CN1555080B

CN1555080B - Plasma display

Info

Publication number: CN1555080B
Application number: CN 200310122350
Authority: CN
Inventors: 林裕凯
Original assignee: AU Optronics Corp
Current assignee: AU Optronics Corp
Priority date: 2003-12-19
Filing date: 2003-12-19
Publication date: 2010-05-12
Anticipated expiration: 2023-12-19
Also published as: CN1555080A

Abstract

A plasma indicator includes a first CB and a second CB set in the containing space formed by a baseboard and a back-cover plate, the first CB is fixed on the baseboard and the second is fixed on the first CB. A first electronic component is carried on the first CB, and a second component with different heating powers to that of the first is carried on the second CB, a heat conduction device is designed between the second component and the back-cover plate to transfer the heat and radiate it, so that, electronic components with different heat powers can be carried on different CB so as to enable them have individual radiation spaces to increase the radiation efficiency.

Description

Plasma display

Technical field

The present invention relates to a kind of plasma display, particularly relate to a kind of electronic building brick and separate plasma display system that there emerged a other heat-dissipating space at the different heat amount.

Background technology

The main pyrotoxin of plasma display is electronic building brick and the driver module on display floater and the drive circuit.In the structure of existing plasma display, as shown in Figure 1, the display floater 10 of plasma display binds by heat conductive pad 20 and is fixed on the metal substrate 30, substrate 30 combines with the back shroud 40 of plasma display and forms a space of sealing with containment circuit board 100, and driver module 120 all is equipped on the circuit board 100 with electronic building brick 140.Therefore the heat that display floater 10 produced can conduct to metal back shroud 40 and disperses via heat conductive pad 20 and substrate 30, and driver module 120 can be by the effect of bleeding of louvre 180 and fan 190 with the caloric value of electronic building brick 140, heat is carried by air-flow L and be dissipated into the plasma display outside, generally speaking, the caloric value of driver module 120 is than electronic building brick 140 height.

The shortcoming of this structure is that driver module 120 is equipped on the same circuit board 100 with electronic building brick 140, the caloric value that is produced does not have enough spaces and path can supply to disperse, therefore can elevate the temperature and influence operation usefulness, and and then influence the ability of drive circuit and the Presentation Function of display floater 10, on circuit design, the arrangement of assembly is also comparatively difficult simultaneously.

At above-mentioned problem, the Japan Patent spy opens and discloses another kind of plasma display structure for 2002-6754 number, as shown in Figure 2, display pannel 10 also binds by heat conductive pad 20 and is fixed on the substrate 30, substrate 30 combine with back shroud 40 and form one the sealing the space, a first circuit board 200 is fixed on the substrate 30 and is equipped with electronic building brick 240 in this spatial accommodation, one second circuit board 250 is fixed on the framework 230, and framework 230 is bonding on the back shroud 40 via a heat conductor 270, side at second circuit board 250 is equipped with electronic building brick 242, opposite side carries driver module 220, the radiators (not shown) of driver module 220 itself contact with framework 230, the heat that driver module 220 produced can be conducted to back shroud 40 via framework 230 and heat conductor 270 by this and dispel the heat.

Though this structure is arranged at electronic building brick 242 and driver module 220 on the second circuit board 250 in addition, but because second circuit board 250 is arranged on the back shroud 40, can't be about to supply with the power supply cable of the drive circuit of second circuit board 250 during assembling earlier and fix, cover back shroud 40 again; In addition, though driver module 220 contacts the heat conduction that can by this driver module 220 be produced and goes out with framework 230, but there is no soft Heat Conduction Material filling between the Metal Contact place, do not have fixtures such as screw on every side again and make both make fluid-tight engagement, so can cause heat transfer area to diminish and make the heat conduction variation.Again because the area of back shroud 40 is big, thin thickness and easy deformation, framework 230 only depends on heat conductor 270 to be attached to and also has the problem that causes heat transfer area to reduce because of bond strength is not good on the back shroud 40 in addition.

Summary of the invention

In view of this, purpose of the present invention just separates out to obtain different heat-dissipating spaces at the electronic building brick that will have the different heat amount, promotes the efficient of heat radiation, simultaneously also especially at the big suitable cooling mechanism of electronic building brick design of caloric value.

For reaching above-mentioned purpose, the invention provides a kind of plasma display, comprise a substrate; One back shroud combines with substrate and forms a spatial accommodation; One first circuit board is located in this spatial accommodation; One first electronic building brick is located on the first circuit board; And one first heat-transfer device, be located between first electronic building brick and the back shroud and be incorporated into first electronic building brick, this first heat-transfer device is a heat conduction shell fragment, have an elastic portion and a contact site, this elastic portion is the ㄩ font in fact and is incorporated into this first electronic building brick, and this contact site extends from this elastic portion and is tabular and is connected to this back shroud and second electronic building brick is located on this first circuit board, and be arranged in the opposition side of this first electronic building brick. in this structure, make the bigger electronic building brick of caloric value (as first electronic building brick) utilize heat-transfer device to engage with back shroud to obtain bigger area of dissipation, can promote the efficient of heat radiation. because the setting of heat conduction shell fragment, can make distance between first electronic building brick and the back shroud have elasticity in the adjustment, possess heat conducting effect again simultaneously, therefore can provide greater room to the design of circuit board and back shroud configuration. wherein heat-transfer device has contact site, can increase the contact area of electronic building brick and bonnet, thereby improve heat-conducting effect.

Plasma display of the present invention also comprises a second circuit board, is fixed between first circuit board and the substrate and affixed each other with this first circuit board.Above-mentioned structure can caloric value is different electronic building brick be arranged at respectively on two circuit boards, separate out different heat-dissipating spaces by this, to promote hot transfer efficiency; Heat-transfer device (as first heat-transfer device) is set and is connected simultaneously and at the bigger electronic building brick of caloric value (as first electronic building brick), by back shroud increase area of dissipation with back shroud.

In the plasma display of the present invention, this first heat-transfer device is a heat conductive pad.

Plasma display of the present invention also comprises a fixture, and this back shroud is fixed on this first circuit board, and this fixture can be bolt.The effect of this fixture can also make the back shroud and second electronic building brick urgently be pressed on the heat conductive pad except fixing back shroud, reduces the thermal resistance between second electronic building brick and the back shroud by this.

Plasma display of the present invention also comprises one the 3rd electronic building brick and one second heat-transfer device; The 3rd electronic building brick is located on the first circuit board, and second heat-transfer device is located between the 3rd electronic building brick and the back shroud and is incorporated into the 3rd electronic building brick.So, on first circuit board, can carry the electronic building brick (as first electronic building brick and the 3rd electronic building brick) of differing heights, and utilize similar and different heat-transfer device that above-mentioned electronic building brick is contacted with back shroud, do heat radiation by the large tracts of land of back shroud.

Plasma display of the present invention also comprises a plurality of first spacers, is located between this first circuit board and this second circuit board, makes to keep a suitable distance between this first circuit board and this second circuit board.

Plasma display of the present invention also comprises a plurality of second spacers, is located between this second circuit board and this substrate, makes to keep a suitable distance between this second circuit board and this substrate.

The electronic building brick that the present invention is different with caloric value is equipped in the different heat-dissipating spaces, and it is special at the bigger electronic building brick of caloric value (as driver module), design special cooling mechanism, make other electronic building brick all can obtain best radiating efficiency by this, and then the radiating efficiency of lifting electronic building brick integral body, to promote the operation usefulness of Plasmia indicating panel.

For above and other objects of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and cooperate appended diagram, be described in detail below.

Description of drawings

Fig. 1 is a kind of cutaway view of existing plasma display.

Fig. 2 is the cutaway view of another kind of existing plasma display.

Fig. 3 is the cutaway view of first embodiment of plasma display of the present invention.

Fig. 4 is the cutaway view of second embodiment of plasma display of the present invention.

Fig. 5 is the cutaway view of the 3rd embodiment of plasma display of the present invention.

Fig. 6 is the cutaway view of the 4th embodiment of plasma display of the present invention.

Fig. 7 is the cutaway view of the 5th embodiment of plasma display of the present invention.

The reference numeral explanation

10～display floater; 20～heat conductive pad; 30～substrate; 40～back shroud; 80,81,82～louvre; 90～bolt; 100～circuit board; 120～driver module; 140～electronic building brick; 160～spacer; 180～louvre; 190～fan; 200～first circuit board; 220～driver module; 230～framework; 240,242～electronic building brick; 250～second circuit board; 270～heat conductor; 280～louvre; 300～second circuit board; 320～driver module; 340～electronic building brick; 350～first circuit board; 361,362,363～spacer; 370～heat conductive pad; 380～electronic building brick; 500～circuit board; 520～driver module; 540～electronic building brick; 541～electronic building brick; 560～spacer; 570～heat conduction shell fragment; 571～elastic portion; 572～contact site; 721,722～driver module; 771～heat conductive pad; 772～heat conduction shell fragment.A, A1, A2, L～air-flow.

Embodiment

The present invention mainly is with in the plasma display, and the heat-dissipating space of the electronic building brick of different heat amount is done and separated, and utilizes the large tracts of land of back shroud to promote radiating effect.Below do explanation at various embodiments of the invention respectively.

First embodiment

As shown in Figure 3, in metal back shroud 40 and substrate 30 formed spatial accommodations, be provided with first circuit board 350 and second circuit board 300, second circuit board 300 is fixed on the substrate 30 by a plurality of spacers 361, and first circuit board 350 is fixed on the second circuit board 300 by a plurality of spacers 362, and make by this between first circuit board 350 and the second circuit board 300 keep one suitably distance be provided with spacer 363 between first circuit board 350 and the back shroud 40 and make and keep one between first circuit board 350 and the back shroud 40 so that carry electronic building brick (second electronic building brick) 340 on the second circuit board 300 suitably apart from so that lift-launch driver module 320 (first electronic building brick) on the first circuit board 350; Because driver module 320 has bigger caloric value than electronic building brick 340, therefore driver module 320 is done thermo-contact by a heat conductive pad 370 (non-stickiness) and back shroud 40, the heat that driver module 320 is produced, conduct to back shroud 40 via heat conductive pad 370, and, promote radiating efficiency by the large tracts of land of back shroud 40.Because back shroud 40 is done affixed with first circuit board 350 by bolt 90 and spacer 363 formed mechanisms, when bolt 90 fastens, heat conductive pad 370 can closely be engaged between driver module 320 and the back shroud 40, can reduce thermal resistance by this, improves radiating efficiency.

Can on back shroud 40, offer a plurality of louvres 80,81 in addition, make the air communication mistake by the mode of free convection, and driver module 320 and electronic building brick 340 are done heat radiation.Also can on the back shroud 40 near near the position the driver module 320, offer louvre 82, promote the radiating efficiency of driver module 320 more.

So, after air current A enters from the louvre 81 of back shroud 40 belows, because the circuit board of present embodiment two-layer equation structure, a part of air current A 2 can be by the space at driver module 320 places, absorb the heat of driver module 320 after discharge by louvre 82, another air current A 1 is partly flowed through behind the electronic building brick 340, is discharged by the louvre 80 of back shroud 40 tops.

By this, the bigger driver module of caloric value 320 is set on the first circuit board 350 near louvre 80,81, allow the air communication mistake of more amount, and make driver module 320 and back shroud 30 do thermo-contact, promote the radiating efficiency of driver module 320 by the large tracts of land of back shroud 30,340 air-flows that pass through in a small amount of electronic building brick that caloric value is less, therefore the radiating module 320 and the electronic building brick 340 of different heat amount can separate out heat-dissipating space by the structure that present embodiment disclosed, to promote radiating efficiency.

Second embodiment

As shown in Figure 4, structure according to first embodiment, if the space between first circuit board 350 and the second circuit board 300 is enough big, can carry highly less electronic building brick (the 5th electronic building brick) 380 at the back side of first circuit board 350, remaining structure is then identical with first embodiment.So, can increase the quantity of the electronic building brick that is carried.

The 3rd embodiment

As shown in Figure 5, circuit board 500 is fixed on the substrate 30 by spacer 560, driver module 520 and electronic building brick 540 are equipped on the circuit board 500, wherein driver module 520 can be done thermo-contact with back shroud 40 by heat conduction shell fragment 570 made of copper, the heat that driver module 520 is produced can conduct to back shroud 40 via heat conduction shell fragment 570, and promotes radiating efficiency by the large tracts of land of back shroud 40.Heat conduction shell fragment 570 is made of elastic portion 571 and contact site 572 in addition, and both can be integrally formed.Elastic portion 571 is the ㄩ font, can open to both sides, so that flexible deformation to be provided; Contact site 572 is the tabular structure, and the restoring force that is produced by elastic portion 571 deformation closely is connected on the back shroud 40.The setting of heat conduction shell fragment 570 can provide design to go up more space, makes the distance between driver module 520 and the back shroud 40 have more various selection in design.

In the present embodiment, do not separate though driver module 520 is done with the heat-dissipating space of electronic building brick 540, but do different designs by special the catching in heat of being provided with of heat conduction shell fragment 570, can reach the effect that promotes radiating efficiency equally at the different assembly of caloric value.

The 4th embodiment

As shown in Figure 6, structure according to the 3rd embodiment, the electronic component (the 3rd electronic building brick) 541 of some is equipped on the back side of circuit board 500, other part is then identical with the 3rd embodiment, therefore identical with the 3rd embodiment or play the part of the assembly of same role, give the label identical with Fig. 5.In the structure that present embodiment disclosed, circuit board 500 separates into two heat-dissipating spaces with substrate 30 with back shroud 40 formed spatial accommodations, in heat-dissipating space near louvre 80,81, caloric value bigger driver module 520 and electronic building brick 540 are set, another heat-dissipating space then is provided with the less electronic building brick of caloric value 541, so the electronic building brick that caloric value is different separates out different heat-dissipating spaces, can promote radiating efficiency.

The 5th embodiment

Present embodiment is in conjunction with first embodiment and the 3rd embodiment, as shown in Figure 7, carry the driver module 721 and the driver module (quadrielectron assembly) 722 of differing heights on the first circuit board 350, driver module 721 is done thermo-contact by heat conductive pad 771 and back shroud 40, and driver module 722 is done thermo-contact by heat conduction shell fragment 772 and back shroud 40.The structure of other parts is identical with disclosed structure among first embodiment, and identical part gives the label identical with Fig. 3.

In the prior art because electronic building brick all is arranged on the same circuit board, thereby cause radiating effect not good, though or use two circuit boards, cause assembling such as power supply cable to be difficult for and can't promote its radiating efficiency for caloric value big electronic building brick such as driver module.By structure of the present invention, two circuit boards are fixed in substrate-side simultaneously, solve the problem in the assembling, and do special heat dissipation design, to promote radiating efficiency at the big assembly of caloric value.

Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; those skilled in the art can do a little change and retouching without departing from the spirit and scope of the present invention, so protection scope of the present invention should be looked the accompanying Claim person of defining and is as the criterion.

Claims

1. plasma display comprises:

One substrate;

One back shroud combines with this substrate and forms a spatial accommodation;

One first circuit board is located in this spatial accommodation, and is fixed on this substrate;

One first electronic building brick is located on this first circuit board;

One first heat-transfer device, be located between this first electronic building brick and this back shroud and be incorporated into this first electronic building brick, this first heat-transfer device is a heat conduction shell fragment, have an elastic portion and a contact site, this elastic portion is the ㄩ font in fact and is incorporated into this first electronic building brick, and this contact site extends from this elastic portion and is tabular and is connected to this back shroud; And

Second electronic building brick is located on this first circuit board, and is positioned at the opposition side of this first electronic building brick.

2. plasma display as claimed in claim 1, wherein this elastic portion and this contact site are integrally formed.

3. plasma display as claimed in claim 1, wherein the material of this heat conduction shell fragment is a copper.

4. plasma display as claimed in claim 1, it also comprises a plurality of first spacers, is located between this first circuit board and this substrate, and this circuit board is fixed on this substrate with a suitable distance.

5. plasma display comprises:

One substrate;

One back shroud combines with this substrate and forms a spatial accommodation;

One first electronic building brick is located on this first circuit board;

One second circuit board is fixed between this first circuit board and the substrate and affixed each other with this first circuit board;

One second electronic building brick is located on this second circuit board;

One first heat-transfer device is located between this first electronic building brick and this back shroud and is incorporated into this first electronic building brick; And

The 3rd electronic building brick is arranged on this first circuit board, and is positioned at the opposition side of this first electronic building brick.

6. plasma display as claimed in claim 5, wherein this first heat-transfer device is a heat conductive pad.

7. plasma display as claimed in claim 5, it also comprises a fixture, and this back shroud is fixed on this first circuit board.

8. plasma display as claimed in claim 7, wherein this fixture is a bolt.

9. plasma display as claimed in claim 5, it also comprises a quadrielectron assembly, is located on this first circuit board; And

One second heat-transfer device is located between this quadrielectron assembly and this back shroud and is incorporated into this quadrielectron assembly.

10. plasma display as claimed in claim 9, wherein this second heat-transfer device is a heat conduction shell fragment.

11. plasma display as claimed in claim 10, wherein this heat conduction shell fragment has an elastic portion and a contact site, and this elastic portion is incorporated into this quadrielectron assembly, and this contact site is connected to this back shroud.

12. plasma display as claimed in claim 11, wherein this elastic portion and this contact site are integrally formed.

13. plasma display as claimed in claim 10, wherein the material of this heat conduction shell fragment is a copper.

14. plasma display as claimed in claim 5, wherein this second circuit board is fixed on this substrate.

15. plasma display as claimed in claim 5, it also comprises a plurality of first spacers, is located between this first circuit board and this second circuit board, makes to keep a suitable distance between this first circuit board and this second circuit board.

16. plasma display as claimed in claim 5, it also comprises a plurality of spacers, is located between this second circuit board and this substrate, makes to keep a suitable distance between this second circuit board and this substrate.