CN1579884A - Electronic device supplying apparatus - Google Patents
Electronic device supplying apparatus Download PDFInfo
- Publication number
- CN1579884A CN1579884A CN 200410070558 CN200410070558A CN1579884A CN 1579884 A CN1579884 A CN 1579884A CN 200410070558 CN200410070558 CN 200410070558 CN 200410070558 A CN200410070558 A CN 200410070558A CN 1579884 A CN1579884 A CN 1579884A
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- CN
- China
- Prior art keywords
- carrier band
- mold pressing
- pressing carrier
- supply
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Auxiliary Devices For And Details Of Packaging Control (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention provides an electronic component feeder capable of smoothly transferring an embossed tape to exactly feed an electronic component to a component feeding position. A compression cylinder 18 can move forward and backward in the thickness direction of an embossed tape 12 being in an empty state after the electronic component 20 is taken out from pockets 12A, and compresses the pockets 12A of the embossed tape 12 in an empty state. The cylinder is provided on the embossed tape transferring side of the component feeding position P1 in the electronic component feeder 10.
Description
Technical field
The present invention relates to electronic device supplier, particularly relate to the mold pressing carrier band of having accommodated electronics package in the bag that forms at interval, supply with the electronic device supplier of electronics package to apparatus for mounting electronic component with regulation by carrying.
Background technology
As known technology in the past, have and a kind ofly supply with the electronic device supplier that electronics package is supplied with in the position to the device of regulation by carrying mold pressing to bring sequentially.This electronic device supplier is further carried supply with the mold pressing carrier band that is dummy status after take out electronics package in the bag position at device, and it is discharged to the outside.
In such electronic device supplier, in order successfully to carry the mold pressing carrier band, supply with electronics package reliably, need successfully carry and discharge the mold pressing carrier band of having supplied with device dummy status afterwards.But, in electronic device supplier so in the past, in order to make equipment miniaturization, generally be in the discharge path of mold pressing carrier band, to exist sweep, because the mold pressing carrier band is at the rigidity height of bag part, in the discharge path of bending, be subjected to jam so exist bag, hinder the problem of the conveying of mold pressing carrier band.Particularly in having the mold pressing carrier band of the sack of accommodating large-scale electronics package, such problem is more obvious.
As a kind of method that addresses this problem, a kind of electronic device supplier (for example, with reference to patent documentation 1) had as shown in Figure 6 been proposed once.
In this known in the past electronic device supplier 100, on the S. A. 102A of the sprocket wheel 102 of carrying mold pressing carrier band 106, be fitted with the acceptor 10 8 of cydariform with the curved outer peripheral face of circle.The mold pressing carrier band 106 that has taken out the dummy status behind the electronics package 104, is flattened bag 106A by being pressed on the acceptor 10 8 by pinch roller 110,112 and pressing body 114 when being transferred.
Patent documentation 1
Te Kaiping 11-177282 number bulletin
But in known electronic device supplier 100 so in the past, pinch roller 110,112 contacts with mold pressing carrier band 106 in the process of carrying all the time with acceptor 10 8.Therefore, because bag 106A passed through curve before being crushed,, hindered conveying so a bag 106A is subjected to jam between pinch roller 110 and acceptor 10 8.And, because for the pressing body 114 that bag 106A is flattened applies certain pressing force to mold pressing carrier band 106 in the process of carrying, so can hinder smooth delivery of power to mold pressing carrier band 106.That is, it is lax etc. based on above-mentioned reason the mold pressing carrier band to be taken place, thereby makes that can not supply to device to electronics package supplies with on the position.
Summary of the invention
The present invention makes in order to solve the above problems, and its objective is that providing a kind of can successfully carry out the conveying of mold pressing carrier band, can supply to device exactly with electronics package and supply with locational electronic device supplier.
The present invention is in order to solve the above problems, be used to carry the mold pressing carrier band of having accommodated electronics package in the bag that forms at interval with regulation, described electronics package is after the device supply position of regulation is removed, in the electronic device supplier that the bending of described mold pressing carrier band is sent, supply with at described device and to supply with the position roughly at grade the mold pressing carrier band transport path with described device between position and the described curve, be provided with and advance and retreat at the thickness direction that from described bag, has taken out the mold pressing carrier band that is dummy status of described electronics package, be used to compress the compression set of described bag of the mold pressing carrier band of this dummy status.
And also can have: be used to detect the gap length that described mold pressing carrier band has been transferred described regulation, described electronics package is fed into described device and supplies with locational device supply detecting sensor; Be used to detect compression that the bag of the mold pressing carrier band of described dummy status compressed by the described compression set sensor of finishing dealing with; Supply with the information handled and convey to the exterior information of device and pass on parts having finished information that compression handles having finished device with the state of supplying with sensor according to described device according to the finish dealing with state of sensor of described compression.
In addition, on described compression set, also can be provided for the cut-off knife of the mold pressing carrier band of the described dummy status of severing.
Description of drawings
Fig. 1 is the schematic side view of the electronic device supplier of expression one embodiment of the invention.
Fig. 2 is the lateral plan that expression is applied in the electronic device supplier of Fig. 1 the example in the apparatus for mounting electronic component.
Fig. 3 is the partial enlarged drawing that the main portion of the electronic device supplier among Fig. 2 is amplified expression.
Fig. 4 is the diagram of circuit of processing sequence of the electronic device supplier of expression one embodiment of the invention.
Fig. 5 is the sequential chart of processing sequence of the electronic device supplier of expression one embodiment of the invention.
Fig. 6 is the partial enlarged drawing that the main portion of in the past electronic device supplier is amplified expression.
Among the figure: P1 ... device is supplied with the position; 10,100 ... electronic device supplier; 12,106 ... the mold pressing carrier band; 12A, 106A ... bag; 14 ... axle curls; 15,102 ... sprocket wheel; 16 ... conveying mechanism; 17 ... push rod; 18 ... compressor cylinder; 20,104 ... electronics package; 22 ... device is supplied with detecting sensor; 24 ... the compressed detected sensor; 26 ... compress the sensor of finishing dealing with; 28 ... cable; 30 ... apparatus for mounting electronic component; 32 ... cylinder; 102A ... S. A.; 108 ... acceptor; 110,112 ... pinch roller; 114 ... pressing body.
The specific embodiment
Below, with reference to accompanying drawing, embodiments of the invention are described.
As shown in Figure 1 and Figure 2, electronic device supplier 10 has the curling axle 14 that is wound with mold pressing carrier band 12; From these 14 conveying mechanisms 16 that intermittently mold pressing carrier band 12 rolled out and is transported on the device supply position P1 that curl; For the bag 12A of mold pressing carrier band 12 is provided with the compressor cylinder (compression set) 18 of compression unit 18A in thickness direction compression at the actuator front end.This electronic device supplier 10 is set on the position of regulation of apparatus for mounting electronic component 30, sequentially supplies with electronics package 20 to apparatus for mounting electronic component 30.
The curling axle 14 of electronic device supplier 10 is the parts that roughly are discoideus, is installed on the main body of electronic device supplier 10, and can is that the center rotates freely with C1.
As being exaggerated expression among Fig. 3, on the mold pressing carrier band 12 that is crimped onto on the axle 14 that curls, forming a plurality of bags of 12A with the interval of stipulating, and in each bag 12A, accommodate electronics package 20.
Described conveying mechanism 16 has the sprocket wheel 15 with (diagram slightly) with holes tabling of mold pressing carrier band 12.This sprocket wheel 15 rotates with the angle of regulation under the driving of push rod 17 that with C2 is the fulcrum rotation, mold pressing carrier band 12 is rolled out and carry with the gap length (delivered length of a device) of regulation.In addition, near push rod 17, be provided with device and supply with sensor 22.This device is supplied with sensor 22 and can be detected from the position of push rod 17, and mold pressing carrier band 12 has been transferred the gap length of regulation, and electronics package 20 is fed into the situation on the device supply position P1.In addition, below an end of push rod 17, dispose the cylinder 32 that is arranged in the apparatus for mounting electronic component 30, the crank motion by cylinder 32 drives conveying mechanism 16 and carries intermittently.
Described mold pressing carrier band 12 after through the device that taking-up electronics package 20 and having supplied with position P1, through and described device supply with position P1 preferably behind at grade the path, also need transport path through the macrobending degree of counter-rotating throughput direction.
Described compressor cylinder 18 be configured to towards supply with at device between position P1 and the described curve, with best at grade the mold pressing carrier band transport path in described device supply position.This compressor cylinder 18 is controlled by air pressure, make the compression unit 18A of actuator front end go up advance and retreat at the thickness direction (the V1 direction among Fig. 3) of mold pressing carrier band 12, when advancing, compression unit 18A rises, and the bag 12A of the mold pressing carrier band 12 that is dummy status that has been removed electronics package 20 is compressed on its thickness direction.In addition, near the advance and retreat path of the compression unit 18A of this compressor cylinder 18, be respectively arranged with summit in the compression unit 18A arrival that is used to detect compressor cylinder 18, the bag 12A of mold pressing carrier band 12 implemented the compressed detected sensor 24 of compression; Be used to detect compression unit 18A and arrive and go to the bottom a little, the compression of the having finished compressed action sensor 26 of finishing dealing with.
In addition, as shown in Figure 1, electronic device supplier 10 is by being used to carry out power supply and supplying with and cable (the information transferring elements) 28 of the input and output of control signal being connected with apparatus for mounting electronic component 30.Thus, can supply with the finish dealing with state of sensor of the state of detecting sensor 22 and compression according to device passes on to apparatus for mounting electronic component 30 and has finished device and supply with the information of handling (aftermentioned) and having finished compression processing (aftermentioned).
Below, in conjunction with Fig. 4, Fig. 5 the effect of described electronic device supplier 10 is described.
30 pairs of busy signals (control signal) by the electronic device supplier 10 of cable 28 inputs of apparatus for mounting electronic component monitor, confirm the compression of electronic device supplier 10 handles whether finish (step S51).Then, when the busy signal is ON, promptly when electronic device supplier 10 is compressing processing, carry out standby, wait finish (the step S52) of processing to be compressed.On the other hand, when the busy signal was OFF, promptly when the compression of having finished electronic device supplier 10 was handled, apparatus for mounting electronic component 30 made cylinder 32 risings (step S53).
The rising of the cylinder 32 of apparatus for mounting electronic component 30, the push rod 17 of the conveying mechanism 16 of drive electronics feedway 10 rotates (step S54), and electronic device supplier 10 begins to carry out device and supplies with processing.When making sprocket wheel 15 rotate fixing angle under the driving of push rod 17, mold pressing carrier band 12 is rolled out the delivered length of a device from the axle 14 that curls, and is transferred, and simultaneously, electronics package 20 is fed into device and supplies with on the P1 of position.Electronic device supplier 10 surveillance device are supplied with detecting sensor 22 (step S55), and when electronics package 20 also was not fed on the device supply position P1, apparatus for mounting electronic component 30 made cylinder 32 continue to rise, and proceeds the conveying of mold pressing carrier band 12.On the other hand, when electronics package 20 was fed on the device supply position P1, electronic device supplier 10 made the busy signal become ON (step S56), the information of having finished is handled in the device supply conveyed to apparatus for mounting electronic component 30 by cable 28.Then, apparatus for mounting electronic component 30 stops the rising of cylinder 32, and stops the conveying of mold pressing carrier band 12.
After cylinder 32 stops, just having stopped driving to the conveying mechanism 16 of electronic device supplier 10, at this moment electronic device supplier 10 begins to compress processing.Electronic device supplier 10 makes compressor cylinder 18 rise to compression and goes up summit (becoming ON up to compressed detected sensor 24) (step S57), the bag 12A of mold pressing carrier band 12 is compressed on its thickness direction, with its flattening.Then, make compressor cylinder 18 drop to the compression point (becoming ON) (step S58) of going to the bottom up to the compression sensor 26 of finishing dealing with.At last, electronic device supplier 10 is changed to OFF to the busy signal, by cable 28 information of having finished the compression processing is conveyed to apparatus for mounting electronic component 30 (step S59).
Like this, interoperation by electronic device supplier 10 and apparatus for mounting electronic component 30, alternately carry out above-mentioned device and supply with and handle that (step S53～S56) and compression handle that (step S57～S59) can carry out the compression of bag 12A of the mold pressing carrier band 12 of the supply of electronics package 20 and dummy status thus repeatedly.
In addition, have and be used to detect the gap length that mold pressing carrier band 12 has been transferred regulation, and electronics package 20 is fed into device and supplies with the device of the situation on the P1 of position and supply with detecting sensor 22; The compression that is compressed the situation of cylinder 18 (compression set) compression with the bag 12A that is used to detect the mold pressing carrier band 12 that the is dummy status sensor 26 of finishing dealing with.And, have according to device and supply with the state of detecting sensor 22 and supply with situation about handling and finished the cable (information transferring elements) 28 that situation that compression handles conveys to apparatus for mounting electronic component 30 having finished device according to finish dealing with 26 state of sensor of compression.And owing to can under the state of the conveying that has stopped mold pressing carrier band 12 fully, compress processing, so can more successfully not carry out the conveying of mold pressing carrier band 12 to the outer load of mold pressing carrier band 12 plus in carrying.In addition, supply with the beginning of handling and stop, thereby can carry out device efficiently and supply with and handle and compression is handled owing to can handle synchronously by being arranged on exterior drive source control device with the compression of electronic device supplier 10.
In addition, electronic device supplier of the present invention is not limited to the shape and the structure of the electronic device supplier 10 of the foregoing description, if can advance and retreat at the thickness direction of the mold pressing carrier band that is dummy status that from described bag, described electronics package has been taken out, be used for compression set that the described bag to the mold pressing carrier band of this dummy status compresses be arranged on described device supply with the position the mold pressing carrier band send side.
Therefore, in the above-described embodiment, be to implement power supply from apparatus for mounting electronic component 30 to electronic device supplier 10, but the invention is not restricted to this, also can beyond apparatus for mounting electronic component 30, implement power supply by cable 28.In addition, also can power supply be set in the inside of electronic device supplier 10, in this case, the cable of the usefulness that then do not need to power.
In addition, in the above-described embodiment, in order to improve treatment effeciency, connecting cable between electronic device supplier 10 and apparatus for mounting electronic component 30 (information transferring elements) 28 makes device supply with processing by control signal (busy) and handles synchronously with compression.But, the invention is not restricted to this, for example, device is supplied with processing and compression is handled if carry out at interval with specific time respectively, then do not need to make and obtain between electronic device supplier 10 and the apparatus for mounting electronic component 30 synchronously, therefore, the cable that can not need control signal to use.
In addition, if the cut-off knife that severing is the mold pressing carrier band 12 of dummy status is set on compressor cylinder (compression set) 18, then can be in compressed bag 12A with the interval severing mold pressing carrier band 12 of regulation.Like this, post-processing can be further simplified, the conveying of mold pressing carrier band 12 can be more successfully carried out the mold pressing carrier band 12 of dummy status.
Electronic device supplier of the present invention has can successfully carry out the conveying of mold pressing carrier band, and can supply to device to electronics package exactly and supply with locational good effect.
Claims (2)
1. an electronic device supplier is used to carry the mold pressing carrier band of having accommodated electronics package in the bag that forms at the interval with regulation, and described electronics package is sent the bending of described mold pressing carrier band after the device supply position of regulation is removed, it is characterized in that,
Supply with at described device and to supply with the position roughly at grade the mold pressing carrier band transport path with described device between position and the described curve, described bag compression set of that setting can be advanced and retreat at the thickness direction that has taken out the mold pressing carrier band that is dummy status of described electronics package from described bag, as to be used to compress this dummy status mold pressing carrier band.
2. electronic device supplier according to claim 1 is characterized in that having:
Be used to detect the gap length that described mold pressing carrier band has been transferred described regulation, and described electronics package is fed into described device and supplies with locational device and supply with detecting sensor;
Be used to detect compression that the bag of the mold pressing carrier band of described dummy status compressed by the described compression set sensor of finishing dealing with; With
The state of supplying with sensor according to described device is supplied with the information handled and is conveyed to the exterior information of device and pass on parts having finished information that compression handles according to the finish dealing with state of sensor of described compression having finished device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003206773 | 2003-08-08 | ||
| JP2003206773A JP4357889B2 (en) | 2003-08-08 | 2003-08-08 | Electronic component feeder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1579884A true CN1579884A (en) | 2005-02-16 |
| CN100347046C CN100347046C (en) | 2007-11-07 |
Family
ID=34363513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100705583A Expired - Fee Related CN100347046C (en) | 2003-08-08 | 2004-08-06 | Electronic device supplying apparatus |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4357889B2 (en) |
| CN (1) | CN100347046C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109963454A (en) * | 2017-12-26 | 2019-07-02 | 松下知识产权经营株式会社 | Assembly supply device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5923827B2 (en) * | 2011-06-01 | 2016-05-25 | 日本リトル株式会社 | Work insertion device and work insertion method |
| CN108033050B (en) * | 2017-12-27 | 2019-10-22 | 福建省将乐县长兴电子有限公司 | A kind of crystal oscillator packing machine |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3301830B2 (en) * | 1993-09-30 | 2002-07-15 | 三洋電機株式会社 | Parts supply device |
| JPH0946088A (en) * | 1995-08-01 | 1997-02-14 | Citizen Watch Co Ltd | Supply equipment of chip electronic component |
| JPH09186487A (en) * | 1995-12-28 | 1997-07-15 | Matsushita Electric Ind Co Ltd | Part supplying device |
| US6513563B1 (en) * | 1997-01-20 | 2003-02-04 | Matsushita Electric Industrial Co., Ltd. | Component feeding method and device |
| JP3606027B2 (en) * | 1997-12-16 | 2005-01-05 | 松下電器産業株式会社 | Tape feeder |
| JP2000022386A (en) * | 1998-07-06 | 2000-01-21 | Matsushita Electric Ind Co Ltd | Component transferring apparatus of component cassette for magnetic component |
-
2003
- 2003-08-08 JP JP2003206773A patent/JP4357889B2/en not_active Expired - Fee Related
-
2004
- 2004-08-06 CN CNB2004100705583A patent/CN100347046C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109963454A (en) * | 2017-12-26 | 2019-07-02 | 松下知识产权经营株式会社 | Assembly supply device |
| CN109963454B (en) * | 2017-12-26 | 2022-03-08 | 松下知识产权经营株式会社 | Component supply device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100347046C (en) | 2007-11-07 |
| JP4357889B2 (en) | 2009-11-04 |
| JP2005056948A (en) | 2005-03-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071107 |