CN1542505A - Display assembly and assembling method thereof - Google Patents
Display assembly and assembling method thereof Download PDFInfo
- Publication number
- CN1542505A CN1542505A CNA2003101142355A CN200310114235A CN1542505A CN 1542505 A CN1542505 A CN 1542505A CN A2003101142355 A CNA2003101142355 A CN A2003101142355A CN 200310114235 A CN200310114235 A CN 200310114235A CN 1542505 A CN1542505 A CN 1542505A
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- glass substrate
- display assembly
- viewing area
- insulation course
- test cell
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Abstract
The display assembly includes one glass substrate, one tape carrier package (TCP) and one protective insulating layer. The glass substrate is provided with a display area, lines and wires connected to one test unit. During test, the display area is connected via lines and wires for the test unit to test on the display area. After test, the wires are blocked and the glass substrate is not connected to the test unit. Only after the blocking area is formed, the protective insulating layer is formed on the glass substrate to cover the blocking area, and TCP is connected electrically with the glass substrate. The present invention can prevent TCP from contacting residual metal in the blocking area and prevent short circuit, and this raises the quality of the display.
Description
(1) technical field
The relevant a kind of display assembly of the present invention, and particularly relevant a kind of display assembly with protection insulation course of the short circuit avoided.
(2) background technology
For general LCD (liquid crystal display, LCD) processing procedure, the mode of processing procedure is to be attached at thin film transistor (TFT) (Thin Film Transistor at Polarizer before general, TFT) just the TFT substrate is carried out functional test (function test) after the substrate, if must give up when the TFT substrate that test is finished has flaw, often also cause the Polarizer that has attached to give up, cause the waste of Polarizer.For waste and the saving manufacturing cost of avoiding raw material, after the TFT substrate carries out the cutting first time, and before attaching Polarizer, earlier the TFT substrate is carried out the pretest (pre-test) of 2G3D or 2G2D, to screen bad TFT substrate earlier.
Please be simultaneously with reference to Figure 1A and Figure 1B.Figure 1A is the part synoptic diagram of the tradition measurement circuit that is applied to a LCD assembly, and Figure 1B is along the sectional view of profile line 1B-1B ' direction among Figure 1A.In Figure 1B, display assembly 100 comprises the glass substrate 110 and coil type carrier package part (TapeCarrier Package, TCP) 120 of a TFT substrate.(IndiumTin Oxide, ITO) pin 111, and dispose many cablings 132 and many leads 131 for tool one viewing area 160, the oxidation of a plurality of indium tin on the glass substrate 110.Lead 131 is to electrically connect with a test cell 130, and viewing area 160 is to be connected with cabling 132 by ITO pin 111, cabling 132 is connected with lead 131 homeotropic alignments and part again, and electrically connect by lead 131 and test cell 160, make test cell 130 be able to viewing area 160 is tested.
In Figure 1B, coil type carrier package part 120 utilizes coil type carrier package part pin (TCP lead) 140 to be connected up and down with ITO pin 111 on the glass substrate 110, and its junction is to utilize an anisotropy conducting film (ACF) 150 to make electrical property descend conducting in vertical direction.TCP pin 140 comprises a soft substrate plate 121, a copper conductor patterned layer 122 and an insulation course 123.The material of soft substrate plate 121 for example is that (polyimide PI), has layer of copper wire pattern layer 122 to polyimide on soft substrate plate 121.Insulation course 123 for example is that (Solder Resist SR), is covered in the subregion on the copper conductor patterned layer 122 to an anti-welding barrier layer.
In Figure 1A, many leads 131 and many cablings 132 are only with three transversely arranged leads (shortingbar) 131a, 131b and 131c, and four cabling 132a, 132b, 132c and 132d that vertically arrange illustrate.Lead 131a, 131b and 131c electrically connect with an end of cabling 132 respectively. Lead 131a, 131b and 131c are the red time pixel (sub-pixel) of the delegation in the viewing area 160 that corresponds to respectively with glass substrate 110, the green time pixel of delegation and delegation's blue sub-pixels electric connection.On lead 131a, 131b and 131c, be coated with an insulation course (Passivation Layer, PL) 133, as shown in Figure 1B.
Each cabling 132 is the ITO pins 111 that are connected to respectively on the corresponding glass substrate 110, so each places pixel will be connected with its corresponding cabling 132 by a plurality of ITO pins 111 on the glass substrate 110 in the viewing area 160 of glass substrate 110.Vertically many cablings of arranging 132 electrically connect with three transversely arranged lead 131a, 131b and 131c respectively again, electrically connect by lead 131 and test cell 130 again, the viewing area 160 of 130 pairs of glass substrates 110 of test cell is tested, shown in Figure 1A.
After the end to be tested, utilize the direction of a laser beam (laser beam) with parallel wire 131, cut off electrically connecting the cabling 132 of glass substrate 110, make and form a blacked-out areas (laser cutting line) 139 between lead 131c and the ITO pin 111 with test cell 130.At this moment, glass substrate 110 interrupts with the electric connection of test cell 130.
Please refer to Fig. 1 C, Fig. 1 C is the synoptic diagram of A part when engaging among Figure 1B.According to above-mentioned conventional practice, glass substrate 110 and coil type carrier package part 120 needed to interrupt earlier the electric connection of glass substrate 110 and test cell 130 before engaging.Because cut is the high temperature of moment, in the process of cutting cabling 132b, cabling 132b can be melted and cut out a breach, reaching the purpose that makes glass substrate 110 and test cell 130 electrical isolation, and forms blacked-out areas 139.Yet in the process of laser high-temperature fusion, the cabling 132b that constitutes with metal material makes the metal material fusion of cabling 132b upwards cross blacked-out areas 139 because of high temperature, and overflowing is dissipated on the surface of insulation course 135, forms metallic residue 1329.Therefore, when TCP pin 140 engages with the ITO pin 111 of glass substrate 110, in blacked-out areas 139 places, the copper conductor patterned layer 122 of TCP coil type carrier package part pin 140 just can be dissipated to insulation course 135 lip-deep metallic residue 1329 and contact with overflowing, cause electrical short circuit, damage the quality of whole display assembly, its influence is real to should not be underestimated.
(3) summary of the invention
In view of this; purpose of the present invention is exactly that a kind of proving installation of avoiding short circuit is being provided; it forms a protection insulation course on this proving installation and the design that covers described blocking-up district; can avoid coil type carrier package part (Tape Carrier Package; TCP) with proving installation on the metal remained material directly contact, to reduce the phenomenon of electrical short circuit.
Propose a kind of display assembly according to an aspect of the present invention, comprise a glass substrate, a coil type carrier package part (TCP) and a protection insulation course.Have a viewing area, many cablings and many leads on the glass substrate, lead is to electrically connect with a test cell.TCP electrically connects with glass substrate.The protection insulation course, part is covered on the glass substrate.When the test phase of a glass substrate, the viewing area is to be connected with lead by cabling, so that test cell is tested the viewing area.Then, after test phase was finished, cabling was to form a blacked-out areas, in order to the electric connection of blocking-up glass substrate and test cell.After blacked-out areas forms, just form the protection insulation course on glass substrate and cover blacked-out areas.At last, after the protection insulation course formed, coil type carrier package part just electrically connected with glass substrate.
A kind of assemble method of display assembly is proposed according to a further aspect of the invention.Assemble method comprises: a glass substrate is provided, includes a viewing area, many cablings and many leads.Lead is to electrically connect with a test cell, is connected with lead by cabling, so that test cell is tested the viewing area.After to be tested the finishing, form a blacked-out areas, in order to the electric connection of blocking-up viewing area and lead in cabling.Afterwards, form a protection insulation course again on glass substrate, and cover blacked-out areas.At last, provide a coil type carrier package part (TCP), electrically connect with glass substrate.
For further specifying above-mentioned purpose of the present invention, design feature and effect, the present invention is described in detail below with reference to accompanying drawing.
(4) description of drawings
Figure 1A is the part synoptic diagram of a traditional LCD assembly.
Figure 1B is along the sectional view of profile line 1B-1B ' direction among Figure 1A.
Fig. 1 C is the synoptic diagram of A part when engaging among Figure 1B.
Fig. 2 is the sectional view according to a display module of preferred embodiment of the present invention.
(5) embodiment
Please refer to Fig. 2, it is the sectional view according to a display module of preferred embodiment of the present invention.In Fig. 2, display assembly 200 comprises a glass substrate 210, a coil type carrier package part (TCP) 220 and a protection insulation course 290.Display assembly 200 for example is a liquid crystal display assembly, and glass substrate 210 for example is the glass substrate of a TFT substrate.
Have a viewing area 260, a plurality of indium tin oxidation (Indium Tin Oxide on the glass substrate 210, ITO) pin 211, and dispose many leads (shorting bar), and for example be lead 231a, 231b and 231c and many cablings, in Fig. 2, only do explanation with cabling 232b.
On lead 231a, 231b and 231c, be coated with an insulation course (Passivation Layer, PL) 233.Cabling 232b position and is coated with an insulation course 235 on the cabling 232b on insulation course 233, also on insulation course 233.Lead 231a, 231b and 231c are and a test cell (not being shown among the figure) electrically connects, and with many cabling homeotropic alignments, and lead 131a, 131b and 131c are respectively via the end electric connection of a plurality of vias with the cabling of corresponding part.For example lead 231b and cabling 232b homeotropic alignment have a via 234b in the confluce.Lead 231b makes lead 231b and cabling 232b to electrically connect by the via 234b in the insulation course 233.
Therefore, when the test phase of glass substrate 210, viewing area 260 is to be connected with cabling 232b by ITO pin 211, cabling 232b is connected with lead 231b homeotropic alignment and part again, and electrically connect by lead 231b and test cell, make test cell be able to functional test is carried out in viewing area 260.
After the end to be tested, utilize the direction of a laser beam (laser beam) with parallel wire 231b, separate with the cabling 232b blocking-up of test cell electrically connecting glass substrate 210, making to form a blacked-out areas 239 between lead 231c and the ITO pin 211, for example is a cut zone (laser cuttingline).At this moment, glass substrate 210 interrupts with the electric connection of test cell.
After the test phase of glass substrate 210 is finished and formed in blocking-up district 239, just form protection insulation course 290 on glass substrate 210 and cover blocking-up and distinguish 239.Protection insulation course 290 is insulation glued membranes, and insulation can add non-conductive particle or sept (spacer) in the glued membrane, perhaps, the material of protection insulation course 290 for example be a non-conductive solid (Non-Conductive Adhesive, NCA).
When forming protection insulation course 290 with after covering blocking-up district 239; again coil type carrier package part 220 is utilized the hot pressing processing procedure with the coil type carrier package part pin (TCPlead) 240 of coil type carrier package part 220 and ITO pin about in the of 211 pressing be connected, and a coated anisotropy conducting film (ACF) 250 makes electrical property descend conducting in vertical direction in the junction.TCP pin 240 comprises a soft board 221, a copper conductor patterned layer 222 and an insulation course 223.The material of soft board 221 for example is that (polyimide PI), has layer of copper wire pattern layer 222 to form to polyimide on it.Insulation course 223 for example is that (solder resist SR), joins the subregion that invests on the copper conductor patterned layer 222 to an anti-welding barrier layer.When TCP pin 240 utilizes hot pressing processing procedure and ITO pin about in the of 211 during pressing, protection insulation course 290 also is heated simultaneously, thus after protecting insulation course 290 hardenings by cooling just can with 220 applyings of coil type carrier package part.
For known in the process of hot pressing; the lead 232b of metal material is because of high-temperature fusion; near blocking-up district 239 and be arranged in formed metallic residue (not being shown in Fig. 2) on insulation course 235 surfaces; at this; because of protection insulation course 290 is covered in the blocking-up district 239; intercepted the virgin metal residue and contacted, just can effectively avoid the generation of electrical short circuit, reduced the possibility of infringement display quality with the direct of copper conductor patterned layer 222 of coil type carrier package part 220.
The display assembly that the above embodiment of the present invention disclosed not only increases output usefulness, also reduces the purchase and the use of tester table and saves cost.The most important thing is; coil type carrier package part (TCP) is coating insulation course (SR) and the copper conductor patterned layer that exposes not; be subjected to the protection of protection insulation course of the present invention; can avoid the copper conductor patterned layer on the blacked-out areas that forms with cut, to be subjected to external foreign matter scratch; as dust, aqueous vapor etc., or produce the phenomenon of electrical short circuit (short) with the excessive dispersed metallic residue of fusion.
Though the present invention describes with reference to current specific embodiment, but those of ordinary skill in the art will be appreciated that, above embodiment is used for illustrating the present invention, under the situation that does not break away from spirit of the present invention, also can make the variation and the modification of various equivalences, therefore, as long as variation, the modification to the foregoing description all will drop in the scope of claims of the present invention in connotation scope of the present invention.
Claims (18)
1. display assembly comprises:
One glass substrate contains a viewing area, many cablings and many leads, and described lead is to electrically connect with a test cell;
One coil type carrier package part is to electrically connect with this glass substrate; And
One protection insulation course, part is covered on this glass substrate;
Wherein, when the test phase of this glass substrate, this viewing area is to be connected with described lead by described cabling, so that this test cell is tested this viewing area;
Wherein, after this test phase was finished, described cabling formed a blacked-out areas, in order to block the electric connection of this glass substrate and this test cell;
Wherein, after this blacked-out areas forms, just form this protection insulation course on this glass substrate and cover this blacked-out areas;
Wherein, after this protection insulation course formed, this coil type carrier package part just electrically connected with this glass substrate.
2. display assembly as claimed in claim 1, it is characterized in that this glass substrate also comprises a plurality of pins, this viewing area is to be connected with described cabling by described pin, described cabling is connected with described lead homeotropic alignment and part again, and electrically connect by described lead and this test cell, make this test cell be able to this viewing area is tested.
3. display assembly as claimed in claim 1 is characterized in that described pin is an indium tin oxidation pin.
4. display assembly as claimed in claim 1 is characterized in that this blacked-out areas is to form with a laser beam high-temperature machining.
5. display assembly as claimed in claim 1 is characterized in that this protection insulation course is an insulation glued membrane.
6. display assembly as claimed in claim 5 is characterized in that this insulation glued membrane comprises a non-conductive particle or a sept.
7. display assembly as claimed in claim 5, the material that it is characterized in that this protection insulation course are non-conductive solids.
8. display assembly as claimed in claim 1 it is characterized in that this display assembly is a liquid crystal display assembly, and wherein this glass substrate is a display panels.
9. the assemble method of a display assembly comprises:
One glass substrate is provided, contains a viewing area, many cablings and many leads, described lead is to electrically connect with a test cell;
This viewing area is to be connected with described lead by described cabling, so that this test cell is tested this viewing area;
After test is finished, form a blacked-out areas in described cabling, in order to block the electric connection of this viewing area and described lead;
Form a protection insulation course on this glass substrate, and cover this blacked-out areas; And
One coil type carrier package part is provided, electrically connects with this glass substrate.
10. assemble method as claimed in claim 9, it is characterized in that this glass substrate also comprises a plurality of pins, this viewing area is to be connected with described cabling by described pin, described cabling is connected with described lead homeotropic alignment and part again, and electrically connect by described lead and this test cell, make this test cell be able to this viewing area is tested.
11. assemble method as claimed in claim 9 is characterized in that described pin is an indium tin oxidation pin.
12. assemble method as claimed in claim 9 is characterized in that this blacked-out areas is to form with a laser beam high-temperature machining.
13. assemble method as claimed in claim 9 is characterized in that this protection insulation course is an insulation glued membrane.
14. display assembly as claimed in claim 13 is characterized in that this insulation glued membrane is to comprise a non-conductive particle or a sept.
15. assemble method as claimed in claim 13, the material that it is characterized in that this protection insulation course are non-conductive solids.
16. assemble method as claimed in claim 9 is characterized in that step that this coil type carrier package part and this glass substrate electrically connect is one to comprise the hot pressing processing procedure of heating.
17. assemble method as claimed in claim 16 is characterized in that this protection insulation course fits with this coil type carrier package part in the heating after-hardening.
18. assemble method as claimed in claim 9 is characterized in that this display assembly, be a liquid crystal display assembly, and wherein this glass substrate is a display panels.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101142355A CN100346200C (en) | 2003-11-05 | 2003-11-05 | Display assembly and assembling method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101142355A CN100346200C (en) | 2003-11-05 | 2003-11-05 | Display assembly and assembling method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1542505A true CN1542505A (en) | 2004-11-03 |
| CN100346200C CN100346200C (en) | 2007-10-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101142355A Expired - Fee Related CN100346200C (en) | 2003-11-05 | 2003-11-05 | Display assembly and assembling method thereof |
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| CN (1) | CN100346200C (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100397160C (en) * | 2005-04-01 | 2008-06-25 | 杨勇 | Method for recovering poor product ni packaging technique of liquid crystal module with anisotropic conducting film |
| US7456507B2 (en) | 2006-01-12 | 2008-11-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Die seal structure for reducing stress induced during die saw process |
| CN1983458B (en) * | 2005-12-08 | 2010-08-11 | 三星电子株式会社 | Protecting cover used in display device and display device having the same |
| US7906836B2 (en) | 2008-11-14 | 2011-03-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Heat spreader structures in scribe lines |
| US7952167B2 (en) | 2007-04-27 | 2011-05-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Scribe line layout design |
| US8125052B2 (en) | 2007-05-14 | 2012-02-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Seal ring structure with improved cracking protection |
| US8334582B2 (en) | 2008-06-26 | 2012-12-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Protective seal ring for preventing die-saw induced stress |
| US8368180B2 (en) | 2009-02-18 | 2013-02-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Scribe line metal structure |
| US8624346B2 (en) | 2005-10-11 | 2014-01-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Exclusion zone for stress-sensitive circuit design |
| US8643147B2 (en) | 2007-11-01 | 2014-02-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Seal ring structure with improved cracking protection and reduced problems |
| CN104332122A (en) * | 2014-09-16 | 2015-02-04 | 友达光电股份有限公司 | Test unit structure of display panel and display panel |
| CN105655265A (en) * | 2014-10-31 | 2016-06-08 | 矽品精密工业股份有限公司 | Non-sticking detection test method and substrate used therefor |
| CN110335860A (en) * | 2019-04-25 | 2019-10-15 | 云谷（固安）科技有限公司 | The manufacturing method of display panel and display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5818562A (en) * | 1995-01-12 | 1998-10-06 | Goldstar Co., Ltd. | Liquid crystal display device |
| JP2000315059A (en) * | 1999-04-28 | 2000-11-14 | Nec Corp | Tcp-type semiconductor device and method for connecting the device with liquid crystal display |
| KR100324283B1 (en) * | 2000-02-23 | 2002-02-21 | 구본준, 론 위라하디락사 | Tape Carrier Package and Method of Fabricating the same |
| JP3678622B2 (en) * | 2000-03-17 | 2005-08-03 | 秋田日本電気株式会社 | Tape carrier package |
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2003
- 2003-11-05 CN CNB2003101142355A patent/CN100346200C/en not_active Expired - Fee Related
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100397160C (en) * | 2005-04-01 | 2008-06-25 | 杨勇 | Method for recovering poor product ni packaging technique of liquid crystal module with anisotropic conducting film |
| US8624346B2 (en) | 2005-10-11 | 2014-01-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Exclusion zone for stress-sensitive circuit design |
| US9691749B2 (en) | 2005-10-11 | 2017-06-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Exclusion zone for stress-sensitive circuit design |
| US8829653B2 (en) | 2005-10-11 | 2014-09-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Exclusion zone for stress-sensitive circuit design |
| CN1983458B (en) * | 2005-12-08 | 2010-08-11 | 三星电子株式会社 | Protecting cover used in display device and display device having the same |
| US7456507B2 (en) | 2006-01-12 | 2008-11-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Die seal structure for reducing stress induced during die saw process |
| US7952167B2 (en) | 2007-04-27 | 2011-05-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Scribe line layout design |
| US8125052B2 (en) | 2007-05-14 | 2012-02-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Seal ring structure with improved cracking protection |
| US8643147B2 (en) | 2007-11-01 | 2014-02-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Seal ring structure with improved cracking protection and reduced problems |
| US8334582B2 (en) | 2008-06-26 | 2012-12-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Protective seal ring for preventing die-saw induced stress |
| US8860208B2 (en) | 2008-11-14 | 2014-10-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Heat spreader structures in scribe lines |
| US7906836B2 (en) | 2008-11-14 | 2011-03-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Heat spreader structures in scribe lines |
| US8368180B2 (en) | 2009-02-18 | 2013-02-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Scribe line metal structure |
| CN104332122A (en) * | 2014-09-16 | 2015-02-04 | 友达光电股份有限公司 | Test unit structure of display panel and display panel |
| CN104332122B (en) * | 2014-09-16 | 2017-01-18 | 友达光电股份有限公司 | Test unit structure of display panel and display panel |
| CN105655265A (en) * | 2014-10-31 | 2016-06-08 | 矽品精密工业股份有限公司 | Non-sticking detection test method and substrate used therefor |
| CN110335860A (en) * | 2019-04-25 | 2019-10-15 | 云谷（固安）科技有限公司 | The manufacturing method of display panel and display panel |
| CN110335860B (en) * | 2019-04-25 | 2021-10-22 | 广州国显科技有限公司 | Display panel and method for manufacturing display panel |
Also Published As
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| CN100346200C (en) | 2007-10-31 |
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