CN1587912A - Package of silicon film sensor chip - Google Patents
Package of silicon film sensor chip Download PDFInfo
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- CN1587912A CN1587912A CN 200410054711 CN200410054711A CN1587912A CN 1587912 A CN1587912 A CN 1587912A CN 200410054711 CN200410054711 CN 200410054711 CN 200410054711 A CN200410054711 A CN 200410054711A CN 1587912 A CN1587912 A CN 1587912A
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- sensor
- evagination
- silicon fiml
- shell
- elastic housing
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Abstract
The invention relates to encapsulation of a silicon film sensor chip, whose outer shell at least has partial elastic outer shell interface with silicon film and consists of a enclosed outer shell with other hard outer shell wherein gas touches silicon film; that elastic outer shell is convex elastic substance for the best; the silicon film sensor is constructed through the steps above: force sensor, dip sensor, angular velocity sensor, angular acceleration sensor, velocity, acceleration sensor, displacement sensor, vibration sensor and their switches.
Description
Affiliated technical field
The present invention relates to a kind of encapsulation of sensitive element, be specifically related to the encapsulation of silicon film sensor chip, and micro mechanical force sensor, obliquity sensor, angular-rate sensor, angular acceleration transducer, speed, acceleration transducer, displacement transducer, vibration transducer, and electronic switch, but not only the limit in this.
Background technology
At present, the known encapsulation that is used for the silicon fiml pressure transducer is carried out according to usability mostly, as: the sensor that is used for measurement gas pressure is the hard material encapsulation of reserving air admission hole, what be used as the inertia measurement sensor is to make strain beam, mass in advance at chip internal, then, with the hard material encapsulation, as: Chinese invention patent: " a kind of method for making of silicon micro mechanical obliquity sensor " described in the application number 03132188.7; " integrated sensistor acceleration transducer and preparation method thereof " described in the application number 00126172.X; Another kind is, is used for measuring the sensor of touch, is the FS series force transducer that Honeywell Inc. produces, and touch is to directly act on the silicon-sensitive chip of sensor internal by the stainless steel ball inserted link; Another kind is, as: carry out the transmission of power by liquid, Chinese invention patent: " seal diaphragm structure that is used for device for pressure measurement " described in the application number 95103521.5; The shortcoming of above-mentioned encapsulation has been to limit the range of application of sensor, and perhaps, will be affected serviceable life, and perhaps, classification is made, to making production cost higher.
Summary of the invention
The objective of the invention is to: overcome the above-mentioned deficiency of prior art, a kind of packaged type of new sensor chip is provided, enlarge to the range of application that makes sensor.
The present invention by following by way of realization:
A kind of according to the semiconductor silicon inhibition effect, on diaphragm, exert pressure and cause the sensor chip of resistance change, by chip, conductive feet, shell constitutes, wherein, described shell has the part elastic housing at least, elastic housing and silicon fiml interval, and elastic housing and other hard shell constitute a sealing shell, gas is arranged in the sealing shell, and gas contacts with silicon fiml; Elastic housing is the elastomeric objects of evagination preferably.By above-mentioned enforcement of the present invention, above-mentioned silicon fiml sensor is constituted: force transducer, obliquity sensor, angular-rate sensor, angular acceleration transducer, speed, acceleration transducer, displacement transducer, vibration transducer and electronic switch thereof.
This practical beneficial effect of the invention is, as a kind of micro mechanical sensor, he can change under the little situation in production technology, and the range of application of sensor is enlarged, and production cost increases little.
Description of drawings:
Fig. 1 is the encapsulation principle schematic of a kind of silicon film sensor chip of the present invention;
Fig. 2 is the encapsulation principle schematic of another kind of silicon film sensor chip of the present invention;
Fig. 3 is the encapsulation usefulness of silicon film sensor chip of the present invention, and a kind of elastomeric objects partial cutaway of evagination is shown synoptic diagram;
Fig. 4 is the encapsulation usefulness of silicon film sensor chip of the present invention, and the elastomeric objects partial cutaway of another evagination is shown synoptic diagram;
Fig. 5 is the encapsulation usefulness of silicon film sensor chip of the present invention, and on another evagination elastic housing, dress has been planted mass, and evagination elastomeric objects partial cutaway is shown synoptic diagram;
Fig. 6 is the encapsulation usefulness of silicon film sensor chip of the present invention, and on another evagination elastic housing, dress has been planted hard objects, and evagination elastomeric objects partial cutaway is shown synoptic diagram;
The present invention is further described below in conjunction with drawings and Examples:
As shown in Figure 1, by thermosetting resin, on the base plate 4 that plastic or other material is made, be equipped with at wafer (perhaps, the substrate that other material is made) 1, and the silicon fiml 2 that on 1, forms, 1,2 constitute chip, and the 3rd, the electricity of chip is introduced, perhaps leading foot, the 5th, by thermosetting resin, the framework that plastic or other material is made, it is by bonding agent, perhaps, other technological means and base plate 4 are bonding, 6 for resilient material (as: elastoplast, perhaps, rubber type of material, elastomeric material) makes, on the elastomeric objects of evagination of the hemisphere (with reference to Fig. 4) of hollow is arranged, 6 with framework 5 by bonding agent, perhaps, other technological means is bonding, 4,5,6 bonding backs constitute an airtight shell, wherein, 6 with 1,2 contacts are 4,5,6 inside have room temperature, under the constant pressure, the air of packing into, and 4,5,6 get final product in general indoor assembling, and air wherein can be other gas, still, must not be unfavorable to chip, preferably clean, do behaviour's air; After the encapsulation of above-mentioned silicon film sensor chip is finished, when on the protrusion summit of the elastomeric objects 6 of evagination, exerting pressure, shell 4,5,6 gas inside density increase, experiencing pressure on the silicon fiml 2 increases, according to the semiconductor silicon inhibition effect, to cause the resistance change of silicon fiml 2, thus, constitute pressure transducer of the present invention; Certainly, if when the protrusion summit of elastomeric objects 6 is pulled outwardly, shell 4,5,6 gas inside density reduce, experience pressure on the silicon fiml 2 and change,, also will cause the resistance change of silicon fiml 2 according to the semiconductor silicon inhibition effect, thus, constitute pulling force sensor of the present invention; In addition, if, with the protrusion summit of object extruding (perhaps, drawing) elastomeric objects 6, the displacement size of its extruding (perhaps, drawing), also will cause the resistance change of silicon fiml 2 outward outward, thus, constitute displacement transducer of the present invention.
As shown in Figure 2, the 7th, a kind of sphygmomanometer that is used for of being sold in the market, or the silicon integrated circuit of gas pressure intensity measurement, one through hole 15 is arranged above it, as be injected with the gas of pressure to through hole 15, also will cause the resistance change of inner silicon fiml, an example of the present invention is exactly on its silicon integrated circuit 7, by bonding agent, perhaps, other technological means is bonding, with resilient material (as: elastoplast, rubber or the like) make, on the elastomeric objects 8 of evagination of the hemisphere (with reference to Fig. 4) of hollow is arranged, constitute the encapsulation of another kind of silicon film sensor chip of the present invention, and displacement transducer, force transducer; Wherein 7 with 8 engage and should be: when exerting pressure on 8 protrusion summit, its gas inside must not be rushed down outward.
Fig. 3 is the encapsulation usefulness of silicon film sensor chip of the present invention, and a kind of elastomeric objects partial cutaway of evagination is shown synoptic diagram; If the elastomeric objects 6 of evagination shown in Figure 1 is transformed to the elastomeric objects 9 of evagination shown in Figure 3, still constitutes the present invention; In Fig. 3,9 for make with resilient material (as: elastoplast, rubber or the like), there is the elastomeric objects of evagination of the spheroid of a hollow 15 centre, wherein, in the hollow 15 is gas, thus, constitute the elastomeric objects of the evagination of a band hollow sphere, still can realize the present invention; Notice that hollow sphere 9 must not contact with 1,2.
In the present invention, the wall thickness of the elastomeric objects of its evagination is not necessarily uniform, and inner, outer shape is also not necessarily fixed, and can customize as required.Fig. 4 is the encapsulation usefulness of silicon film sensor chip of the present invention, and the elastomeric objects partial cutaway of another evagination is shown synoptic diagram; The elastomeric objects 10 of this evagination, help putting on protrude the summit upward pressure after, the mistake of protruding the summit upper stress is put, both the fast quick-recovery original form of the elastomeric objects of evagination; The elastomeric objects 10 of the evagination among Fig. 4 can exchange with the elastomeric objects 6,8 of evagination among Fig. 1, Fig. 2 equally.
Fig. 5 is the encapsulation usefulness of silicon film sensor chip of the present invention, and on another evagination elastic housing, dress has been planted mass 12, and evagination elastomeric objects partial cutaway is shown synoptic diagram; Wherein, the 12nd, ball, it can be that the bigger materials of proportion such as iron, stainless steel, lead are made; The 11st, the elastomeric objects of the evagination made from resilient material (as: elastoplast, rubber or the like), 12 insert, are fixed in (perhaps inner) on 11 by means such as bonding, cast; If, dress described in Fig. 5 has been planted mass 12, the elastomeric objects 6,8 of the evagination among evagination elasticity thing 11,12 and Fig. 1, Fig. 2 exchanges, so, the described silicon fiml sensor of Fig. 1, Fig. 2 not only can be used for Displacement Measurement, draws, pressure, and, according to the inertia-gravity principle, can measure inclination angle displacement, the angular velocity of carrier, acceleration, physical quantitys such as vibration, constitute micromechanics of the present invention with this: force transducer, obliquity sensor, angular-rate sensor, acceleration transducer, displacement transducer, vibration transducer;
As: obliquity sensor is an example with Fig. 2, wherein 8 is transformed to 11,12, and when raising silicon fiml sensor right-hand member gradually, 12 reduce gradually for 11 pressure, and silicon fiml sensor internal gas pressure intensity reduces gradually, and silicon fiml resistance changes thereupon, detects the inclination angle displacement according to this.
As: angular-rate sensor is an example with Fig. 2, wherein 8 is transformed to 11,12, when the silicon fiml sensor an angle of 90 degrees that overturns forward, and when being positioned on the carriers such as automobile, when automobile travels with certain speed, during turning, because action of centrifugal force, it 12 changes for 11 pressure (or pulling force), and silicon fiml sensor internal gas pressure intensity changes, and silicon fiml resistance changes thereupon, detect according to this angular velocity or, angular speed.
As: speed, acceleration transducer, with Fig. 2 is example, wherein 8 be transformed to 11,12, when the silicon fiml sensor an angle of 90 degrees that overturns forward, and when being positioned on the carriers such as automobile, when automobile travels with certain speed, because the effect of pressure, it 12 changes for 11 pressure (or pulling force), and silicon fiml sensor internal gas pressure intensity changes, silicon fiml resistance changes thereupon, detects car speed according to this; When pickup travelled, because the effect of pressure, it 12 changed for 11 pressure (or pulling force), and silicon fiml sensor internal gas pressure intensity changes, and silicon fiml resistance changes thereupon, detects pickup according to this.According to its principle, should expect, simultaneously, can detect the automobile angular acceleration.
As: vibration transducer is an example with Fig. 2, wherein 8 is transformed to 11,12, when the silicon fiml sensor lies against on the vibrating object, and fixedly the time, object vibration, will cause 12 up-down vibration or, move, because the effect of pressure, it 12 changes for 11 pressure (or pulling force), and silicon fiml sensor internal gas pressure intensity changes, silicon fiml resistance changes thereupon, inspected object vibration according to this.As be used for human blood-pressure and measure.
As: above-mentioned force transducer, obliquity sensor, angular-rate sensor, angular acceleration transducer, speed, acceleration transducer, displacement transducer, vibration transducer compares from electric signal and the reference signal that it detected by electronic circuit, and the output of its electric signal promptly constitutes force transducer of the present invention, obliquity sensor, angular-rate sensor, angular acceleration transducer, speed, acceleration transducer, displacement transducer, vibration transducer electronic switch.
Fig. 6 is the encapsulation usefulness of silicon film sensor chip of the present invention, and on another evagination elastic housing, dress has been planted hard objects, and evagination elastomeric objects partial cutaway is shown synoptic diagram; Wherein, 14 is one to have a metal object of a horizontal through hole, and it can be that hard materials such as iron, stainless steel are made; The 13rd, the elastomeric objects of the evagination made from resilient material (as: elastoplast, rubber or the like), 14 insert, are fixed in (perhaps inner) on 13 by means such as cast; Metal object 14 on this evagination elastomeric objects, that have a horizontal through hole helps in use and being connected of other object, and therefore, 14 can be shaped on the structure that bolt, screw, boss etc. are connected with other object during fabrication in advance, perhaps, and annex.
By above-mentioned argumentation of the present invention, should be noted that: the elasticity coefficient of elastic housing 6,8,10,11,13 wherein, thickness, planform is influential to the sensitivity of sensor, should be noted during manufacturing.
Elastic housing of the present invention comprises: pipe, tabular rubber-like shells such as the corrugated plate that metal, alloy material are made, corrugated tube are interior; And corrugated plate, the corrugated tube of made such as plastics, rubber, pipe such as flat board, tabular rubber-like shell are interior.
It should be noted that in the present invention Fig. 1, silicon fiml sensor shown in Figure 2, by external mass, the external structure that is connected with other object, perhaps, annex also can constitute: micro mechanical force sensor, obliquity sensor, angular-rate sensor, angular acceleration transducer, speed, acceleration transducer, displacement transducer, vibration transducer; Perhaps, by the various combination of a plurality of silicon fiml sensors, can constitute the sensor of other application type.
It should be noted that the chip described in the present invention, comprise the silicon single crystal wafer of making on the glass substrate; The full-bridge pressure drag component of on the silicon body, processing; The semi-girder silicon fiml chip that contains mass, or the like all other chip varistors interior.
Claims (7)
1. silicon fiml sensor, by chip, conductive feet, formations such as shell is characterized in that:
Described shell has the part elastic housing at least,
Described elastic housing and silicon fiml interval,
Described part elastic housing and other hard shell constitute a sealing shell,
In the described sealing shell gas is arranged,
Described gas contacts with silicon fiml.
2. part elastic housing as claimed in claim 1 is characterized in that: the elastomeric objects that is evagination.
3. the elastomeric objects of evagination as claimed in claim 2 is characterized in that: be elastoplast, perhaps, and rubber type of material, elastomeric material is made.
4. silicon fiml sensor, by chip, conductive feet, formations such as shell is characterized in that:
Described shell has the part elastic housing at least,
Described elastic housing and silicon fiml interval,
Described part elastic housing and other hard shell constitute a sealing shell,
In the described sealing shell gas is arranged,
Described gas contacts with silicon fiml,
Described silicon fiml sensor is a force transducer, obliquity sensor, angular-rate sensor, angular acceleration transducer, speed, acceleration transducer, displacement transducer, vibration transducer, and electronic switch.
5. part elastic housing as claimed in claim 4 is characterized in that: the elastomeric objects that is evagination.
6. the elastomeric objects of evagination as claimed in claim 5 is characterized in that: be elastoplast, perhaps, and rubber type of material, elastomeric material is made.
7. as the part elastomeric objects of claim 5,6 described evaginations, it is characterized in that:
Dress has been planted mass on the elastomeric objects of described evagination, and perhaps, dress has been planted hard objects on the elastomeric objects of described evagination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410054711 CN1587912A (en) | 2004-07-15 | 2004-07-15 | Package of silicon film sensor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410054711 CN1587912A (en) | 2004-07-15 | 2004-07-15 | Package of silicon film sensor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1587912A true CN1587912A (en) | 2005-03-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410054711 Pending CN1587912A (en) | 2004-07-15 | 2004-07-15 | Package of silicon film sensor chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105377125A (en) * | 2014-03-28 | 2016-03-02 | 深圳市大富网络技术有限公司 | Blood pressure detection device and related measuring method, device and communication system |
-
2004
- 2004-07-15 CN CN 200410054711 patent/CN1587912A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105377125A (en) * | 2014-03-28 | 2016-03-02 | 深圳市大富网络技术有限公司 | Blood pressure detection device and related measuring method, device and communication system |
| CN105377125B (en) * | 2014-03-28 | 2018-11-02 | 深圳市大富网络技术有限公司 | A kind of blood pressure detector and relevant apparatus and communication system |
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