CN1610138A - Group-III-element nitride crystal semiconductor device - Google Patents

Group-III-element nitride crystal semiconductor device Download PDF

Info

Publication number
CN1610138A
CN1610138A CN200410086095.XA CN200410086095A CN1610138A CN 1610138 A CN1610138 A CN 1610138A CN 200410086095 A CN200410086095 A CN 200410086095A CN 1610138 A CN1610138 A CN 1610138A
Authority
CN
China
Prior art keywords
semiconductor device
substrate
thin layer
writing
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN200410086095.XA
Other languages
Chinese (zh)
Other versions
CN1610138B (en
Inventor
北冈康夫
峯本尚
木户口勋
塚本和芳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN1610138A publication Critical patent/CN1610138A/en
Application granted granted Critical
Publication of CN1610138B publication Critical patent/CN1610138B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02387—Group 13/15 materials
    • H01L21/02389—Nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02439—Materials
    • H01L21/02455—Group 13/15 materials
    • H01L21/02458—Nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02538—Group 13/15 materials
    • H01L21/0254—Nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/0257—Doping during depositing
    • H01L21/02573—Conductivity type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02623—Liquid deposition
    • H01L21/02625—Liquid deposition using melted materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/15—Structures with periodic or quasi periodic potential variation, e.g. multiple quantum wells, superlattices
    • H01L29/151—Compositional structures
    • H01L29/152—Compositional structures with quantum effects only in vertical direction, i.e. layered structures with quantum effects solely resulting from vertical potential variation
    • H01L29/155—Comprising only semiconductor materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
    • H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L29/2003—Nitride compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/94—Laser ablative material removal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

The present invention provides a semiconductor device in which alkali metal is prevented from diffusing. In a Group-III-element nitride semiconductor device including a Group-III-element nitride crystal layer stacked on a Group-III-element nitride crystal substrate, the substrate is produced by allowing nitrogen of nitrogen-containing gas and a Group III element to react with each other to crystallize in a melt (a flux) containing at least one of alkali metal and alkaline-earth metal, and a thin film layer is formed on the substrate and the thin film has a lower diffusion coefficient than that of the substrate with respect to impurities contained in the substrate.

Description

III family element nitride crystal semiconductor device
Technical field
The present invention relates to III family element nitride crystal semiconductor device (being also referred to as III family element nitride crystal semiconductor device).
Background technology
Gallium nitride III family element nitride compound semiconductors such as (GaN) (following also have the occasion that is referred to as III family element nitride semiconductor or GaN based semiconductor) is as the material of the semiconductor element that sends blue light and ultraviolet light and noticeable.Blue laser diode (LD) is applied to high density compact disc and display aspect, and blue LED (LED) is applied to aspects such as display and illumination.In addition, ultraviolet LD is expressed expectation in the application of aspects such as biotechnology, and ultraviolet LED is also expressed expectation as the ultraviolet source of fluorescent lamp.
LD and LED on Sapphire Substrate, form III family element nitride crystal heteroepitaxial growth by adopting the vapor phase epitaxial growth method with the substrate of III family's element nitride semiconductor (for example GaN) usually.The dislocation density of the crystallization that obtains with this method is generally 10 8Cm -2～10 9Cm -2, dislocation density be reduced to important problem.In addition,, carried out reducing the various researchs of dislocation density, for example developed ELOG (Epitaxial lateralovergrowth) method for solving this problem.According to this method, dislocation density can be reduced to 10 5Cm -2～10 6Cm -2About, but manufacturing process's complexity.
On the other hand, having studied not is vapor phase epitaxial growth, but carries out the method for crystalline growth in liquid phase.But under the fusing point of III family element nitride single crystals such as GaN and AlN, the nitrogen budgets vapour pressure reaches 10000atm (10000 * 1.013 * 10 5Pa) or more than, so, in the past for growing GaN in liquid phase, need be at 1200 ℃, 8000atm (8000 * 1.013 * 10 5Pa) carry out under the condition.In contrast, in recent years owing to adopt the Na flux, clear and definite can be at 750 ℃, 50atm (50 * 1.013 * 10 5Pa) such comparison low-temp low-pressure synthesizes GaN down.
Recently, in containing the blanket of nitrogen of ammonia, the mixture that makes Ga and Na is at 800 ℃, 50atm (50 * 1.013 * 10 5Pa) down fusion utilizes this fused solution in 96 hours incubation time, has obtained full-size and be the monocrystalline (for example, opening the 2002-293696 communique with reference to the spy) about 1.2mm.
And, also reported on the Sapphire Substrate by behind metal organic chemical vapor deposition (MOCVD:Metalorganic Chemical Vapor Deposition) the method film forming GaN crystallizing layer, the method by liquid growth (LPE:Liquid Phase Epitaxy) method growing single-crystal again.
In the liquid phase growing method of at least a crystal of nitride as flux among using alkali metal and alkaline-earth metal, sneaking into of impurity is a problem.Because when sneaking into impurity, the situation that carrier density etc. changes can appear.In addition, in semiconductor technology, be the special dvielement of sneaking into abstained from as the alkali metal of flux and alkaline-earth metal.
Summary of the invention
The purpose of this invention is to provide a kind of technology that prevents diffusion of impurities in the semiconductor device that uses the substrate manufacturing, described substrate is to be flux with at least a among alkali metal and the alkaline-earth metal, and makes the crystalline growth of III family element nitride therein.
For reaching described purpose, III of the present invention family element nitride crystal semiconductor device, it is to be laminated with III family element nitride crystal layer on III family element nitride crystal substrate, it is characterized in that: described substrate is at least a fused solution (flux) among containing alkali metal and alkaline-earth metal, makes by making nitrogen in the gas that contains nitrogen and III family element reaction and crystallization; On described substrate, be formed with thin layer; The diffusion coefficient of the impurity that contains in described substrate in described thin layer is littler than the diffusion coefficient of this impurity in described substrate.
Semiconductor device of the present invention, owing on III family element nitride crystal substrate, form thin layer, the diffusion coefficient of the impurity that contains in described substrate in described thin layer is littler than the diffusion coefficient of this impurity in described substrate, thereby the diffusion of impurities that can prevent to contain in the described substrate is in III family element nitride crystal layer.
Description of drawings
Fig. 1 (a)～(c) is the profile of an example of the structure of semiconductor device of the present invention.
Fig. 2 (a)～(d) is the process chart of an example of the manufacture method of semiconductor device of the present invention.
Fig. 3 (a)～(e) is the process chart of other example of the manufacture method of semiconductor device of the present invention.
Fig. 4 is the structure chart of an example of the manufacturing installation that uses in the manufacture method of semiconductor device of the present invention.
Fig. 5 is the profile of the structure of other example of expression semiconductor device of the present invention.
Fig. 6 is the profile of the structure of another other example of expression semiconductor device of the present invention.
Fig. 7 is the profile of the structure of another other example of expression semiconductor device of the present invention.
Fig. 8 (a)～(c) is the process chart of another other example of the manufacture method of semiconductor device of the present invention.
Embodiment
The part of the crystallization that makes the growth of III family element nitride crystal at least a flux among containing alkali metal and alkaline-earth metal and obtain, for example there is under the situations such as connecting dislocation (as screw dislocation and edge dislocation etc.) and lattice defect the danger that probably has alkali metal and alkaline-earth metal etc. to sneak into there.Feature of the present invention is the diffusion that can prevent the alkali metal of sneaking into like this and alkaline-earth metal etc.In addition, probably there is especially Na and the Li danger of sneaking into of alkali metal and alkaline-earth metal in perforation dislocation in crystallization and lattice defect zone, and their diffusion is waited first by present inventor and finds.This is for example sneaked into and can be obtained confirming by SIMS (Secondary ion massspectroscopy).In addition, observe dim spot part that cathodoluminescence that electron beam is radiated on the substrate to be produced will obtain thus as the dislocation part.
In the present invention, III family element nitride crystal substrate can be at least a fused solution (flux) among containing alkali metal and alkaline-earth metal, makes nitrogen in the gas that contains nitrogen and III family element reaction and crystallization and makes.For example, after the III family element nitride crystal that is grown to large-size massive in described fused solution carries out slice processing, also can be used as described substrate and use.
As described alkali metal, can enumerate Na, Li, K, Rb, Cs and Fr, as described alkaline-earth metal, can enumerate Ca, Mg, Sr, Be and Ba.They both can use separately, also can 2 kinds or above and usefulness.Preferred Na, Li, Ca, the Mg of using among them, preferred especially and use separately with Na and Li or with Na and Li.For example under the situation of GaN substrate, preferred also with Na and Li, under the situation of AlN substrate, a kind of and Ca among preferred Li, Na and the Sn also uses described substrate.In addition, described fused solution adds alkali metal and alkaline-earth metal as the flux composition, also can contain other metal.As described metal, for example can enumerate Sn etc.
As described III family element, can enumerate Ga, Al, In, preferred Ga and Al, the composition formula of preferred described substrate is Al uGa vIn 1-u-vN (wherein 0≤u≤1,0≤v≤1, u+v≤1).In addition, preferred described III family element is that Ga, described substrate are that GaN or preferred described III family element are that Al, described substrate are AlN.
In addition, described substrate also can make the element nitride crystal growth of III family form on pre-prepd support substrate.In the case, form inculating crystal layer on described support substrate, preferably the crystallization of same composition forms described inculating crystal layer by having with described III family element nitride crystal substrate.Described support substrate, preferred surface are that GaAs substrate, the surface of (111) face is any one substrate in the SiC substrate of (0001) face for the Si substrate of (111) face, surface for the Sapphire Substrate and the surface of (0001) face.
In the present invention, as the impurity that contains in the described substrate, for example be the constituent material that derives from the alkali metal of flux composition and alkaline-earth metal, the crucible that is used for the crystallization manufacturing, reaction vessel and other member etc. the material that becomes to grade.As described alkali metal, can enumerate Na, Li, K, Rb, Cs and Fr, can enumerate Ca, Mg, Sr, Be and Ba as described alkaline-earth metal.Wherein particularly Na, Li, Ca, Mg etc., because they sneak in described substrate, the carrier density that probably will give III family element nitride crystal layer for example is with bigger influence.
In the present invention, the diffusion coefficient of the impurity that contains in described substrate in described thin layer is littler than the diffusion coefficient of this impurity in described substrate, little 1 order of magnitude of diffusion coefficient of the impurity that contains in for example preferred described substrate than described substrate or more than.In addition, the diffusion coefficient of the impurity that in the described substrate of described thin layer, contains, for example preferably 1000 ℃, 1 * 10 -16Cm 2/ sec or following, more preferably 1 * 10 -17Cm 2/ sec or following.The diffusion coefficient of described impurity can be estimated by SIMS.As evaluation method by SIMS, the impurity that at first contains for example by the sims analysis substrate, secondly, inject ion at substrate surface by ion, again after implementing heat treatment under the temperature of setting, the impurity that contains by the sims analysis substrate again is that profile of impurities figure is made on the basis with the analysis result of the SIMS before and after handling, can obtain the diffusion coefficient of described impurity thus.
Can enumerate silicon nitride (SiN), aluminium nitride (AlN), aluminium gallium nitride alloy (Al as described thin layer xGa 1-xN (wherein 0≤x≤1)), carborundum (SiC), germanium nitride (GeN 2), diamond like carbon, diamond etc., be preferably silicon nitride, aluminium gallium nitride alloy, aluminium nitride, further preferred aluminium gallium nitride alloy.In addition, under the situation of using the III family element nitride crystal substrate that is formed by mass crystallization, thin layer is preferably aluminium nitride as described substrate.
For example under the situation of GaN substrate, thin layer is preferably silicon nitride (SiN), aluminium nitride (AlN), aluminium gallium nitride alloy (Al to described substrate xGa 1-xN (wherein 0≤x≤1)) at least a and among the carborundum (SiC), more preferably aluminium gallium nitride alloy, aluminium nitride are preferably aluminium gallium nitride alloy especially.For example under the situation of AlN substrate, thin layer is preferably diamond to described substrate.
The not special restriction of the thickness of described thin layer is 1nm～1000nm for example, is preferably 5nm～100nm, more preferably 10nm～50nm.At described thin layer is under the situation of silicon nitride, and preferably its thickness is 5nm or following, more preferably 3nm or following.If thickness is 5nm or following, then the growth of III family element nitride crystal can not harmed on described thin layer.
The not special restriction of the formation method of described thin layer can be made suitable decision according to forming material, for example can enumerate electron cyclotron resonace (ECR) sputtering method, mocvd method etc.For example under the situation that forms silicon nitride layer, preferably form, under the situation that forms aln layer, preferably form by the decompression mocvd method by electron cyclotron resonace (ECR) sputtering method.
For preferred its composition formula of described crystallizing layer is Al uGa vIn 1-u-vN (wherein 0≤u≤1,0≤v≤1, u+v≤1).Described crystallizing layer preference is as forming by vapour deposition processes such as mocvd methods.
With regard to the formation of semiconductor device of the present invention, be that example is illustrated below with Fig. 1 (a)～(c).In addition, in Fig. 1 (a)～(c), at same local mark prosign.
Shown in Fig. 1 (a), semiconductor device of the present invention is on III family element nitride crystal substrate 13, form thin layer 15 and III family element nitride crystal layer 18, and preferred film layer 15 is to form on the whole surface of substrate 13.
In addition, shown in Fig. 1 (b), on III family element nitride crystal substrate 13, when having perforation dislocation 14, thin layer 15 can form with perforation dislocation 14 corresponding parts.As previously mentioned, probably there is impurity in the zone connecting dislocation 14, so by forming thin layer 15 in corresponding part with it, can fully prevent crystallizing layer 18 diffusions to III family element nitride crystal of the impurity that contains in the substrate 13.
In addition, shown in Fig. 1 (c), semiconductor device of the present invention also can further form III family element nitride crystal layer 18 between III family element nitride crystal substrate 13 and thin layer 15.
In addition, semiconductor device of the present invention also can be formed with on described substrate in the described thin layer, side at described semiconductor device is formed with thin layer, perhaps only is formed with thin layer in the side of described semiconductor device and forms described thin layer on described substrate.In addition, described semiconductor device also can be divided into a plurality of chips, at this moment, is formed with in the described thin layer on described substrate, or replaces described thin layer, preferably forms thin layer in the side of described chip.Like this by forming thin layer, also can prevent diffusion owing to the impurity such as for example alkali metal of the side of the chip that exposes such as cutting apart in the side.
Semiconductor device of the present invention is preferably laser diode, light-emitting diode or field-effect transistor.
An example of the manufacture method of semiconductor device of the present invention is illustrated with Fig. 2.And the same with Fig. 1, at same local mark prosign.
At first, shown in Fig. 2 (a), on support substrates 11 such as Sapphire Substrate, the formation composition formula is Al uGa vIn 1-u-vThe inculating crystal layer 12 of N (wherein 0≤u≤1,0≤v≤1, u+v≤1).Inculating crystal layer 12 becomes kind of a crystalline substance, and preference is as with GaN or Al uGa 1-uThe crystallization of N (wherein 0≤u≤1) etc.Inculating crystal layer 12 for example can form by methods such as mocvd method, MBE method, HVPE methods.Supporting on the substrate 11, for example can use the surface to be the Si substrate of (111) face, surperficial for the Sapphire Substrate of (0001) face or surperficially be the SiC substrate of (0001) face for the GaAs substrate of (111) face, surface.In addition, at the semiconductor layer of supporting to contain between substrate 11 and the inculating crystal layer 12 other.
Secondly, shown in Fig. 2 (b), (preferred 100atm (100 * 1.013 * 10 in nitrogen-containing atmosphere 5Pa) or following pressurization atmosphere), at least a, the III family element that contain among alkali metal and the alkaline-earth metal are contacted with inculating crystal layer 12 with nitrogenous fused solution, LPE-GaN13a grows on inculating crystal layer 12.At this moment, as containing the III family element nitride crystal substrate 13 of supporting substrate 11, inculating crystal layer 12 and LPE-GaN13a.In addition, behind the formation LPE-GaN13a, also can remove described support substrate 11,, can relax the strain in the LPE-GaN13a by having removed support substrate 11.Can enumerate laser lift-off, grinding and polishing processing etc. as the removal method.
Can enumerate Ga, Al, In as described III family element, preferred Ga and Al.Alkali metal and alkaline-earth metal play a role as flux usually, as described alkali metal, for example Na, Li, K, Rb, Cs and Fr as described alkaline-earth metal for example Ca, Mg, Sr, Be and Ba, use wherein at least a i.e. wherein a kind of or their mixture.At least a nitrogenous gas atmosphere that for example contains among nitrogen and the ammonia as nitrogen-containing atmosphere can be suitable for.
For example heat and modulate for fused solution by material being dropped into crucible.After having modulated fused solution, make the element nitride crystal growth of III family by fused solution being become hypersaturated state.The fusion of material and crystalline growth for example can be about 700 ℃～1100 ℃, pressure is 1atm (1 * 1.013 * 10 in temperature 5Pa)～50atm (50 * 1.013 * 10 5Pa) carry out under the condition about.According to this method, can obtain composition formula is Al xGa yIn 1-x-yThe III family element nitride crystal of N (wherein 0≤x≤1,0≤y≤1, x+y≤1), for example GaN or composition formula are Al xGa 1-xThe crystallization of N (wherein 0≤x≤1).
Shown in Fig. 2 (c), in the LPE-GaN13a of liquid growth, probably can there be several perforation dislocations 14.Particularly under the situation of selective growth, probably can there be perforation dislocation 14 (for example screw dislocation and edge dislocation etc.) in the inculating crystal layer that forms from selectivity to the thickness direction of substrate, in this zone that connects dislocation 14, may there be many flux compositions and other impurity.Therefore, exist to connect the part of dislocation 14, thin layers 15 such as silicon nitride are for example formed at the top at the LPE-GaN13a of liquid growth.Thus, can prevent from for example to come from the diffusion of the sodium metal etc. of LPE-GaN13a.This thin layer 15 for example can use electron cyclotron resonace (ECR) sputtering method to form.
And shown in Fig. 2 (d), for example GaN layer 16 and the AlGaN layer 17 that forms by mocvd method forms device architectures such as semiconductor laser, light-emitting diode and high-frequency element thus, thereby can realize the semiconductor device of high reliability.
In addition, use the GaN substrate as III family element nitride crystal substrate 13, as the thin layer on this substrate 15, also can form silicon nitride layer (for example thickness is 3nm) or form AlN layer (for example thickness is 100nm) by electron cyclotron resonace (ECR) sputtering method by mocvd method.In addition, the formation by above-mentioned mocvd method AlN layer preferably is suitable for the decompression mocvd method.And on thin layer 15, after for example heated substrate makes underlayer temperature reach about 1020 ℃～1100 ℃, on substrate, supply trimethyl gallium (TMG) and NH 3Can form n type GaN crystallization.Owing in n type GaN crystallization, formed device architectures such as semiconductor laser, light-emitting diode and high-frequency element, thereby can realize the semiconductor device of high reliability.As the formation of the silicon nitride layer or the aln layer of thin layer, just can prevent to be present in impurity such as sodium in the III family element nitride crystal substrate 13 by like this to the diffusion of crystallizing layer 18.
Further describe the present invention with embodiment below.And, use the making of the III family element nitride semiconductor device of GaN crystallization to be illustrated among the following embodiment, but Al for example xGa 1-xThe composition formula of N or AlN etc. is Al xGa yIn 1-x-yThe III family element nitride crystal of N (wherein 0≤x≤1,0≤y≤1, x+y≤1) also can use the same method and form.
Embodiment 1
Embodiment 1 is for using the example of making semiconductor device on the inculating crystal layer that selectivity forms with the III family element nitride crystal of liquid-phase growth method growth.
At first, shown in Fig. 3 (a), after heating makes the temperature of the support substrate of being made up of sapphire 21 reach about 1020 ℃～1100 ℃, by on substrate, supplying trimethyl gallium (TMG) and NH 3, form the semiconductor seed layer of forming by GaN 22.
Secondly, by photoetching process, on the surface of semiconductor seed layer 22, form resist pattern.Under look like shown in Fig. 3 (b), by using Cl 2The dry etching of gas carries out graphical treatment to semiconductor seed layer 22.Described dry etching can carry out with reactive dry etching (RIE) device of inductance coupled mode.
Remove resist pattern then, form semiconductor seed layer 22.And, in the side of semiconductor seed layer 22 and support can also form mask on the face of substrate 21.And under blanket of nitrogen (preferably at 100atm (100 * 1.013 * 10 5Pa) or under the following pressurization atmosphere), in the fused solution that contains Ga, Na and nitrogen, contact with the surface of semiconductor seed layer 22, by fused solution is maintained hypersaturated state, shown in Fig. 3 (c), on semiconductor seed layer 22, make the LPE-Ga23a selective growth.At this moment, contain support substrate 21, inculating crystal layer 22 and LPE-GaN23a and become III family element nitride crystal substrate 23.
An example of the rocking type LPE device that Fig. 4 uses when representing the element nitride crystal making of III family.This rocking type LPE device 300 has the cultivation stove 301 of stainless steel, can anti-50atm (50 * 1.013 * 10 5Pa) air pressure.Cultivating on the stove 301, disposing the heater 302 and the thermocouple 303 of heating usefulness.Crucible fixed station 304 is configured in to be cultivated in the stove 301.Being equipped with rotating shaft 305 at this is the mechanism of center rotation.In crucible fixed station 304, fixing by boron nitride (BN) or aluminium oxide (Al 2O 3) crucible 306 formed.In crucible 306, dispose fused solution 307 and plant brilliant 308.By making 304 rotations of crucible fixed station, the fused solution move left and right in the crucible 306 can stir fused solution thus.Atmosphere pressures is adjusted by flow regulator 309.Nitrogen or ammonia (NH as unstrpped gas 3Gas) and the mist of nitrogen, supply with, remove to deliver to behind the impurity by gas purification portion and cultivate in the stove 301 by raw material gas tank (not shown).
An example to the crystalline growth that uses this device is illustrated below.
(1) at first, with Ga with as the Na of flux, the amount that only takes by weighing setting places in the crucible.Preferably using purity for Ga is 99.9999% (6 9) or above Ga, is to use refining Na for Na.At He (N 2, Ar, Ne, Xe etc. also can) make Na heating fusion in the glove-box of displacement, the oxide etc. that appears at superficial layer by removal just can be made with extra care Na.Also can make with extra care Na by means of zone melting method.Zone melting method by carry out fusion and the curing of Na repeatedly in pipe, separates out impurity, can improve the purity of Na by the removal of this impurity.
(2) secondly, the raw material in the fusion crucible rise to 800 ℃ with the temperature in the electric furnace.In this stage, as shown in the figure, plant brilliant substrate and be not present in the fused solution.For stirring Ga and Na, shake crucible with the degree that can not adhere to fused solution on kind of the brilliant substrate.For preventing the oxidation of GaN, as the atmosphere gas preference as using nitrogen.
(3) then, be that the center makes crucible rotation and will plant brilliant substrate and places fused solution to revolve axle, the beginning crystallization is cultivated.
(4) during crystallization is cultivated,, shake crucible with the speed in 1 cycle of per minute for stirring fused solution.Wherein, plant brilliant substrate in the cultivation and be present in the fused solution, make crucible remain on 800 ℃, pressure remains on 40atm (40 * 1.013 * 10 5Pa), for example carry out 10 hours LPE growth.
(5) cultivate to finish after, resemble and rotate crucible the diagram, take out substrate from fused solution, reduce the fused solution temperature.
With the result of described method Grown GaN crystallization is from the growth of semiconductor seed layer 22 beginning crystallizations, can observe the perforation dislocation from semiconductor seed layer to substrate surface, and from the part of semiconductor seed layer cross growth, can turn out good GaN monocrystalline.In addition, the part of meeting between the GaN of cross growth crystallization has also observed dislocation.
According to this method, be not only Na, can also use Li, K, Ca, Sr or Ba flux, perhaps use the mixed flux of alkali metal and alkaline-earth metal, also can obtain same effect.For example, the mixed flux of Na and Ca because sneaked into about 10% Ca, can be cultivated crystallization under lower pressure.
Secondly, shown in Fig. 3 (d), for example on substrate (LPE-GaN23a) 23, form the thin layer of forming by silicon nitride 25 by electron cyclotron resonace (ECR) sputtering method.Smooth processing also can be carried out by machining (polishing processing) and chemical mechanical polishing in the surface of substrate 23.In LPE-GaN23a, as previously mentioned, can observe perforation dislocation 24 to substrate surface from semiconductor seed layer 22.In addition, the part of meeting between the GaN crystallization of cross growth has also observed dislocation.The result who carries out impurity analysis by SIMS is in the zone that connects dislocation 24, for example has the impurity of many sodium and so on.Surface at the substrate 23 that has the zone that connects dislocation 24 has formed the thin layer of being made up of silicon nitride 25.Described thin layer also can be that aluminium nitride, aluminium gallium nitride alloy, carborundum, germanium nitride or diamond like carbon replace silicon nitride.
And, shown in Fig. 3 (e), for example form GaN layer 26 and AlGaN layer 27 by mocvd method, can make semiconductor device of the present invention thus.When using the GaN substrate of making by the alkali metal flux growth method to make semiconductor device, formed thin layer 25 thus, alkali metal etc. can be prevented to the illuminating part of semiconductor laser, light-emitting diode or the diffusion of transistorized each electrode part of FET, thereby Devices Characteristics can be improved.
Though formed the substrate of semiconductor seed layer and make the GaN crystallization carry out LPE Grown GaN substrate to be illustrated with regard to use, also can use and to carry out the GaN substrate that slice processing obtains with the GaN crystallization as the crystallization that seed crystal carries out the large-size massive growth.Sheng Chang crystallization like this, owing to do not have selective growth, thereby probably partly wait impurity such as containing alkali metal or alkaline-earth metal in the dislocation that produces at random.For this reason, form thin layer, can prevent the diffusion of impurity on the entire substrate surface.
Method with regard to the fabricating yard effect transistor is that the basis is illustrated with Fig. 5 below.III family element nitride crystal substrate 43 contains and supports substrate 41, inculating crystal layer 42 and LPE-GaN43a, and it for example is 10 that the LPE-GaN43a that is obtained by foregoing liquid growth shows resistance 10Ω or the above characteristic that approaches insulator.Zone in the perforation dislocation 44 of this LPE-GaN43a has formed the silicon nitride layer as thin layer 45.Afterwards, GaN layer 46 and AlGaN layer 47 have been formed by mocvd method.And, form source electrode 48, conductivity gate 49 in the above and drain 50.By to grid 49 applied voltages, control the two-dimensional electron gas bulk concentration of the interface formation of GaN layer 46 and AlGaN layer 47, carry out as transistorized action.
The field-effect transistor that the method according to this invention forms, owing to formed thin layer, insulating properties is also higher, the leakage current in the time of can reducing transistor action can be realized the field-effect transistor of excellent in high-frequency characteristics.
Embodiment 2
Fig. 6 has represented the example that semiconductor laser constitutes.Represented as this figure, at first, on the GaN substrate 51 that has formed thin layer (not shown), for making carrier density 5 * 10 18Cm -3Or below, the contact layer 52 of the n type GaN composition of the Si that mixed is oozed in formation.The crystallization (containing the crystallization of Ga and N) of GaN system, the emptying aperture of Ga increases when having added as impurity Si.Because the emptying aperture of such Ga spreads easily, thereby when on it, making device, will exert an adverse impact at aspects such as life-spans.For this reason, the control doped account is 1 * 10 so that make carrier density 19Cm -3Or below, be preferably 3 * 10 18Cm -3Or below.
Secondly, on contact layer 52, form by n type Al 0.07Ga 0.93Coating 53 that N forms and the photoconductive layer of forming by n type GaN 54.Afterwards, form the multiple quantum well (MQW) as active layer 55, described multiple quantum well is by consisting of Ga 0.8In 0.2The barrier layer (thickness is 6nm) that the well layer of N (the about 3nm of thickness) and GaN form constitutes.And then form the photoconductive layer 56 formed by p type GaN, by p type Al 0.07Ga 0.93Coating 57 that N forms and the contact layer of forming by p type GaN 58.These layers can form with known method.Semiconductor laser 500 is a double heterojunction N-type semiconductor N laser, and the energy gap that contains indium well layer of MQW active layer 55 is littler than the energy gap of n type that contains aluminium and p type coating.On the other hand, for the refractive index of light, the well layer of active layer 55 is maximum, and the order of secondly pressing photoconductive layer 54, coating 53 reduces.
On the part of contact layer 58, forming the formation width is the dielectric film 59 in the current injection area territory about 2 μ m.On the part and p type contact layer 58 of p type coating 57, become the protrusion of current blocking portion.
In the side of p type contact layer 58, form the p lateral electrode 60 of carrying out ohmic contact with contact layer 58.In the side of n type contact layer 52, form the n lateral electrode 61 of carrying out ohmic contact with contact layer 52.
Embodiment 3
Fig. 7 represents other formation of semiconductor laser.In the figure, 601 express support for substrate, 602 expression inculating crystal layers, 603 expression LPE-GaN layers, 604 expressions connect dislocation, 605 expression thin layers, 606 expression GaN layers, 607 expression n-GaN layers, 608 expression n coatings, 609 expression active layers, 610 expression protrusions, 611 expression p lateral electrodes, 612 expression dielectric films, 614 expression n lateral electrodes, 615 expression selective growth films, 616 expression symmetry axis.As shown in the figure, rising zone 610 that this device is formed the laser vibration section and is to form on the position of the symmetry axis 616 that departs from thin layer 605 on thin layer 605.The epitaxial film (GaN layer 606) of growing mutually in thin layer 605 enterprising promoting the circulation of qi is because the never part of thin layer 605 growth and roughly near on the symmetry axis 616, so I'm afraid remaining edge dislocation on symmetry axis 616.For this reason, wish that rising zone 610 departs from symmetry axis.
Carried out device evaluation to the semiconductor laser of described structure.For the semiconductor laser that obtains, when between p lateral electrode and n lateral electrode, adding the setting voltage of forward, in the MQW active layer from p lateral electrode injected hole, inject electronics from the n lateral electrode, in the MQW active layer again in conjunction with producing optical gain, the laser vibration takes place at vibration wavelength 404nm place.
In addition, operable III family element nitride crystal substrate is not limited to described GaN single crystalline substrate in semiconductor device of the present invention, the preferred few substrate of supplying with the optics of making on substrate of use wavelength absorption.For this reason, as the semiconductor laser and the effective substrate of light-emitting diodes of ultraviolet range, the preferred use contains the many and few Al of short wavelength regions light absorption of aluminium xGa 1-xN (0≤x≤1) monocrystalline.
Embodiment 4
Shown in Fig. 8 (a), be flux with sodium, on the GaN substrate of making by liquid growth, carry out epitaxial growth, be made into wafer by the semiconductor laser of laser structure processing and formation electrode.Shown in Fig. 8 (b), into strips with this wafer process.For the reflectivity of control laser resonator and carry out end face protection and then prevent the diffusion of sodium, be formed with coating on the light-emitting area of bar.In this coating, contain silicon nitride layer at least, to prevent the diffusion of sodium.In addition, in the figure, on LPE-GaN substrate 82, form device architecture 83, and then also can form electrode 84.Secondly, shown in Fig. 8 (c), the bar that the end face of illuminating part applied carry out chipization.On the chip sides of cutting apart (divisional plane) 85, probably occur part because the sodium impurity zone (not shown) that dislocation or defective cause, think and the diffusion that prevents sodium need on divisional plane, also form thin layers such as silicon nitride.The leakage current that the diffusion by sodium causes can be significantly reduced whereby, stable device work can be realized.In addition, in the figure 86 the expression light-emitting areas.
At this, use silicon nitride as thin layer, but aluminium nitride, carborundum or diamond like carbon etc. also have higher block to sodium, can be used effectively.
The present invention is applicable to for example various semiconductor device such as laser diode, light-emitting diode, field-effect transistor.
In addition, at concrete example or the embodiment that carries out in the item that explain of the present invention, clear and definite technology contents of the present invention can not only limit to the explanation that such object lesson carries out narrow sense, in purport of the present invention, can do and variously be implemented after changing.

Claims (22)

1. III family element nitride semiconductor device that on III family element nitride crystal substrate, is laminated with III family element nitride crystal layer, it is characterized in that: described substrate is at least a fused solution among containing alkali metal and alkaline-earth metal, makes by making nitrogen in the gas that contains nitrogen and III family element reaction and crystallization; On described substrate, be formed with thin layer; The diffusion coefficient of the impurity that contains in described substrate in described thin layer is littler than the diffusion coefficient of this impurity in described substrate.
2. the semiconductor device of putting down in writing according to claim 1 wherein exists to connect dislocation on described substrate, is formed with described thin layer in the part of the described perforation dislocation of correspondence.
3. wherein there is impurity in the semiconductor device of putting down in writing according to claim 2 in the zone of described perforation dislocation, and described impurity is at least a among alkali metal and the alkaline-earth metal.
4. the semiconductor device of putting down in writing according to claim 1, wherein said impurity are at least a among Na and the Li.
5. the semiconductor device of putting down in writing according to claim 1, wherein said thin layer is to form on the whole surface of described substrate.
6. the semiconductor device of putting down in writing according to claim 1, wherein said thin layer is a silicon nitride.
7. the semiconductor device of putting down in writing according to claim 6, the thickness of wherein said thin layer is 5nm or following.
8. the semiconductor device of putting down in writing according to claim 6, the thickness of wherein said thin layer is 3nm or following.
9. the semiconductor device of putting down in writing according to claim 1, wherein said thin layer are at least a among aluminium nitride, aluminium gallium nitride alloy and the carborundum, and the composition formula of wherein said aluminium gallium nitride alloy is Al xGa 1-xN, 0≤x≤1.
10. the semiconductor device of putting down in writing according to claim 1 is formed with described thin layer between described substrate and described crystallizing layer.
11. the semiconductor device according to claim 10 is put down in writing also is formed with III family element nitride crystal layer between described substrate and described thin layer.
12. according to the semiconductor device that claim 1 is put down in writing, wherein said crystallizing layer forms by vapor phase growth.
13. according to the semiconductor device that claim 1 is put down in writing, the alkali metal in the wherein said fused solution is at least a among Na, Li, K, Rb, Cs and the Fr.
14. according to the semiconductor device that claim 1 is put down in writing, the alkali metal in the wherein said fused solution is at least a among Na and the Li.
15. according to the semiconductor device that claim 1 is put down in writing, the alkaline earth generic in the wherein said fused solution is at least a among Ca and the Mg.
16. according to the semiconductor device that claim 1 is put down in writing, wherein said III family element is at least a among Ga, Al and the In.
17. the semiconductor device of putting down in writing according to claim 1, wherein said fused solution contains at least a among Na and the Li, described substrate is the gallium nitride substrate, and described thin layer is at least a among aluminium nitride, aluminium gallium nitride alloy and the carborundum, and the composition formula of wherein said aluminium gallium nitride alloy is Al xGa 1-xN, 0≤x≤1.
18. according to the semiconductor device that claim 17 is put down in writing, wherein said substrate contains at least a impurity among Na and the Li.
19. according to the semiconductor device that claim 1 is put down in writing, wherein said fused solution contains at least a and Ca among Li, Na and the Sn, described substrate is the aluminium nitride substrate, and described thin layer is a diamond.
20. according to the semiconductor device that claim 19 is put down in writing, wherein said substrate contains at least a impurity among Na and the Li.
21. the semiconductor device of putting down in writing according to claim 1, on described substrate, be formed with in the described thin layer, side at described semiconductor device is formed with thin layer, perhaps only is formed with thin layer in the side of described semiconductor device and forms described thin layer on described substrate.
22. according to the semiconductor device that claim 1 is put down in writing, wherein said semiconductor device is laser diode, light-emitting diode and field-effect transistor.
CN200410086095.XA 2003-10-20 2004-10-20 Group-III-element nitride crystal semiconductor device Expired - Fee Related CN1610138B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003359709 2003-10-20
JP359709/2003 2003-10-20
JP188478/2004 2004-06-25
JP2004188478 2004-06-25

Publications (2)

Publication Number Publication Date
CN1610138A true CN1610138A (en) 2005-04-27
CN1610138B CN1610138B (en) 2010-05-12

Family

ID=34525419

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200410086095.XA Expired - Fee Related CN1610138B (en) 2003-10-20 2004-10-20 Group-III-element nitride crystal semiconductor device

Country Status (2)

Country Link
US (1) US7227172B2 (en)
CN (1) CN1610138B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8192543B2 (en) 2005-06-23 2012-06-05 Sumitomo Electric Industries, Ltd. Nitride crystal, nitride crystal substrate, epilayer-containing nitride crystal substrate, semiconductor device and method of manufacturing the same
US8771552B2 (en) 2005-06-23 2014-07-08 Sumitomo Electric Industries, Ltd. Group III nitride crystal substrate, epilayer-containing group III nitride crystal substrate, semiconductor device and method of manufacturing the same
CN105314886A (en) * 2015-07-15 2016-02-10 常州亚玛顿股份有限公司 High weather resistance antireflection glass
US9708735B2 (en) 2005-06-23 2017-07-18 Sumitomo Electric Industries, Ltd. Group III nitride crystal substrate, epilayer-containing group III nitride crystal substrate, semiconductor device and method of manufacturing the same
CN108425147A (en) * 2011-08-10 2018-08-21 日本碍子株式会社 13 race's element nitride films and its laminated body

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7221037B2 (en) * 2003-01-20 2007-05-22 Matsushita Electric Industrial Co., Ltd. Method of manufacturing group III nitride substrate and semiconductor device
US7524691B2 (en) * 2003-01-20 2009-04-28 Panasonic Corporation Method of manufacturing group III nitride substrate
US7176115B2 (en) * 2003-03-20 2007-02-13 Matsushita Electric Industrial Co., Ltd. Method of manufacturing Group III nitride substrate and semiconductor device
US7309534B2 (en) * 2003-05-29 2007-12-18 Matsushita Electric Industrial Co., Ltd. Group III nitride crystals usable as group III nitride substrate, method of manufacturing the same, and semiconductor device including the same
US7255742B2 (en) * 2003-07-02 2007-08-14 Matsushita Electric Industrial Co., Ltd. Method of manufacturing Group III nitride crystals, method of manufacturing semiconductor substrate, Group III nitride crystals, semiconductor substrate, and electronic device
US7288152B2 (en) * 2003-08-29 2007-10-30 Matsushita Electric Industrial Co., Ltd. Method of manufacturing GaN crystals and GaN crystal substrate, GaN crystals and GaN crystal substrate obtained by the method, and semiconductor device including the same
US7227172B2 (en) 2003-10-20 2007-06-05 Matsushita Electric Industrial Co., Ltd. Group-III-element nitride crystal semiconductor device
EP1734158B1 (en) * 2004-03-31 2012-01-04 NGK Insulators, Ltd. Gallium nitride single crystal growing method
JP5015417B2 (en) * 2004-06-09 2012-08-29 住友電気工業株式会社 GaN crystal manufacturing method
JP4856934B2 (en) 2005-11-21 2012-01-18 株式会社リコー GaN crystal
US8231726B2 (en) * 2006-01-20 2012-07-31 Panasonic Corporation Semiconductor light emitting element, group III nitride semiconductor substrate and method for manufacturing such group III nitride semiconductor substrate
EP2083865A2 (en) 2006-10-12 2009-08-05 C-3 International, Llc Methods for providing prophylactic surface treatment for fluid processing systems and components thereof
US8236594B2 (en) * 2006-10-20 2012-08-07 Chien-Min Sung Semiconductor-on-diamond devices and associated methods
JP4538596B2 (en) * 2006-11-14 2010-09-08 国立大学法人大阪大学 GaN crystal manufacturing method
WO2008099720A1 (en) * 2007-02-15 2008-08-21 Ngk Insulators, Ltd. Melt composition for gallium nitride single crystal growth and method for growing gallium nitride single crystal
WO2009047894A1 (en) * 2007-10-09 2009-04-16 Panasonic Corporation Method for producing group iii nitride crystal substrate, group iii nitride crystal substrate, and semiconductor device using group iii nitride crystal substrate
KR20090072980A (en) * 2007-12-28 2009-07-02 서울옵토디바이스주식회사 Light emitting diode and method of fabricating the same
NL1036459A1 (en) * 2008-02-13 2009-08-14 Asml Netherlands Bv Method and apparatus for angular-resolved spectroscopic lithography characterization.
US8623301B1 (en) 2008-04-09 2014-01-07 C3 International, Llc Solid oxide fuel cells, electrolyzers, and sensors, and methods of making and using the same
WO2010024390A1 (en) * 2008-08-29 2010-03-04 住友金属工業株式会社 METHOD AND APPARATUS FOR MANUFACTURING SiC SINGLE CRYSTAL FILM
WO2013021804A1 (en) 2011-08-10 2013-02-14 日本碍子株式会社 Method for peeling group 13 element nitride film
JP5903818B2 (en) * 2011-09-26 2016-04-13 富士通株式会社 Compound semiconductor device and manufacturing method thereof
CN103243389B (en) 2012-02-08 2016-06-08 丰田合成株式会社 Manufacture the method for group III nitride semiconductor monocrystalline and manufacture the method for GaN substrate
JP5708550B2 (en) * 2012-04-03 2015-04-30 株式会社デンソー Silicon carbide semiconductor device and manufacturing method thereof
JP5999443B2 (en) * 2013-06-07 2016-09-28 豊田合成株式会社 Group III nitride semiconductor crystal manufacturing method and GaN substrate manufacturing method
JP6384851B2 (en) * 2014-03-03 2018-09-05 国立大学法人大阪大学 Group III nitride crystal manufacturing method, group III nitride crystal, semiconductor device, and group III nitride crystal manufacturing apparatus
US10202710B2 (en) 2014-03-03 2019-02-12 Osaka University Process for producing group III nitride crystal and apparatus for producing group III nitride crystal
CN104269486A (en) * 2014-09-15 2015-01-07 映瑞光电科技(上海)有限公司 Flip LED chip and manufacturing method thereof
CN109390368B (en) * 2018-09-26 2020-11-27 北京蜃景光电科技有限公司 Micro-display device, preparation method thereof and display panel

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5838029A (en) * 1994-08-22 1998-11-17 Rohm Co., Ltd. GaN-type light emitting device formed on a silicon substrate
JP3409576B2 (en) 1996-04-25 2003-05-26 ソニー株式会社 Method for manufacturing semiconductor device
US5868837A (en) * 1997-01-17 1999-02-09 Cornell Research Foundation, Inc. Low temperature method of preparing GaN single crystals
US6270569B1 (en) 1997-06-11 2001-08-07 Hitachi Cable Ltd. Method of fabricating nitride crystal, mixture, liquid phase growth method, nitride crystal, nitride crystal powders, and vapor phase growth method
JP3036495B2 (en) * 1997-11-07 2000-04-24 豊田合成株式会社 Method for manufacturing gallium nitride-based compound semiconductor
TW418549B (en) * 1998-06-26 2001-01-11 Sharp Kk Crystal growth method for nitride semiconductor, nitride semiconductor light emitting device, and method for producing the same
US6614059B1 (en) * 1999-01-07 2003-09-02 Matsushita Electric Industrial Co., Ltd. Semiconductor light-emitting device with quantum well
JP4231189B2 (en) 1999-04-14 2009-02-25 パナソニック株式会社 Method for producing group III nitride compound semiconductor substrate
US6592663B1 (en) * 1999-06-09 2003-07-15 Ricoh Company Ltd. Production of a GaN bulk crystal substrate and a semiconductor device formed on a GaN bulk crystal substrate
TW504754B (en) * 2000-03-24 2002-10-01 Sumitomo Chemical Co Group III-V compound semiconductor and method of producing the same
JP2002293696A (en) 2001-03-29 2002-10-09 Japan Science & Technology Corp METHOD OF MANUFACTURING CaN SINGLE CRYSTAL
JP3795765B2 (en) * 2001-04-06 2006-07-12 ソニー株式会社 Method for manufacturing compound semiconductor substrate
JP3785970B2 (en) 2001-09-03 2006-06-14 日本電気株式会社 Method for manufacturing group III nitride semiconductor device
US6710376B2 (en) * 2001-09-04 2004-03-23 Eugene Robert Worley Opto-coupler based on integrated forward biased silicon diode LED
EP1548160A4 (en) 2002-07-31 2009-04-29 Osaka Ind Promotion Org Method for producing group iii element nitride single crystal and group iii element nitride transparent single crystal prepared thereby
US7098487B2 (en) * 2002-12-27 2006-08-29 General Electric Company Gallium nitride crystal and method of making same
US7524691B2 (en) * 2003-01-20 2009-04-28 Panasonic Corporation Method of manufacturing group III nitride substrate
US7221037B2 (en) * 2003-01-20 2007-05-22 Matsushita Electric Industrial Co., Ltd. Method of manufacturing group III nitride substrate and semiconductor device
US7176115B2 (en) * 2003-03-20 2007-02-13 Matsushita Electric Industrial Co., Ltd. Method of manufacturing Group III nitride substrate and semiconductor device
US7309534B2 (en) * 2003-05-29 2007-12-18 Matsushita Electric Industrial Co., Ltd. Group III nitride crystals usable as group III nitride substrate, method of manufacturing the same, and semiconductor device including the same
US7255742B2 (en) * 2003-07-02 2007-08-14 Matsushita Electric Industrial Co., Ltd. Method of manufacturing Group III nitride crystals, method of manufacturing semiconductor substrate, Group III nitride crystals, semiconductor substrate, and electronic device
US7227172B2 (en) 2003-10-20 2007-06-05 Matsushita Electric Industrial Co., Ltd. Group-III-element nitride crystal semiconductor device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8192543B2 (en) 2005-06-23 2012-06-05 Sumitomo Electric Industries, Ltd. Nitride crystal, nitride crystal substrate, epilayer-containing nitride crystal substrate, semiconductor device and method of manufacturing the same
CN1896343B (en) * 2005-06-23 2012-07-04 住友电气工业株式会社 Nitride crystal, nitride crystal substrate, epilayer-containing nitride crystal substrate, semiconductor device and method of manufacturing the same
US8771552B2 (en) 2005-06-23 2014-07-08 Sumitomo Electric Industries, Ltd. Group III nitride crystal substrate, epilayer-containing group III nitride crystal substrate, semiconductor device and method of manufacturing the same
US8828140B2 (en) 2005-06-23 2014-09-09 Sumitomo Electric Industries, Ltd. Nitride crystal, nitride crystal substrate, epilayer-containing nitride crystal substrate, semiconductor device and method of manufacturing the same
US9499925B2 (en) 2005-06-23 2016-11-22 Sumitomo Electric Industries, Ltd. Group III nitride crystal substrate, epilayer-containing group III nitride crystal substrate, semiconductor device and method of manufacturing the same
US9570540B2 (en) 2005-06-23 2017-02-14 Sumitomo Electric Industries, Ltd. Nitride crystal, nitride crystal substrate, epilayer-containing nitride crystal substrate, semiconductor device and method of manufacturing the same
US9708735B2 (en) 2005-06-23 2017-07-18 Sumitomo Electric Industries, Ltd. Group III nitride crystal substrate, epilayer-containing group III nitride crystal substrate, semiconductor device and method of manufacturing the same
US10078059B2 (en) 2005-06-23 2018-09-18 Sumitomo Electric Industries, Ltd. Nitride crystal, nitride crystal substrate, epilayer-containing nitride crystal substrate, semiconductor device and method of manufacturing the same
CN108425147A (en) * 2011-08-10 2018-08-21 日本碍子株式会社 13 race's element nitride films and its laminated body
CN105314886A (en) * 2015-07-15 2016-02-10 常州亚玛顿股份有限公司 High weather resistance antireflection glass

Also Published As

Publication number Publication date
US20050082564A1 (en) 2005-04-21
US7227172B2 (en) 2007-06-05
CN1610138B (en) 2010-05-12

Similar Documents

Publication Publication Date Title
CN1610138B (en) Group-III-element nitride crystal semiconductor device
US5432808A (en) Compound semicondutor light-emitting device
US5239188A (en) Gallium nitride base semiconductor device
CN100423297C (en) Method for manufacturing N0.3 family nitride substrate
JP5026271B2 (en) Method for producing hexagonal nitride single crystal, method for producing hexagonal nitride semiconductor crystal and hexagonal nitride single crystal wafer
US7125801B2 (en) Method of manufacturing Group III nitride crystal substrate, etchant used in the method, Group III nitride crystal substrate, and semiconductor device including the same
US20040144300A1 (en) Method of manufacturing group III nitride substrate and semiconductor device
JP4397695B2 (en) Method for manufacturing group III nitride substrate
CN100338733C (en) Group III nitride semiconductor crystal, production method thereof and group III nitride semiconductor epitaxial wafer
JPWO2004013385A1 (en) Method for producing group III element nitride single crystal and group III element nitride transparent single crystal obtained thereby
JP2005012171A (en) Method for manufacturing group iii nitride substrate and semiconductor device
JP2004224600A (en) Manufacturing method of group iii nitride substrate, and semiconductor device
WO2000057460A1 (en) METHOD FOR GROWING GaN COMPOUND SEMICONDUCTOR CRYSTAL AND SEMICONDUCTOR SUBSTRATE
JP4597534B2 (en) Method for manufacturing group III nitride substrate
JP2010056555A (en) Semiconductor structure and method for manufacturing the same
CN105393336A (en) Composite substrate, method for fabricating same, function element, and seed crystal substrate
US6538265B1 (en) Indium aluminum nitride based light emitter active layer with indium rich and aluminum rich areas
CN100547734C (en) Multilayered semiconductor substrate, semiconductor free-standing substrate and preparation method thereof and semiconductor device
JP4824920B2 (en) Group III element nitride crystal semiconductor device
JP4554287B2 (en) Group III nitride crystal manufacturing method and semiconductor substrate manufacturing method
JP4451265B2 (en) Group III element nitride crystal substrate and group III element nitride semiconductor device manufacturing method
JP2001274093A (en) Semiconductor base and its manufacturing method
JPH05190900A (en) Manufacture of semiconductor light-emitting device
US7306675B2 (en) Method for manufacturing semiconductor substrate
Zhang et al. GaN Substrate Material for III–V Semiconductor Epitaxy Growth

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100512

Termination date: 20131020