CN1539901A - Combination of heat conducting materials softend at low temperature, preparation method and application - Google Patents
Combination of heat conducting materials softend at low temperature, preparation method and application Download PDFInfo
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- CN1539901A CN1539901A CNA03122072XA CN03122072A CN1539901A CN 1539901 A CN1539901 A CN 1539901A CN A03122072X A CNA03122072X A CN A03122072XA CN 03122072 A CN03122072 A CN 03122072A CN 1539901 A CN1539901 A CN 1539901A
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- heat
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Abstract
A heat-conducting composite rubber able to be softened at 38-65 deg.C is prepared through proportionally mixing liquid-state acrylonitrile rubber with vinyl polyacetate, and adding heat-conducting agent chosen from alumina, zinc oxide, aluminium nitride, etc. It can be made into film or heat-conducting sheet, or for filling it in seam of electronic package or heat radiator.
Description
Technical field
The present invention relates to a kind of low temperature softening heat-conducting glue material composition and method of making the same, the invention still further relates to its purposes between heating electronic package and scatterer as the joint filling thermally conductive interface that reduces thermal impedance, and the method that improves heat conduction efficiency.
Background technology
Known, help the thermally conductive material of heat radiation can be divided into following several types on the electronic package that is applied to generate heat:
The first kind is ceramic heat-conducting glue material, be with ceramic sheet as the heat conduction pad, based on sheets such as mica and graphite, heat-conducting cream must be smeared in the conducting strip two sides during use, to reduce interface impedance, shortcoming is easily broken unfavorable cutting.
Second class is the heat conduction pad, be with heat-conducting polymer material blade coating made heat conduction pad on glass cloth, glass cloth has advantages such as high-tensile and flexibility, cut easily and be difficult for fragmentation, shortcoming is that glass cloth thickness is greater than 0.05mm, the macromolecular material total thickness that adds blade coating can't so thermal impedance is higher, be applied on the low heat generating component at present less than 0.1mm.
The third is a heat-conducting cream, be to add ceramic powder, graphite or metal powder in the liquid macroimolecule, make liquid state or half heat-conducting cream of shape admittedly, the advantage of this class material is that thermal impedance is low, heat-transfer effect is good, pollute electronic package or circuit card when its shortcoming is use easily, and the possibility of mummification and volatilization small-molecule substance is arranged under hot environment.
The 4th kind is the low melting point metal conducting strip, be to utilize fusing point to be lower than the made thermally conductive material in two sides that 100 low melting point alloy is coated on tinsel, because the intensity of low melting point alloy and ductility is much smaller than the common metal material, attached to can moulding on the tinsel.The shortcoming of this material is that alloy melting postadhesion power diminishes, and exosmoses easily behind the pressurized, can cause performance to reduce, poor stability and can't reusing.
In order to solve above-mentioned many shortcomings, on industry, created a kind of technology of low temperature softening heat-conducting glue material, the patented technology document of low temperature softening heat-conducting glue material such as No. the 5950066th, United States Patent (USP) and No. 6197859 for example, but this two patent is earlier the alkene class of 16～19 alkyl to be synthesized low temperature softening glue material with the silane that 30～45 silylation and each silicon connect 1 hydrogen atom at least under platinum catalysis, and then add the softening agent of 15～20 weight parts, as increase flexibilities such as ethene acetate resin, a kind of low temperature softening heat-conducting glue material of being formed.This low temperature softening heat-conducting glue material need add softening agent technology again on layoutprocedure, not only complex process and time-consuming, moreover material is crossed conference because of solubility parameter difference and produced the phenomenon that is separated, so its suitability is not satisfactory.
Summary of the invention
The purpose of this invention is to provide a kind of low temperature softening heat-conducting glue material composition.
A kind of low temperature softening heat-conducting glue material composition comprises that mainly molecular weight is 300～10000 propylene liquid nitrile rubber (Liquid NBR), Vinyl Acetate Copolymer (EVA) and an amount of thermal conducting agent.
The molecular formula of wherein said propylene liquid nitrile rubber is: CH
3(CH
2CH=CH-CN)
nCH
2CH
2, n=13～50.
Wherein said thermal conducting agent can be aluminum oxide (Al
2O
3), made powder diameter scope such as zinc oxide (ZnO), aluminium nitride (AlN), boron nitride (BN), graphite (C), copper (Cu), aluminium (Al), silver (Ag), metal powder or nanoclay is at the powder thermal conducting agent of inferior micron or nanometer, its objective is and form the low temperature softening heat-conducting glue material that thermal conductivity is good and thermal impedance is low, make low temperature softening heat-conducting glue material can be applied to generate heat between electronic package and the scatterer as the joint filling thermally conductive interface usefulness that reduces thermal impedance, to improve heat conduction efficiency.
Wherein said low temperature softening heat-conducting glue material can add an amount of diluting solvent.
Wherein said diluting solvent can be acetone (Acetone), butylacetate (Butyl acetate), toluene (Methyl benzene) or butanone (Butanone).
Wherein said heat-conducting glue material composition can further add an amount of wax (Paraffin).
Another object of the present invention provides described low temperature softening heat-conducting glue material preparation method of composition, comprise that mainly the propylene liquid nitrile rubber with molecular weight 300～100000 mixes mutually with Vinyl Acetate Copolymer, make softening temperature and be 38～65 ℃ glue material, add an amount of thermal conducting agent again and make low temperature softening heat-conducting glue material.
The another purpose of invention provides described low temperature softening heat-conducting glue material composition joint filling thermally conductive interface as the reduction thermal impedance between heating electronic package and scatterer, to improve the application of heat conduction efficiency aspect, be after the thermoplastic of described low temperature softening heat-conducting glue material is become paste, directly blade coating or be sprayed on heating electronic package or the scatterer as heat conducting interface, and blade coating or coating thickness are controlled at 0.01～0.1mm; Or:
Described low temperature softening heat-conducting glue material is added diluting solvent, agitation and dilution becomes the solution of viscosity at 800～1000cps, directly blade coating is in the one side of separate-type paper, again it is dried, make solvent evaporates, treat low softening temperature heat-conducting glue material cooling after, cover another layer separate-type paper above it again, promptly can be made into the heat conducting interface finished product of low temperature softening heat-conducting glue material
The wherein said separate-type paper film that general stationery, polyethylene (Polyethlyene), polypropylene (Polyproplyene), polyvinyl chloride (Polyvinylchloride) and polyimide materials such as (Polyimide) are made of serving as reasons, be affixed on the emplastic, have the effect that prevents the mutual adhesion of emplastic, also can be referred to as to protect sticking paper.
The inventive method can be made the heat-conducting glue material of 38～65 ℃ of low temperature softening temperature, utilizes the temperature of heating electronic package can impel the heat-conducting glue material softening, and the joint filling that improves the heat-conducting glue material, to reduce the thermal impedance between heating electronic package and the scatterer.
Description of drawings
Fig. 1 makes the schematic flow sheet of heat conducting interface method for low temperature softening heat-conducting glue material of the present invention.
Embodiment
Low temperature softening heat-conducting glue material composition of the present invention is to be that 300～100000 propylene liquid nitrile rubber mixes with Vinyl Acetate Copolymer with molecular weight, makes the glue material of softening temperature between 38～65 ℃, adds an amount of thermal conducting agent again and makes.
This propylene liquid nitrile rubber molecular formula is: CH
3(CH
2CH=CH-CN-)
nCH
2CH
2, n=13-50.
This thermal conducting agent can be inferior micron or the powder thermal conducting agent of nanometer that aluminum oxide, zinc oxide, aluminium nitride, boron nitride, graphite, copper, aluminium, silver, metal powder or nanoclay etc. are made.
The low temperature softening heat-conducting glue material that obtains thus, fusing point are at 38～65 ℃, and fusing back viscosity is 1 * 10
2～1 * 10
5Between the cps, the film thickness that the powder thermal conducting agent of described time micron or nanometer can be coated with formation is between 0.01～5mm, and heat-conduction coefficient is between 0.5～5W/m-K, and thermal impedance is at 0.005～0.2 ℃ of m
2Between/the W.
As shown in Figure 1, low temperature softening heat-conducting glue material composition of the present invention is made the method for heat conducting interface, its step is as follows:
Step (1) is earlier inserted the propylene liquid nitrile rubber of 100 weight parts and the Vinyl Acetate Copolymer of 5～50 weight parts 100 ℃ and is stirred and accompany heating for dissolving in the groove, and stirred.
Step (2) in the glue material that heating is mixed and made into, adds the thermal conducting agent of 50～500 weight parts again, and leaves standstill the heat-conducting glue material of making low softening temperature after 30 minutes stir process.
Step (3) is in the diluting solvent with 80 milliliters of the 20 low softening temperature heat-conducting glue materials addings that restrain, heated and stirred is melted into the about 800-1000cps diluent of viscosity more than 30 minutes after, in order to implementing spraying or blade coating.
This diluting solvent can be acetone, butylacetate, toluene or butanone etc.
Step (4), can directly spray during use or blade coating on scatterer bottom or electronic heating component surface, gauge control is treated promptly to form low temperature softening heat conduction film behind the solution evaporation at 0.01～0.1mm.Also can be sprayed on wherein one side of separate-type paper, treat to stick another layer separate-type paper again behind the solution evaporation, form the heat conduction thin-film material.
Heat conduction film using method is that first wherein one side separate-type paper tears off, the side that will scribble low temperature softening heat-conducting glue material again is attached to scatterer bottom or electronic heating component surface, can utilize the heat conduction tackiness agent to change stickup is applied to generate heat between electronic package and the scatterer, and then make low temperature softening heat-conducting glue material as thermally conductive interface usefulness, to improve radiating efficiency.
Below make the heat conducting interface method, will enumerate following examples and make more specific description for illustrating further low temperature softening heat-conducting glue material.
Embodiment 1:
Low temperature softening heat-conducting glue material is made the preparation method of heat conducting interface
The propylene liquid nitrile rubber of 100 weight parts and the Vinyl Acetate Copolymer of 10 weight parts inserted 100 ℃ and stir and accompany heating for dissolving in the groove, and stirred (1), earlier.
(2), in the glue material that heating is mixed and made into, add the aluminum oxide and the 50 part by weight of zinc oxide thermal conducting agents of 300 weight parts again, and be heated to after 100 ℃ to stir and leave standstill the heat-conducting glue material of making low softening temperature at least after 30 minutes.
(3), the thermoplastic of low temperature softening heat-conducting glue material is become behind the paste with the direct blade coating of doctor knife coater on the metal aluminium alloy heat radiator of surface coarsening, and the blade coating gauge control is at 0.01～0.1mm.
(4), at last cooled low softening temperature heat-conducting glue material film is pasted separate-type paper again and avoided being stained with sticking, make the heat conducting interface finished product of low temperature softening heat-conducting glue material.
The heat conducting interface finished product of making low temperature softening heat-conducting glue material thus is applied to generate heat on the electronic package, and its test learns that its thermal impedance is 0.12 ℃ of m
2/ W; Therefore to make the thermal impedance of low temperature softening heat-conducting glue material extremely low in the present invention, joint filling is also good, through actual machine test can use central processing unit as the computing frequency in 2.4GHz, the power desktop PC below 70W, as the usefulness of the heat conductive caulking glue material between central processing unit and the scatterer.
Embodiment 2:
The propylene liquid nitrile rubber of 100 weight parts and the Vinyl Acetate Copolymer of 10 weight parts inserted 100 ℃ and stir and accompany heating for dissolving in the groove, and stirred (1), earlier.
(2), heating is mixed and made into aluminium nitride and the 50 part by weight of zinc oxide thermal conducting agents that the glue material adds 150 weight parts again, and stirred at least 30 minutes after being heated to 100 ℃, leave standstill the heat-conducting glue material of making low softening temperature.
(3), low softening temperature heat-conducting glue material thermoplastic is become the butylacetate and 50 parts by weight of toluene of directly adding 200 weight parts behind the paste, stir more than 30 minutes, and adopt spraying machine evenly to be sprayed on the metal aluminium alloy heat radiator of surface coarsening, and coating thickness is controlled at 0.01～0.1mm.
(4), at last cooled low softening temperature heat-conducting glue material film is pasted separate-type paper again, to avoid bonding, make the heat conducting interface finished product of low temperature softening heat-conducting glue material.
Make the heat conducting interface finished product of low temperature softening heat-conducting glue material thus, on the electronic package that is applied to generate heat, its test learns that its thermal impedance is 0.11 ℃ of m
2/ W, fusing point is at 57 ℃; Therefore to make the thermal impedance of low temperature softening heat-conducting glue material extremely low in the present invention, joint filling is also good, through actual machine test can use central processing unit as the computing frequency in 2.2GHz, the power desktop PC below 60W, as the usefulness of the heat conductive caulking glue material between central processing unit and the scatterer.
Embodiment 3:
Step (1)～(2) are with embodiment 2 steps (1)～(2).
(3), directly the butylacetate and 50 parts by weight of toluene of interpolation 200 weight parts stirred more than 30 minutes after the thermoplastic of softening temperature heat-conducting glue material became paste with hanging down, and employing blade coating mode, and evenly be coated on the one side of separate-type paper, again it is dried, make solvent evaporates.
The material of this separate-type paper can be general stationery, polyethylene, polypropylene, polyvinyl chloride and polyimide etc., and the blade coating gauge control is at 0.01～0.1mm.
(4), at last cooled low softening temperature heat-conducting glue material film is pasted separate-type paper again and avoided being stained with sticking, make the heat conduction finished film of low temperature softening heat-conducting glue material.
The heat conducting interface finished product of making low temperature softening heat-conducting glue material thus is applied to generate heat between electronic package and the scatterer, and its test learns that its thermal impedance is 0.11 ℃ of m
2/ W, fusing point is at 57 ℃; Therefore to make the thermal impedance of low temperature softening heat-conducting glue material extremely low in the present invention, joint filling is also good, through actual machine test can use central processing unit as the computing frequency in 2.2GHz, the power desktop PC below 60W, as the usefulness of the heat conductive caulking glue material between central processing unit and the scatterer.
In addition, the made heat conducting interface of low temperature softening heat-conducting glue material constituent of the present invention can further add an amount of wax, to increase heat conducting interface softening temperature person in composition.
Claims (10)
1, a kind of low temperature softening heat-conducting glue material composition comprises that mainly molecular weight is 300～10000 propylene liquid nitrile rubber, Vinyl Acetate Copolymer and an amount of thermal conducting agent.
2, low temperature softening heat-conducting glue material composition according to claim 1, the molecular formula of wherein said propylene liquid nitrile rubber is CH
3(CH
2CH=CH-CN)
nCH
2CH
2, n=13～50.
3, low temperature softening heat-conducting glue material composition according to claim 1, wherein said thermal conducting agent are with the powder thermal conducting agent of the made powder diameter scope of aluminum oxide, zinc oxide, aluminium nitride, boron nitride, graphite, copper, aluminium, silver, metal powder or nanoclay in inferior micron or nanometer.
4, low temperature softening heat-conducting glue material composition according to claim 1, wherein said low temperature softening heat-conducting glue material can add an amount of diluting solvent.
5, low temperature softening heat-conducting glue material composition according to claim 4, wherein said diluting solvent can be acetone, butylacetate, toluene or butanone.
6, low temperature softening heat-conducting glue material composition according to claim 1, wherein said heat-conducting glue material composition can further add an amount of wax.
7, a kind of low temperature softening heat-conducting glue material preparation of compositions method, comprise that mainly the propylene liquid nitrile rubber with molecular weight 300～10000 mixes with Vinyl Acetate Copolymer, make softening temperature at 38～65 ℃ glue material, and in described glue material, add an amount of thermal conducting agent and make low temperature softening heat-conducting glue material.
8, the joint filling thermally conductive interface of a kind of low temperature softening heat-conducting glue material composition conduct between heating electronic package and scatterer reduction thermal impedance, to improve the application of heat conduction efficiency aspect, be after low temperature softening heat-conducting glue material thermoplastic with one of claim 1-6 becomes paste, directly blade coating or be sprayed on heating electronic package or the scatterer as heat conducting interface, and blade coating or coating thickness are controlled at 0.01～0.1mm.
9, the joint filling thermally conductive interface of a kind of low temperature softening heat-conducting glue material composition conduct between heating electronic package and scatterer reduction thermal impedance, to improve the application of heat conduction efficiency aspect, the low temperature softening heat-conducting glue material of one of claim 1-6 is added diluting solvent, agitation and dilution becomes the solution of viscosity at 800～1000cps, directly blade coating is in the one side of separate-type paper, again it is dried, make solvent evaporates, after treating low softening temperature heat-conducting glue material cooling, cover another layer separate-type paper above it again, make the heat conducting interface finished product of low temperature softening heat-conducting glue material.
10, low temperature softening heat-conducting glue material preparation of compositions method according to claim 9, the wherein said separate-type paper film that materials such as general stationery, polyethylene, polypropylene, polyvinyl chloride or polyimide are made of serving as reasons.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA03122072XA CN1539901A (en) | 2003-04-24 | 2003-04-24 | Combination of heat conducting materials softend at low temperature, preparation method and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA03122072XA CN1539901A (en) | 2003-04-24 | 2003-04-24 | Combination of heat conducting materials softend at low temperature, preparation method and application |
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|---|---|
| CN1539901A true CN1539901A (en) | 2004-10-27 |
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|---|---|---|---|
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009055964A1 (en) * | 2007-10-31 | 2009-05-07 | Zhigang Zhao | A thermometer temperature sensing probe |
| CN100491490C (en) * | 2006-11-09 | 2009-05-27 | 上海大学 | Low-viscosity heat-conductive adhesive and process for preparing same |
| CN101358009B (en) * | 2008-09-25 | 2011-05-25 | 上海快鹿电线电缆有限公司 | Heat conductive anti static and non-halogen flame-retarding polymer composite insulating material for temperature sensitive detection cable |
| CN106273790A (en) * | 2016-08-12 | 2017-01-04 | 斯迪克新型材料（江苏）有限公司 | A kind of Copper Foil conduction, heat conduction, antidetonation, the preparation method of shielding tape |
| WO2017113084A1 (en) * | 2015-12-29 | 2017-07-06 | 江苏斯迪克新材料科技股份有限公司 | Modified ultra-thin adhesive tape with high heat conductivity based on synthetic graphite |
-
2003
- 2003-04-24 CN CNA03122072XA patent/CN1539901A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100491490C (en) * | 2006-11-09 | 2009-05-27 | 上海大学 | Low-viscosity heat-conductive adhesive and process for preparing same |
| WO2009055964A1 (en) * | 2007-10-31 | 2009-05-07 | Zhigang Zhao | A thermometer temperature sensing probe |
| CN101358009B (en) * | 2008-09-25 | 2011-05-25 | 上海快鹿电线电缆有限公司 | Heat conductive anti static and non-halogen flame-retarding polymer composite insulating material for temperature sensitive detection cable |
| WO2017113084A1 (en) * | 2015-12-29 | 2017-07-06 | 江苏斯迪克新材料科技股份有限公司 | Modified ultra-thin adhesive tape with high heat conductivity based on synthetic graphite |
| CN106273790A (en) * | 2016-08-12 | 2017-01-04 | 斯迪克新型材料（江苏）有限公司 | A kind of Copper Foil conduction, heat conduction, antidetonation, the preparation method of shielding tape |
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