CN1554805A - Electroplating method and electroplating device special for such electroplating method - Google Patents
Electroplating method and electroplating device special for such electroplating method Download PDFInfo
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- CN1554805A CN1554805A CNA2003101174977A CN200310117497A CN1554805A CN 1554805 A CN1554805 A CN 1554805A CN A2003101174977 A CNA2003101174977 A CN A2003101174977A CN 200310117497 A CN200310117497 A CN 200310117497A CN 1554805 A CN1554805 A CN 1554805A
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- rotary table
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- electroplating
- soaks
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Abstract
The electroplating method includes the following steps: providing two objects with at least a pair of flat sides; sandwiching one easy-to-wet object between the two objects; wetting the sandwiched object with electroplating solution; and contacting the object to be electroplated to the easy-to-wet object. The electroplating apparatus includes at least two objects with at least one pair of flat sides, and one easy-to-wet object sandwiched between the two objects with one flat side aligned to the flat sides. Compared with available technology, the electroplating method and apparatus needs no the step of brushing and thus no damage to the electroplated object and may realize local electroplating to save electroplating material and lower cost.
Description
[technical field]
The present invention relates to a kind of electro-plating method and be exclusively used in the electroplating device of this electro-plating method, refer in particular to a kind of electro-plating method of the LGA of being used for type cpu connector terminal and be exclusively used in the electroplating device of this electro-plating method.
[background technology]
Figure 6 shows that the terminal 1 of LGA type cpu connector and connect the strip 2 of these terminals 1, each terminal 1 upper end is provided with elastic contact part 3, electrically to contact with external conductive component.In order to guarantee that termination contact portion 3 and external conductive component have the excellent contact conductivity, need on contact part 3, plate one deck gold usually.But,, can cause the waste of plated material not needing also plated with gold of galvanized large area region if adopt the immersion plating method because this termination contact portion 3 and terminal material belt 2 are not at grade.And if adopt brush plating method, then easy scratch termination contact portion 3, and can be electroplated onto part terminal material belt 2 and other position inevitably, can waste plated material equally.Therefore the electro-plating method that needs a kind of novelty of design neither can damage and can save plated material during plating terminal.
[summary of the invention]
The object of the present invention is to provide a kind of electro-plating method and be exclusively used in the electroplating device of this electro-plating method, this method can be saved electroplating cost and can not treat and be electroplated object and damage.
For achieving the above object, electro-plating method of the present invention may further comprise the steps: (1) provides two articles, and at least one side of this two articles is substantially flush; (2) easily soak thing with one and be held between the above-mentioned two articles, and this easily soaks thing one side and roughly flushes with the substantially flush side of above-mentioned two articles; (3) will easily soak thing with electroplate liquid soaks; (4) need of electroplated object being electroplated part is affixed on easily and soaks on the thing.
Electroplating device of the present invention comprises having the substantially flush two articles of a side at least and being held on and easily soaks thing between the above-mentioned two articles, and this easily soaks thing one side and roughly flushes with the substantially flush side of above-mentioned two articles.
Compared with prior art, electro-plating method of the present invention is because of needing to brush This move, thereby can not damage the electroplated object, and because of may be plated to local location, thereby can save plated material, reduce cost.
[description of drawings]
Fig. 1 is the synoptic diagram of electro-plating method of the present invention.
Fig. 2 is the vertical view of the used electroplating device top rotary table of electro-plating method shown in Figure 1.
Fig. 3 is the vertical view of the used electroplating device lower rotary table of electroplating device shown in Figure 1.
Fig. 4 is the partial enlarged drawing at Fig. 1 centre circle A place.
Fig. 5 is the motion synoptic diagram of electroplating device and terminal material belt.
Fig. 6 is the stereographic map of P5 type cpu connector terminal and strip.
[embodiment]
See also Fig. 1 to shown in Figure 5, electroplating device of the present invention comprises top rotary table 10, lower rotary table 20, flannelette 30, injection device 40, returnable 50, rotating shaft 60, rotating mechanism (not drawing among the figure).These top rotary table 10 top adjacent lateral side are provided with annular and outward-dipping slightly electroplate liquid holds pond 12, and this holds pond 12 adjacent lateral side and is provided with some apertures 14, and adjacent medial side is provided with some macropores 16, and these top rotary table 10 central authorities are provided with first through hole 18.These lower rotary table 20 central authorities are provided with second through hole 22, and corresponding above-mentioned macropore 16 is provided with ring groove 24, and this ring groove 24 extends inwardly to adjacent discs central authorities and forms some conduits 26, and each conduit 26 end is provided with small through hole 28.This flannelette 30 is ring-type (also can be circle or other analogous shape), can be made of some ciliums, and is clipped between top rotary table 10 and the lower rotary table 20, is positioned at aperture 14 belows.Second through hole 22 and first through hole 18 are passed in this rotating shaft 60 respectively, so that top rotary table 10 and lower rotary table 20 are fixed in the rotating shaft 60.This rotating shaft 60 also is equiped with returnable 50 below lower rotary table 20, these returnable 50 tops are provided with the pond for recovering 52 that opening makes progress, this pond for recovering 52 is equiped with delivery line 54, so that being derived, the exhausted electroplate liquid is convenient to recycle, returnable 50 bottoms are equiped with bearing 56, rotate with rotating shaft 60 to avoid returnable 50.This injection device 40 is positioned at top rotary table 10 tops, and its outlet 42 alignings hold pond 12.Rotating mechanism links to each other with rotating shaft 60, to drive rotating shaft 60 rotations.These top rotary table 10 outer lower portion and lower rotary table 20 outer upper are inwardly recessed, form accepting groove 70, so that electroplated object 80 (being terminal and strip in the present embodiment) is limited in preposition.
During use, earlier above-mentioned electroplating device is installed, and electronegative electroplated object 80 is positioned in the accepting groove 70, with injection device 40 electroplate liquid is injected then and hold pond 12, this electroplate liquid can flow on the flannelette 30 (if the electroplate liquid injection rate is excessive along aperture 14, too much electroplate liquid can flow into flow-guiding structure along macropore 16, it is ring groove 24, conduit 26, small through hole 28, electroplate liquid is imported in the returnable 50, to avoid electroplate liquid to overflow top rotary table 10), this flannelette 30 can all be soaked by electroplate liquid because of capillarity, thereby the need that make electroplate liquid touch the electroplated object are electroplated part, according to electroplating principle, the metallic cation in the electroplate liquid (as gold ion) can with the electroplated object on metal generation replacement(metathesis)reaction, thereby the gold in the electroplate liquid is plated on the electroplated object.For in being convenient to continuous electroplating, in electroplating process, activate rotating mechanism, reach upward lower rotary table 10,20 rotations to drive rotating shaft 60, thereby can continuously electroplated object 80 be electroplated (as shown in Figure 5).
Certainly, those skilled in the art understand easily, and the present invention is not limited to flannelette, and face can adopt other easily to soak thing, as sponge or the like.
Compared with prior art, the present invention is because of only need clamping one easily soaking thing between two articles, and make and easily soak thing and soaked by electroplate liquid, the electroplated object is affixed on easily soaks on the thing, can finish and electroplate action, because of this electro-plating method does not need to brush This move, thereby can not damage the electroplated object, and because of may be plated to local location, thereby can save plated material, reduce cost.
Claims (10)
1. electro-plating method is used for electroplating the local location of electroplated object, and it is characterized in that may further comprise the steps: (1) provides two articles, and at least one side of this two articles is substantially flush; (2) easily soak thing with one and be held between the above-mentioned two articles, and this easily soaks thing one side and roughly flushes with the substantially flush side of above-mentioned two articles; (3) will easily soak thing with electroplate liquid soaks; (4) need of electroplated object being electroplated part is affixed on easily and soaks on the thing.
2. electro-plating method as claimed in claim 1, it is characterized in that: above-mentioned two articles is respectively diameter top rotary table and lower rotary table about equally, this easily soaks the beyond the region of objective existence edge for circular, this easily soaks the beyond the region of objective existence edge and roughly flushes with the outer rim of last lower rotary table, or roughly flushes with the last lower rotary table into formed accepting groove bottom land that concaves.
3. electro-plating method as claimed in claim 2 is characterized in that: this electro-plating method further may further comprise the steps: the rotating mechanism that a rotating shaft is provided and links to each other with this rotating shaft, the rotatable drive of this rotating mechanism should be gone up lower rotary table and rotating shaft rotation.
4. as claim 2 or 3 described electro-plating methods, it is characterized in that: this top rotary table top adjacent lateral side is provided with holds the pond, and this holds the below, pond and is provided with some apertures, and this easily soaks thing and is positioned at the aperture below.
5. electroplating device that is exclusively used in the described electro-plating method of claim 1, it is characterized in that: it comprises having the substantially flush two articles of a side at least and being held on and easily soaks thing between the above-mentioned two articles, and this easily soaks thing one side and roughly flushes with the substantially flush side of above-mentioned two articles.
6. electroplating device as claimed in claim 5, it is characterized in that: above-mentioned two articles is respectively diameter top rotary table and lower rotary table about equally, this easily soaks the beyond the region of objective existence edge for circular, this easily soaks the beyond the region of objective existence edge and roughly flushes with the outer rim of last lower rotary table, or roughly flushes with the last lower rotary table into formed accepting groove bottom land that concaves.
7. electroplating device as claimed in claim 6 is characterized in that: this electroplating device further comprises a rotating shaft and the rotating mechanism that links to each other with this rotating shaft, and the rotatable drive of this rotating mechanism should be gone up lower rotary table and rotating shaft rotation.
8. as claim 6 or 7 described electroplating devices, it is characterized in that: this top rotary table top adjacent lateral side is provided with holds the pond, and this holds the below, pond and is provided with some apertures, and this easily soaks thing and is positioned at the aperture below.
9. electroplating device as claimed in claim 8 is characterized in that: this top rotary table holds the pond and is provided with a macropore in addition, and this lower rotary table is to being provided with flow-guiding structure by macropore.
10. as claim 5,6 or 7 described electroplating devices, it is characterized in that: this easily soaks thing is flannelette.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101174977A CN1333110C (en) | 2003-12-23 | 2003-12-23 | Electroplating method and electroplating device special for such electroplating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101174977A CN1333110C (en) | 2003-12-23 | 2003-12-23 | Electroplating method and electroplating device special for such electroplating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1554805A true CN1554805A (en) | 2004-12-15 |
| CN1333110C CN1333110C (en) | 2007-08-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101174977A Expired - Fee Related CN1333110C (en) | 2003-12-23 | 2003-12-23 | Electroplating method and electroplating device special for such electroplating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1333110C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107059078A (en) * | 2017-04-21 | 2017-08-18 | 东莞领益精密制造科技有限公司 | A kind of local accurate tin plating processing technology of metal parts |
| CN107946201A (en) * | 2017-12-19 | 2018-04-20 | 哈尔滨工业大学 | A kind of preparation method of the wire bonding pad structure based on local electro-deposition |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4010083A (en) * | 1975-05-28 | 1977-03-01 | U.S. Philips Corporation | Method of local electroplating of strip material |
| JPS55128598A (en) * | 1979-03-27 | 1980-10-04 | Daiichi Denshi Kogyo Kk | Surface treatment |
| JPS596919B2 (en) * | 1981-08-17 | 1984-02-15 | 富士通株式会社 | Roll plating method |
-
2003
- 2003-12-23 CN CNB2003101174977A patent/CN1333110C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107059078A (en) * | 2017-04-21 | 2017-08-18 | 东莞领益精密制造科技有限公司 | A kind of local accurate tin plating processing technology of metal parts |
| CN107946201A (en) * | 2017-12-19 | 2018-04-20 | 哈尔滨工业大学 | A kind of preparation method of the wire bonding pad structure based on local electro-deposition |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1333110C (en) | 2007-08-22 |
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