CN1546943A - Micro-electromechanical system testing device and method based on micro-interference technique - Google Patents

Micro-electromechanical system testing device and method based on micro-interference technique Download PDF

Info

Publication number
CN1546943A
CN1546943A CNA2003101071311A CN200310107131A CN1546943A CN 1546943 A CN1546943 A CN 1546943A CN A2003101071311 A CNA2003101071311 A CN A2003101071311A CN 200310107131 A CN200310107131 A CN 200310107131A CN 1546943 A CN1546943 A CN 1546943A
Authority
CN
China
Prior art keywords
interference
motion
mems
image
phase shift
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2003101071311A
Other languages
Chinese (zh)
Other versions
CN1303396C (en
Inventor
胡小唐
冯亚林
胡晓东
靳世久
傅星
郝一龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianjin University
Original Assignee
Tianjin University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tianjin University filed Critical Tianjin University
Priority to CNB2003101071311A priority Critical patent/CN1303396C/en
Publication of CN1546943A publication Critical patent/CN1546943A/en
Application granted granted Critical
Publication of CN1303396C publication Critical patent/CN1303396C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Length Measuring Devices By Optical Means (AREA)

Abstract

The invention discloses a kind of testing device and method for micro electromechanical system based on microinterference technology. The device mainly includes a light microscope, a Mirau interferometer, a phase shift controller, stroboscopic illumination driving device, a LED array, a MEMS structure moving motivation device. The character lies in: the light source uses diode array, and each sub light source has an independent collimating device; the microinterference device integrates the light splitting channel Mirau interference microscope and the phase shift controller. The measuring method includes the synchronous control of the strobotron and driving signal, the separation of the mutation area in the interference figure, the reconstruction of the three-dimension surface and inclination amendment, the normalization analysis of the three-dimension surface, the tracing of the measured point. The merits of the invention lie in: the invention uses virtual device mode to facilitate the adjustment and development of the system function; uses light splitting channel Mirau interference microscope and the phase shift device to realize the test of three-dimension movement characters with high recession and anti-interference ability in mode of the continuous light and strobotron illumination.

Description

Proving installation and method based on the MEMS (micro electro mechanical system) of micro-interference technology
Technical field
The present invention relates to a kind of based on the three-dimensional geometry parameter of structure in the micro-interference technical testing MEMS (micro electro mechanical system) (MEMS) and the apparatus and method of kinetic characteristic.Belong to towards the geometric sense and the mechanical quantity test technology of the photoelectricity noncontact method of MEMS (micro electro mechanical system).
Background technology
Measuring technology has important practical significance in MEMS (micro electro mechanical system) (MEMS) R﹠D process and industrialization process.The means of testing of MEMS mainly is by means of expensive microcosmic testing apparatus such as traditional IC testing tool and scanning electron microscope, atomic force microscope at present, but above equipment is not the specialized equipment at the MEMS test, can't realize the test of MEMS Structure dynamic characteristics, these equipment price costlinesses of while, test speed is slow, measurement range is little, test environment is required harsh.In recent years, along with MEMS steps into the industrialization stage gradually from conceptual phase, more urgent to the demand of test macro.Because measurement by physical dimension and kinetic characteristic, the key property that can reflect the MEMS device indirectly, as: MEMS micro-structural 3 D micromotion situation, material properties and Mechanics of Machinery parameter, MEMS reliability and component failure pattern, failure mechanism etc., so the importance of MEMS technique of dynamic measurement is more outstanding.
The test of MEMS structure is divided into following components: the one, and the measurement of structural plan size; The 2nd, the measurement of structural plan motion; The 3rd, the measurement of structure longitudinal size; The 4th, the measurement of structure lengthwise movement.Because the dynamic perfromance of MEMS structure has determined the key property of MEMS, so technique of dynamic measurement has great importance in the MEMS R﹠D process.
In recent years, method of testing to MEMS device dynamic characteristic under the microscale has been carried out a lot of useful explorations, and some achievements in research with practical value have been obtained, as use the moving image of the MEMS movable part of stroboscopic imaging technique collection period high-speed motion, utilize Digital image processing technique to analyze its dynamic perfromance; Wait by the inferior pixel analytical technology in phase shift interference technology in the accurate laser measurement and the computer vision and to improve measuring accuracy; Utilize the real-time measurement of laser Dppler veloicty measurement technology realization MEMS device transient motion etc.
When realizing the measurement of MEMS longitudinal size and periodic motion state, mainly contain two kinds of methods at present, the one, the focal plane mensuration of digital picture; A kind of is microscopic interferometry.Because the precision of first kind of measuring method is lower, therefore present focus mainly is a microscopic interferometry.
External research institution, reported that as the inferior National Laboratory in: masschusetts, u.s.a Polytechnics, University of California Berkeley and the Holy Land some carry out the situation of MEMS dynamic test model machine about utilizing the micro-interference technology, have following characteristics: the interferometer that (1) is adopted is mainly Michelson Michelson interferometer and Linik; (2) adopt the stroboscopic illumination technology to realize catching of motion moment; (3) adopt single wavelength light source (LED or semiconductor laser LD) as light source.
By analysis-by-synthesis and comparison to prior art, mainly there is the problem of following several respects in the technical scheme of being reported at present: the first, the enlargement factor of Michelson interference microscope can not surpass 5 *, and it is little to measure the visual field, the Linik interference microscope is difficult to reach fully to two identical requirements of object lens characteristic, is subjected to extraneous interference easily; The second, to lacking unified evaluation method by micro-interference technology derived geometrical amount parameter; Three, when estimating three-dimensional coupled motions, lack effective measurement point means of tracking; Four, generally only adopt the light of single wavelength to carry out interferometry, the anti-interference of system is relatively poor; Five, the measurement mechanism systematicness is not strong, and extended capability is relatively poor.
Summary of the invention
The object of the present invention is to provide a kind of apparatus and method, characteristics such as strong interference immunity, measurement range are wide, measuring accuracy height that it has based on micro-interference test MEMS (micro electro mechanical system) (MEMS) geometric parameter and dynamic perfromance.
The present invention is realized by following technical proposals.Based on the micro-interference technology, carry out the device of MEMS (micro electro mechanical system) (MEMS) geometric parameter and dynamic characteristic test, this device comprises by three-dimensional fine motion test board, optical microscope, the Mirau interferometer, phase shift controller, the stroboscopic illumination drive unit, the drive signal change-over switch, led array, MEMS structure motion excitation drive unit, ccd video camera, image pick-up card, data processing and control computer are formed, it is characterized in that, light source is a multi wave length illuminating source, employing comprises by in vain, red, yellow, the array that green light emitting diode is formed, and each sub-light source is equipped with independently collimating apparatus; Micro-interference is measured to adopt and is divided light path Mirau interference microscope and integrated with phase shift controller.
Above-mentioned light emitting diode matrix is evenly arranged according to the cross one another mode of equilateral triangle.
Above-mentioned micro-interference part mainly is made up of Mirau interference microscope and phase shift controller.
Adopt said apparatus, carry out the method for testing of MEMS (micro electro mechanical system) (MEMS) geometric sense parameter and dynamic perfromance based on the micro-interference technology, its process comprises the synchro control of stroboscopic and drive signal, the phase shift control of interference microscope, the collection of interference image under the different phase shifts, the isolation in pattern sudden change zone in the interference image, phase shift and phase unwrapping to interference image under the different phase shifts calculate 3 d surface topography figure, the tilt correction of 3 d surface topography figure, the normalized Analysis of 3 d surface topography figure, the tracking of measurement point, it is characterized in that, when static MEMS structure is carried out geometric parameter measurement:
(1) lighting device is set to the continuous illumination mode, and the MEMS device is thrown light on; Tested MEMS device is fixed on three-dimensional fine motion test board;
(2) utilize standard P AL system ccd video camera, obtain MEMS by the interference image of geodesic structure stationary state; Adjust the output of phase shift controller, make that producing equally spaced 5 is the phase shift that step changes, at each phase shift step collection interference image at that time, totally 5 width of cloth interference images;
(3) according to the edge that interference fringe occurred interference image is carried out Edge Gradient Feature, the edge is comprised, and the zone of not having an interference fringe is as pattern sudden change zone, and gray-scale value that should each pixel of zone to compose be 0, to realize the isolation in pattern sudden change zone;
(4) utilize 5 step Hariharan phase shift algorithm that 5 width of cloth interference images that above-mentioned processing obtains are carried out analysis-by-synthesis, obtain reflecting 1 amplitude phase diagram of three-dimensional appearance; Utilize the least square phase-unwrapping algorithm to analyze this phase diagram, obtain comprising the 3-D view of surface topography information;
(5) three-dimensional appearance figure is carried out tilt correction, calculate their least square plane earlier with the artificial regional area of selecting in entire image or the image, and entire image is carried out tilt correction with the slope of this least square plane;
(6) 3-D view is carried out the normalization evaluation, realize geometric parameter measurement; The geometric parameter criterion is estimated in normalization: the depth of parallelism on two planes is the depth of parallelism of the least square plane on two surfaces; The verticality of facade is to estimate with the angle of the least square plane of its bottom surface and this facade; The outline line of planar structure is to utilize curve fitting technique to obtain the line of the marginal point of inferior pixel precision to each xsect; The envelope center line of outline line is to comment
The slotted line of the size of valency planar structure, the depth of parallelism and verticality.
When motion MEMS structure is carried out the kinetic characteristic test:
(1) tested MEMS device is fixed on three-dimensional fine motion test board, and the excitation input end of motion structure in the MEMS device is linked to each other with the electrode pin of three-dimensional fine motion test board; Lighting device is set to the stroboscopic illumination mode, the MEMS device is carried out stroboscopic illumination, the cycle of stroboscopic signal is identical with the cycle of motion-activated signal, and the time delay that is maintained fixed, so the periodic motion of MEMS structure belongs to " freezing " state substantially under stroboscopic illumination;
(2) number of times of same phase place stroboscopic is set, make standard P AL system ccd video camera carry out multiexposure, multiple exposure, the integrating effect that exposes, obtain MEMS by the interference image of geodesic structure stationary state, adjust the output of phase shift controller, make that producing equally spaced 5 is the phase shift that step changes, at each phase shift step collection interference image at that time, totally 5 width of cloth interference images, isolation by pattern sudden change zone in the interference image, and carry out the calculating of 5 step Hariharan phase shift algorithm and least square phase-unwrapping algorithms, can obtain MEMS by geodesic structure under pairing fixed time of the above-mentioned period of motion, i.e. the 3-D view of the surface topography of periodic motion phase place;
(3) time delay of adjustment stroboscopic signal and motion-activated signal, promptly adjust the periodic motion phase place that institute " freezes ", repeating step (2) can obtain MEMS by the 3-D view of geodesic structure at the surface topography of different cycles motion phase; Time delay is corresponding with the quantity of the 3-D view of gathering in the period of motion, by continuous adjustment time delay, can obtain reflecting the three-dimensional image sequence of MEMS structure motion characteristic;
(4) by isolation result in conjunction with pattern sudden change zone in the interference image, the three-dimensional image sequence of different cycles motion phase lower surface pattern is carried out spatial domain analysis and evaluation, can obtain the three-dimensional periodic moving situation of MEMS structure under certain driving frequency; Its interpretational criteria is: when pattern sudden change zone does not influence the reconstruct of motion structure 3-D view in the image, 3-D view according to motion structure extracts structural plan feature contour line, determine the relative position of this outline line in entire image by images match, thereby obtain the plane motion displacement of structure, simultaneously set up the relative measurement coordinate system according to structural plan feature contour line, obtain selected measurement point residing relative position in every width of cloth image, the elevation information of measurement point institute each relative position pixel of correspondence in the three-dimensional image sequence relatively, obtain structure from face (vertical direction) moving displacement; When pattern sudden change zone in the image makes the motion structure 3-D view fully during reconstruct, isolation result according to pattern sudden change zone in the interference image extracts structural plan feature contour line, determine the relative position of this outline line in entire image by images match, thereby obtain the plane motion displacement of structure, simultaneously set up the relative measurement coordinate system according to structural plan feature contour line, obtain selected measurement point residing relative position in every width of cloth image, the elevation information of measurement point institute each relative position pixel of correspondence in the partial 3 d image sequence of institute's reconstruct relatively, obtain structure from face (vertical direction) moving displacement;
(5) adjust the frequency of drive signal with certain step pitch, make the MEMS structure move with different frequencies, repeating step (2) (3) and (4), can obtain the detailed features of the three-dimensional motion of structure under a series of driving frequencies, not only can obtain the resonance frequency and the quality factor of structure by analysis-by-synthesis, also can obtain the three-dimensional motion state overall process of structure.
The invention has the advantages that: adopt the mode of virtual instrument to set up inner functional module, be convenient to the function adjustment and the expansion of system; Under continuous lighting mode, adopt and divide light path Mirau interference microscope and phase shifting devices to realize that precision height, the surface topography that antijamming capability is strong detect, and adopt normalized method to carry out the evaluation of geometric sense parameter; Under the mode of stroboscopic illumination, utilize standard P AL system ccd video camera to realize the collection of the moment image of MEMS high speed periodic motion structure, and be aided with phase shift algorithm, phase place and separate parcel algorithm and spatial domain analysis, set up reference measure system with the surface profile of resolving, obtain the three-dimensional motion characteristic of structure; Adopt light source switching fast, realize multi-wavelength interference flexibly, improve the scope of measuring.
Description of drawings
Fig. 1 utilizes stroboscopic illumination to realize the basic principle schematic of dynamic characteristic test;
Fig. 2 is based on the MEMS dynamic checkout unit system chart of micro-interference technology;
The interference image of Fig. 3 nanoscale triangle step;
Fig. 4 comprises the phase diagram of nanoscale triangle step three-dimensional appearance feature;
The partial 3 d image of the surface topography reconstruct of Fig. 5 nanoscale triangle step;
The partial 3 d shape appearance figure of Fig. 6 degree of tilt correction Vee formation shape step;
The synoptic diagram of Fig. 7 for realizing that inferior pixel precision diabolo step edge carries out curve fitting;
Fig. 8 MEMS resonator is at the interference image of 30 ° of following zero phase-shifts of motion phase;
Fig. 9 MEMS resonator is at the interference image of 30 ° of following λ of motion phase/8 phase shifts;
Figure 10 MEMS resonator is at the interference image of 120 ° of following zero phase-shifts of motion phase;
Figure 11 MEMS resonator is in the movement profiles of vertical direction;
LED array of figure in Figure 12 stroboscopic light source.
Embodiment
Embodiment 1:
Present embodiment mainly focuses under the continuous illumination condition, utilizes phase shift micro-interference technology to realize the test of geometric sense parameters such as MEMS structure three-dimensional physical dimension and morpheme error.
Measure with control computer by the GPIB control card, the control AWG (Arbitrary Waveform Generator) is exported a direct current voltage drive signals, makes stroboscopic illumination device be operated under the continuous illumination state, the MEMS structure is placed on the three-dimensional fine motion test board under the optical microscope.
Utilize the object distance of phase shift controller control Mirau interferometer, the spacing of adjusting is λ/8, λ is for interfering the wavelength of light source, equidistantly adjust 4 times, comprise initial point, can obtain equally spaced 5 phase shifts successively, be respectively 0, pi/2, π, 3 pi/2s, 2 π, utilize the computer control image pick-up card to gather the interference image of the MEMS device that ccd video camera obtains, totally 5 width of cloth images in each phase shift difference.Be illustrated in figure 3 as the micro-interference image of nanometer triangle step under 0 phase shift, other 4 width of cloth interference image is similar substantially to Fig. 3, and just interference fringe has certain dislocation.Utilize 5 step Hariharan phase shift algorithm that 5 width of cloth interference images are carried out phase extraction, obtain the phase diagram that comprises nanometer triangle step three-dimensional appearance as shown in Figure 4.In 5 step Hariharan phase shift algorithm, the formula that calculates the phase place employing is: =arctan[(2I 1-2I 3)/(-I 0+ 2I 2-I 4)], I 0To I 4Be respectively the light intensity of correspondence position in 5 width of cloth interference images.
Utilization is based on the least square phase-unwrapping algorithm of fast discrete cosine transform, do not launch the least square solution of the difference of phase difference value between the neighbor pixel that searching has launched between phase difference value and this neighbor pixel, obtain MEMS device stationary state lower surface pattern, reconstruct obtains the three-dimensional picture of nanometer triangle step, as shown in Figure 5.Because the inclination of worktable and measurand is inevitable, as ise apparent from FIG. 5, for the variation of true reflection surface topography, utilization tilt correction algorithm, Fig. 5 is carried out tilt correction handle, Figure 6 shows that the part figure of the revised nanometer triangle of degree of tilt step three-dimensional appearance.
The tilt correction algorithm has two kinds of implementations: (1) is under default situation, entire image is analyzed, calculate the slope of each row in the image earlier, calculate the slope of each row then, finally calculate the least square plane of whole visual field surface topography, carry out the correction of view data according to the slope on this plane; (2) on image, select specific zone artificially, at the surface topography of this selection area the slope that calculates least square plane with the method identical with (1), and carry out corresponding data correction, this will help to set up corresponding measuring basis face, realize that the normalization of three-dimensional geometry amount is measured.Fig. 6 is for to carry out the degree of tilt correction result to entire image, and the calibrated altitude of triangle nanometer step is 44nm, and measurement result is 43.56nm.
In order to realize the normalization of MEMS construction geometry measurement amount, have following characteristics in concrete the enforcement: the evaluation of the depth of parallelism on (1) two surface comes from the depth of parallelism of the least square plane on two surfaces, the upper and lower surface of nanometer step as shown in Figure 6; (2) verticality of sidewall is estimated by the angle of the least square plane of bottom surface and sidewall, the side of the nanometer step lower surface as shown in Figure 6 and the surface transition that makes progress; (3) obtain the cross section of 3-D view line by line, as shown in Figure 7, utilize the cubic curve fitting technique to obtain the marginal point of inferior pixel precision, connect the marginal point in each cross section, determine the outline line of surface plane structure at outline line on the respective cross section; (4) all be on the basis of the outline line of the resulting inferior pixel precision of step (3), to carry out to the evaluation of MEMS structural plan geometric sense parameter, promptly calculate the envelope center line of outline line, and with its datum line as geometric sense parameters such as evaluation planar dimension, the depth of parallelism, verticality.
Embodiment 2:
Present embodiment mainly focuses under the stroboscopic illumination condition, and comprehensive utilization phase shift micro-interference technology, image space domain analysis reach based on the measurement relative reference coordinate system of surface profile feature and set up, and realize the measurement of MEMS structure three-dimensional kinetic characteristic.
The excitation of MEMS structure motion drives relevant parameters and start-up period sinusoidal drive signals is set, frequency is 10kHz, and bias voltage is 20V, and peak-to-peak value is 160V, drive the MEMS resonator and produce the periodic planes motion, produce certain coupled motions simultaneously in vertical direction.
Utilize phase shift controller control Mirau interferometer to be in initial object distance state, the stroboscopic illumination control signal of output and motion-activated signal Synchronization when initial, the rising edge that is stroboscopic pulse is on 0 ° of phase place of sinusoidal drive signals, the pulse width of stroboscopic signal is 1.5 μ s, carry out 1 stroboscopic exposure on each 0 ° of phase place of 1500 periods of motion, stroboscopic illumination finishes the interference image in back this stage of computer acquisition; Adjust phase shift controller then, make the object distance of interferometer with one step of change of stride of λ/8, promptly produce the fixing phase shift of pi/2, continue the stroboscopic illumination control signal of output and motion-activated signal Synchronization, 1500 stroboscopic illuminations finish the interference image in back this stage of computer acquisition; The object distance of interferometer is adjusted in continuation with step pitches such as λ/8 ground, and export the stroboscopic signal synchronously, number of times is 3 times, obtain a width of cloth interference image at every turn, the interference image that comprised for 2 steps, obtain 5 width of cloth interference images altogether, 5 width of cloth interference images are carried out the phase extraction and the least square phase unwrapping of 5 step Hariharan phase shift algorithm, can obtain MEMS structure motion three-dimensional plot of surface topography when (0 °) under initial phase.Utilize phase shift controller control Mirau interferometer to come back to initial object distance state at last.
Increase the phase retardations of stroboscopic illumination control signal and motion-activated signal with 30 ° of certain increments, and the phase shift that repeats above-described interferometer after the phase retardation adjustment of two signals each time controls, and obtain 5 width of cloth interference images of each phase shift.Fig. 8 is the interference image of MEMS resonator (0 °) zero phase-shift under same motion phase, Fig. 9 is the interference image of MEMS resonator (0 °) λ/8 phase shifts under same motion phase, can find out that the position of interference fringe that the variation (adjustment object distance) because of phase shift causes changes, and not have plane motion.The 3-D view of the surface topography after handling through 5 step Hariharan phase extraction with based on the least square phase unwrapping of fast discrete cosine transform.After the phase differential of stroboscopic illumination control signal and motion-activated signal reaches one-period, MEMS the structure motion 3-D view of surface topography, totally 12 width of cloth when (0-360 °) under out of phase have just been obtained.Figure 11 is 1 a cycle vertical movement situation on the MEMS resonator.
The phase delay increment of stroboscopic illumination control signal and motion-activated signal can be equally spaced, and as above-mentioned situation, also can right and wrong equally spaced, its size also can be adjusted flexibly.The phase delay increment is more little, will can obtain the 3-D view of the surface topography of MEMS structure in one-period under more motion phase.If the phase delay increment is set at 10 °, will equidistantly gather 36 width of cloth images to a period of motion, more can reflect the dynamic perfromance of MEMS.
To the equivalent plane picture of the three-dimensional image sequence of MEMS body structure surface pattern for gray-scale value reflection elevation information, compare the relative position of plane characteristic in each width of cloth image by phase place is relevant with the quadric surface match, can obtain the plane motion situation of structure; In addition, edge feature according to the plane of being extracted, can set up relative measurement coordinate system, obtain selected measurement point residing relative position in every width of cloth image, the elevation information of measurement point institute each relative position pixel of correspondence in the three-dimensional image sequence relatively, obtain structure from face (vertical direction) moving displacement.
Following formula is the fundamental formular of phase place related operation.
F 1 ( ξ , η ) · F 2 * ( ξ , η ) | F 1 ( ξ , η ) · F 2 * ( ξ , η ) | e j 2 π ( ξ x 0 + η y 0 ) . . . ( 1 )
Wherein, F 1And F 2Be respectively the result of the Fourier transform of two width of cloth images (image that the different motion phase place is gathered).By the theory of (1) formula and Fourier transform as can be known, this phase spectrum has comprised the position translation information of two width of cloth images, and it is that a spectrum amplitude is 1 power spectrum in full frequency-domain.(1) formula is carried out inverse Fourier transform as can be known, and the phase place related function is one and is positioned at two figure offsets (x0, the δ impulse function of y0) locating also is referred to as relevant peaks.Complete when similar when two width of cloth images, its value is 1, otherwise is 0.Therefore, utilize the phase place related operation result of two width of cloth images to determine the shift offset of image in the present invention, determine moving situation with this.
The present invention adopts the quadric surface match to carry out the analysis of inferior pixel.The thought of surface fitting method is: with the optimal match point on the pixel level is the center, carries out surface fitting by similarity measurement, calculates the exact position of extreme point then by corresponding mathematical method.The present invention adopts the relevant related coefficient of phase place as the similarity measurement feature, selects quadric surface as fitting function, adopts multivariate least square regression method to determine the exact position of extreme point in calculating.
The quadric surface fitting function adopts formula to be:
PC(x,y)=ax 2+by 2+cxy+dx+ey+f
Wherein, (x is corresponding to position (x, phase place correlation y) y) to PC.Above-mentioned function can be write as following form:
AX=B
In the formula,
A = x 0 2 y 0 2 x 0 y 0 x 0 y 0 1 x 1 2 y 1 2 x 1 y 1 x 1 y 1 1 . . . . . . . . . . . . . . . . . . x 8 2 y 8 2 x 8 y 8 x 8 y 8 1 X = a b c d e f B = P C 0 P C 1 . . . P C 8
The present invention adopts multivariate least square regression method in The Fitting Calculation, make calculating simple, accurate.In computation process, as regression coefficient, and the value of hypothesis stochastic variable B depends on the independent variable in the matrix A with vectorial X, regression coefficient ask for the coefficient that is fitting function.After trying to achieve the coefficient of fitting function, can utilize following formula to try to achieve the exact position of the image shift of inferior pixel precision.
x = 2 db - ce c 2 - 4 ab y = 2 ae - dc c 2 - 4 ab
Under above situation, come the surface measurements pattern mutually by measuring position that measured surface causes.Because the periodicity of light wave vibration, the interference term of being modulated mutually by the position in the interference light intensity is the periodic function of measured position phase, therefore can only obtain the mould that measured position is relevant to π in the ordinary course of things, the measurement range of measured position phase is limited in the π scope, the phase shift interference method can be with one times of phase measurement expanded range, correspondingly surface topography depth survey scope has also enlarged one times, but the depth survey scope remains quite narrow.If surface topography is a continually varying, handle by phase unwrapping so, still can access several microns depth survey scope, this with interferometer in the coherent length of light source be relevant, if but in height there is sudden change in surface topography, the 3-D view of whole visual field can not correctly parse, and so just can not obtain the surface topography of whole visual field.Sudden change on height reaches one regularly, can not observe the existence of interference fringe simultaneously in the sudden change zone, and interference fringe just can not be observed in bottom surface as shown in Figure 8, and this zone will make that phase extraction and deployment algorithm can not correct execution.Therefore can carry out Edge Gradient Feature to interference image according to the edge that interference fringe occurred, the edge is comprised, and the zone of not having interference fringe is as pattern sudden change zone, and gray-scale value that should each pixel of zone to compose be 0, this zone does not participate in phase extraction and unfolding calculation, promptly realize the isolation in pattern sudden change zone, can obtain three-dimensional surface shape so except the zone that highly suddenlys change.When the region surface three-dimensional appearance of institute's reconstruct can carry out the profile extraction of plane of movement structure, just can access the three-dimensional motion characteristic of MEMS structure fully by above step.Yet, when the region surface three-dimensional appearance of institute's reconstruct is not enough to carry out the profile extraction of plane of movement structure, as shown in Figure 8, because the bottom surface does not have interference fringe, just can not obtain the height of the relative bottom surface of moving component in the resonator, three-dimensional image sequence can not obtain the xsect of the relative bottom surface of moving component, promptly can not extract the outline line of plane motion structure.Even so, can be directly in the distribution situation of entire image the feature extraction of highly sudden change be gone out corresponding surface profile line from interference fringe.Be the interference image of MEMS resonator as shown in figure 10 in 120 ° of following zero phase-shifts of motion phase, compare with Fig. 9 with Fig. 8, can tell the existence of plane motion from the variation of spacing shown in Figure 10, but because the difference in height of intermediate structure opposite edges is bigger, therefore can only directly carry out the edge extracting of structure earlier to interference image, detect the shift position at edge then by the interference image that compares other motion phase, this moment, the error of edge calculations was bigger owing to the existence of interference fringe.In this case, the surface profile line that directly extracts from interference fringe can be used for setting up the measurement relative coordinate system equally, as two represented among Figure 10 outline lines, obtain selected measurement point residing relative position in every width of cloth image, in the more local reconstruction of three-dimensional images sequence measurement point the elevation information of corresponding each relative position pixel, obtain structure from face (vertical direction) moving displacement.
Explained later is utilized the face profile feature to set up and is measured relative coordinate system, realize the tracking of selected measurement point, finally finishes off-plane movement and measures.When the movement in vertical direction measurement is carried out in the variation of foundation three-dimensional image sequence height, even tested structure has only the motion of vertical direction when design, but owing to intercoupling of x, y, three coordinate directions motions of z, under the actual conditions by the measurement point of geodesic structure when the movement in vertical direction, more or less all on the xy plane, have certain coupled motions.And in most of the cases, generally all there is motion by a relatively large margin by geodesic structure at x, y, three coordinate directions of z, as Fig. 8, Fig. 9 with shown in Figure 10ly reached several microns by the motion amplitude of geodesic structure on the xy plane exactly, there are the coupled motions of tens nanometers in the z direction.Under above situation, if do not consider the existence of plane motion, so the movement in vertical direction measurement be on the 3-D view with the gray-scale value of image border stationkeeping point, because image border stationkeeping point can not correspond to actual spot of measurement, so just can not correctly obtain the real motion characteristic of selected measurement point in vertical direction.
In order to address this problem, the present invention is in front in the horizontal edge feature extraction of described three-dimensional image sequence and the interference image on the isolation result's in pattern sudden change zone the basis, set up the reference frame that measurement point is followed the tracks of according to the edge that is extracted, measurement point to initial selected calculates the relative position that constitutes reference frame with the edge earlier, then when the spatial domain that three-dimensional image sequence is in vertical motion characteristic is extracted, estimating point all is to select and the fixing measurement point of the relative position of reference frame, has so just guaranteed the tracking of measurement point.
Embodiment 3:
Because the coherent length of light that LED sends is little, in order to enlarge measurement range, improve the accommodation of measuring, the present invention's proposition can finish the interferometry of multi-wavelength and white light based on the MEMS dynamic checkout unit of micro-interference technology.
In order to realize the above target, in device, comprise two parts: drive signal change-over switch and LED array.Under the support of above hardware components, the luminance of the LED of various wavelength (comprising white light LEDs) can be controlled flexibly by the drive signal change-over switch, and there is not mechanical displacement means in the Lights section when switching, guarantee the position consistency of light source switching repeatedly, realized higher measuring repeatability.In led array shown in Figure 12, each three of red, green, yellow and white LED, arrange by certain position and to guarantee the homogeneity of optical microscope visual field intraoral illumination, can be respectively the LED of different colours be lighted by the drive signal change-over switch, realize the interference and the white light interference of multi-wavelength.
In order further to improve the homogeneity of the illumination of optical microscope visual field, the light that each LED sent has all carried out collimation separately in entering illumination path handles.The light that LED sent is what disperse, considers specifically arranging of the less and array of the size of LED, all adopts simple separately collimation to handle to each LED, promptly adopts spherical reflector, and the luminous point of LED is adjusted to the central point of sphere.

Claims (4)

1, a kind of proving installation of the MEMS (micro electro mechanical system) based on the micro-interference technology, this device comprises by three-dimensional fine motion test board, optical microscope, Mirau interferometer, phase shift controller, stroboscopic illumination drive unit, drive signal change-over switch, led array, MEMS structure motion excitation drive unit, ccd video camera, image pick-up card, data processing and control computer and forming, it is characterized in that: light source is a multi wave length illuminating source, employing comprises the array of being made up of white, red, yellow, green light emitting diode, and each sub-light source is equipped with independently collimating apparatus; Micro-interference is measured to adopt and is divided light path Mirau interference microscope and integrated with phase shift controller.
2, by the proving installation of the described MEMS (micro electro mechanical system) based on the micro-interference technology of claim 1, it is characterized in that: light emitting diode matrix is evenly arranged according to the cross one another mode of equilateral triangle.
3, by the proving installation of the described MEMS (micro electro mechanical system) based on the micro-interference technology of claim 1, it is characterized in that: the micro-interference part, mainly form by Mirau interference microscope and phase shift controller.
4, adopt proving installation by the described MEMS (micro electro mechanical system) based on the micro-interference technology of claim 1, the method of testing, its process comprises the isolation in pattern sudden change zone in the collection, interference image of interference image under the synchro control of stroboscopic and drive signal, the phase shift control of interference microscope, the different phase shift, the tilt correction that the phase shift and the phase unwrapping of interference image under the different phase shifts calculated 3 d surface topography figure, 3 d surface topography figure, the normalized Analysis of 3 d surface topography figure, the tracking of measurement point, it is characterized in that:
When static MEMS structure is carried out geometric parameter measurement:
(1) lighting device is set to the continuous illumination mode, and the MEMS device is thrown light on; Tested MEMS device is fixed on three-dimensional fine motion test board;
(2) utilize standard P AL system ccd video camera, obtain MEMS by the interference image of geodesic structure stationary state; Adjust the output of phase shift controller, make that producing equally spaced 5 is the phase shift that step changes, at each phase shift step collection interference image at that time, totally 5 width of cloth interference images;
(3) according to the edge that interference fringe occurred interference image is carried out Edge Gradient Feature, the edge is comprised, and the zone of not having an interference fringe is as pattern sudden change zone, and gray-scale value that should each pixel of zone to compose be 0, to realize the isolation in pattern sudden change zone;
(4) utilize 5 step Hariharan phase shift algorithm that 5 width of cloth interference images that above-mentioned processing obtains are carried out analysis-by-synthesis, obtain reflecting 1 amplitude phase diagram of three-dimensional appearance; Utilize the least square phase-unwrapping algorithm to analyze this phase diagram, obtain comprising the 3-D view of surface topography information;
(5) three-dimensional appearance figure is carried out tilt correction, calculate their least square plane earlier with the artificial regional area of selecting in entire image or the image, and entire image is carried out tilt correction with the slope of this least square plane;
(6) 3-D view is carried out the normalization evaluation, realize geometric parameter measurement; The geometric parameter criterion is estimated in normalization: the depth of parallelism on two planes is the depth of parallelism of the least square plane on two surfaces; The verticality of facade is to estimate with the angle of the least square plane of its bottom surface and this facade; The outline line of planar structure is to utilize curve fitting technique to obtain the line of the marginal point of inferior pixel precision to each xsect; The envelope center line of outline line is a slotted line of estimating size, the depth of parallelism and the verticality of planar structure;
When motion MEMS structure is carried out the kinetic characteristic test:
(1) tested MEMS device is fixed on three-dimensional fine motion test board, and the excitation input end of motion structure in the MEMS device is linked to each other with the electrode pin of three-dimensional fine motion test board; Lighting device is set to the stroboscopic illumination mode, the MEMS device is carried out stroboscopic illumination, the cycle of stroboscopic signal is identical with the cycle of motion-activated signal, and the time delay that is maintained fixed, so the periodic motion of MEMS structure belongs to " freezing " state substantially under stroboscopic illumination;
(2) number of times of same phase place stroboscopic is set, make standard P AL system ccd video camera carry out multiexposure, multiple exposure, the integrating effect that exposes, obtain MEMS by the interference image of geodesic structure stationary state, adjust the output of phase shift controller, make that producing equally spaced 5 is the phase shift that step changes, at each phase shift step collection interference image at that time, totally 5 width of cloth interference images, isolation by pattern sudden change zone in the interference image, and carry out the calculating of 5 step Hariharan phase shift algorithm and least square phase-unwrapping algorithms, can obtain MEMS by geodesic structure under pairing fixed time of the above-mentioned period of motion, i.e. the 3-D view of the surface topography of periodic motion phase place;
(3) time delay of adjustment stroboscopic signal and motion-activated signal, promptly adjust the periodic motion phase place that institute " freezes ", repeating step (2) can obtain MEMS by the 3-D view of geodesic structure at the surface topography of different cycles motion phase; Time delay is corresponding with the quantity of the 3-D view of gathering in the period of motion, by continuous adjustment time delay, can obtain reflecting the three-dimensional image sequence of MEMS structure motion characteristic;
(4) by isolation result in conjunction with pattern sudden change zone in the interference image, the three-dimensional image sequence of different cycles motion phase lower surface pattern is carried out spatial domain analysis and evaluation, can obtain the three-dimensional periodic moving situation of MEMS structure under certain driving frequency; Its interpretational criteria is: when pattern sudden change zone does not influence the reconstruct of motion structure 3-D view in the image, 3-D view according to motion structure extracts structural plan feature contour line, determine the relative position of this outline line in entire image by images match, thereby obtain the plane motion displacement of structure, simultaneously set up the relative measurement coordinate system according to structural plan feature contour line, obtain selected measurement point residing relative position in every width of cloth image, the elevation information of measurement point institute each relative position pixel of correspondence in the three-dimensional image sequence relatively, obtain structure from face (vertical direction) moving displacement; When pattern sudden change zone in the image makes the motion structure 3-D view fully during reconstruct, isolation result according to pattern sudden change zone in the interference image extracts structural plan feature contour line, determine the relative position of this outline line in entire image by images match, thereby obtain the plane motion displacement of structure, simultaneously set up the relative measurement coordinate system according to structural plan feature contour line, obtain selected measurement point residing relative position in every width of cloth image, the elevation information of measurement point institute each relative position pixel of correspondence in the partial 3 d image sequence of institute's reconstruct relatively, obtain structure from face (vertical direction) moving displacement;
(5) adjust the frequency of drive signal with certain step pitch, make the MEMS structure move with different frequencies, repeating step (2) (3) and (4), can obtain the detailed features of the three-dimensional motion of structure under a series of driving frequencies, not only can obtain the resonance frequency and the quality factor of structure by analysis-by-synthesis, also can obtain the three-dimensional motion state overall process of structure.
CNB2003101071311A 2003-11-28 2003-11-28 Micro-electromechanical system testing device and method based on micro-interference technique Expired - Fee Related CN1303396C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2003101071311A CN1303396C (en) 2003-11-28 2003-11-28 Micro-electromechanical system testing device and method based on micro-interference technique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2003101071311A CN1303396C (en) 2003-11-28 2003-11-28 Micro-electromechanical system testing device and method based on micro-interference technique

Publications (2)

Publication Number Publication Date
CN1546943A true CN1546943A (en) 2004-11-17
CN1303396C CN1303396C (en) 2007-03-07

Family

ID=34334336

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2003101071311A Expired - Fee Related CN1303396C (en) 2003-11-28 2003-11-28 Micro-electromechanical system testing device and method based on micro-interference technique

Country Status (1)

Country Link
CN (1) CN1303396C (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1312459C (en) * 2005-06-16 2007-04-25 华中科技大学 Device of measuring dynamic characteristics of micro electromechanical system possessing environment-loading function
CN100363710C (en) * 2005-04-15 2008-01-23 天津大学 Micro-structural 3D information obtaining method based on phase shifting interference image sequence analysis
CN100432620C (en) * 2005-06-16 2008-11-12 富士能株式会社 Interferometric apparatus for measuring moving object and optical interferometry method for measuring moving object
CN102879729A (en) * 2012-09-25 2013-01-16 江苏物联网研究发展中心 Built-in self-test system aiming at micro-electro-mechanical integrated system
TWI447351B (en) * 2009-02-24 2014-08-01 Univ Nat Taipei Technology Orthogonal-polarization mirau interferometry and beam-splitting module and interferometric system using the same
RU2526134C2 (en) * 2012-10-26 2014-08-20 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет радиотехники, электроники и автоматики" (МГТУ МИРЭА) METHOD OF in vitro ESTIMATING INDIVIDUAL REACTION OF PATIENT'S ORGANISM TO ACTION OF PHARMACOLOGICAL PREPARATION
RU2543336C2 (en) * 2012-12-24 2015-02-27 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет радиотехники, электроники и автоматики" Method for prediction of patient's immune response to environmental exposure
CN104534979A (en) * 2014-12-10 2015-04-22 佛山市南海区欧谱曼迪科技有限责任公司 Multi-wavelength phase shift microscopy imaging system and method
CN104914106A (en) * 2014-03-11 2015-09-16 由田新技股份有限公司 Defect detection method and defect detection device
CN105203033A (en) * 2015-10-08 2015-12-30 重庆平伟实业股份有限公司 Method for measuring in-plane displacement of MEMS
CN105320152A (en) * 2014-07-09 2016-02-10 日本株式会社日立高新技术科学 Three-dimensional fine movement device
CN106855395A (en) * 2015-12-08 2017-06-16 中国航空工业第六八研究所 A kind of optical detection evaluation method of silicon chip anode linkage technique deformation
CN107462173A (en) * 2017-09-25 2017-12-12 山东大学 Micromotion platform displacement measurement method and system based on micro-vision
CN108168932A (en) * 2017-12-15 2018-06-15 江苏鲁汶仪器有限公司 Pinpoint slice systems and method
CN114111638A (en) * 2021-09-07 2022-03-01 领先光学技术(江苏)有限公司 Curved surface detection method based on phase deflection

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102679907B (en) * 2012-06-01 2015-04-22 哈尔滨工业大学深圳研究生院 High-precision differential interference measuring system and method based on LED light source

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2412212Y (en) * 2000-03-09 2000-12-27 西安交通大学 Micro-mechanical mechanics performance tester
US6449048B1 (en) * 2000-05-11 2002-09-10 Veeco Instruments, Inc. Lateral-scanning interferometer with tilted optical axis
US6762844B2 (en) * 2001-08-24 2004-07-13 Ut-Battelle, Llc Optical microscope using an interferometric source of two-color, two-beam entangled photons

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100363710C (en) * 2005-04-15 2008-01-23 天津大学 Micro-structural 3D information obtaining method based on phase shifting interference image sequence analysis
CN100432620C (en) * 2005-06-16 2008-11-12 富士能株式会社 Interferometric apparatus for measuring moving object and optical interferometry method for measuring moving object
CN1312459C (en) * 2005-06-16 2007-04-25 华中科技大学 Device of measuring dynamic characteristics of micro electromechanical system possessing environment-loading function
TWI447351B (en) * 2009-02-24 2014-08-01 Univ Nat Taipei Technology Orthogonal-polarization mirau interferometry and beam-splitting module and interferometric system using the same
CN102879729A (en) * 2012-09-25 2013-01-16 江苏物联网研究发展中心 Built-in self-test system aiming at micro-electro-mechanical integrated system
CN102879729B (en) * 2012-09-25 2014-09-24 江苏物联网研究发展中心 Built-in self-test system aiming at micro-electro-mechanical integrated system
RU2526134C2 (en) * 2012-10-26 2014-08-20 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет радиотехники, электроники и автоматики" (МГТУ МИРЭА) METHOD OF in vitro ESTIMATING INDIVIDUAL REACTION OF PATIENT'S ORGANISM TO ACTION OF PHARMACOLOGICAL PREPARATION
RU2543336C2 (en) * 2012-12-24 2015-02-27 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет радиотехники, электроники и автоматики" Method for prediction of patient's immune response to environmental exposure
CN104914106A (en) * 2014-03-11 2015-09-16 由田新技股份有限公司 Defect detection method and defect detection device
CN105320152A (en) * 2014-07-09 2016-02-10 日本株式会社日立高新技术科学 Three-dimensional fine movement device
CN104534979A (en) * 2014-12-10 2015-04-22 佛山市南海区欧谱曼迪科技有限责任公司 Multi-wavelength phase shift microscopy imaging system and method
CN105203033A (en) * 2015-10-08 2015-12-30 重庆平伟实业股份有限公司 Method for measuring in-plane displacement of MEMS
CN105203033B (en) * 2015-10-08 2017-11-10 重庆平伟实业股份有限公司 MEMS in-plane displacement measurement methods
CN106855395A (en) * 2015-12-08 2017-06-16 中国航空工业第六八研究所 A kind of optical detection evaluation method of silicon chip anode linkage technique deformation
CN107462173A (en) * 2017-09-25 2017-12-12 山东大学 Micromotion platform displacement measurement method and system based on micro-vision
CN107462173B (en) * 2017-09-25 2019-07-05 山东大学 Micromotion platform displacement measurement method and system based on micro-vision
CN108168932A (en) * 2017-12-15 2018-06-15 江苏鲁汶仪器有限公司 Pinpoint slice systems and method
CN114111638A (en) * 2021-09-07 2022-03-01 领先光学技术(江苏)有限公司 Curved surface detection method based on phase deflection
CN114111638B (en) * 2021-09-07 2024-02-20 领先光学技术(江苏)有限公司 Curved surface detection method based on phase deflection

Also Published As

Publication number Publication date
CN1303396C (en) 2007-03-07

Similar Documents

Publication Publication Date Title
CN1303396C (en) Micro-electromechanical system testing device and method based on micro-interference technique
CN109596065B (en) High-precision micro-nano three-dimensional measurement method based on time domain phase shift algorithm
CN103477209B (en) For the system and method for phase control of throwing light in fluorescent microscope
CN105814402B (en) The super-resolution micro imaging method and system of continuously adjustable Structured Illumination
CN104583713B (en) The method that the body surface of preferably structuring is imaged and the device for imaging
CN1673666A (en) Micro-structural 3D information obtaining method based on phase shifting interference image sequence analysis
CN109269438B (en) Structured light illumination microscopic measurement method for detecting multilayer complex micro-nano structure
CN106643550B (en) Three-dimensional shape measuring device and method based on digital holographic scanning
CN103782129B (en) Utilize 3 d shape measuring apparatus and the method for projection grating amplitude
JP2007534019A (en) Dual-use (confocal interference) type optical side meter
CN109916331B (en) Three-dimensional detection method for structured light micro-nano structure based on composite grating
CN110715616A (en) Structured light micro-nano three-dimensional morphology measurement method based on focusing evaluation algorithm
CN102735380A (en) Multi-function electronic speckle interferometer
CN106940389B (en) The white light interference atomic force probe caliberating device and scaling method that a kind of super-resolution can trace to the source
CN103292690A (en) Synthetic aperture microscopy method and device on basis of light field selection
CN1285882C (en) System and method for testing three-dimensional motion of microstructure by image matching and phase shift interference
CN204255304U (en) A kind of three-dimensional surface profile measurement mechanism
CN105509635A (en) White light interferometer suitable for measurement of large-range surface appearance
CN108917643A (en) Three dimensional shape measurement system and method based on the scanning ranging of double light combs
CN109341571A (en) A kind of dual wavelength synchronizes the surface figure measuring device and method of interference
CN104390604A (en) Material fracture surface microscopic three-dimensional topography interference detection device and detection and data processing method thereof
CN206832200U (en) A kind of wide range three-dimensional surface profile measurement apparatus
CN111256618B (en) Double-differential structured light illumination microscopic measurement method for rapidly measuring three-dimensional morphology of surface of micro-nano structure
CN1260116C (en) Computer vision based test apparatus and method for micro electro-mechanical systems
CN1696604A (en) Device of measuring dynamic characteristics of micro electromechanical system possessing environment-loading function

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee