CN1599142A - Connector and image sensor module using the same - Google Patents

Connector and image sensor module using the same Download PDF

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Publication number
CN1599142A
CN1599142A CNA2004100431193A CN200410043119A CN1599142A CN 1599142 A CN1599142 A CN 1599142A CN A2004100431193 A CNA2004100431193 A CN A2004100431193A CN 200410043119 A CN200410043119 A CN 200410043119A CN 1599142 A CN1599142 A CN 1599142A
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CN
China
Prior art keywords
conductive pattern
substrate
dielectric substrate
imageing sensor
image sensor
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Granted
Application number
CNA2004100431193A
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Chinese (zh)
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CN1298082C (en
Inventor
金相镐
李永燮
李铉周
李都炯
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Publication date
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Publication of CN1599142A publication Critical patent/CN1599142A/en
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Publication of CN1298082C publication Critical patent/CN1298082C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

A conductive connector for use by an image module connects electrically a first electric circuit substrate having a first conductive pattern to a second electric circuit substrate having a second conductive pattern. The conductive connector includes an insulating substrate located between the first electric circuit substrate and the second electric circuit substrate, and has at least one hole formed by perforation, and a conductive filling material filled in the hole for electrically connecting the first conductive pattern to the second conductive pattern.

Description

The image sensor module of connector and this connector of use
Technical field
The present invention relates to electric connector structure, relate in particular to and have the image sensor module that is electrically connected to the printed circuit board (PCB) Images transducer.
Background technology
Generally, image sensor module is constructed to: use such as CCD (charge coupled device) or CMOS etc. and can obtain opto-electronic conversion and charge-coupled imageing sensor takes pictures as object, to export the corresponding signal of telecommunication of being clapped image.Image sensor module comprises printed circuit board (PCB) (PCB), imageing sensor, be used for PCB be electrically connected to imageing sensor device, be used for protecting the housing of each above-mentioned parts and be used for embodying the lens combination of the light signal input picture transducer of object.
Imageing sensor comprises CCD or CMOS, and will convert the signal of telecommunication to by the light signal that the photographic subjects thing obtains.Be used for the pixel that light signal converts the signal of telecommunication to is arranged on the upper surface of imageing sensor.The conductive pattern that can conduct each signal of telecommunication that is become by pixel transitions is formed on the imageing sensor.These conductive pattern wire-bonded are to the conductive pattern that is formed on the PCB upper surface, and conductive pattern described later is electrically connected to imageing sensor by this way: promptly detect the signal of telecommunication that converted to by imageing sensor and the described signal of telecommunication is sent to the outside.
The method of making above-mentioned image sensor module comprises COB (the plate base is chip-shaped) technology, COF (thin film based is chip-shaped) technology and CSP (chip size packages) technology.
Fig. 1 is the view that traditional C OB type image sensor module is shown, and described module has the imageing sensor 120 that is engaged to the PCB110 upper surface.Imageing sensor 120 comprises conductive pattern 122 and the pixel 121 that is used for detecting radiant light, and is engaged to the last core of PCB110 by die bonder, and wherein conductive pattern 111 is formed on the described PCB110.Imageing sensor 120 is electrically connected to the conductive pattern 111 that is formed on the PCB110 by wire-bonded 160, and is installed in housing 150 protections on the PCB110.
Infrared ray cut off filter 130 is fixed on the top of housing 150, and is relative with imageing sensor 120.And lens combination 140 is fixed on the infrared ray cut off filter 130, so that collected radiation is gone into the light of imageing sensor 120.
Yet above-mentioned COB type image sensor module existing problems are: the pixel of imageing sensor is easily by contaminating impurity.
Fig. 2 is the view that traditional C OF type image sensor module is shown.With reference to figure 2, COF type image sensor module has the imageing sensor 220 that is fixed to the PCB210 bottom by ACF (anisotropic conducting film), and the core of wherein said PCB210 forms porose 212.ACF comprises the conduction sphere, and is melted by this way when pressure or heat apply thereon: even imageing sensor 220 electricity are engaged to PCB210.
One side place of imageing sensor 220 has conductive pattern 222 and pixel 221, and with pixel faces the mode in the hole 212 of PCB is engaged to PCB210.
Shape for hat housing 260 is installed on the upper surface of PCB210, and is fixed in the infrared ray cut off filter 240 at place, housing top.Lens combination 250 is arranged on the top of housing 260, and is relative with pixel 221 and align with infrared ray cut off filter 240, so that radiant light is inducted into pixel.
Yet imageing sensor is equally easily by contaminating impurity, and COF type image sensor module also has such problem: promptly the engaging force of ACF can depend on temperature and changes a lot.
Fig. 3 is the view that traditional C P type image sensor module is shown.With reference to figure 3, CSP type image sensor module comprises imageing sensor 320, and the upper surface place of described imageing sensor 320 is formed with pixel 321, and its lower surface place is formed with the conductive pattern 322 that is electrically connected to pixel 321.In addition, glass substrate 370 is engaged to the upper surface of imageing sensor 320, so that surround pixel 321, thereby prevents that pixel is by contaminating impurity.
Imageing sensor 320 is engaged to the upper surface of PCB310 by stove reflux technique (oven reflow process), and the upper surface place of described PCB310 is formed with conductive pattern 311.
Specifically, the soldered ball (not shown) is inserted between PCB310 and the imageing sensor 320, and is melted by the stove reflux technique, thereby imageing sensor 320 electricity are engaged to PCB310.
Above-mentioned CSP type image sensor module comprises the housing that is installed on the PCB310, the infrared ray cut off filter 330 that is fixed on housing 350 tops and lens combination 340.
Yet problem is, because pixel and conductive pattern be formed on the upper and lower surface of imageing sensor, and the therefore technology that the pixel of imageing sensor need be connected to conductive pattern and glass substrate be engaged to the imageing sensor upper surface.Because the increase of the quantity of required step and parts, these additional process steps force manufacturing cost to raise.
Summary of the invention
The present invention is intended to solve the above-mentioned problems in the prior art, and the purpose of this invention is to provide a kind of Elecrical connector structure, and it can prevent the article defects that causes owing to impurity, and can boost productivity by easily realizing being electrically connected to fetch.
In order to realize above purpose, it provides a kind of Elecrical connector, and first circuitry substrate that this Elecrical connector will have first conductive pattern is electrically connected to the second circuit substrate with second conductive pattern.Elecrical connector comprises the dielectric substrate between first circuitry substrate and second circuit substrate, and has at least one hole that forms by the punching to dielectric substrate.Conductive filling material is filled in the described hole, so that first conductive pattern is electrically connected to second conductive pattern.
Description of drawings
By the detailed description below in conjunction with accompanying drawing, above purpose of the present invention and other feature and advantage will become more obvious, and wherein identical label is used to indicate identical or similar parts in whole accompanying drawings:
Fig. 1 is the view that traditional C OB type image sensor module is shown;
Fig. 2 is the view that traditional C OF type image sensor module is shown;
Fig. 3 is the view that traditional C P type image sensor module is shown;
Fig. 4 illustrates the view of Elecrical connector structure according to an embodiment of the invention;
Fig. 5 is the cutaway view that illustrates according to the structure of the image sensor module of first embodiment of the invention; And
Fig. 6 is the view that illustrates according to the structure of the image sensor module of second embodiment of the invention.
Embodiment
The preferred embodiments of the present invention are described below with reference to the accompanying drawings.For sake of clarity, omitted the known function of institute's combination in the literary composition and the detailed description of structure.
The view of Fig. 4 shows Elecrical connector structure according to an embodiment of the invention by explanatory and the mode indefiniteness example.As shown in Figure 4, Elecrical connector according to the present invention comprises: first circuitry substrate 410; Second circuit substrate 420; Dielectric substrate 430 with at least one hole 431, wherein said hole is by punching forms to dielectric substrate; And be filled in conductive filling material 440 in the hole 431, be used for first circuitry substrate 410 is electrically connected to second circuit substrate 420.
The upper surface place of first circuitry substrate 410 is formed with first conductive pattern 411, and the lower surface place of second circuit substrate 420 is formed with second conductive pattern 421.Second circuit substrate 420 is located by this way with first circuitry substrate 410: promptly first conductive pattern 411 is relative with second conductive pattern 421.
When dielectric substrate 430 is between first circuitry substrate 410 and second circuit substrate 420, in the bottom of second conductive pattern, 421 patchholes 431, in the top of first conductive pattern, 411 patchholes 431.
Dielectric substrate 430 comprises glass or the plastics with good electric insulation attribute.And dielectric substrate 430 is by adhesive, such as the epoxy resin that is coated between first circuitry substrate and the second circuit substrate, and is engaged in first circuitry substrate 410 and the second circuit substrate 420 each.The adhesive that comprises epoxy resin is coated on the whole zone except that hole 431 of dielectric substrate 430.
Conductive filling material 440 comprises soldered ball.After in the upper end of soldered ball patchhole 431 and each end in the bottom, heat is applied to soldered ball to melt described soldered ball, so that first conductive pattern 411 is electrically connected to second conductive pattern 421.Before dielectric substrate 430 was engaged to first circuitry substrate 410 and second circuit substrate 420, soldered ball was inserted in the hole 431.
Fig. 5 is an example that illustrates according to the structure of the image sensor module of first embodiment of the invention.With reference to figure 5, image sensor module comprises imageing sensor 530, PCB510, dielectric substrate 520, is used to support housing 540 and the lens combination 550 of PCB510.
Imageing sensor 530 comprises and is used for radiant light is converted to the pixel 531 of the signal of telecommunication and will be exported at least one outside first conductive pattern 532 by pixel 531 electrical signal converted.
PCB510 comprises second conductive pattern 511 and hole 512, and can export its outside to from the signal of telecommunication of imageing sensor 530 inputs, and allows radiant light through pixel 531.PCB510 is divided into flexible PCB and rigidity PCB.In first conductive pattern 532 and second conductive pattern 511 each is formed with metallic alloy, such as Au and Cu.
Dielectric substrate 520 comprises at least one hole 521, as making first conductive pattern 532 be electrically connected to the path of second conductive pattern 511.Dielectric substrate 520 is used glass by this way: promptly radiant light is assembled in the pixel 531.And infrared filter is formed on the dielectric substrate 520.
One side engagement of dielectric substrate 520 is to the side that is formed with second conductive pattern 511 of PCB510, and the opposite side of dielectric substrate 520 is engaged to a side that is formed with first conductive pattern 532 of imageing sensor 530.By being coated on the predetermined portions that does not form hole 521 of dielectric substrate 520, make dielectric substrate 520 be engaged to the end of each imageing sensor 530 and PCB510 such as adhesives such as epoxy resin.
Second conductive pattern 511 of PCB510 is inserted in the top in hole 521, and first conductive pattern 532 of imageing sensor 530 is inserted in the bottom in hole 521.Therefore, first conductive pattern 532 is relative with second conductive pattern 511.
Specifically, dielectric substrate 520 is engaged to the side with pixel 531 and first conductive pattern 532 of imageing sensor 530, thereby prevents that pixel 531 is by contaminating impurity.And when hole 521 execution made second conductive pattern 511 be electrically connected to the access function of first conductive pattern 532, second conductive pattern 511 was electrically connected to first conductive pattern 532 in an easy manner.
And first conductive pattern 532 of imageing sensor 530 and second conductive pattern 511 of PCB510 are electrically connected to each other by the conductive filling material 560 that is filled in the hole 521.Conductive filling material 560 comprises soldered ball.Before dielectric substrate 520 was engaged to imageing sensor 530 and PCB510, soldered ball was inserted in the bottom and top in hole 521.Soldered ball is melted by the stove reflux technique, thereby first conductive pattern 532 is electrically connected to second conductive pattern 511.
Shape for hat housing 540 is installed on the PCB510, and lens combination 550 is fixed on the top of housing 540.Radiant light scioptics system 550 is focused at pixel 531 places of imageing sensor 530.
The invention provides the following advantage of image sensor module: manufacturing easily, productivity ratio improve and avoid by contaminating impurity.
Fig. 6 is the example view that illustrates according to the structure of the image sensor module of second embodiment of the invention.With reference to figure 6, image sensor module comprises: imageing sensor 630 is formed with the pixel 631 and first conductive pattern 632 on its top; PCB610 forms porosely 612 at its core, and be formed with second conductive pattern 611 in its bottom; Dielectric substrate 620 between PCB and imageing sensor, described dielectric substrate 620 have perforation 621, as the path that first conductive pattern is electrically connected to second conductive pattern; Be used to hold the housing 640 of above-mentioned parts; And lens combination 650, be used for radiant light is converged to the pixel of imageing sensor.
Housing 640 is contained in by the predetermined portions with PCB610, imageing sensor 630 and dielectric substrate 620 wherein protects above-mentioned parts not to be subjected to external environment influence.
As mentioned above, Elecrical connector of the present invention can be made simply, can easily implement simultaneously to be formed with the electrical connection and the assembling of the circuitry substrate of conductive pattern.Similarly, can realize being electrically connected and assembly working between imageing sensor and the PCB easily.In addition, when manufacturing comprises imageing sensor and printed circuit board (PCB) Images sensor assembly, can prevent the contaminating impurity imageing sensor effectively.
Although illustrate and described the present invention with reference to certain preferred embodiment of the present invention, yet it will be understood by those skilled in the art that under situation without departing from the spirit and scope of the present invention, can carry out various changes on form and the details to the present invention.

Claims (20)

1. Elecrical connector, first circuitry substrate that this Elecrical connector will have first conductive pattern is electrically connected to the second circuit substrate with second conductive pattern, and described Elecrical connector comprises:
Dielectric substrate between first circuitry substrate and second circuit substrate, and have at least one hole that forms by punching to dielectric substrate; And
Conductive filling material, it is filled in the described hole, so that first conductive pattern is electrically connected to second conductive pattern.
2. Elecrical connector according to claim 1 is characterized in that, described first circuitry substrate has upper surface, and first conductive pattern is arranged on described upper surface place.
3. Elecrical connector according to claim 2 is characterized in that, described second circuit substrate has lower surface, and second conductive pattern is arranged on described lower surface place.
4. Elecrical connector according to claim 3 is characterized in that described hole has the bottom, and described second conductive pattern is inserted in the described bottom.
5. Elecrical connector according to claim 4 is characterized in that described hole has top, and described first conductive pattern is inserted in the described top.
6. Elecrical connector according to claim 5 is characterized in that, described dielectric substrate is engaged to each substrate in first and second circuitry substrate.
7. Elecrical connector according to claim 4 is characterized in that, described dielectric substrate is engaged to each substrate in first and second circuitry substrate.
8. Elecrical connector according to claim 3 is characterized in that, described dielectric substrate is engaged to each substrate in first and second circuitry substrate.
9. Elecrical connector according to claim 1 is characterized in that, described dielectric substrate is engaged to each substrate in first and second circuitry substrate.
10. Elecrical connector according to claim 1 is characterized in that described hole has the bottom, and described second conductive pattern is inserted in the described bottom.
11. Elecrical connector according to claim 10 is characterized in that, described hole has top, and described first conductive pattern is inserted in the described top.
12. an image sensor module comprises:
Be used for radiant light is converted to the imageing sensor of the signal of telecommunication, described imageing sensor has at least one conductive pattern that is used for exporting the signal of telecommunication;
Printed circuit board (PCB) (PCB) is used for outwards exporting the signal of telecommunication from the imageing sensor input electrical signal and from described module;
Dielectric substrate between imageing sensor and PCB, described dielectric substrate have at least one hole that forms by the punching to dielectric substrate; And
Be filled in the conductive filling material in the described hole, be used for the conductive pattern of imageing sensor is electrically connected to circuitry substrate.
13. image sensor module according to claim 12 is characterized in that, described imageing sensor has upper surface, and the conductive pattern projection that is formed with metal material of imageing sensor is at the described upper surface place contiguous with described hole.
14. image sensor module according to claim 12 is characterized in that, by being coated in the epoxy resin on the dielectric substrate except that described hole, makes dielectric substrate be engaged to PCB.
15. image sensor module according to claim 12 is characterized in that, the packing material that is filled in the described hole comprises conductive weld.
16. image sensor module according to claim 12 is characterized in that, described dielectric substrate has the upper surface that is provided with infrared filter.
17. image sensor module according to claim 12 is characterized in that, described PCB has the predetermined portions that has window, to allow optical convergence in imageing sensor.
18. image sensor module according to claim 12 is characterized in that, described dielectric substrate comprises glass.
19. image sensor module according to claim 12 is characterized in that, also comprises:
Housing with core, bottom and top is formed with window and transmits through described housing to allow light in described central part office, PCB is fixed to described bottom; And
Lens combination, described lens combination is arranged on described top, makes that described lens combination is relative with PCB and aligns with the window of housing.
20. image sensor module according to claim 12 is characterized in that, described module has top, and described module also comprises:
Have the bottom and be formed on the housing that described top is located, described housing is relative with PCB, and described housing has window and transmits through described housing to allow light, and described window has top, and imageing sensor is fixed to described bottom; And
Lens combination, described lens combination are positioned at the place, top of window.
CNB2004100431193A 2003-09-16 2004-05-11 Connector and image sensor module using the same Expired - Fee Related CN1298082C (en)

Applications Claiming Priority (2)

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KR20030064039 2003-09-16
KR1020030064039A KR100557140B1 (en) 2003-09-16 2003-09-16 Connector and image sensor module using the same

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CN1599142A true CN1599142A (en) 2005-03-23
CN1298082C CN1298082C (en) 2007-01-31

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US (1) US7151251B2 (en)
JP (1) JP4005994B2 (en)
KR (1) KR100557140B1 (en)
CN (1) CN1298082C (en)

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CN109314331A (en) * 2016-06-03 2019-02-05 大陆-特韦斯股份有限公司 Sensor, method and sensor module
CN109691076A (en) * 2016-09-07 2019-04-26 惠普发展公司， 有限责任合伙企业 Edge sensing
CN109691076B (en) * 2016-09-07 2022-03-18 惠普发展公司，有限责任合伙企业 Edge sensing device and system
CN114422681A (en) * 2022-01-27 2022-04-29 苏州昀冢电子科技股份有限公司 Driving mechanism, driving mechanism combination, camera module and electronic equipment

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US7151251B2 (en) 2006-12-19
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