (8) of reinforcement.
3. according to the chip module of the 1st of claim, the layer (9) that wherein is intended to be used as reinforcement is repeated to interrupt by the pattern of following edge (5) along this.
4. according to the chip module of the 3rd of claim, the layer (9) that wherein is intended to be used as reinforcement has side dimension partly and is lip-deep for few apart from this chip carrier one segment distance, at least directly in the direction of this chip carrier (1).
CNB038020394A 2002-01-08 2003-01-07 Chip module Expired - Fee Related CN100380638C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2002100382 DE10200382B4 (en) 2002-01-08 2002-01-08 Chip module for chip cards
DE10200382.3 2002-01-08

Publications (2)

Publication Number Publication Date
CN1613149A true CN1613149A (en) 2005-05-04
CN100380638C CN100380638C (en) 2008-04-09

Family

ID=7711643

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038020394A Expired - Fee Related CN100380638C (en) 2002-01-08 2003-01-07 Chip module

Country Status (4)

Country Link
EP (1) EP1464081A2 (en)
CN (1) CN100380638C (en)
DE (1) DE10200382B4 (en)
WO (1) WO2003058713A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004029585A1 (en) * 2004-06-18 2006-01-19 Infineon Technologies Ag Chip package used as a ball grid array package comprises a reinforcing layer fixed to a system carrier
DE602005021515D1 (en) 2004-09-02 2010-07-08 Nxp Bv IDENTIFICATION DOCUMENT WITH CONTACTLESS RFID CHIP
DE102005002733B4 (en) * 2005-01-20 2016-05-12 Giesecke & Devrient Gmbh Portable data carrier
DE102006061943B4 (en) 2006-12-29 2023-03-30 Pictiva Displays International Limited Light Emitting Device
US8830695B2 (en) 2007-01-25 2014-09-09 Osram Opto Semiconductors Gmbh Encapsulated electronic device
DE102007012504B4 (en) * 2007-01-25 2022-02-10 Osram Oled Gmbh electronic device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2644630B1 (en) * 1989-03-20 1994-05-27 Sgs Thomson Microelectronics MICROMODULE INSERTING PROCESS AND ITS APPLICATION TO THE PRODUCTION OF CHIP CARDS
FR2645680B1 (en) * 1989-04-07 1994-04-29 Thomson Microelectronics Sa Sg ENCAPSULATION OF ELECTRONIC MODULES AND MANUFACTURING METHOD
DE3924439A1 (en) * 1989-07-24 1991-04-18 Edgar Schneider CARRIER ELEMENT WITH AT LEAST ONE INTEGRATED CIRCUIT, ESPECIALLY FOR INSTALLATION IN CHIP CARDS, AND METHOD FOR THE PRODUCTION OF THESE CARRIER ELEMENTS
JPH05139082A (en) * 1991-11-19 1993-06-08 Hitachi Ltd Electronic device
JPH0976678A (en) * 1995-09-20 1997-03-25 Dainippon Printing Co Ltd Ic module for ic card and the ic card
DE19623826C2 (en) * 1996-06-14 2000-06-15 Siemens Ag Method for producing a carrier element for semiconductor chips
JP3914620B2 (en) * 1997-10-16 2007-05-16 シチズン時計株式会社 IC card
JP2000058705A (en) * 1998-08-12 2000-02-25 Hitachi Ltd Semiconductor device and its manufacture
JP2000195984A (en) * 1998-12-24 2000-07-14 Shinko Electric Ind Co Ltd Semiconductor device, its manufacture carrier substrate therefor and its manufacture
JP2000232179A (en) * 1999-02-10 2000-08-22 Shinko Electric Ind Co Ltd Substrate for pga electronic component, its manufacture and semiconductor device
FR2799857A1 (en) * 1999-10-14 2001-04-20 Gemplus Card Int METHOD FOR REINFORCING AN INTEGRATED SMART CARD CIRCUIT MODULE

Also Published As

Publication number Publication date
DE10200382A1 (en) 2003-07-24
DE10200382B4 (en) 2006-05-04
WO2003058713A3 (en) 2004-02-26
CN100380638C (en) 2008-04-09
WO2003058713A2 (en) 2003-07-17
EP1464081A2 (en) 2004-10-06

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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Granted publication date: 20080409

Termination date: 20210107