CN1582089A - Method for manufacturing soft circuit board - Google Patents
Method for manufacturing soft circuit board Download PDFInfo
- Publication number
- CN1582089A CN1582089A CN 03143965 CN03143965A CN1582089A CN 1582089 A CN1582089 A CN 1582089A CN 03143965 CN03143965 CN 03143965 CN 03143965 A CN03143965 A CN 03143965A CN 1582089 A CN1582089 A CN 1582089A
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- flexible circuit
- circuit board
- dividing plate
- circuit plate
- manufacture method
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Abstract
The method includes steps: printing upper and lower circuit silver paste on same base material so as to form a integrated upper flexible circuit plate and lower flexible circuit plate; punching out line ends of upper flexible circuit plate and lower flexible circuit plate; printing waterproof glue on upper flexible circuit plate and lower flexible circuit plate; assembling upper flexible circuit plate and lower flexible circuit plate with waterproof glue being printed and a semi finished clapboard; rolling and molding the said assembled part. Features are: simple flow, accurate assembled product, small tolerance and good waterproof function.
Description
Technical field
The present invention relates to a kind of manufacture method of flexible circuit board, particularly relate to a kind of manufacture method of waterproof flexible circuit board.
Background technology
At present high-tech product all requires to be easy to carry, and requires that product overall appearance shape reaches gently, thin, short, little requirement.But often overall volume is excessive for present personal electric product, and does not meet requirement easy to carry.Such as being seen computor-keyboard on the present market, general volume is bigger, though light-duty keyboard is arranged, its inner flexible circuit board (Flexible Print Circuit is abbreviated as FPC) design is again a difficult problem.
Ordinary circumstance is, this kind flexible circuit board adopts different process such as individual layer, bilayer or three layer circuit boards, area is too little because effective circuit is arranged for the individual layer circuit technology, circuit layout complexity often, reciprocal circuit distance is too close, causes electromagnetic interference serious, produces noise, influence the stability of signal, so generally do not adopt this scheme.For double-deck or three layers of circuit technology, generally speaking, adopt upper and lower flexible circuit board structure, upper strata flexible circuit board and lower floor's flexible circuit board are provided with conductive junction point with respect to the key position place, in order to isolate corresponding upper and lower conductiving point, at the dividing plate that is provided with one deck certain thickness electric insulation up and down between the flexible circuit board, this dividing plate is to being provided with a perforate in upper and lower conductiving point place, when button is pressed, should go up mutually conductiving point and press downwards and pass this perforate and touch this time conductiving point, turning circuit produces a signal of telecommunication.
With reference to figure 1, this figure is the manufacturing process schematic diagram of present three layers of flexible circuit board.Present manufacturing technology, be to go up flexible circuit board, following flexible circuit board and dividing plate are separately made, that is to say that flexible circuit board is divided equally out printed silver slurry 201 up and down, 202, go out line end 203 then respectively, 204, divide again and start to print marine glue 205,206, be cut into monolithic 207 again, 208, flexible circuit board assembles 210 with finished product dividing plate 209 up and down then, last roll extrusion, moulding 211,212, therefore make with assembling on comparatively consuming time, simultaneously because separate machined is made is all to have tolerance, flexible circuit board and middle dividing plate often can not very accurate assemblings up and down, cause the final tolerance of product bigger, the product fraction defective rises.Again because up and down flexible circuit board is divided equally and is started to print brush and cut, each step all has certain tolerance, then in when assembling because the stack of these tolerances of flexible circuit board up and down, cause this flexible circuit board periphery not seal well, so big heavy discount of waterproof effect, if use in particular surroundingss such as humidity, perhaps the user pours beverage into accidentally, all may cause circuit to damage.
Therefore, be necessary to provide a kind of manufacture method of flexible circuit board, overcome the defective of foregoing circuit plate.
Summary of the invention
The manufacture method that the purpose of this invention is to provide a kind of flexible circuit board, this method can effectively reduce the influence that machining tolerance brings assembling, by the delicate joint of flexible circuit board up and down, realizes effective water-proof function.
To achieve these goals, the invention provides a kind of manufacture method of flexible circuit board, this method comprises the steps: printing upper and lower circuit silver slurry on same base material, forms the last flexible circuit board and the following flexible circuit board of one; Should go up flexible circuit board and following flexible circuit board and go out line end; On this, print marine glue on flexible circuit board and the following flexible circuit board; Assemble the dividing plate of this last flexible circuit board that is printed on marine glue, following flexible circuit board and semi-finished product; With this last flexible circuit board that is assembled into one, flexible circuit board and dividing plate roll extrusion together down, moulding.
Therefore, the manufacture method flow process of flexible circuit board of the present invention is simple, and the assembling precision tolerance is little, realizes that water-proof function is effective.
Description of drawings
Below in conjunction with accompanying drawing,, will make technical scheme of the present invention and other beneficial effects apparent by the specific embodiment of the present invention is described in detail.
In the accompanying drawing,
Fig. 1 is the flexible circuit board fabrication method block diagram of prior art;
Fig. 2 is the decomposing schematic representation of flexible circuit board structure of the present invention;
Fig. 3 is the block diagram of flexible circuit board fabrication method of the present invention.
Embodiment
Please refer to shown in Figure 2ly, the manufacture method of flexible circuit board provided by the invention is made the flexible circuit board of gained, comprises flexible circuit board 310 on, a dividing plate 320 and flexible circuit board 330 once; Should go up flexible circuit board 310 and have a upper surface and a lower surface, this time flexible circuit board 330 has a upper surface and a lower surface.This upper and lower flexible circuit board 310,320 includes a plurality of upper and lower conductiving points 315,335, and corresponding to this conductiving point position, 320 are provided with perforate 325 on this dividing plate.Flexible circuit board 310, this dividing plate 320 and this time flexible circuit board 330 are provided with some through holes 316,326,336 again on this, this through hole 316,326,336 just can run through flexible circuit board 310 on this, this dividing plate 320 and this time flexible circuit board 330, and these through holes are used for the flexible circuit board location.
Please refer to shown in Figure 3ly, the invention provides a kind of manufacture method of flexible circuit board, this method comprises:
The printing upper and lower circuit is silver-colored on same base material starches, and forms the last flexible circuit board that is printed with silver slurry circuit and the following flexible circuit board that is printed with silver-colored slurry circuit, refer step 401 of one; This step is included in this lower surface printed circuit silver slurry of flexible circuit board 310 on this, this upper surface printed circuit silver slurry of this time flexible circuit board 330; Wherein the circuit silver slurry of these upper and lower flexible circuit board 310,330 printings includes a plurality of conductiving points 315,335, this upper and lower conductiving point 315,335 is corresponding mutually, simultaneously this dividing plate 320 with this on these conductiving point 335 corresponding positions of flexible circuit board 310 these conductiving points 315 and this time flexible circuit board 320 be provided with perforate 325, this perforate 325 contacts with this conductiving point of this time flexible circuit board in order to the conductiving point of realizing flexible circuit board on this.When user key-press, go up conductiving point 315 accordingly and just move downward and pass corresponding perforate 325 and contact with following conductiving point 335, realize electrically conducting of upper and lower circuit, trigger a push button signalling, realize keypress function.
Should go up flexible circuit board and following flexible circuit board and go out line end, refer step 403.
Print marine glue on the ad-hoc location on this on flexible circuit board and the following flexible circuit board, this ad-hoc location be included in this up and down flexible circuit board all around and the position of predetermined set through hole, refer step 405; This step 405 is included in the lower surface of flexible circuit board 310 on this and the going up all around of upper surface of this time flexible circuit board 330 printed marine glue; Should go up the peripheral part between flexible circuit board 310 and this dividing plate 320, and the peripheral part between this time flexible circuit board 330 and this dividing plate 320 all prints marine glue, simultaneously, the position seal marine glue of through hole 316,326,336 will be set, thereby form an airtight circuit space.Therefore the flexible circuit board of flexible circuit board fabrication method gained of the present invention has splendid water-proof function.
With this be printed on the last flexible circuit board of marine glue, down flexible circuit board be processed into half-finished dividing plate (this dividing plate is provided by step 407) and be assembled into one refer step 409; Flexible circuit board doubling with one, dividing plate 320 is at up and down between the flexible circuit board of this doubling, and, the lower surface of flexible circuit board on this 310 is mutually bonding with this upper surface of this dividing plate 320, this upper surface of this time flexible circuit board 330 is mutually bonding with this lower surface of this dividing plate 320, from but go up flexible circuit board 310, flexible circuit board 330 is assembled into one with dividing plate 320 down.
At last, with this flexible circuit board that is assembled into one with the dividing plate roll extrusion, refer step 411, moulding, refer step 413 is included in predetermined set through hole 316,326, the 336 position punchings that are printed on marine glue, thereby forms through hole 316,326,336.
Therefore, the manufacture method flow process of flexible circuit board of the present invention is simple, the assembly precision height, and tolerance is little, realizes that water-proof function is effective.
The above; for the person of ordinary skill of the art; can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection range of accompanying Claim of the present invention.
Claims (5)
1, a kind of manufacture method of flexible circuit board is characterized in that, this method comprises the steps:
Printing upper and lower circuit silver slurry on same base material, the last flexible circuit board and the following flexible circuit board of formation one;
Should go up flexible circuit board and following flexible circuit board and go out line end;
On this, print marine glue on flexible circuit board and the following flexible circuit board;
Assembling is printed on the dividing plate that should go up flexible circuit board, this time flexible circuit board and semi-finished product of marine glue;
Should go up flexible circuit board, this time flexible circuit board and the roll extrusion together of this dividing plate, moulding with what this was assembled into one.
2, the manufacture method of flexible circuit board according to claim 1 is characterized in that, on this upper surface of the lower surface of flexible circuit board and this time flexible circuit board around print marine glue.
3, the manufacture method of flexible circuit board according to claim 1 is characterized in that, the position seal marine glue of the predetermined set through hole on this on flexible circuit board and this time flexible circuit board.
4, the manufacture method of flexible circuit board according to claim 2 is characterized in that, the upper surface of the lower surface of flexible circuit board on this and this dividing plate is bonding, the upper surface of this time flexible circuit board and the lower surface bonds of this dividing plate.
5, the manufacture method of flexible circuit board according to claim 1 is characterized in that, with the last flexible circuit board and the following flexible circuit board doubling of one, dividing plate is at up and down between the flexible circuit board of this doubling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03143965 CN1582089A (en) | 2003-08-05 | 2003-08-05 | Method for manufacturing soft circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03143965 CN1582089A (en) | 2003-08-05 | 2003-08-05 | Method for manufacturing soft circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1582089A true CN1582089A (en) | 2005-02-16 |
Family
ID=34579558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03143965 Pending CN1582089A (en) | 2003-08-05 | 2003-08-05 | Method for manufacturing soft circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1582089A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100442956C (en) * | 2005-03-25 | 2008-12-10 | 华通电脑股份有限公司 | Soft-hard composite circuit board manufacturing method |
| CN103298266A (en) * | 2013-05-02 | 2013-09-11 | 精模电子科技（深圳）有限公司 | Manufacturing method of flexible circuit board of keyboard |
| CN108213481A (en) * | 2017-12-29 | 2018-06-29 | 重庆来来来商贸有限公司 | A kind of method of keyboard punching machine |
| CN112449507A (en) * | 2019-08-28 | 2021-03-05 | 宏启胜精密电子(秦皇岛)有限公司 | Waterproof circuit board and manufacturing method thereof |
-
2003
- 2003-08-05 CN CN 03143965 patent/CN1582089A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100442956C (en) * | 2005-03-25 | 2008-12-10 | 华通电脑股份有限公司 | Soft-hard composite circuit board manufacturing method |
| CN103298266A (en) * | 2013-05-02 | 2013-09-11 | 精模电子科技（深圳）有限公司 | Manufacturing method of flexible circuit board of keyboard |
| CN103298266B (en) * | 2013-05-02 | 2016-05-04 | 精模电子科技（深圳）有限公司 | The preparation method of keyboard FPC |
| CN108213481A (en) * | 2017-12-29 | 2018-06-29 | 重庆来来来商贸有限公司 | A kind of method of keyboard punching machine |
| CN112449507A (en) * | 2019-08-28 | 2021-03-05 | 宏启胜精密电子(秦皇岛)有限公司 | Waterproof circuit board and manufacturing method thereof |
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| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |