KR20080029472A - Method for manufacturing light emitting diode package - Google Patents

Abstract

A method for manufacturing a light emitting diode package is provided to enhance the light emitting efficiency by forming a concavo-convex part on a surface of a transparent resin substance. A light emitting diode chip(17) is mounted into a cavity(21) of a package body(15). The cavity is filled with a liquefied resin to cover the light emitting diode chip and to form a transparent resin substance(23). A concavo-convex part(23C) is formed on a surface of the transparent resin substance. The concavo-convex part is compressed by using a mechanism having a corresponding concavo-convex par formed at a surface of an end thereof. The concavo-convex part has one of a hemispheric shape, a cone, a polygonal pyramid, a cylinder, a polygonal prism, a cone pyramid, and a polygonal cone pyramid.

Description

Manufacturing method of light emitting diode package {METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE}

1 is a flowchart illustrating a method of manufacturing a light emitting diode package according to the present invention.

2 to 4C are views for explaining a method of manufacturing a light emitting diode package according to an embodiment of the present invention.

The present invention relates to a light emitting diode package manufacturing method, and more particularly, to a light emitting diode package manufacturing method comprising a light-transmitting resin with improved light emission efficiency.

Generally, a light source system using a light emitting diode chip uses various types of packages having a cavity open in a light emitting direction according to the intended use, and mounts a light emitting diode (LED) chip in the cavity and bonds conductive wires. Then, it is manufactured by a method of encapsulating a light emitting diode chip by molding a liquid or solid epoxy resin to form a transparent resin body. In this case, a light emitting diode package can be provided which emits white light by appropriate selection of the light emitting diode chip and the phosphor mixed in the molding liquid.

On the other hand, in the general light emitting diode package manufactured by this method, when the transparent resin containing phosphor is filled in the cavity of the light emitting diode chip, the upper surface of the transparent resin is concave to reduce the light emission efficiency. In addition, when the amount of the transparent resin is increased to solve this problem, the light-transmissive resin protrudes above the upper surface of the package main body, which may be damaged or contaminated by external force.

Therefore, there is a need for a method for solving the problem that the amount of transparent resin is not increased so that the light-transmissive resin does not protrude above the upper surface of the package body, thereby reducing the light emission efficiency of the upper surface of the transparent resin formed concave. It is becoming.

The present invention is to provide a method of manufacturing a light emitting diode package that can improve the luminous efficiency.

Another object of the present invention is to provide a light emitting diode package manufacturing method capable of increasing light emission efficiency by forming an uneven portion on the surface of an upper surface of a concave transparent resin.

In order to achieve the above technical problem, a method of manufacturing a light emitting diode package according to the present invention includes mounting a light emitting diode chip in a cavity of a package main body, filling a liquid resin covering the light emitting diode chip in the cavity, and having a concave surface thereof. After forming the transparent resin, it includes forming an uneven portion on the surface of the transparent resin. Moreover, the said uneven | corrugated part is crimped | formed and formed by the mechanism which has the uneven | corrugated part corresponding to the shape in the end surface.

In addition, the concave-convex portion preferably has a shape of any one of a conical, polygonal pyramid, cylindrical, polygonal columnar, truncated cone and polygonal truncated cone.

Accordingly, light generated in the light emitting diode chip is easily emitted to the outside.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided as examples to ensure that the spirit of the present invention can be fully conveyed to those skilled in the art. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. And, in the drawings, the width, length, thickness, etc. of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 is a flowchart illustrating a method of manufacturing a light emitting diode package according to the present invention, and FIGS. 2 to 4c are views illustrating a method of manufacturing a light emitting diode package according to an embodiment of the present invention. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 2, the LED package includes a pair of lead terminals, that is, first and second lead terminals 11 and 13. The first and second lead terminals 11 and 13 define a light emitting diode chip mounting region. Meanwhile, the second lead terminal 13 is spaced apart from the first lead terminal 11 and is generally positioned at the same level as the first lead terminal 11.

The first and second lead terminals 11 and 13 are formed from a lead frame made of a phosphor bronze plate, and the first and second lead terminals 11 and 13 are usually made of silver (Ag) to improve reflectance. Plated with.

The first and second lead terminals 11 and 13 are supported by the package body 15. The package body 15 may be formed by insert molding the lead terminals 11 and 13.

In addition, the first and second lead terminals 11 and 13 protrude out of the package main body 15 to be electrically connected to an external power source. Although not shown here for convenience, the lead terminals 11 and 13 protruding to the outside may have various shapes and may be bent into various shapes. Since the lead terminals can be bent in various shapes, the LED package manufacturing method according to the present invention can be applied to LED packages of various forms.

The package body 15 has a cavity 21 exposing a portion of the first and second lead terminals 11 and 13 and a light emitting diode chip 17 mounted thereon. Accordingly, the light emitted from the light emitting diode chip 17 is emitted above the package body 15, that is, in the direction in which the cavity 21 is opened.

According to an embodiment of the present invention, the LED chip 17 is mounted in the LED chip mounting region in the cavity 21 and electrically connected to the first and second lead terminals 11 and 13 (1). . As illustrated, the light emitting diode chip 17 may be mounted on the first lead terminal 11 and electrically connected to the second lead terminal 13 by the bonding wire 19.

Subsequently, the cavity 21 is filled with a liquid resin containing phosphors to form a transparent resin 23 (3). The transparent resin 62 may be formed by doping a liquid resin containing phosphor in the cavity 21 and then curing the liquid resin, and thus, the transparent resin 23 is formed in the lower portion of the cavity 215. Can be. That is, the height of the transparent resin 23 formed in the cavity 21 is preferably located below the top surface of the package body 15.

The transparent resin member 23 may be formed of, for example, epoxy or silicone resin, and may include a phosphor for converting light emitted from the light emitting diode chip 17, for example, blue light into yellow light, thereby providing white light. Emitting light emitting diode packages may be provided. The light emitting diode chip 17 and the phosphor may be variously selected, and thus light of various colors may be realized.

And, as shown in Figure 3 to form an uneven portion on the surface of the transparent resin 23 (5). In this case, when the transparent resin 23 is hardened to a degree that can be molded, the mechanism having the uneven portion corresponding to the shape of the uneven portion 23C to be formed on the surface of the transparent resin 23 on the end surface thereof. By pressing the surface of the transparent resin member 23 at a constant pressure by using, the uneven portion 23C having a shape corresponding to that of the uneven portion of the surface of the instrument can be formed on the surface of the transparent resin 23. .

In general, the light emitted from the light emitting diode chip 17 is not easily emitted to the outside from the concave or flat surface of the transparent resin 23 according to the total reflection phenomenon, but light is scattered as the uneven part 23C is formed. It is easily released to the outside.

Thus, the method of forming the uneven portion 23C on the surface of the transparent resin body 23 in a manner of compression using a mechanism having an uneven portion on the end surface is not only easy to apply, but also the uneven portion of the end surface of the mechanism By providing it in various forms, the uneven part 23C of various forms can be formed.

4A to 4C show a cross section of the uneven portion 23C that may be formed on the surface of the transparent resin 23, and illustrate some of the various possible forms of the uneven portion 23C as an example.

Referring to the drawings, the uneven portion 23C may be formed in various shapes such as hemispherical, cylindrical or polygonal pillar shape, cone or polygonal pyramidal shape and truncated cone or polygonal truncated cone shape.

Accordingly, even in the case of concave or flat transparent resins that are not damaged or contaminated by external force, a light emitting diode package is manufactured in which a concave-convex portion is formed on the surface in such a manner that the manufacturing cost is not easily increased. A method can be provided and the luminous efficiency improves in the light emitting diode package provided with the translucent resin of concave or flat form.

According to embodiments of the present invention, it is possible to provide a light emitting diode package manufacturing method that can improve the luminous efficiency by forming the surface of the transparent resin in an uneven shape. In addition, in order to form the surface of the transparent resin body in an uneven shape, by using a mechanism having uneven portions corresponding to the shape, the process is simple and there is an effect of not increasing the manufacturing cost.

Claims (2)

Mounting a light emitting diode chip in a cavity of the package body; Filling a transparent resin covering the light emitting diode chip in the cavity to form a transparent resin body having a concave shape; And And forming an uneven portion on the surface of the transparent resin body, wherein the uneven portion is formed by being pressed by a mechanism having an uneven portion corresponding to a shape on an end surface thereof. The method according to claim 1, The concave-convex portion of the light emitting diode package manufacturing method characterized in that it has a shape of any one of hemispherical, conical, polygonal, cylindrical, polygonal, cone-shaped and polygonal truncated.

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