CN1501038A - Temperature adjusting and controlling method for minitype experiment period and special apparatus therefor - Google Patents
Temperature adjusting and controlling method for minitype experiment period and special apparatus therefor Download PDFInfo
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- CN1501038A CN1501038A CNA021486794A CN02148679A CN1501038A CN 1501038 A CN1501038 A CN 1501038A CN A021486794 A CNA021486794 A CN A021486794A CN 02148679 A CN02148679 A CN 02148679A CN 1501038 A CN1501038 A CN 1501038A
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Abstract
The present invention relates to temperature regulating and controlling method and special apparatus suitable for miniature experiment section. When the temperature of metal body is higher or lower than the temperature the temperature control instrument sets, the temperature controlling circuit will control the conversion of power supply polarity to make the temperature of the metal body within the range around the set temperature. The apparatus includes one metal body with experiment section flow channel, semiconductor refrigerator mounted on the metal body, heat sink set on the semiconductor refrigerator, heat isolating lay to cover the metal body except the part the semiconductor refrigerator is mounted; and temperature sensor fixed inside the hole in the metal body and connected to the temperature control instrument, with the heat sink being connected electrically to the DC power supply and the temperature control instrument via the temperature control circuit.
Description
Technical field
The present invention relates to a kind of method and isolated plant of temperature adjustment temperature control, particularly relate to a kind of method and isolated plant of being suitable for temperature adjustment temperature control in the microscale experiment section that is used for the laboratory.
Background technology
In the micro liquid flowing experiment, environment temperature directly influences the flow behavior of liquid in fluid channel (the general micron diameter capillary that adopts of experiment).In order to regulate and the environment temperature of stable experimental section, usually must be by controlling the temperature (employing air conditioner) in the room, laboratory or adopting the method and apparatus of local controlled temperature cabinet to realize, all on sale on this class register market.But this class register not only makes the adjustment process need be for a long time, the extremely requirement of incompatibility scientific experiment; And this method temperature control precision is low, can not satisfy the requirement of scientific experiment; And this kind cost of equipment height, energy consumption is big, temperature regulating range is little, and the harsh requirement that is difficult to create in the scientific experiment and is proposed is as the low temperature environment near 0 ℃.Particularly can be used for directly yet there are no report in the experiments such as micro liquid flowing experiment, liquid viscosity mensuration or high pressure liquid chromatographic analysis for experimental section provides micro constant-temperature device stable, adjustable temperature environment.
Summary of the invention
The objective of the invention is in order to overcome the defective of prior art, can create adjustable temperature environment on a large scale for experimental section quickly and efficiently, thereby providing a kind of is used for the micro liquid flowing experiment, liquid viscosity is measured or high pressure liquid chromatographic analysis etc. tests, not only had refrigerating function, simultaneously but also have the function of heating and constant temperature, be suitable for the method and the isolated plant of temperature adjustment temperature control in the microscale experiment section.
The object of the present invention is achieved like this:
The method that is suitable for temperature adjustment temperature control in the microscale experiment section provided by the invention, it is characterized in that: comprising: place the experiment thing in the experimental section of on a metal body, being opened, the metal body outer wall posts semiconductor cooler, semiconductor cooler is bound up on the temperature-control circuit, by the control temperature of metal body, realize temperature adjustment temperature control to experiment thing in the experimental section.When temperature of metal body is higher or lower than the temperature that temperature control instrument sets, by the conversion of temperature-control circuit control electric power polarity, in the fluctuation range that the temperature that temperature of metal body is controlled at set allows.
The isolated plant that is suitable for temperature adjustment temperature control method in the microscale experiment section provided by the invention; Comprise: dc source, temperature control instrument, temperature-control circuit and temperature sensor; It is characterized in that: also comprise a metal body, at least one block semiconductor refrigerator, radiator and insulation material thermal insulation layer; Wherein have placement on the metal body and need the experimental section runner of experiment thing of temperature adjustment temperature control and the hole of a laying temperature sensor, semiconductor cooler is installed on the surface of metal body, radiator is installed on the semiconductor cooler, the position of the metal body outside except that semiconductor cooling device is installed all coats with the insulation layer, and this temperature sensor is electrically connected with temperature control instrument; Radiator is electrically connected with temperature-control circuit; This temperature-control circuit is electrically connected with dc source and temperature control instrument respectively.
Described radiator also comprises a cooling fan, and is installed in the radiator outside, and it is electrically connected with temperature-control circuit.
Described semiconductor cooler is installed on a face of metal body, 2 planes of symmetry or 4 faces.
Open near the runner of the experimental section on the metal body in described temperature sensor mounted hole, and the runner of close experimental section.
When the experiment thing was liquid, with in the capillary, this capillary front end connected a precooling/heat pipe with its experiment of packing into, and the rear end connects the glass tube of a metering usefulness, and this pipe inserts in the experimental section runner.
The invention has the advantages that:
The method that is suitable for temperature adjustment temperature control in the microscale experiment section of the present invention utilizes that semiconductor cooling device not only can freeze, after the power supply reversal connection but also the characteristics that can heat, with its cooling or heating of metal body.Temperature sensor is housed on the metal body, design temperature on temperature measurement signal and the temperature control instrument relatively after, connection direction and turn-on time by control circuit control semiconductor cooling device power supply,, temperature of metal body allows within the fluctuation range thereby being controlled at design temperature.Have the runner of placing experimental section in the metal body, thereby for experimental section provides required precise dose environment as quickly as possible, for advantage has been created in scientific experiment.
Isolated plant of the present invention regulates machine with the experiment space air of present use or local controlled temperature cabinet is compared, the present invention has heating and refrigeration dual-use function, and thermoregulation range is wide, can reach 0-50 ℃, even wider, also have series of advantages such as temperature adjustment speed is fast, accuracy of temperature control is high, power is little, energy-conservation.
Description of drawings
Fig. 1 is a kind of example structure schematic diagram that is suitable for the isolated plant of temperature adjustment temperature control method in the microscale experiment section of the present invention
Drawing is described as follows:
1. metal body 2. semiconductor coolers 3. radiators
4. cooling fan 5,6. insulation layer 7. temperature sensor
9. temperature-control circuit 10. dc sources 11. precoolings/heat pipe
12. the glass tube of capillary 13. experimental section runners 14. metering usefulness
Make the isolated plant that is suitable for temperature adjustment temperature control method in the microscale experiment section by accompanying drawing 1, the rectangular copper of getting a block length 180mm is as metal body 1, and its sectional area is 50mm * 50mm; Make a call to the hole that a diameter is 4mm along long side direction in the middle, as the experimental section runner 13 of placing experimental section, in experimental section runner 13, insert one precooling/heat pipe 11, and the front end of this pipe is exposed at outside the metal body 1, terminal and diameter is that the 0.1mm-4mm experiment is joined with capillary 12, and this capillary rear end connects the glass tube 14 of a metering usefulness.On the top of metal body 1 and have between the radiator 3 of fin a plate semiconductor cooler 2 is installed, perhaps a cooling fan 4 can also be installed on radiator 3 again.The position of metal body 1 except that end face is installed semiconductor cooler all coats with insulation layer 5,6.In addition, be the 4mm duct opening a diameter that inserts temperature sensor 7 again near the position of experimental section runner 13; This temperature sensor 7 is electrically connected with temperature control instrument 8; Radiator 3 is electrically connected with temperature-control circuit 9; This temperature-control circuit 9 is electrically connected with dc source 10 and temperature control instrument 8 respectively.Wherein control circuit 9 is common temperature control circuits, and semiconductor cooler 2 sizes are a long 40mm * thick 40mm's; Above semiconductor cooler 2, temperature sensor 7, dc source 10 and temperature control instrument all are auxiliary products of buying on the market.
Embodiment 2
On the device of embodiment 1, adorn a plate semiconductor cooler 2 again in the bottom surface of metal body 1; Cooling fan 4 is equipped with in the heat radiator fin outside, and temperature sensor 7 is contained in the hole of being opened on the metal body 1, and conventional temperature control instrument 8 is controlled the connection direction and the turn-on time of dc source 10 by temperature-control circuit 9.When metal body 1 temperature was higher than the design temperature of temperature control instrument 8, that side that semiconductor cooler 2 is attached to metal body 1 was a cold junction, was the hot junction near heat sink side, and semiconductor cooler 2 makes metal body 1 cooling during energising; When metal body 1 temperature is lower than design temperature, connect directions by changing dc source 10, semiconductor cooler 2 side that belongs to body 1 of gilding becomes the hot junction, thereby to metal body 1 heating, its temperature is controlled at design temperature allows within the fluctuation range.Temperature control instrument 8 can be selected the corresponding auxiliary products or and the different circuit design that can satisfy above-mentioned control temperature requirement for use with control circuit 9 and dc source 10.
Claims (5)
1. method that is suitable for temperature adjustment temperature control in the microscale experiment section, it is characterized in that: comprising: the experimental section of in a metal body, being opened, the metal body outer wall posts semiconductor cooler, semiconductor cooler is bound up on the temperature-control circuit, by the control temperature of metal body, realize the temperature adjustment temperature control of experiment thing in the experimental section.When temperature of metal body is higher or lower than the temperature that temperature control instrument sets, conversion by temperature-control circuit control electric power polarity comprises a metal body (1), at least one block semiconductor refrigerator (2), radiator (3) and insulation layer (5,6); Wherein have the experimental section runner (13) of the need temperature adjustment temperature control of placing the experiment thing and the hole of laying temperature sensor (7) on the metal body (1), semiconductor cooler (2) is installed on the surface of metal body (1), radiator (3) is installed on the semiconductor cooler (2), the place of the metal body outside except that semiconductor cooling device is installed all uses insulation material thermal insulation layer (5,6) to be coated on the metal body outside; This temperature sensor (7) is electrically connected with temperature control instrument (8); Radiator (3) is electrically connected with temperature-control circuit (9); This temperature-control circuit (9) is electrically connected with dc source (10) and temperature control instrument (8) respectively.
2. the isolated plant that is suitable for the method for temperature adjustment temperature control in the microscale experiment section according to claim 2, it is characterized in that: also comprise a cooling fan, this cooling fan (4) is installed in radiator (3) outside, and cooling fan is electrically connected with temperature-control circuit (9).
3, the isolated plant that is suitable for the method for temperature adjustment temperature control in the microscale experiment section according to claim 2, it is characterized in that: be to be contained in an experiment when testing thing with in the capillary (12) for liquid, capillary (12) front end connects a precooling/heat pipe (11), the rear end connects the glass tube (14) of a metering usefulness, and this pipe inserts in the runner (13) of experimental section.
4, the isolated plant that is suitable for the method for temperature adjustment temperature control in the microscale experiment section according to claim 2 is characterized in that: described semiconductor cooler (2) is installed in respectively on the face of metal body, on 2 planes of symmetry or on 4 faces.
5, the isolated plant that is suitable for the method for temperature adjustment temperature control in the microscale experiment section according to claim 2, it is characterized in that: the position of close experimental section runner (13) on metal body is opened in described temperature sensor mounted hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02148679 CN1208590C (en) | 2002-11-15 | 2002-11-15 | Temperature adjusting and controlling method for minitype experiment period and special apparatus therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02148679 CN1208590C (en) | 2002-11-15 | 2002-11-15 | Temperature adjusting and controlling method for minitype experiment period and special apparatus therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1501038A true CN1501038A (en) | 2004-06-02 |
| CN1208590C CN1208590C (en) | 2005-06-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 02148679 Expired - Fee Related CN1208590C (en) | 2002-11-15 | 2002-11-15 | Temperature adjusting and controlling method for minitype experiment period and special apparatus therefor |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100549695C (en) * | 2004-04-13 | 2009-10-14 | 中国科学院力学研究所 | A kind of measuring instrument of real-time human body blood viscosity |
| CN102654489A (en) * | 2012-05-02 | 2012-09-05 | 辽宁科技大学 | Middle and low temperature control device of simulated moving bed chromatograph |
| CN102927716A (en) * | 2012-11-01 | 2013-02-13 | 西北大学 | Automatic temperature control ultralow temperature semiconductor refrigerator and automatic temperature control method thereof |
| CN103521281A (en) * | 2013-10-23 | 2014-01-22 | 中国科学院声学研究所 | Temperature control pipetting device |
| CN102149474B (en) * | 2008-08-01 | 2014-12-24 | 艾本德股份有限公司 | Heating/cooling device having opportunity for testing and method for testing a heating/cooling device |
| CN106769339A (en) * | 2017-02-28 | 2017-05-31 | 河海大学 | Analogue means and application process of the deepwater environment to cement-based material performance impact |
| CN106861779A (en) * | 2017-02-20 | 2017-06-20 | 广东工业大学 | A kind of segmented micro-fluidic chip temperature regulating device |
| CN108036995A (en) * | 2018-01-16 | 2018-05-15 | 南京大学 | A kind of smell booster based on pre-concentration principle |
| CN109283172A (en) * | 2018-11-23 | 2019-01-29 | 大连航创科技有限公司 | A kind of miniaturization NO gas-detecting device |
| CN111487162A (en) * | 2020-05-14 | 2020-08-04 | 南开大学 | Device for measuring liquid viscosity coefficient by capillary method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101818964A (en) * | 2010-04-16 | 2010-09-01 | 深圳市普康电子有限公司 | Biochemical instrument refrigeration system with semiconductor refrigeration chip |
-
2002
- 2002-11-15 CN CN 02148679 patent/CN1208590C/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100549695C (en) * | 2004-04-13 | 2009-10-14 | 中国科学院力学研究所 | A kind of measuring instrument of real-time human body blood viscosity |
| CN102149474B (en) * | 2008-08-01 | 2014-12-24 | 艾本德股份有限公司 | Heating/cooling device having opportunity for testing and method for testing a heating/cooling device |
| CN102654489A (en) * | 2012-05-02 | 2012-09-05 | 辽宁科技大学 | Middle and low temperature control device of simulated moving bed chromatograph |
| CN102927716A (en) * | 2012-11-01 | 2013-02-13 | 西北大学 | Automatic temperature control ultralow temperature semiconductor refrigerator and automatic temperature control method thereof |
| CN102927716B (en) * | 2012-11-01 | 2015-03-25 | 西北大学 | Automatic temperature control ultralow temperature semiconductor refrigerator and automatic temperature control method thereof |
| CN103521281A (en) * | 2013-10-23 | 2014-01-22 | 中国科学院声学研究所 | Temperature control pipetting device |
| CN106861779A (en) * | 2017-02-20 | 2017-06-20 | 广东工业大学 | A kind of segmented micro-fluidic chip temperature regulating device |
| CN106769339A (en) * | 2017-02-28 | 2017-05-31 | 河海大学 | Analogue means and application process of the deepwater environment to cement-based material performance impact |
| CN106769339B (en) * | 2017-02-28 | 2020-03-17 | 河海大学 | Simulation device for influence of deepwater environment on performance of cement-based material and application method |
| CN108036995A (en) * | 2018-01-16 | 2018-05-15 | 南京大学 | A kind of smell booster based on pre-concentration principle |
| CN109283172A (en) * | 2018-11-23 | 2019-01-29 | 大连航创科技有限公司 | A kind of miniaturization NO gas-detecting device |
| CN109283172B (en) * | 2018-11-23 | 2021-05-11 | 大连航创科技有限公司 | Miniaturized NO gas detection device |
| CN111487162A (en) * | 2020-05-14 | 2020-08-04 | 南开大学 | Device for measuring liquid viscosity coefficient by capillary method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1208590C (en) | 2005-06-29 |
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