CN1548920A - Semiconductor laser device mounting aligning and correcting method - Google Patents
Semiconductor laser device mounting aligning and correcting method Download PDFInfo
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- CN1548920A CN1548920A CNA031310044A CN03131004A CN1548920A CN 1548920 A CN1548920 A CN 1548920A CN A031310044 A CNA031310044 A CN A031310044A CN 03131004 A CN03131004 A CN 03131004A CN 1548920 A CN1548920 A CN 1548920A
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Abstract
The semiconductor laser installing and aligning method includes the following steps: fixing TO shell for sintering upper laser chip die on rack with the bottom plane of the TO shell being close to the rack to ensure the central axle of the TO shell in Y-direction; irradiating the natural crystal cleavage plane of the semiconductor laser chip die with one aligning visible light laser in the direction of theta angle to the Y-direction; fixing a rule in the position of D distance to the laser outgoing light cavity plane to make the reflected light from the semiconductor laser cavity plane form a light spot on the rule; calculating the distance between the light spot on the rule and the reflected light spot when the light emitting plane of the laser is perpendicular to the central axle of the shell; and measuring the angle deviation between the laser light emitting direction and the central axle of the shell via measuring the distance.
Description
Technical field
The invention belongs to technical field of semiconductors, be meant semiconductor laser installing and aligning and Calibration Method in a kind of photoelectron technology field especially.
Background technology
Since the seventies, because the important breakthrough of optical fiber technology and semiconductor laser, causing with optical-fibre communications, Fibre Optical Sensor, optical information storage, optical information processing and demonstration etc. is optical information technology flourish of representative.Promoted semiconductor laser to use more widely conversely again.And in the major applications of semiconductor laser, all relate to the coupling of semiconductor laser and optical fiber.The coupling efficiency that how to improve laser instrument and optical fiber becomes the gordian technique of semiconductor laser.The coupling packaged type of semiconductor laser and optical fiber mainly contains coaxial packaging, dual-in-line, encapsulation of butterfly encapsulation, band radio frequency interface or the like.Coaxial packaging has that parasitic parameter is little, technology is simple, low cost and other advantages and be widely used in LED, LD and light receiving element and component package.Whole coaxial configuration is by the TO base, pipe cap, and interior cover, overcoat and internal optics system constitute, and there is consistent concentricity the structure top and the bottom.The installation of semiconductor laser on the TO base is to the coupling efficiency of coaxial packaging, and yield rate is most important.In general, require the light-emitting axis of laser instrument will overlap fully with the central shaft of TO base.See Fig. 1.X, Y, the aligning of Z direction can realize by the aligning by registration mark under high-power microscope, and the aligning of angle aspect is difficult to realize with microscope.Because angular deviation 1-2 degree, coupling efficiency will alter a great deal, and even can not be coupling luminous.The present invention surveys the deviation of light emission direction by the laser cavity surface reflected light, and this method can be used in the real-time installation of semiconductor laser, improves alignment precision, improves the efficient and the yield rate of coupling.
Summary of the invention
The objective of the invention is to, a kind of semiconductor laser installing and aligning and Calibration Method are provided, this method can be used in the real-time installation of semiconductor laser, improves alignment precision, improves the efficient and the yield rate of coupling.When improving the degree of accuracy of chip installation, solve quantitative measurment and correction problem that semiconductor laser light direction and TO shell central axis direction depart from especially.
The method of a kind of semiconductor laser installing and aligning of the present invention is characterized in that, comprises the steps:
1) the TO shell of laser tube core on the sintering is fixed on the support, it is the y direction with the central axis direction that guarantees the TO shell that the baseplane of TO shell is adjacent to support;
2) with the visible laser of a collimation to become the direction at θ angle with the y direction, be radiated on the crystal natural cleavage plane (being the outgoing chamber face of laser instrument) of semiconductor laser chip;
3) be that a ruler is fixed in the place of D at distance lasers emitting cavity face, make the light of films on cavity surfaces of semiconductor lasers reflection can on ruler, show a luminous point;
4) when the central shaft of laser instrument light-emitting area and shell is vertical, the luminous point of visible light on scale is A1, when the central shaft deviation angle a of laser instrument light-emitting area and shell, the luminous point of visible light on scale is A2, A1 and A2 are directly apart from E and deviation angle a, the pass of the incident angle θ of visible light is:
E＝D{tg(θ+2a)-tgθ}
Wherein D is the vertical range of scale to laser cavity surface;
5), just can calculate the angular deviation a of the central shaft of laser instrument light emission direction and TO shell by measuring distance E;
Move from the position on the z direction of reflection light point, can judge the angular deviation of laser tube core in the z direction; In like manner, move, can also judge the angular deviation of laser tube core in the x direction from the position of reflection light point on the x direction.
A kind of semiconductor laser installing Calibration Method of the present invention is characterized in that, comprises the steps:
2) get an eyeglass, be fixed on the TO shell support;
2) parallel on the plane of eyeglass and the fixed support with the surface of contact of TO shell bottom surface, and the light-emitting area that makes reflecting surface and laser instrument in one plane, the luminous point of mirror reflects is the A1 point, note this method being reference field with the surface of contact of TO pipe bottom surface on the fixed support, so this surface of contact is wanted smoothly and with TO shell bottom surface and order the target mirror surface and closely contact.
Description of drawings
For further specifying technology contents of the present invention, be described in detail as follows below in conjunction with embodiment and accompanying drawing, wherein:
Fig. 1 is a scheme of installation of the present invention;
Fig. 2 is a TO shell fixed support synoptic diagram;
Fig. 3 is the device synoptic diagram that adopts the visible laser detection angles to aim at.
Embodiment
See also Fig. 1, Fig. 2 and shown in Figure 3, the method for a kind of semiconductor laser installing and aligning of the present invention comprises the steps:
1) the TO shell 1 of laser tube core on the sintering 2 is fixed on the fixed support 4, it is the y direction with the central axis direction that guarantees TO shell 1 that the baseplane of TO shell 1 is adjacent to fixed support 4;
2) with the visible light laser pen 7 of a collimation to become the direction at θ angle with the y direction, be radiated on the crystal natural cleavage plane (being the emitting cavity face 5 of laser instrument) of semiconductor laser chip;
3) fix a ruler 3 at distance lasers emitting cavity face 5 for the place of D, make the light of semiconductor laser emitting cavity face 5 reflections can on ruler 3, show a luminous point;
4) when the central shaft of laser instrument light-emitting area and shell was vertical, reflection light point was reference point A1, and when the central shaft out of plumb of laser instrument light-emitting area and shell, when promptly the central shaft of laser instrument light direction and TO shell had an angle a, reflection light point was A2;
5), just can measure the angular deviation a of the central shaft of laser instrument light emission direction and TO shell by measuring distance E;
Computing formula is:
E＝D{tg(θ+2a)-tgθ}
Wherein θ is the incident angle of visible laser, and a is a deviation angle, and E is the distance of A1 and A2;
Move from the position on the z direction of reflection light point, can judge the angular deviation of laser tube core in the z direction; In like manner, move, can also judge the angular deviation of laser tube core in the x direction from the position of reflection light point on the x direction.
A kind of semiconductor laser installing Calibration Method of the present invention comprises the steps:
1) gets an eyeglass, be fixed on the TO shell support 4;
2) parallel on the plane of eyeglass and the fixed support 4 with the surface of contact of TO shell bottom surface, and the light-emitting area that makes reflecting surface and laser instrument in one plane, the luminous point of mirror reflects is the A1 point, note this method being reference field with the surface of contact of TO pipe bottom surface on the fixed support 4, so this surface of contact is wanted smoothly and with TO shell bottom surface and order the target mirror surface and closely contact.
Calibration steps of the present invention is to determine reference point A1: get an eyeglass, be fixed on the TO shell support 4, parallel on the plane of eyeglass and the TO shell support 4 with the surface of contact of TO shell 1 bottom surface, and the light-emitting area that makes reflecting surface and laser instrument in one plane, the luminous point of mirror reflects is the A1 point, note this method being reference field with the surface of contact of TO pipe bottom surface on the support, so this surface of contact is wanted smoothly and with TO shell bottom surface and order the target mirror surface and closely contact.
After adopting this method, the laser instrument sintering on TO shell 1 time alignment precision improve greatly, particularly solved indivedual low problems of pipe coupling efficiency in the coupling of follow-up laser instrument and optical fiber, improved yield rate.
Embodiment
The TO pipe is fixed on the support 4, as shown in Figure 2.Make the bottom surface of TO shell 1 be close to support 4, guarantee that the central axis direction of TO shell 1 is vertical with reference surface.Other makes a support, as shown in Figure 3, visible light laser pen 7, surveyors' staff 3 and fixing on the table as the slide plate 6 of reference field.Notice that slide plate is parallel with scale.TO shell fixed support 4 is placed on the slide plate 6, and the angled θ of the light beam of laser pen 7 and slide plate is as 45 degree.Open the power supply of laser pen 7, the directional light of being launched, on the laser cavity surface on the parallel TO of the being incident on shell with the bottom surface (supposing that the chamber face of laser tube core is definitely vertical with the shell central shaft), reflected light produces a luminous point on scale.Can judge the angular deviation in the horizontal direction of tube core sintering by the position of this luminous point; Same method also can be judged the angular deviation of tube core sintering in vertical direction.TO shell fixed support 4 slides along slide plate 6, can judge the angular deviation that is contained in other tube core sintering on the TO shell fixed support 4 successively.
Reference point A1 determines: with a level crossing, it be fixed on the mutually same plane of the light-emitting area of tube core on, make this minute surface parallel with the slide plate strictness.The light spot position of reflected light this moment on scale is reference point A1.
Claims (3)
1, a kind of method of semiconductor laser installing and aligning is characterized in that, comprises the steps:
1) the TO shell of laser tube core on the sintering is fixed on the fixed support, it is the y direction with the central axis direction that guarantees the TO shell that the baseplane of TO shell is adjacent to fixed support;
2) with the visible light laser pen of a collimation to become the direction at θ angle with the y direction, be radiated on the emitting cavity face of crystal of semiconductor laser chip;
3) be that a ruler is fixed in the place of D at distance lasers emitting cavity face, make the light of semiconductor laser emitting cavity face reflection can on ruler, show a luminous point;
4) when the central shaft of laser instrument light-emitting area and shell is vertical, can determine reference point A1;
5), just can calculate the angular deviation a of the central shaft of laser instrument light emission direction and TO shell by measuring distance E;
Move from the position on the z direction of reflection light point, can judge the angular deviation of laser tube core in the z direction; In like manner, move, can also judge the angular deviation of laser tube core in the x direction from the position of reflection light point on the x direction.
2, the method for semiconductor laser installing and aligning according to claim 1 is characterized in that, wherein the said angular deviation a that calculates the central shaft of laser instrument light emission direction and TO shell by formula of step 4); Its formula is:
E＝D{tg(θ+2a)-tgθ}
Wherein θ is the incident angle of visible laser, and a is a deviation angle, and E is the distance of A1 and A2.
3, a kind of semiconductor laser installing Calibration Method is characterized in that, comprises the steps:
1) gets an eyeglass, be fixed on the TO shell support;
2) parallel on the plane of eyeglass and the fixed support with the surface of contact of TO shell bottom surface, and the light-emitting area that makes reflecting surface and laser instrument in one plane, the luminous point of mirror reflects is the A1 point, note this method being reference field with the surface of contact of TO pipe bottom surface on the fixed support, so this surface of contact is wanted smoothly and with TO shell bottom surface and order the target mirror surface and closely contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03131004 CN1235014C (en) | 2003-05-14 | 2003-05-14 | Semiconductor laser device mounting aligning and correcting method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03131004 CN1235014C (en) | 2003-05-14 | 2003-05-14 | Semiconductor laser device mounting aligning and correcting method |
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| Publication Number | Publication Date |
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| CN1548920A true CN1548920A (en) | 2004-11-24 |
| CN1235014C CN1235014C (en) | 2006-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 03131004 Expired - Fee Related CN1235014C (en) | 2003-05-14 | 2003-05-14 | Semiconductor laser device mounting aligning and correcting method |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102175257A (en) * | 2010-12-30 | 2011-09-07 | 中国科学院长春光学精密机械与物理研究所 | Laser alignment device for theodolite |
| CN102214891A (en) * | 2010-04-07 | 2011-10-12 | 深圳市大族激光科技股份有限公司 | Method for adjusting lasers |
| CN108296759A (en) * | 2018-01-10 | 2018-07-20 | 彭德文 | A kind of reflective laser centralising device |
| CN108663758A (en) * | 2018-04-10 | 2018-10-16 | 中国科学院上海技术物理研究所 | A kind of free space laser coupled to single mode optical fiber device and method |
| CN109917194A (en) * | 2017-12-13 | 2019-06-21 | 清华四川能源互联网研究院 | A kind of automatic laser range calibration external member for wireless charging test macro |
| CN110196019A (en) * | 2019-06-27 | 2019-09-03 | 中信戴卡股份有限公司 | A kind of laser sensor caliberating device and its scaling method |
| CN110932087A (en) * | 2018-09-20 | 2020-03-27 | 潍坊华光光电子有限公司 | Semiconductor laser chip correcting device and correcting method |
-
2003
- 2003-05-14 CN CN 03131004 patent/CN1235014C/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102214891A (en) * | 2010-04-07 | 2011-10-12 | 深圳市大族激光科技股份有限公司 | Method for adjusting lasers |
| CN102214891B (en) * | 2010-04-07 | 2014-02-19 | 深圳市大族激光科技股份有限公司 | Method for adjusting lasers |
| CN102175257A (en) * | 2010-12-30 | 2011-09-07 | 中国科学院长春光学精密机械与物理研究所 | Laser alignment device for theodolite |
| CN102175257B (en) * | 2010-12-30 | 2012-07-25 | 中国科学院长春光学精密机械与物理研究所 | Laser alignment device for theodolite |
| CN109917194A (en) * | 2017-12-13 | 2019-06-21 | 清华四川能源互联网研究院 | A kind of automatic laser range calibration external member for wireless charging test macro |
| CN108296759A (en) * | 2018-01-10 | 2018-07-20 | 彭德文 | A kind of reflective laser centralising device |
| CN108296759B (en) * | 2018-01-10 | 2020-11-03 | 彭德文 | Reflection type laser centering device |
| CN108663758A (en) * | 2018-04-10 | 2018-10-16 | 中国科学院上海技术物理研究所 | A kind of free space laser coupled to single mode optical fiber device and method |
| CN108663758B (en) * | 2018-04-10 | 2019-07-23 | 中国科学院上海技术物理研究所 | A kind of free space laser coupled to single mode optical fiber device and method |
| CN110932087A (en) * | 2018-09-20 | 2020-03-27 | 潍坊华光光电子有限公司 | Semiconductor laser chip correcting device and correcting method |
| CN110196019A (en) * | 2019-06-27 | 2019-09-03 | 中信戴卡股份有限公司 | A kind of laser sensor caliberating device and its scaling method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1235014C (en) | 2006-01-04 |
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