CN1555959A - Tin base alloy solder - Google Patents
Tin base alloy solder Download PDFInfo
- Publication number
- CN1555959A CN1555959A CNA200310121009XA CN200310121009A CN1555959A CN 1555959 A CN1555959 A CN 1555959A CN A200310121009X A CNA200310121009X A CN A200310121009XA CN 200310121009 A CN200310121009 A CN 200310121009A CN 1555959 A CN1555959 A CN 1555959A
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- CN
- China
- Prior art keywords
- solder
- alloy solder
- base alloy
- tin base
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
A Sn-base alloy solder for microelectric circuits contains Au, Sb and Sn. Its advantages are low soldering temp (250 deg.C), high flowability, and high strength and brightness of soldered point.
Description
Technical field
The present invention relates to microelectronic component tin based lead solder.
Background technology
In microelectronic device package technology, be applicable to that the solder of gold-plated circuit substrate and gold-plated cover plate soldering has solders such as PbSnAg, SnSbAg, AuSn, its fusing point is all more than 250 ℃, and its brazing temperature is all more than 300 ℃.Under such temperature, can damage the electric conductivity of some microelectronic circuit.Be the serviceability of these microelectronic circuits that adequately protect, require during soldering the brazing temperature of solder is reduced to below 300 ℃.
Summary of the invention
The object of the invention provides a kind of kamash alloy solder, and this solder has low brazing temperature.
Realize the kamash alloy solder of the object of the invention, the mass percent composition is: Au7～11, and Sb0.1～0.5, surplus is Sn.
In the rich Sn district of Sn-Au bianry alloy, there are eutectic composition point, i.e. a Sn
90Au
10, eutectic temperature is 217 ℃, the alloy principal component of solder of the present invention is located in this eutectic point zone.Thereby solder of the present invention has good brazing characteristics, and brazing temperature is low, is 250 ℃.Under brazing temperature, have good cross flow and gap fillibility.Simultaneously, owing to contain the Au of 7～11 mass ratio % in the solder alloy of the present invention, therefore fabulous with the brazing characteristics of gold-plated mother metal on gold-plated workpiece, almost do not have erodible to the mother metal Gold plated Layer.In alloy, add metal Sb composition, can effectively improve the intensity of soldered fitting, improve the brightness of soldered fitting, reduce the roughness of joint surface.But when the addition of metal Sb exceeds certain limit, be difficult to the processing forming that produces above-mentioned effect and can cause reducing brazing filler metal alloy.
Material purity Sn 〉=99.95% that the present invention uses, Au 〉=99.98%, Sb 〉=99.95%.The impurity content (mass ratio) that the present invention allows: Pb≤0.003%, Zn≤0.002%, Cd≤0.002%.Table 1 is a kamash alloy solder performance of the present invention.
Embodiment
Adopt following technology to prepare kamash alloy solder of the present invention:
Melting by mass percentage under vacuum or the Ar atmosphere: the raw material that Au7～11, Sb0.1～0.5, surplus Sn prepare, and---ingot casting and cleaning surfaces thereof are handled---cold forging, cold drawn, cold-drawn are also carried out 150 ℃ of vacuum heat---, and fine finishining obtains foil, band, silk material solder.
Table 1 kamash alloy solder performance of the present invention
| The embodiment numbering | The brazing filler metal alloy composition | Fusing point ℃ | Draw Shen intensity MPa | Machinability | ||
| ?Au | ????Sb | Sn | ||||
| ????1 | ?7.0 | ????0.1 | Surplus | ????218 | ????56 | Good |
| ????2 | ?9.0 | ????0.3 | Surplus | ????222 | ????57 | Good |
| ????3 | ?10.8 | ????0.3 | Surplus | ????224 | ????65 | Good |
Claims (1)
1. kamash alloy solder, composition (quality %) is: Au7～11, Sb0.1～0.5, surplus Sn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200310121009 CN1261277C (en) | 2003-12-31 | 2003-12-31 | Tin base alloy solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200310121009 CN1261277C (en) | 2003-12-31 | 2003-12-31 | Tin base alloy solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1555959A true CN1555959A (en) | 2004-12-22 |
| CN1261277C CN1261277C (en) | 2006-06-28 |
Family
ID=34338362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200310121009 Expired - Fee Related CN1261277C (en) | 2003-12-31 | 2003-12-31 | Tin base alloy solder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1261277C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101265120B (en) * | 2008-04-07 | 2010-12-08 | 哈尔滨工业大学 | Solder for braze welding silicon nitride ceramic and method for braze welding silicon nitride ceramic |
| CN106695163A (en) * | 2016-12-29 | 2017-05-24 | 安徽华众焊业有限公司 | Au-base slicken solder and preparation method thereof |
-
2003
- 2003-12-31 CN CN 200310121009 patent/CN1261277C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101265120B (en) * | 2008-04-07 | 2010-12-08 | 哈尔滨工业大学 | Solder for braze welding silicon nitride ceramic and method for braze welding silicon nitride ceramic |
| CN106695163A (en) * | 2016-12-29 | 2017-05-24 | 安徽华众焊业有限公司 | Au-base slicken solder and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1261277C (en) | 2006-06-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060628 Termination date: 20121231 |