CN1508864A - Chip Packaging board - Google Patents
Chip Packaging board Download PDFInfo
- Publication number
- CN1508864A CN1508864A CNA021551863A CN02155186A CN1508864A CN 1508864 A CN1508864 A CN 1508864A CN A021551863 A CNA021551863 A CN A021551863A CN 02155186 A CN02155186 A CN 02155186A CN 1508864 A CN1508864 A CN 1508864A
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- CN
- China
- Prior art keywords
- substrate unit
- support plate
- chip packaging
- cutting groove
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P80/00—Climate change mitigation technologies for sector-wide applications
- Y02P80/30—Reducing waste in manufacturing processes; Calculations of released waste quantities
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Abstract
The invention is suitable to packaging form of plastic package ball grid array. Since structural reason in design, traditional carrier plate leaves over more unusable frame waste material after cutting. The packaging carrier plate provided by the invention is composed of multiple substrate units. Porthole for filling glue is setup at each substrate unit, and slots are setup on left and right sides as well as low sides of substrate units. There is notch on up side of a substrate unit with no slot. Low side of a substrate unit with slot is extruded downwards, and the extruded object is matched to the said notch. The specific design reduces frame waste material generated so as to lower packing cost.
Description
Technical field
The present invention relates to a kind of support plate, can be used for the encapsulation of chip, the invention particularly relates to a kind of support plate that is applicable to plastic ball grid array (PBGA) packing forms.
Background technology
The Chip Packaging form of PBGA (plastic ball grid array) is by extensive and a large amount of technology of using in the present integrated circuit encapsulation field.Be accompanied by the development of electronic technology high density and miniaturization, and the use of new technology such as lead-free solder, used substrate is also constantly towards high density in the PBGA encapsulation, and the direction of high reliability develops.The thing followed is, the cost of substrate unit are also constantly increases, and the cost of substrate has accounted for a big chunk of sealing cost at present.Below the structure and the manufacture process of traditional PBGA support plate (substrate) are done a summary.
See also Fig. 1 and Fig. 2, every support plate generally can be made of a plurality of substrate unit 100, is formed with cutting groove 101 around each substrate unit 100.And also be provided with a gum-injecting port 102 on the angle on each substrate unit 100, be used for the injecting glue of plastic encapsulant.In the appropriate position of whole support plate several location holes 103 can be set, be used for playing the role of positioning in process of production.
When Chip Packaging,, usually several chips are encapsulated on a support plate simultaneously in order to enhance productivity.After encapsulation is finished, adopt the method for die cut, each substrate unit downcut by cutting groove 101, form as shown in Figure 3 individual devices 104 with played the cut frame waste material 106 that becomes of the housing that is connected substrate unit 100 originally.Because this a part of material can't reclaim and utilization again, caused the wastage of material of quite a few, increased the cost of encapsulation.And because the gum-injecting port 102 that location hole 103 and Plastic Package are used is necessary part in the present stage packaging technology, so single from shortening the length and the width of support plate rectangle band, the space under saving is very limited.So problems of the prior art are the generations that can't fundamentally solve frame waste material 106, production cost is high.
Summary of the invention
Therefore, the objective of the invention is to reduce the generation of frame waste material as much as possible, thereby reduce the cost of support plate by improving the design of support plate.
According to above-mentioned purpose of the present invention, the invention provides a kind of chip packaging carrying plate, constitute by a plurality of substrate unit, each substrate unit is provided with gum-injecting port, it is characterized in that be provided with cutting groove at the left and right sides and the downside of described substrate unit, the upside that described substrate unit does not have cutting groove is provided with breach, described substrate unit has the downside of cutting groove outstanding downwards, and the outstanding breach with described upside of described downside is complementary.
Further feature, advantage and the effect of chip packaging carrying plate of the present invention will be further described and explain by the following examples.
Description of drawings
Fig. 1-Fig. 3 shows the structure and the encapsulation process of traditional die encapsulating carrier plate;
Fig. 4-Fig. 6 shows the structure and the encapsulation process of chip packaging carrying plate of the present invention;
Fig. 7 shows the jigsaw example of chip packaging carrying plate of the present invention.
Embodiment
Chip packaging carrying plate of the present invention has been done improvement on the basis of traditional support plate, saved the cutting groove of traditional support plate top one side.
As shown in Figure 4 and Figure 5, support plate of the present invention comprises a plurality of substrate unit 200, and the left and right sides of each substrate unit 200 and downside are provided with cutting groove 201, and the upside of substrate unit 200 does not have cutting groove, but is provided with breach 204.Substrate unit 200 has the downside of cutting groove outstanding downwards, and the outstanding breach with upside of downside is complementary.Gum-injecting port on the support plate and location hole 203 are identical with traditional structure, on each substrate unit 200 gum-injecting port 202 are set, and the appropriate position of support plate is provided with several location holes 203.
Because cutting groove cancellation with substrate unit 200 tops, and indent, like this, as shown in Figure 6, after encapsulation was finished, the frame waste material 206 that die cut produces was compared with traditional frame waste material 106 shown in Figure 3, reduced widely, therefore, chip packaging carrying plate of the present invention is in the use of carrier plate material, and is more economical.
In addition, because recessed prominent coupling structure on the support plate of the present invention can carry out the jigsaw design as shown in Figure 7 when making support plate.When jigsaw, the projection of the breach on the substrate unit top of support plate and the substrate unit bottom of another support plate is mated meshing mutually, has saved the required material area of production support plate, thereby has improved the output of unit are, has further saved cost.
As mentioned above, the present invention has saved a part of raw material, thereby has reached the purpose that reduces cost.And above-mentioned improved realization of the present invention also need not the plate mill and encapsulation factory increases any new equipment investment, and the support plate production cost is reduced, thereby has reduced the cost of whole encapsulation process.
Claims (1)
1, a kind of chip packaging carrying plate, constitute by a plurality of substrate unit, each substrate unit is provided with gum-injecting port, it is characterized in that, left and right sides and downside in described substrate unit are provided with cutting groove, the upside that described substrate unit does not have cutting groove is provided with breach, and described substrate unit has the downside of cutting groove outstanding downwards, and the outstanding breach with described upside of described downside is complementary.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021551863A CN1508864A (en) | 2002-12-19 | 2002-12-19 | Chip Packaging board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021551863A CN1508864A (en) | 2002-12-19 | 2002-12-19 | Chip Packaging board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1508864A true CN1508864A (en) | 2004-06-30 |
Family
ID=34235777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA021551863A Pending CN1508864A (en) | 2002-12-19 | 2002-12-19 | Chip Packaging board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1508864A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100382266C (en) * | 2005-05-17 | 2008-04-16 | 华为技术有限公司 | Ball mounting method and apparatus for ball grid array packaging substrate |
-
2002
- 2002-12-19 CN CNA021551863A patent/CN1508864A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100382266C (en) * | 2005-05-17 | 2008-04-16 | 华为技术有限公司 | Ball mounting method and apparatus for ball grid array packaging substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |