TW589347B - Low temperature softening heat-conductive resin composition - Google Patents

Abstract

A kind of low temperature softening heat-conductive resin composition is obtained by blending a liquid NBR with molecular weight of 300-100000 and EVA to form a resin with a softening temperature of 38-65 DEG C, and adding an adequate amount of heat-conductive agent such as sub-micro or nano powder heat-conductive agents made from aluminum oxide, zinc oxide, aluminum nitride, boron nitride, graphite, metal powder or nano clay. A heat-conductive sheet, with film thickness of 0.01 to 5 mm, heat transfer coefficient of 0.5 to 5 W/m.K, and thermal impedance of 0.005 to 0.2 DEG C in<2>/W, has a softening temperature range between 38 and 65 DEG C, preferably at 45 DEG C, to prevent liquefaction during storage and transportation and can be applied on electronic elements and heat sinks for the use of filling heat transfer interface to reduce thermal impedance and thus enhance heat transfer efficiency.

Description

Case No. 92] 0R1fU

V. Description of the invention (1) [Technical field to which the invention belongs] The present invention provides a low-temperature softening conductive material for heating electronic components and heat sinks, which is a material composition, and further should be used for a thermally conductive interface to improve heat transfer efficiency: Caulking to reduce the thermal resistance value [Previous technology] According to the conventional application on the heating electronic components, the upper can be divided into the following types: The first type of thermal conductive material to help political heat is ceramic thermal conductive material, which is made of ceramics. Sheets such as mica and graphite are mainly used to reduce the interface resistance as a thermal pad. The disadvantage is that both sides of the sheet must be coated. The second type is thermal pads, which will not guide the ancients. The heat conductive gasket made of cloth, glass fiber cloth has: the total thickness of the polymer material added to the glass fiber is greater than γ. ·. 5_, the resistance value is higher, Η -Γ 田田 y # 政 1. Lmm, so the thermal resistance # 平 乂 同 目 刖 is applied to low-heat components. The second type is a thermal conductive paste. It has the advantages of liquid high score A and right, and the thermal conductivity of t is poor. The material of this kind of material is == road: hot L :: ... its disadvantage is the time capacity: molecular circuit board, ... temperature environment. There are dry and volatilized low-melting low-melting ΪΓϋ low-melting point metal heat-conducting sheets, which use heat-conducting materials with melting points on both sides of low-melting% H metal 11 below 100, because the strength and ductility of gold are much less than— Ordinary metal 变: can be molded ". The disadvantage of this material is the adhesion after the alloy is melted

9nil2sol.ptc Page 5 ~ r—Exudation, which can lead to reduced energy, poor stability, and III iil 1¾¾ KWHfWr.i ^ UHJmrwuw m λ_ · μ i &gt; jp κ, / j hi *, hi — 11,1 11 , 1 _ 589347 month case number 92106] 5j_ 5. Description of the invention (2) Cannot be reused. In order to solve the above-mentioned various defects, here is a novel low-temperature softening adhesive. In this industry, No. 5, 950, 066 and No. 6, 97, ^^ f, such as the US patent No. Documents, and these two patents are the technology of specializing in low-temperature softening of thermally conductive adhesives. Shi Xixuanji and the classification of 19: / wooden per solid and 30 ~ 45 chemical synthesis of low-temperature softening glue; connect iy solid Again = ~, in platinum to promote: 丨 such as vinyl acetate resin to increase the flexibility of 0 dagger: "soft plastic material, so low temperature softening of thermally conductive adhesive t ^ &gt; 4 thermal conductivity requires the addition of softeners, not only The manufacturing process is multi-tasking and the second is that the disparity of the solubility parameters in the configuration process is too great, and the material that will cause phase separation is not ideal. Brother's applicability [Summary of the Invention] The main purpose of the present invention is to provide finished products. Soften the liquid with a molecular weight of 300 ~ 100000 ^ Hot glue material group Lu: ld: cR! Blend with polyvinyl acetate (eva) to make a softened material with a degree between 38 ~ 65 C, add an appropriate amount ζ Cheng Wen Shao (Ai203), Zinc Oxide (Zη〇) 'Nitriding Ming ^ 2 such as oxide (M), graphite (C ), Copper (Cu), aluminum (, boron metal powder, or nano clay, etc.): (,,), and then form a low-temperature softening guide with good thermal conductivity and low thermal resistance: ：: Heat agent 'warm softened thermally conductive adhesive can be used for heating electronic components and heat sinks' to reduce the thermal resistance value of the caulking heat conduction interface. Taking θ s as another object of the present invention is to improve: Group! ^ Y wins

911112sol.ptc 589347 Amendment 92106154 ___ month, day, five, description of the invention (3) The temperature of the thermoelectronic components can promote the softening of the thermally conductive adhesive material, and improve the resistance to caulking, and reduce the heat between the heating electronic components and the radiator [ Embodiment] The low-temperature softened thermally conductive adhesive composition of the present invention has a molecular weight of 300 ~ 10 =. The liquid acrylonitrile rubber (Liciuid _) and J vinyl acetate EVA) are mixed and made into a rubber material with a softening temperature between 38 and 65t, and then mixed with an appropriate amount of a heat conductive agent. (LiQUld NBR) CH.sub.3 = 13-! 6 .Μ _) '_ · n CH.Ca.CH. sub. 2, η side heat transfer agent may be alumina (A12〇3) zinc oxide (Zn. ), Aluminum nitride (A1N), boron nitride (BN), graphite (c), such as n (A1), silver (Ag), metal powder or nano-viscosity, etc. . Point soil temple made of sub-micron or. The low-temperature softened thermally conductive adhesive material configured in this way has a flash point force of ~ C, and the viscosity after melting is 丨 X 1 〇2 ~ 1 X 1 〇5 ... or nanometer powder heat conductive agent can be coated into thin chess: two uses f Micrometers, and the thermal conductivity is between 0.5 ~ · -K gate thickness / ρ〇 · 〇〇1 =: ~ OTCinVW. The thermal resistance value is between om. The low-temperature softened thermally conductive adhesive composition of the present invention is used to make a guide rail interface. The steps are as follows: (as shown in the first figure) 'Step ⑴' is first 100 parts by weight of liquid acrylonitrile Rubber (Liquid NBR) and 5 to 50 parts by weight of polyvinyl acetate (eva) are placed in a 100 C stirring tank and heated to dissolve, and mixed.

589347 Case No. 92106154 V. Description of the invention (4) Step (2): It is made by heating and kneading into a glue material, and then adding 50 to 5000 parts by weight of a heat conductive agent, and then making it stand by stirring for 30 minutes. Low softening temperature thermal conductive adhesive. Step (3): Add 20 grams of low-softening-temperature thermally conductive adhesive to 80 ml of dilute solvent, heat and stir for more than 30 minutes to melt to a viscosity of about 8000-1,000 cps, and facilitate the implementation. Spray or scrape operators. The diluting solvent may be a mixed solvent such as acetone, butyl acetate (Butyi a, Cetat /), toluene (MethWrOuP) or butan (Butanone), etc., and is diluted by stirring to have a viscosity of 800 ～ 1000cps solution. On the surface of the electronic heating element, the thickness of the product is η ηι 1 Xin ..., and the degree of Iw 1 is controlled between 0.01 and 0.1 mm, and the solution is volatilized: after: a low-temperature softened thermally conductive film is formed. Can also spray

On one side, after the solution is volatilized, attach another sound 孓, 氏 eight T film material. Use another layer of release paper on Dan's to form a thermally conductive thin film. How to use County 4 * Η Finish the side of the Gantz coated with low-temperature softened thermally conductive adhesive ^ paper and then tear off the surface of the thermal element to use the guide. a ..., the bottom of the electronic device or the electronic device and the scolding n, ", ... create a paste to apply to the heating electronic media 'use two = hot low temperature softening thermal conductive material as the heat conduction method with: = month: warm softening thermal conductive adhesive The material is made of a thermally conductive interface to implement 丄 '…] for more specific description. (1) First, put 100 weight I 柃, six workers --- 夂 ethylene (EVA) into the loot mixing tank and add 911112sol.ptc Page 8 589347 Revised in January _ Case No. 92106154 V. Description of the invention (5) Dissolve by heat and stir evenly. (2) Mix and heat to make a glue, then add 300 weight (ΑΙΛ) and 50 parts by weight of zinc oxide (z, lice, aluminum, and agitate for at least 30 minutes to guide ...), and heat to 100 to stand still to make a low softening temperature. (3) Good low-temperature softening thermal conductive adhesive Force # ± ^ ... glue material. 栻 Directly scrape a surface roughened gold to take / shape, and then use a scrape coating thickness control to 0. 01 ~ 0. Lmm. ', Σ, put ,,,, and benefit, and scrape (4), finally cool after cooling, four stickers-release paper to avoid staining # nm I glue film and then sticking the finished product Low, the thermally conductive medium of the dish softening heat-conducting adhesive material is made of low-temperature softening adhesive 敎 1, and the test is as follows: = = U Cin / W, 2 : The machine test can be used in the central processor for the calculation of the frequency between the processor and the heat-conducting sealant between the radiator and the center. Example 2 at the center of the example:) Liquid 4 acrylonitrile rubber (1)) Dissolve hot melted polyvinyl acetate (EVA) and mix them evenly. Put them in a 10 ° C companion tank, add t and? 1, mix them, and add 15. Add weight. Parts of nitric oxide (A1N) and 50 parts of oxygen, compared with r7n., Emulsified fresh (Zn0) heat transfer agent, and added 埶 to 100 t: after stirring for at least 30 minutes, statically make 詈 your red "^ ⑻. Low-softening Λ thermal conductive adhesive. Add 2. . Parts by weight of acetic acid di V,:, B = ° directly after thermal softening into a paste ____ 夂 J a day (jjutyl acetate) and 50 parts by weight

Ml 911112sol.ptc Page 9 589347 Correction

Case No. 92106154 V. Description of the invention (6) M + ethyl group is stirred for more than 30 minutes, and sprayed on a metal-aluminum alloy radiator with roughened surface, and the coating thickness is controlled at 0.Q1 ~ O.lmjj]. Spray (4), and finally cool the low-softening temperature thermally conductive adhesive thin release paper ′ to avoid sticking, and make it—the low-temperature softening of the thermal interface finished product. 〃 Publication &lt; ¥ From this, a low temperature softened thermally conductive adhesive material is fabricated on the thermal electronic component of the thermal interface interface finished product library, and its test shows that its thermal resistance value is 0u ^ in2 /, /, = point is 57 t :; The low-temperature softened thermally conductive adhesive produced by the present invention has extremely low thermal resistance and good caulking performance. It can be used in the center of the machine as a tabletop with a computing frequency of 2 · 2GHz and a power of 60w. The computer is used as the heat-conducting jointing glue between the central processor and the radiator. Embodiment 3: Steps (1) to (2) are the same as steps (1) to (2) of Embodiment 2. (3) After heating and softening the low-softening-temperature thermally conductive adhesive into a paste, directly add 200 parts by weight of Butyi aCetate and 50 parts by weight of toluene (Methyl group) and stir for more than 30 minutes, and adopt a doctor blade method , And evenly cover one side of the release paper, and then dry it to make the solvent volatilize. The material of the release paper can be general paper, polyethylene (Polyethlyene), polypropylene (polypropylene), polyvinyl chloride (polyvinylchloride), and polyimide (polyamide), etc. Try to control it from 0.01 to 0.1lmni. (4) Finally, the low-softening temperature thermally conductive adhesive film after cooling is pasted with a release paper to avoid sticking, and a low-temperature softened thermally conductive adhesive is made into a thermally conductive thin film.

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Case No. 92106154 V. Description of the invention (7) Film finished product. This makes a low-temperature softened thermally conductive adhesive m between the thermal electronic component and the heat sink. The test: the two-sided finished product is used for the development of ° Cin2 / W with a melting point of 57. . ; Therefore, the present invention: 'The resistance value is 0.11, the thermal resistance value of the material is extremely low, and the caulking is also good X, ☆ a low-temperature softened thermally conductive rubber central processor has a computing frequency of 2 birds and a good performance; f test can be used In the computer, it is called Zhuweiwei CPU processor crying on the desktop type under 60WU. Zheng · ,, '. . The interface between the heat-conducting caulking glue material :: t the heart: the low 'plate' softens the heat-conducting glue composition made of the guide surface, which can be further added to the composition into a suitable form into ... (Par 二fin) to increase the softening temperature of the thermal interface. Its system: guide :: face i: bright temperature softened heat-conductive adhesive material technology and industry _:,: surface charge :: 4;: =; ::: effect ^^^ Applicants who have filed invention patents. Therefore, according to the law, the above is only for the artist of the present invention and the present case. It is more than “λ yoke example. Everyone is familiar with the changes ^ ^, tb, equivalent changes made according to the spirit of this case. Modifications should be covered in The following patent applications are within the scope of this application. "589347

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Claims (1)

589347 fix 彳 η Λ species of low 'tritiated thermally conductive adhesive composition, mainly based on eight; 3: 0 ~. 00 Liquid Acrylonitrile Rubber: Sub-quantity _ Case No. 92106154 VI. Patent Application Scope = Addition of an appropriate amount of heat-conducting agent to the rubber material. Two rubbers and two dimethyl acrylonitrile rubbers (L id: ,,, and finished products: 、 :: Λ 专: 1: 可? = A A: warm material group (Z Π 0), argonization (&quot; A 1 λτ, 'copper ...'), '明 ⑷ 银' (f (delete (BNy, Graphite (c), powders made in the range of sub-sn gold, 2 or nano-clay, etc. 4, such as Shen Zhenzhen U: or nano-powder heat transfer agent. # 利 乾 围 # 1 The low-temperature softening guide Um U Tu Γ = Γ ;: After the thermally conductive adhesive is heated and softened into a paste = surface ί =; = Γ on the component or the radiator as a guide: ί mHe coating thickness is controlled at 0.001 ~ 〇.〗 _ 者. * 、、 '&quot; ,, f σσσslow patent softening guide m 4 described in patent scope Item 4: Medium and low temperature softening thermal conductive adhesives can be added with appropriate dilution :: ^ 材Make up the mouth coating or coating operation. Dilution> Cereals for your benefit% \ The low temperature softening agent as described in item 5 of the patent application park, where the diluting solvent can be acetone Material composition (MW such as), toluene (㈣ 91111 2sol.ptc p. 13 589347 No. 921f) fna, patent application scope (Butanone), etc. and other mixed solvents, and give a solution of 80 ~ 1000cps. Selectively dilute it to a low-viscosity substance with a viscosity of 7, as described in item 丨 of the scope of the patent application, where the low-temperature softened thermally conductive adhesive is added with dilute = 2b thermally conductive adhesive, which can be directly scraped on one side of the release paper, and then : ^ / After synthesizing the liquid, send it. After the low-softening temperature heat-conductive adhesive material cools, it will dry out. Dry the solvent, and then make the solvent volatilize the paper, and then make a low-temperature soft:::: -layer product. $ ”, The thermal interface of the repair material is 8, as described in item 7 of the scope of the patent application, the release paper is general paper, polyethylene = = composition), polypropylene (polyproplyene), polygas Ethylene ne (Polyvinylchloride) and poly (4). ) And ... amine (P0l ”nude) and other materials 9, as described in the scope of the patent application 丨 low-temperature softening heat conductive rubber material, wherein the heat conductive rubber composition can further add an appropriate amount of wax, (Paraffin) 'In order to increase the softening temperature of the thermal interface. Page 14