CN1535104A - Device and method ofr mfg. printed wiring board - Google Patents
Device and method ofr mfg. printed wiring board Download PDFInfo
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- CN1535104A CN1535104A CNA2003101243267A CN200310124326A CN1535104A CN 1535104 A CN1535104 A CN 1535104A CN A2003101243267 A CNA2003101243267 A CN A2003101243267A CN 200310124326 A CN200310124326 A CN 200310124326A CN 1535104 A CN1535104 A CN 1535104A
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- wiring board
- printed wiring
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- conductor width
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Abstract
To provide a printed wiring board manufacturing device and its method with which artificial adjusting work is avoided and which have a good yield. A processor (PC) 22 arranged in a wiring pattern width measuring process 104 measures conductor width (line width) in a designation position of a wiring pattern which is received from printed wiring board design CAD 24, which follows position information of the wiring pattern of an object of measurement, and from which a dry film is peeled and removed. A prescribed etching condition such as line speed, etching liquid concentration and spraying pressure of etching liquid is controlled in an etching processing process 102 by a measured result value (value of conductor width). (C)2004,JPO&NCIPI.
Description
Technical field
The present invention relates to be suitable for the printed wiring board manufacturing apparatus and the printed wiring board fabrication method that in the multilayer printed-wiring board manufacturing process that requires the pattern with high precision corrosion, use.
Background technology
When forming the pattern of printed wiring board (PWB), in etching process, remove the part (not forming the part of wiring pattern) that does not need conductor (Copper Foil).Generally, since the thickness of the pattern of printed wiring board, pattern density, and reasons such as etching condition produce the dispersiveness of the pattern width after the corrosion.When the manufacturing of printed wiring board, need suppress the dispersiveness of pattern width according to various requirement.For example, need the high-speed data transfer circuit of suppression characteristic impedance within the specific limits etc., for the pattern width of the reason of changes that becomes impedance operator etc., need be with its value of finishing of High Accuracy Control.
As the method for the value of finishing of controlling pattern width, used the inspection method of being undertaken by the inspector in the test run in the past.This method is before all plates (copper foil plate) in making in batches are sent to etching process, only a spot of plate is sent to the corrosion line, the prosecutor finishes pattern width with mensuration such as magnifying glasses, makes in batches if its pattern width in certain control range, then all transmits it.Pattern width do not enter into control range with interior situation under, the concentration of process management personnel adjustment corrosive liquid, the etching conditions such as speed of corrosion line are after adjusting, once more a spot of plate is sent to the corrosion line, adjusts etching condition up to entering into control range with till interior.
Control technology about corrosion, have when the Thinfilm pattern of semiconductor wafer forms, the value of the finishing measured value of finishing after measured value and the corrosion of pattern according to the resist pattern before the corrosion asks it poor, the manufacturing technology (for example, opening the 2000-269190 communique) of the next corrosion operating condition in batches of decision with reference to the spy.
Summary of the invention
The object of the present invention is to provide the adjustment operation of avoiding artificial, printed wiring board manufacturing apparatus that rate of finished products is high and printed wiring board fabrication method.
The feature of the printed wiring board manufacturing apparatus of first aspect present invention be possess the instrumentation corrosion treatment the measuring device of conductor width of wiring pattern of printed wiring board; Control the control device of etching condition according to the value of the conductor width that measures by above-mentioned measuring device.
The feature of the method for fabricating printed wiring board of second aspect present invention is to possess the conductor width instrumentation technology of selecting the conductor width of predetermined this wiring pattern of wiring pattern instrumentation from the substrate that has passed through etching process; Control the technology of the etching condition of above-mentioned etching process according to the conductor width that in above-mentioned conductor width instrumentation technology, measures.
Description of drawings
Fig. 1 illustrates the etching process of the printed wiring board manufacturing apparatus in the invention process form.
Fig. 2 illustrate in the invention process form wiring pattern width measurements technology and based on the structure example of the etching condition control system of measurement result.
Fig. 3 illustrates the relation that can finish width according to the etching condition and the pattern after the corrosion treatment of etching condition control information control in the invention process form.
Fig. 4 A illustrates the corrosion treatment state of the corrosion treatment technology in the invention process form to Fig. 4 E.
Embodiment
Following with reference to description of drawings example of the present invention.
Fig. 1 illustrates the etching process of the printed wiring board manufacturing apparatus in the invention process form.
Etching process shown in Figure 1 possesses etchant resist coated technique 101, corrosion treatment technology 102, etchant resist stripping technology 103, wiring pattern width measurements technology 104.
Etchant resist coated technique 101 is included in copper plating film laminated plate (substrate) and goes up the technology of pasting dry film (photosensitive film); Then the technology of conductive pattern part (having formed the part of conductive pattern) exposure; The technology of developing; The technology that keeps the corrosion resistance tunicle in the position (conductive pattern part) of having exposed.
Etchant resist stripping technology 103 is to peel off, remove the dry film that sticks on the conductive pattern part, exposes the technology of conductive pattern (copper-clad surface).
Wiring pattern width measurements technology 104 is for the positional information according to the wiring pattern that becomes the instrumentation object that receives from printed wiring board Design CAD (with reference to the symbol 24 of Fig. 2), peeled off, removed the wiring pattern (conductive pattern) of dry film, the technology of the conductor width of its assigned address of instrumentation (line width).
In example of the present invention, according to the measurement result value (value of conductor width) of wiring pattern width measurements technology 104, the predetermined etching conditions such as expulsion pressure of the linear velocity in the control corrosion treatment technology 102, corrosive liquid concentration, corrosive liquid.In addition, narrate the concrete structure example of wiring pattern width measurements technology 104 in the back with reference to Fig. 2 and based on the etching condition control of the corrosion treatment technology 102 of measurement result.In addition, narrate the concrete processing (state transitions) of the corrosion in the corrosion treatment technology 102 in the back to Fig. 4 E with reference to Fig. 4 A.
Fig. 2 illustrate in the invention process form wiring pattern width measurements technology 104 and based on the structure example of the etching condition control system of measurement result.
Among Fig. 2,, the instrumentation structure of having used along the ccd sensor of directions X or Y direction line scanning CCD element is shown as an example.Instrumentation mechanism is not limited to this example, for example also can use the pattern sensor based on laser scanning, line sensor, other optical pickocff such as two-dimentional camera.
Device in the wiring pattern width measurements technology 104 shown in Figure 1 as shown in Figure 2, possesses CCD element 221, ccd sensor 223 with CCD sweep mechanism 222, the processing unit (PC) 22 of the inscape of formation etching condition control system, resume database 25.
In addition, the device in the corrosion treatment technology 102 shown in Figure 1 possesses the processing unit (PC) 21 and the corrosion control mechanism 213 of the inscape that constitutes the etching condition control system.
Processing unit (PC) 22 and processing unit (PC) 21 interconnect through the system bus 23 in the system that is arranged on management printed wiring board manufacturing line.In example of the present invention, send etching condition control information (CNT) to processing unit (PC) 21 from processing unit (PC) 22.
In addition, processing unit (PC) 22 is for printed wiring board Design CAD 24, is used to obtain the request of pattern position information of wiring pattern that indication becomes the printed wiring board (PWB) of instrumentation object.
And then, processing unit (PC) is then controlled the CCD sweep mechanism 222 of ccd sensor 223 if 22 obtain the pattern position information of wiring pattern that indication becomes the printed wiring board (PWB) of instrumentation object from printed wiring board Design CAD 24 with this positional information.And processing unit (PC) 22 obtains the instrumentation value of conductor width (line width) according to the output of ccd sensor 223.At this moment, printed wiring board (PWB) that etchant resist stripping technology 103 has been passed through in ccd sensor 223 scanning is gone up the wiring pattern (CP) that usefulness the pattern position information that forms has been indicated, and sends to processing unit (PC) 22 exporting from the pattern of ccd sensor 223.
Printed wiring board Design CAD 24 possesses the CAD database 241 of having stored design data.If printed wiring board Design CAD 24 receives above-mentioned request from processing unit (PC) 22, then visit CAD database 241, obtain the positional information of the wiring pattern of the instrumentation object that becomes printed wiring board of being asked, this positional information is sent to requesting party's processing unit (PC) 22.
In addition, if processing unit (PC) 21 receives etching condition control information (CNT) through system bus 23 from processing unit (PC) 22, then defer to the indication of its information content for corrosion control mechanism 213.Corrosion control mechanism 213 carries out various controls according to indicated etching condition, for example corrodes the linear velocity control of line 211, the concentration control of the corrosive liquid that corrosive liquid feed unit 212 is supplied with, the expulsion pressure control of nozzle (ns) etc.
Fig. 3 and Fig. 4 A are respectively action specification figure in the invention process form to Fig. 4 E.
Fig. 3 illustrates the relation that can finish width according to the etching condition and the pattern after the corrosion treatment of etching condition control information (CNT) control.
Fig. 4 A illustrates the state example of the corrosion in the corrosion treatment technology 102 to 4E.Fig. 4 A illustrates the state (being the state after the etchant resist coating) before the corrosion.State transitions when Fig. 4 B to Fig. 4 D shows corrosion.Fig. 4 E shows the state after the corrosion.
Participate in the processing action of the printed wiring board manufacturing process in each figure explanation the invention process form.
The device of etchant resist coated technique 101 carries out the stickup of dry film to the raw-material copper plating film laminated plate (substrate) that constitutes printed wiring board, the exposure and the development of conductive pattern part.Thus, substrate becomes the state (with reference to Fig. 4 A) that keeps corrosion resistance tunicle (etchant resist) on the conductive pattern part of having exposed.
Device in the corrosion treatment technology 102, dissolves gradually and removes the conductive pattern part useless Copper Foil that exposes (with reference to Fig. 2, Fig. 4 B～Fig. 4 D) in addition from nozzle (ns) jet etching liquid through corrosive liquid feed unit 218 on the corrosion line.
At this moment, corrosion control mechanism 213 is according to etching condition control information (CNT) the control line speed of exporting from processing unit described later (PC) 22, corrosive liquid concentration, the injection conditions (with reference to Fig. 3) that the expulsion pressure of corrosive liquid etc. are predetermined.
Then, the device in the etchant resist stripping technology 103 peels off, remove the dry film that sticks on the conductive pattern part, the state (with reference to Fig. 4 E) that conductive pattern (copper-clad surface) is become expose.
Then, the device in the wiring pattern width treatment process 104 is for predetermined conductive pattern (wiring pattern) its conductor width of instrumentation (line width).
At this moment, processing unit (PC) 22 instrumentations are according to the conductor width (line width) of the assigned address of the wiring pattern (conductive pattern) of the positional information of the wiring pattern of importing from printed wiring board Design CAD 24 that becomes the instrumentation object.And, processing unit (PC) is according to its instrumentation end value (value of conductor width), be included in the parameter (pattern thickness (thickness of Copper Foil) the design information of the printed wiring board of obtaining from printed wiring board Design CAD 24 that becomes the instrumentation object, with wiring pattern information is the wiring density of foundation, suitable corrosive liquid and concentration thereof etc.), make conductor width become the Optimal Control that design load is corroded like that.
Promptly, the printed wiring board that processing unit (PC) 22 exposes for the conductive pattern (copper-clad surface) that has passed through resist stripping technology 103, according to the positional information that obtains from printed wiring board Design CAD 24, the CCD sweep mechanism 222 of drive controlling ccd sensor 223, read in the output of the pattern sensor on the wiring pattern (CP) of positional information indication, obtain the instrumentation value of conductor width (line width) from the pattern output of ccd sensor 223.
At this moment, the characteristic impedance that is produced by conductor width of for example representing that processing unit (PC) 22 has been specified in the design phase in advance from printed wiring board Design CAD 24 input changes the positional information of the wiring pattern of the high speed signal transmission lines that is influenced, for the wiring pattern of deferring to this positional information, obtain the instrumentation value of its conductor width (line width).
And then processing unit (PC) compares the value of this instrumentation value with the line width of obtaining from printed wiring board Design CAD 24, calculates the error of finishing pattern width.And it is 0 such that processing unit (PC) 22 makes that error becomes, and according to value that calculates and parameter, sends etching condition control informations (CNT) to processing unit (PC) 21.
Processing unit (PC) is then deferred to the indication of its information content if 21 receive etching condition control information (CNT) for corrosion control mechanism 213.Corrosion control mechanism 213 is according to indicated etching condition, and the speed of line 211, the concentration of perhaps variable control corrosive liquid (eP), the expulsion pressure of perhaps variable control nozzle (ns) are corroded in for example variable control.
In addition, corrosion control mechanism 213 is the speed of corrosion line 211, and the expulsion pressure of concentration of corrosive liquid (eP) and nozzle (ns) combines and carries out variable control.
By from wiring pattern width measurements technology 104 FEEDBACK CONTROL to corrosion treatment technology 102, it is such to make that conductor width becomes design load, that is, the error of finishing pattern width is 0 such, the Optimal Control of corroding when long.
Like this, the etching condition from the result who has measured pattern width obtains suiting by in real time this etching condition being fed back to corrosion treatment technology 102, can make pattern width near desired value all the time, also reduces the dispersiveness of pattern width simultaneously.Thus, can avoid the manufacturing of the high printed wiring board of artificial rate of finished productss such as adjustment operation.
Secondly, the processing action for the resume database 25 of processing unit (PC) 22 utilizes illustrates its example.
Utilization example as resume database 25 has following utilization example.Resume database 25 is for example under the control of processing unit (PC) 22, for the various printed wiring boards of on this manufacturing line, making, in each kind, store the relation of finishing width of the prescribed route pattern of various corrosive environments that influence the live width of finishing pattern and the printed wire wiring plate of under this corrosive environment, making at interval with preset time.By analyzing this information, can obtain the parameter information of the best corrosive environment of each kind.
By having such system control function, can cut down artificial operation significantly, the multilayer printed-wiring board that fabrication yield is high.
In addition, by using the information that is stored in the resume database 25 when the design of the printed wiring board that has used printed wiring board Design CAD 24, can realize to make the printed wiring board design support function of more high-quality printed wiring board.
If according to the present invention, then can avoid the manufacturing of high printed wiring board such as the rate of finished products of artificial adjustment operation etc.
Other advantage of the present invention and distortion will produce from its knack easily.Therefore, main aspect of the present invention is not limited to the equipment of special explanation shown here, description and illustrated example.Thereby, in the spirit and scope that do not break away from claim and the defined overall thought of the present invention of equivalents thereof, can produce various distortion.
Claims (12)
1. printed wiring board manufacturing apparatus is characterized in that: possesses,
The instrumentation corrosion treatment the measuring device of conductor width of wiring pattern of printed wiring board; And
According to the control device of controlling etching condition by the value of the conductor width of above-mentioned measuring device instrumentation.
2. printed wiring board manufacturing apparatus according to claim 1 is characterized in that:
Above-mentioned measuring device possesses,
From above-mentioned corrosion treatment the design information of above-mentioned printed wiring board, obtain the positional information acquisition device of the positional information of the wiring pattern that becomes the instrumentation object; And
According to the positional information that obtains by above-mentioned positional information acquisition device, specific above-mentioned corrosion treatment the wiring pattern that becomes the instrumentation object of above-mentioned printed wiring board, the instrumentation processing unit of its conductor width of instrumentation.
3. printed wiring board manufacturing apparatus according to claim 1 is characterized in that:
Above-mentioned control device is controlled the linear velocity of above-mentioned corrosion treatment, make above-mentioned corrosion treatment the conductor width of printed wiring board become design load.
4. printed wiring board manufacturing apparatus according to claim 1 is characterized in that:
Above-mentioned control device is controlled at the concentration of the corrosive liquid that uses in the above-mentioned corrosion treatment, make above-mentioned corrosion treatment the conductor width of printed wiring board become design load.
5. printed wiring board manufacturing apparatus according to claim 1 is characterized in that:
Above-mentioned control device is controlled at the expulsion pressure of the corrosive liquid that uses in the above-mentioned corrosion treatment, make above-mentioned corrosion treatment the conductor width of printed wiring board become design load.
6. printed wiring board manufacturing apparatus according to claim 1 is characterized in that:
Above-mentioned control device is according to by the value of the conductor width of above-mentioned measuring device instrumentation be included in the etching condition that the technology of above-mentioned corrosion treatment is carried out in parameter control in the Design CAD data of the printed wiring board that becomes the instrumentation object.
7. printed wiring board manufacturing apparatus according to claim 1 is characterized in that:
The printed wiring board that above-mentioned control device has possessed for the past corrosion treatment, be stored in the resume database of the etching condition that wiring pattern width aspect exerts an influence, be suitable for carrying out the etching condition of the printed wiring board of above-mentioned corrosion treatment from above-mentioned resume database retrieval, this etching condition is used as above-mentioned set information.
8. printed wiring board manufacturing apparatus according to claim 2 is characterized in that:
Above-mentioned positional information acquisition device is from the design information of the printed wiring board that carries out above-mentioned corrosion treatment, and the characteristic impedance of selecting to be produced by conductor width changes the wiring pattern of the high speed signal transmission lines that is influenced, and obtains the positional information of this wiring pattern.
9. printed wiring board manufacturing apparatus according to claim 6 is characterized in that:
Above-mentioned parameter comprises at least a in the thickness, wiring density, lamination condition, etching condition of pattern.
10. printed wiring board fabrication method is characterized in that: possesses,
Thereby select the conductor width instrumentation technology of the conductor width of predetermined this wiring pattern of wiring pattern instrumentation from the substrate that has passed through etching process; And
Control the technology of the etching condition of above-mentioned etching process according to the conductor width of instrumentation in above-mentioned conductor width instrumentation technology.
11. printed wiring board fabrication method according to claim 10 is characterized in that:
Above-mentioned conductor width instrumentation technology comprises the design information that obtains the printed wiring board that becomes the instrumentation object from the printed wiring board Design CAD, is selected to the technology of the wiring pattern of instrumentation object according to its design information.
12. printed wiring board fabrication method according to claim 10 is characterized in that:
The technology of control etching condition comprises the conductor width and the design information that becomes the printed wiring board of instrumentation object according to instrumentation in above-mentioned conductor width instrumentation technology, control at least a etching condition in the expulsion pressure of the concentration of the linear velocity of above-mentioned etching process or corrosive liquid or corrosive liquid, make the conductor width of above-mentioned wiring pattern in allowed band with interior optimally-controlled technology of corroding like that.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002377167A JP2004207611A (en) | 2002-12-26 | 2002-12-26 | Printed wiring board manufacturing device and printed wiring board manufacturing method |
| JP377167/2002 | 2002-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1535104A true CN1535104A (en) | 2004-10-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2003101243267A Pending CN1535104A (en) | 2002-12-26 | 2003-12-26 | Device and method ofr mfg. printed wiring board |
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| Country | Link |
|---|---|
| JP (1) | JP2004207611A (en) |
| CN (1) | CN1535104A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI617934B (en) * | 2015-09-25 | 2018-03-11 | 思可林集團股份有限公司 | Data correcting apparatus, drawing apparatus, wiring pattern forming system, inspection apparatus, data correcting method and wiring substrate producing method |
| CN110719697A (en) * | 2019-10-28 | 2020-01-21 | 深圳市兴森快捷电路科技股份有限公司 | PCB etching uniformity detection and adjustment method |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5442104B2 (en) | 2010-03-23 | 2014-03-12 | 株式会社フジクラ | Method for manufacturing printed wiring board |
| CN110493967A (en) * | 2019-07-23 | 2019-11-22 | 福州瑞华印制线路板有限公司 | A kind of printed wiring board automation control etch system and process |
| CN116614951B (en) * | 2023-05-23 | 2024-04-12 | 赣州市超跃科技有限公司 | Circuit board production control system and method |
| CN117062324A (en) * | 2023-08-10 | 2023-11-14 | 淮安特创科技有限公司 | Automatic adjust etching liquid concentration and linear speed device |
-
2002
- 2002-12-26 JP JP2002377167A patent/JP2004207611A/en active Pending
-
2003
- 2003-12-26 CN CNA2003101243267A patent/CN1535104A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI617934B (en) * | 2015-09-25 | 2018-03-11 | 思可林集團股份有限公司 | Data correcting apparatus, drawing apparatus, wiring pattern forming system, inspection apparatus, data correcting method and wiring substrate producing method |
| CN108029196A (en) * | 2015-09-25 | 2018-05-11 | 株式会社斯库林集团 | Data correction device, drawing apparatus, Wiring pattern form the manufacture method of system, check device, data correcting method and wiring substrate |
| CN108029196B (en) * | 2015-09-25 | 2020-07-28 | 株式会社斯库林集团 | Data correction device, drawing device, wiring pattern forming system, inspection device, data correction method, and method for manufacturing wiring substrate |
| CN110719697A (en) * | 2019-10-28 | 2020-01-21 | 深圳市兴森快捷电路科技股份有限公司 | PCB etching uniformity detection and adjustment method |
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| Publication number | Publication date |
|---|---|
| JP2004207611A (en) | 2004-07-22 |
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