CN1508887A - Surface adhesion element packaging structure of light-emitting diode with lens and top plane - Google Patents
Surface adhesion element packaging structure of light-emitting diode with lens and top plane Download PDFInfo
- Publication number
- CN1508887A CN1508887A CNA021550638A CN02155063A CN1508887A CN 1508887 A CN1508887 A CN 1508887A CN A021550638 A CNA021550638 A CN A021550638A CN 02155063 A CN02155063 A CN 02155063A CN 1508887 A CN1508887 A CN 1508887A
- Authority
- CN
- China
- Prior art keywords
- plane
- lens
- protecting colloid
- light
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Led Device Packages (AREA)
Abstract
Packing surface of light emitting diode which possesses lens, is prepared in shape of plane in order to carry out subsequent installation expediently, and for sucking up device to suck and move the product expediently.
Description
Affiliated field
What the present invention relates to is a kind of LED surface adhering element encapsulating structure with lens and plane, top, is meant especially the encapsulating structure technology again of adhering of the light-emitting diode with convex protecting colloid and spill colloid.
Background technology
In the prior art; as shown in Figure 1; LED wafer 10 is placed on the metal 12; the electrode of LED wafer 10 bottom surfaces fuses on metal electrode 12; the surface electrode wire 13 of LED wafer 10 is connected with metal electrode 11; protecting colloid 14 is encapsulated in metal electrode 11; the element of 12 tops; protecting colloid 14 forms convex surface in the light of LED wafer 10 is penetrated the zone; constitute the convex lens effect; improved outer quantum effect, made light effectively be collected and launch, but this kind projecting surface; make suction means can't draw this element easily, influence the automatic flow of complete machine operation.
Summary of the invention
For reaching above-mentioned purpose, the LED surface adhesion that the inventor will have lens is encapsulated in upper surface and is designed to one planely, overcomes the problem that the prior art suction means can't be drawn easily.
The objective of the invention is to overcome that the projecting surface of light-emitting diode is not suitable for the shortcoming that suction means is drawn this element in the prior art.
Description of drawings
Fig. 1 is the light emitting diode construction figure that has lens function in the prior art;
Fig. 2 is LED surface adhering element encapsulation embodiment 1 structure chart with lens and plane, top;
Fig. 3 is LED surface adhering element encapsulation embodiment 2 structure charts with lens and plane, top;
Fig. 4 is LED surface adhering element encapsulation embodiment 3 structure charts with lens and plane, top;
Fig. 5 is LED surface adhering element encapsulation embodiment 4 structure charts with lens and plane, top;
Fig. 6 is LED surface adhering element encapsulation embodiment 5 structure charts with lens and plane, top;
Fig. 7 is LED surface adhering element encapsulation embodiment 6 structure charts with lens and plane, top.
Element number contrast among the figure
10 ... wafer 11 ... first metal
12 ... second metal 13 ... routing
14,142 ... protecting colloid 141,143 ... the limit wall
20 ... cap 201 ... dull and stereotyped lid
202,203,204,205 ... inserts
Specific embodiment
See also shown in Figure 2; can be clearly seen that from figure Fig. 2 and prior art Fig. 1 difference have been to use the flat-top cap 20 of printing opacity; cover the top of protecting colloid 14 lens; flat-top cap 20 is the LED package outsides that cover Fig. 1; this flat-top cap 20 is encapsulated in the light-emitting diodes tube outer surface; and the plane domain on adhesion one top, the absorption of being convenient to this element suction means in automatic assembly line is used.
Accompanying drawing 3 is further embodiment of this invention, and it is that outer with the protecting colloid 14 of light-emitting diode is designed to limit wall 141 shapes, covers a printing opacity flat board 201 then in the above, and is adhered on the limit wall 141, forms one.
Accompanying drawing 4 is another embodiment of the present invention, and it is to have the top of projecting surface protecting colloid 14, and adopting refractive index to fill the formation top less than the light transmissive material 202 of protecting colloid 14 is the plane.
Accompanying drawing 5 is yet another embodiment of the invention; provided among the embodiment and had the shape that projecting surface protecting colloid 14 is designed to have limit wall 141; fill the light transmissive material 203 of refractive index less than protecting colloid 14 then in the zone of limit wall 141, it is plane that the top is become.
What accompanying drawing 6 provided is the structure chart of embodiment 5, can clearly find out the top of the protecting colloid 142 with concave surface from figure, adopts refractive index to fill greater than the light transmissive material 204 of protecting colloid 142 refractive indexes, and making it to become the top is the plane.
What accompanying drawing 7 provided is the structure chart of embodiment 6; can find out clearly that from figure the protecting colloid 142 with concave surface is designed to the shape of limit wall 143; fill the light transmissive material 205 of refractive index greater than protecting colloid 142 then in the zone of limit wall 143, making it to constitute the top is the plane.
In sum, by the variation of these structures, the inventor has reached goal of the invention of the present invention, makes this element in the industry automation, can use suction means, improves the application of industrialization.
Claims (7)
1. LED surface adhesion encapsulating structure with lens and plane, top, it is characterized in that: its pipe top of the light-emitting diodes after the encapsulation is plane.
2. the LED surface adhering element encapsulating structure with lens and plane, top as claimed in claim 1, it is characterized in that: this light-emitting diode top is plane, is to cover protecting colloid (14) by a flat-top cap (20) to form the lens top.
3. the LED surface adhering element encapsulating structure with lens and plane, top as claimed in claim 1; it is characterized in that: the protecting colloid of this light-emitting diode (14); be designed to have the shape of limit wall (141), cover a light-passing board (201) above and form plane.
4. the LED surface adhering element encapsulating structure with lens and plane, top as claimed in claim 1; it is characterized in that: the top of the protecting colloid of this light-emitting diode (14); adopt refractive index to fill, constitute plane less than the packing material (202) of protecting colloid (14).
5. the LED surface adhering element encapsulating structure with lens and plane, top as claimed in claim 1; it is characterized in that: the protecting colloid of this light-emitting diode (14) is designed to limit wall (141) shape, fills refractive index then and fill less than the packing material of protecting colloid (14) in Bian Bi (141) zone.
6. the LED surface adhering element encapsulating structure with lens and plane, top as claimed in claim 1; it is characterized in that: top in recessed protecting colloid (142); adopt refractive index to fill, constitute top surface plane greater than the packing material (204) of protecting colloid (142).
7. the LED surface adhering element encapsulating structure with lens and plane, top as claimed in claim 1; it is characterized in that: be designed to the shape of limit wall (143) at recessed protecting colloid (142), the packing material (205) of filling then greater than protecting colloid (142) refractive index constitutes the plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021550638A CN1508887A (en) | 2002-12-20 | 2002-12-20 | Surface adhesion element packaging structure of light-emitting diode with lens and top plane |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021550638A CN1508887A (en) | 2002-12-20 | 2002-12-20 | Surface adhesion element packaging structure of light-emitting diode with lens and top plane |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1508887A true CN1508887A (en) | 2004-06-30 |
Family
ID=34235678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA021550638A Pending CN1508887A (en) | 2002-12-20 | 2002-12-20 | Surface adhesion element packaging structure of light-emitting diode with lens and top plane |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1508887A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009039680A1 (en) * | 2007-09-27 | 2009-04-02 | Helio Optoelectronics Corporation | Manufacturing method of led having multi-layer lenses and the structure thereof |
| CN106057092A (en) * | 2016-07-30 | 2016-10-26 | 深圳浩翔光电技术有限公司 | Lamp panel and driving plate connecting structure for LED display screen |
| WO2023116096A1 (en) * | 2021-12-20 | 2023-06-29 | 惠州视维新技术有限公司 | Backlight source module and display device |
-
2002
- 2002-12-20 CN CNA021550638A patent/CN1508887A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009039680A1 (en) * | 2007-09-27 | 2009-04-02 | Helio Optoelectronics Corporation | Manufacturing method of led having multi-layer lenses and the structure thereof |
| CN106057092A (en) * | 2016-07-30 | 2016-10-26 | 深圳浩翔光电技术有限公司 | Lamp panel and driving plate connecting structure for LED display screen |
| WO2023116096A1 (en) * | 2021-12-20 | 2023-06-29 | 惠州视维新技术有限公司 | Backlight source module and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5730680B2 (en) | LED light emitting device and manufacturing method thereof | |
| US10396234B2 (en) | Package structure of long-distance sensor and packaging method of the same | |
| CN1572718A (en) | Semiconductor device and manufacturing method of the same | |
| CN1508887A (en) | Surface adhesion element packaging structure of light-emitting diode with lens and top plane | |
| CN1344036A (en) | Flat type LED and mfg. method thereof | |
| CN102479785A (en) | Light emitting structure with deposited type fluorescence covering layer and manufacturing method thereof | |
| CN102257644B (en) | Method for producing a plurality of optoelectronic semiconductor components and optoelectronic semiconductor component | |
| CN100342558C (en) | Ceramic package light-emitting diode an dits package method | |
| CN102779815A (en) | Packaging structure of light emitting diode and manufacturing method thereof | |
| CN1898805A (en) | Optical data communication module | |
| CN103050582A (en) | Packaging method for light emitting diode with glue wall | |
| CN108336215A (en) | Photoelectric packaging body and manufacturing method thereof | |
| US11437539B2 (en) | Optical sensor package and manufacturing method for the same | |
| US20110108871A1 (en) | Edge led package | |
| CN2819478Y (en) | Sealing structure of multiple-chip light emitting diode | |
| CN1545471A (en) | Triangular-tetrahedron container with spout assembly | |
| CN1698214A (en) | Chip type LED | |
| CN1275368C (en) | Semiconductor laser heat sink | |
| CN102569535A (en) | Method for manufacturing encapsulation structure for light-emitting diode | |
| CN2718785Y (en) | Image sensor module | |
| CN114287066A (en) | Optoelectronic component and method for producing an optoelectronic component | |
| CN2613047Y (en) | Stacking packaging assembly for integrated circuit | |
| CN100345315C (en) | Light source module | |
| CN218385260U (en) | Photoelectric packaging structure | |
| KR20080029472A (en) | Method for manufacturing light emitting diode package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned | ||
| C20 | Patent right or utility model deemed to be abandoned or is abandoned |