CN1497409A

CN1497409A - Thickening casing for heat source

Info

Publication number: CN1497409A
Application number: CNA031380794A
Authority: CN
Inventors: 松王; 王松
Original assignee: Individual
Current assignee: Individual
Priority date: 2002-05-27
Filing date: 2003-05-27
Publication date: 2004-05-19

Abstract

A thickened casing for the heat source which may be computer or the devices in computer is disclosed, which can play such roles as preventing hardware, software and files from being stolen or destroyed, preventing electromagnetic interference, and suppressing computer noise. Its thickness is greater than 1.1 mm. Said thickened casing can also be combined with the heat dissipation member of heat source.

Description

The thickening casing of thermal source

One. technical field ... ... ... ... ... ... ... .... page or leaf 1

Two. background technology ... ... ... ... ... ... ... ... .1

Three. technical matters ... ... ... ... ... ... ... ... .1

Four. technical scheme ... ... ... ... ... ... ... ... .2

Five. technical scheme is about thermal source ... ... ... ... ... ... ..2

Six. technical scheme is about thickening casing ... ... ... ... ... ... .3

Seven. technical scheme is about the control of thermal source and thickening casing ... ... ... ... .5

Eight. technical scheme is about the heat radiation of thermal source and thickening casing combination ... ... ... 7

Nine. technical scheme is about the heat conductor of thermal source and thickening casing combination heat radiation ... ... 8

Ten. technical scheme is about the thermal source of thermal source and thickening casing combination heat radiation ... ... ..9

11. technical scheme is about the thickening casing of thermal source and thickening casing combination heat radiation ... .10

12. beneficial effect ... ... ... ... ... ... ... .10

13. Summary of drawings ... ... ... ... ... ... ... .12

14. embodiment ... ... ... ... ... ... ... .12

One. technical field:

This case relates to the structure of computer, relates in particular to the door closure control of computer casing and the thermal source control of enclosure.

Two. background technology:

The consideration that the manufacturer of known computer reduces for easy to carry or cost, its sheathing material be the thickness of 0.5～0.8mm only usually, and weight is lighter, and reserves many bigger louvres.

Though indivedual types have lock, and the lock of the usefulness small padlock that to be protectiveness very little or the simple and easy lock of common key.

Increasing capsule information are entering computer, and computer hardware and data information anti-stolen and tamper-proof four nearly all be blank.The correction of papery account book has sign of erasure, and the vestige that the Electronic Data Processing account book is altered all completely without.Even afterwards or chance on mistake, the mistake when being the data input so? it is the mistake of maloperation? it is other people bad correction? its reason and responsibility all are difficult to assert.Easily a large amount of stolen of data information, stolen or destroy after will be difficult to timely discovery, also be difficult to corrigendum and recover as destroyed.The password of booting computer and data file is shaped like a hypothetical, opens shell as long as coomputerate slightly, and all files have all had.Inconvenience is imported, inquired about, calls to the password of data file.Password is easily spied on by other people or is adopted decryption software to sweep sign indicating number and break through.

Because the running frequency of computer is very high, the frequency band of radiation is very wide, and sheathing material is thinner, the effect of electromagnetic screen is not good enough, electromagnetic screen not only is related to the stable operation of computer, also is related to the interference of computer to other electrical equipment, more is related to the hurt of electromagnetic wave to peripheral crowd.

Long-continued computer noise, to operating personnel and peripheral personnel component interference, in quiet places such as commander, monitoring, design, medical treatment, the place of especially many computers, the computer noise is exactly to endanger really, is the difficult problem that people need to be resolved hurrily.

Three. technical matters:

Improve the security performance of computer, minimum comprising: 1. artificial safety to the anti-pilferage of computer hardware, computer program, computer document, tamper-proof, anti-spying on, comprises the deletion of the interpolation of antivirus program, anti-file or modification etc. to the tamper-proof of software; 2. shield safety, suppress the computer electromagnetic wave, suppress the electromagnetic interference (EMI) of environment simultaneously computer to the divulging a secret of information, to personnel's injury, to the interference of electrical equipment; 3. noise safety suppresses interference or the damage of computer noise to personnel.

Four. technical scheme:

The thickening casing of thermal source by thermal source and the combination of metal thickening casing, is characterized in that, the inside of thickening casing, had the one or more connection that has connected the operation power supply thermal source of thickening casing external data line, and the material average thickness of thickening casing is 1.1～1.4mm, contain 1.4mm or, 1.4～1.7mm, contain 1.7mm or, 1.7～2.1mm, contain 2.1mm or, 2.1～2.6mm, contain 2.6mm or, 2.6～3.2mm, contain 3.2mm or,＞3.2mm.

Thermal source has been connected data line with the outside of thickening casing, and has connected the power supply of operation, has possessed the pacing items of thermal source at the thickening casing internal operation.For volume and the essentially identical thickening casing of material, the increase of thickness will cause the increase of weight, realization this case purpose that the increase of thickness and weight can be preliminary.

The thickening casing of thermal source, by thermal source and the proof box combination that is equipped with lock construction element, it is characterized in that the inside of thickening casing, had the connection that connected the operation power supply thermal source of thickening casing external data line, and the material thickness of thickening casing is 1.2～1.4mm, contain 1.4mm or, 1.4～1.7mm, contain 1.7mm or, 1.7～2.1mm, contain 2.1mm or,＞2.1mm.

At concrete application, the shell and the control member thereof of thermal source and proof box are combined, can better realize this case purpose.The control member of described proof box and control structure thereof are held after treating and are stated.

Described operation power supply, be meant the power supply that electric energy can be provided for the normal operation of thermal source, can be battery or the storage battery that self has electric energy, also can be the power supply unit that connects the urban network electricity source, minimumly comprise or made up: the rechargeable battery of UPS, supply convertor, storage battery, fuel cell, eliminating memory purposes button cell.

Five. technical scheme is about thermal source:

Described thermal source, be meant in operation and the time have more power consumption and produce more heat transfer, have independently the computer circuits parts and the computer complete machine thereof of utility function, minimumly comprise or made up: indivedual computer part, a complete set of host computer parts, be furnished with case host computer, be furnished with the computer complete machine of case.

Described circuit block minimumly comprises or has made up: processor or, north bridge or, hard disk or, CD drive or, high power valve or, fuel cell, and the assembly of thermal source.

Described processor minimumly comprises or has made up: microprocessor MPU, central processor CPU, image processor GPU, digital signal processor DSP, single-chip, integrated chip, System on Chip/SoC.Described single-chip is meant one or more processor chips and the integrated chip that is manufactured on single chip of other computer chip.Described integrated chip is meant the chip with one or more processor chips and the integrated encapsulation of other computer chip.The interface of processor minimumly comprises or has made up: the slot contact on the CPU next door of the stitch interface of common plane, similar Slot1, and the contact of the contact that compresses mutually that may adopt in the future.

Described CD drive minimumly comprises or has made up: CD-R, CD-RW, DVD-R, DVD+R, DVD-RW, DVD+RW.

Described high power valve minimumly comprises or has made up: the triode of power-supply system, diode.

Described battery, minimum comprising: rechargeable battery, fuel cell.The thermal value of fuel cell is also more many greatly than rechargeable battery, but the power capacity of fuel cell is very big, be subject to people's attention,, its heat radiation can be directly carried out with reference to the radiator structure of other thermal source of this case for the effect of its heat radiation will directly influence the promotion and application of fuel cell.

The assembly of described thermal source minimumly comprises or has made up: made up the circuit board of processor, made up hard disk external portable hard drive, made up the power supply unit of high power valve.

Described complete machine is meant the various computer complete machines or the main frame of processor and input media or control device; Minimumly comprise or made up: compatible computer of IBM and Apple Computers: minimum comprising: server, workstation, industrial computer, business PC, family expenses machine; Minimumly comprise or made up: cabinet type computer or, tower computer or, pocket computer or, vertical computer or, horizontal computer or, the frame computer or, network computer or, integrated computer or, palm PC or, portable computer or, panel computer or, special purpose computer or, computer peripheral equipment.

Described input media or control device minimumly comprise or have made up: keyboard, mouse, touch-screen, acoustic control, remote control, smart card.

A. described cabinet type computer is meant that various overall volumes are 〉=678000cm ³, be fit to the computer that place on ground.

B. described tower computer is meant that overall volume is 43200～64800cm ³, contain 64800cm ³, or, 64800～135900cm ³, contain 135900cm ³, or, 135900～260300cm ³, contain 260300cm ³, or, 260300～440500cm ³, contain 440500cm ³, or, 440500～678000cm ³Host computer.

C. described pocket computer is meant that overall volume is 22200～18500cm ³, contain 18500cm ³, or, 18500～14700cm ³, contain 14700cm ³, or, 14700～11000cm ³, contain 11000cm ³, or, 11000～7200cm ³, contain 7200cm ³, or, 7200～3450cm ³, or ,≤3450cm ³Vertical host computer.

D. described vertical computer is meant various overall volume＞pocket computers, and＜tower computer, and external member only is fit to erect the host computer of placing.

E. described horizontal computer is meant that various overall volumes are identical with vertical computer, and external member is fit to horizontal positioned; Perhaps, external member be fit to horizontal positioned and erect place all can host computer.

F. described frame computer is meant that the outer wall of shell has the combination fixture, is fit to the computer of computer group of planes combination, for example: the blade computer.

G. described network computer is meant the horizontal computer main frame of no hard disk, vertical host computer, pocket computer main frame.

H. described integrated computer is meant that combined display screen is＞14.5 o'clock a computer, can select or on-keyboard, for example: the computer that 17 o'clock display screens and keyboard are arranged.

I. described palm PC is meant that combined display screen is, contains 12.5 o'clock computer at 1～12.5 o'clock.For example: the notepad computer.

J. described portable computer is meant that the display screen of combination is bigger than palm computer, and is littler than integrated computer, and display screen is with upset commissure and keyboard combination, and the computer of radiating electric fan or heat radiation electric pump is arranged.

K. described panel computer is meant that the display screen of combination is bigger than palm computer, and is littler than integrated computer, gets rid of other computer of portable computer, for example: the computer of board PC, intelligent display, radio display, electronic reader, rotatable display screen etc.

L. described special purpose computer is meant display, video player, the game machine of CPU.

M. described computer peripheral equipment, minimum comprising: storer, switch, router, hub, modulator-demodular unit, disk array.

The computer of the present medium volume size of popularizing, the vertical computer of especially medium volume size, if it is combined with the thickening casing of this case, may feel that for most of small enterprises supporting thickening casing is too tall and big, and the vertical computer of medium volume size next door vacant vertical direction spatial too much, difficult the utilization; And,, need the supporting thickening casing of larger volume on the contrary especially with the enterprise of a server or a computer group of planes for large, medium-sized enterprises.So this case is bigger for overall volume; Perhaps, the less computer of overall volume will more be added with practical reference value.

Six. technical scheme is about thickening casing:

Usually each plane of thickening casing or the material thickness at position are essentially identical, and at this moment, the material average thickness or the material thickness of thickening casing are meant the average thickness of the total area at each position on each plane of outer shell outer wall.Iff some planes or the position adopt the material of thickening, and very thin material is adopted at other plane or position, very thin material not only influences the weight of thickening casing, has more caused the leakage of electromagnetism and noise and influences this case effect.

The material average thickness or the material thickness of described thickening casing are meant that choosing 100% of the thickening casing outer wall total area is the material average thickness or the material thickness of thickening casing;

Perhaps, the material thickness of choosing thickening casing is tried one's best thick, and the average thickness on 2 close planes mutually, is the material average thickness or the material thickness of thickening casing;

Perhaps, choose the thin as far as possible position of material thickness of thickening casing, choose 100～68% of the outer shell outer wall total area, contain 68% or, 68～45%, contain 45% or, 45～30%, contain 30% or, 30～22%, contain 22% or, 22～20% or, ≤ 20% average thickness is the material average thickness or the material thickness of described thickening casing.

Give an example 1: the thickening casing of certain computer, adopted multiple thickness of material, the % ratio of the thickness of its various materials and the shared total area is respectively: 0.8mm and 17%; 1mm and 3%; 1.5mm with 19%; 10mm and 61%.If calculating average thickness with the total area is 6.49mm.Because has adopted at some positions will be slightly influential to this case effect than thin material, if strict this case effect of pursuing, then can be at the thin as far as possible position of the material thickness of thickening casing, choose some positions of the outer shell outer wall total area, can select 30% of the total area to limit, then average thickness is 1.05mm.Table 1.

Table 1: the thickness mm of various materials:	??0.8	????1??????????????????????1.5	??10	Average thickness
Table 1: the thickness mm of various materials:	??0.8	????1??????????????????????1.5	??10	Average thickness	Various materials account for the ratio of the total area:	??17％	??3％??????????????????????19％	??61％	????6.55
Choose 45% position of the total area, various materials account for the ratio of the total area: various materials account for the ratio of choosing the position area:	??17％ ??38％	??3％??????????????????????19％ ??7％??????????????????????42％	??6％ ??13％	????2.34	Various materials account for the ratio of the total area:	??17％	??3％??????????????????????19％	??61％	????6.55
	??17％ ??38％	??3％??????????????????????19％ ??7％??????????????????????42％	??6％ ??13％	????2.34	Choose 40% position of the total area, various materials account for the ratio of the total area: various materials account for the ratio of choosing the position area:	??17％ ??43％	??3％??????????????????????19％ ??8％??????????????????????48％	??1％ ??3％	????1.38
Choose 35% position of the total area, various materials account for the ratio of the total area: various materials account for the ratio of choosing the position area:	??17％ ??49％	??3％??35％-17％-3％-19％＝15％ ??9％???????????15％/35％＝43％		????1.12		??17％ ??43％	??3％??????????????????????19％ ??8％??????????????????????48％	??1％ ??3％	????1.38
	??17％ ??49％	??3％??35％-17％-3％-19％＝15％ ??9％???????????15％/35％＝43％		????1.12	Choose 40% position of the total area, various materials account for the ratio of the total area: various materials account for the ratio of choosing the position area:	??17％ ??57％	??3％??30％-17％-3％-19％＝10％ ?10％???????????10％/30％＝33％		????1.05

Described thickening casing minimumly comprises or has made up: the metal thickening casing; Perhaps, the metal thickening casing of proof box member is arranged, its manufacture method is minimum to be comprised or has made up: casting, cold forging, milling, hot pressing, extruding.

The material of described thickening casing minimumly comprises or has made up: the thickening casing of metal level and non-metallic layer combination or, contain metal the synthetic material thickening casing or, combination have hardware thickening casing or, all be the thickening casing of metal material.If adopt the synthetic material that contains metal to make thickening casing, its thickness especially fixed sturcture of internals must have specific difference with the metal thickening casing, and is lower as the temperature conductivity of material, should select the less thermal source of heat.

Described combination has the thickening casing of hardware, is meant the member that other positions such as separation structure, lock construction element, handle of shell have metal to make.

Described all is the thickening casing of metal material, minimumly comprise or made up: the planar metal plate thickening casing or, have the bending groove the sheet metal thickening casing or, with sheet metal be fixed on the local thickening of thickening casing table wall thickening casing or, local or all be the thickening casing of shape.

Described shape thickening casing is meant that the inwall of thickening casing material makes up the structure that other hardware is arranged.

Thickening casing is for better this case purpose that realizes, can select also can select thickening casing inside that more separation structure is set, the weight of common increase thickening casing with thicker material shell, for well, heavier weight is that the thickening casing global reliability shows preferably to thickening casing with heavily.The weight that can select thickening casing is 4～9kg, contain 9kg or, 9～17kg, contain 17kg or, 17～28kg, contain 28kg or, 28～40kg, contain 40kg or, 40～55kg or, 〉=55kg.

The volume of this case thickening casing is with less or big better.

The volume of thickening casing is better with less, takies less space to make things convenient for small enterprise or little department, and the overall volume that can select thickening casing is 222000～190500cm ³, contain 222000cm ³, or, 190500～156600cm ³, contain 190500cm ³, or, 156600～119000cm ³, contain 156600cm ³, or, 119000～75000cm ³, contain 119000cm ³, or, 75000～4440cm ³, contain 75000cm ³, or ,≤4440cm ³

More can select bigger thickening casing, with more greatly better, with the multi-usage that satisfies thickening casing, multidisciplinary common use, the overall volume that can select thickening casing is 222000～291000cm ³, contain 291000cm ³, or, 291000～419000cm ³, contain 419000cm ³, or, 419000～583000cm ³, contain 583000cm ³, or, 583000～778000cm ³, contain 778000cm ³, or, 778000～999000cm ³, or, 〉=999000cm ³

Described thickening casing can be selected, and its feature is minimum have been comprised: the weight kg of the thickening casing of iron and volume m ³Ratio be 220～600, contain 600 or, 600～1160, contain 1160 or, 1160～1810, contain 1810 or, 1810～2520, contain 2520 or, 2520～3300 or, 〉=3300; The thickening casing of non-iron then changes ratio according to the proportion with iron and changes.

The weight of thickening casing and the ratio of volume have not only reflected the material thickness of thickening casing, have also reflected the structure and the thickness of the barrier material of thickening casing inside.Increase the weight of thickening casing and the ratio of volume, can better realize this case purpose.Separation structure is treated the back narration.

Give an example 2: the several thickening casings that adopt iron material to make, the weight of thickening casing all is 500kg, thickening casing weight kg and volume m ³Ratio be respectively 600,1160,1810, so, the volume of thickening casing is respectively 500/600=0.833m ³, 0.431m ³, 0.276m ³

Give an example 3: ginseng higher education publishing house " pyrology " in April, 1994 version, 482 pages, the proportion of common metal material is respectively, kg/m ³: aluminium 2700, iron 7900.The ratio of aluminium and iron proportion is 0.34, so, and the material weight kg and the volume m of the thickening casing that aluminium is made ³Ratio selectable to select be 68～957, contain 957 or,＞2800* (2700/7900)=957.

Seven. technical scheme is about the control of thermal source and thickening casing:

The proof box control member of known technology proof box only has opening or ringing and wait other warning structure of control proof box and door closure thereof.

The proof box control member of this case thickening casing not only has the structure and the function thereof of the proof box control member of known proof box, and with whether opening of door closure the safety of thermal source is controlled, and also more can directly control the operation conditions of thermal source.

For better this case purpose that realizes, can be chosen in the thickening casing material inside or, the inwall of thickening casing or, the outer wall of thickening casing, combination has the various proof box control members at thermal source and thickening casing thereof, and thermal source and thickening casing thereof are carried out various control.The control member of described proof box minimumly comprises or has made up: the 1. partition member of thickening casing inside, 2. lock construction element, the 3. control assembly of thermal source and thickening casing of door closure.

1. the partition member of described thickening casing minimumly comprises or has made up: external partition or, internal partition or, the shelter of electric wire through-hole.

The outer wall of a thickening casing can have been selected one or more door closure.Inside between each door closure can be selected to carry out outer the separation with external partition, can satisfy the people of each authority, through door closure separately, each space that external partition is separated is fixed or be placed on to separately thermal source or other article respectively.

One or more interior the separation can have been selected in the inboard of a door closure.The inner space of certain door closure can be selected to carry out interior separation with one or more internal partition, can satisfy the people of certain authority, with one or more thermal source or other article, fixes or be placed on each space that internal partition is separated respectively.Owing to be the strick precaution to business enterprice sector inside, each space of interior separation is adopted the structure of opening wide or the enclosure of simple lock construction element is arranged.

Described other article minimumly comprise or have made up: cash or, the voucher data also can be protected each thermal source and data file, realizes one-object-many-purposes.

For the connection of data line, can be chosen in thickening casing and reserve the bigger data line through hole that passes data line and plug thereof and directly connect: also can select to reserve less data line through hole, after data line passes through hole, make the plug of data line again at shell.The shelter of described electric wire through-hole is meant at data line or power lead through hole position, the structure that the electric wire clearance spaces of electric wire through-hole is blocked with baffle plate.

The socket that also can select data line is set at the shell outer wall is connected with the thermal source of thickening casing inside.

The control assembly of 2. described thermal source and thickening casing, its component unit all adopts known technology, minimumly comprises or has made up: executive circuit, instruction unit.

Various executive circuits and instruction unit can select to adopt combined switch, give with or or relation make up control.

Described executive circuit is meant by the circuit of instruction unit control break-make or conversion, minimumly comprises or has made up: lock construction element executive circuit, scene pipe warning executive circuit, telecommunications warning executive circuit, thermal source executive circuit.

Described lock construction element executive circuit, scene pipe warning executive circuit, telecommunications warning executive circuit minimumly comprise or have made up its power circuit or trigger circuit.Described telecommunications warning executive circuit is meant the circuit that transmits alerting signal in special moment through local network or wireless network automatically.

Described thermal source executive circuit, be meant the data line of thermal source and the executive circuit of power lead break-make or conversion, minimumly comprise or made up: the low-tension supply line (6V, 12V) of keyboard chord, mouse lines, display line, hard disk line, CD-ROM drive line, USB line, live wire ieee1394, optical cable, grid line, telephone wire, scanner line, urban network electricity source line, ups power line, computer inside.

Described instruction unit minimumly comprises or has made up: switch and circuit thereof or, the coding-decoding circuit circuit or, remote control circuit or, the magnetic card circuit or, timing circuit.

Described switch and circuit thereof minimumly comprise or have made up: the electromagnetic relay of Purely mechanical switch, switch control, the solid-state relay of switch control.Described Purely mechanical switch minimumly comprises or has made up: automatically reset pushbutton switch, 2 bit switches, multi-position switch.

Described coding-decoding circuit circuit minimumly comprises or has made up: the digital coding-decoding circuit of computor-keyboard, the audio coding decoding circuit of phone, password coding-decoding circuit.

Described remote control circuit minimumly comprises or has made up: wireless smart card circuit, radio remote-controlled circuit, ultra-sonic remote control circuit.

Described smart card circuitry: be meant IC information intelligent card, be widely used in the electronic bus monthly ticket, detail circuits principle and application are introduced, ginseng " radio " February calendar year 2001 37 pages of wireless smart cards and application, May 36 pages of contactless smart card card reader of card reading module, October 53 pages of 48 pages of RF705 wireless smart cards on-off circuit, Dec are brief talked the intelligent wireless IC-card, ginseng "China Information World" A4 version on June 10th, 2002, the aiming smart card.Form by identification card and card reader.Wherein, card reader is made up of dispatch coil, module for reading and writing RF01～04, control chip RF602.RF705, general amplification ON-OFF control circuit.Radiowave with the emission of scrambled identification module activates the identification card that enters environs, and identification card feeds back to identification module with the scrambled of controlling oneself with radiowave again, and identification module drives executive circuit work.Identification card divides active and passive two kinds, the distance 0.05～1M of passive identification card, the distance 10～100M of active card.

Smart card can select to adopt the fixed point control structure: with identification card, the passive identification card of battary without change preferably, be fixed on the work place of thickening casing, if thickening casing has left the fixed location, the identification module of thickening casing inside will lose the scrambled of identification card, and the drive executive circuit makes thickening casing enter alarm condition.

Smart card also can be selected to adopt to decide people's control structure: the operating personnel that wear identification card can operate thermal source and thickening casing thereof, if should block away from thickening casing, and then thermal source and thickening casing thereof refusal operation.

Single thickening casing can select to be equipped with simultaneously a plurality of identification cards, and be applied to a plurality of operating personnel respectively the thermal source of each compartment is operated, and fixed point control.Smart card both can have been controlled the lock construction element executive circuit of the door closure of thickening casing, also can directly control the executive circuit of thermal source.The use of smart card, the password use amount of minimizing data file has made things convenient for use.

The principle of work of radio remote-controlled circuit and ultra-sonic remote control circuit is identical with smart card circuitry.

The effect of timing circuit is various operations or the control operation to thermal source and thickening casing thereof, carries out the qualification of each time period.For example: allow other operation in normal working time section, and the non-working time section of coming off duty will limit many operations.

3. the lock construction element of known computer adopts the cross-sectional area of single lock construction element, dead bolt very little, the thin kind in light weight, lock of lock construction element material of lock body is single, adopt easy key, and the strick precaution effect of lock construction element is not good enough.

This case according to actual needs, can select to increase the kind of the physical construction of the total cross-sectional area of dead bolt, the total weight that increases lock construction element, increase lock construction element.Described total, be meant the corresponding parameter of single member numerical value or, the numerical value of the corresponding parameter addition of a plurality of member parameters.

Described dead bolt is meant that lock construction element directly limits the position that door closure is opened.The total cross-sectional area of described increase dead bolt, can select the single dead bolt of single lock construction element to increase cross-sectional area, also can select single lock construction element to adopt the structure of a plurality of dead bolts, also can select to adopt a plurality of lock construction elements to control the structure of this door closure at a plurality of positions of single door closure, can increase the total cross-sectional area of dead bolt, thereby strengthen the external force resistance intensity of dead bolt.

The structure that the single dead bolt increase cross-sectional area of single lock construction element and single lock construction element adopt a plurality of dead bolts especially is suitable for thicker thickening casing.A plurality of lock construction elements are controlled the structure of this door closure at a plurality of positions of single door closure, especially thin thickening casing is suitable for.

The number of the dead bolt of lock construction element can be 1, also can select be 2 or, 3 or, 4 or, 〉=5.

The feature of lock construction element is that the total cross-sectional area of dead bolt is 10～18mm ³, contain 18mm ³, or, 18～33mm ³, contain 33mm ³, or, 33～51mm ³, contain 51mm ³, or, 51～74mm ³, contain 74mm ³, or, 74～99mm ³, or, 〉=99mm ³

The total weight of described increase lock construction element can select to increase the overall weight of single lock construction element, also can select to adopt the lock construction element more than 2 or 2 that the door closure of single thickening casing is controlled, and can increase the external force resistance intensity of lock construction element.

The feature of lock construction element is, the total weight of lock construction element is 99～180g, contain 180g or, 180～227g, contain 327g or, 327～517g, contain 517g or, 517～743g, contain 743g or, 743～999g or, 〉=999g.

The kind of the physical construction of described increase lock construction element, its kind minimumly comprises or has made up: minimumly comprise or made up: mechanical lock, electromechanical lock.

Described mechanical lock minimumly comprises or has made up: door lock,, the mechanical rotation coded lock of outer padlock, the special use of known technology proof box.

Described electromechanical lock, can select with the motor is power, adopts rack and pinion to cooperate or other structure, promotes the electromechanical locks of dead bolt activity; Also can select with the motor is power, and the electromechanical locks that the additionaling power of restriction dead bolt activity is unblanked: also can select with the electromagnet is power, and promote the electromagnetic lock of dead bolt activity: also can select with the electromagnet is power, the electromagnetic lock of restriction dead bolt activity.

Eight. technical scheme is about the heat radiation of thermal source and thickening casing combination:

The heat radiation of known computer also has many problem demanding prompt solutions, the computer circuits parts that in thickening casing, use still more, and especially to high performance computer circuits parts, radiator structure is with even more important.If radiator structure is not good enough, during the operation of computer computer part, the outside use that computer must be moved on to thickening casing is very much a trouble.

Described thermal source, the feature of its radiator structure be, in the inside of thickening casing or, the inwall of thickening casing or, the outer wall of thickening casing, combination has radiating element or member.

Described radiating element or member minimumly comprise or have made up: heat conductor or, heat pipe or, heating radiator or, electric fan or, the electric fan casket or, the electric fan hole or, electric pump or, semiconductor cooling device; Perhaps, other radiating element or member.Also can select the heat conductor of thermal source or thermal source to be adjacent to the radiator structure of thickening casing inwall.

Described thermal source, its radiator structure also can be selected: single thermal source, minimum one or more surface; Perhaps, the minimum one or more surface of single thermal source, the heat conductor that is adjacent to, minimum one or more surface, be adjacent to the minimum one or more surface of thickening casing inwall, and, this heat conductor heat conduction direction xsect, circular heat conductor diameter or square heat conductor width and thickness all are 0.4～1.2mm, contain 1.2mm or, 1.2～5mm, contain 5mm or,＞5mm;

Perhaps, thermal source is 0～28mm through the near-thermal road length that real core heat conductor or container heat conductor are adjacent to the thickening casing inwall, contains 0mm, or, 28～75mm contains 28mm, or, 75～132mm, contain 75mm, or 132～198mm contains 132mm, or, 198～270mm contains 198mm, or, 〉=270mm, and the diameter of near-thermal road xsect or width and thickness all are 0.4～0.8mm, contain 0.8mm, or, 0.8～2.1mm, contain 2.1mm, or 2.1～4.5mm contains 4.5mm, or, 4.5～8.1mm contains 8.1mm, or, 8.1～13mm, or, 〉=13mm, and near-thermal road length is 0～3 with the diameter of near-thermal road xsect or the ratio of catercorner length, contains 0, or, 3～6, contain 3, or, 6～12, contain 6, or, 12～24, contain 12, or, 24～48, contain 24, or, 〉=48.

Described thermal source is adjacent to the thickening casing inwall, the fixed position that is meant thermal source is as far as possible near the thickening casing inwall, thermal source can select directly to be adjacent to the thickening casing inwall, at this moment thermal source is to the hot road length=0mm of thickening casing inwall, and the near-thermal road length and the round diameter of hot road xsect or the ratio of square catercorner length are 0; Also can select thermal source to be adjacent to the thickening casing inwall indirectly through the low thermal resistance heat conductor.Described thermal source is adjacent to the thickening casing inwall through the low thermal resistance heat conductor, and for shielding, low thermal resistance should be that the heat xsect of trying one's best big is arranged also is bigger shielding surface.

Described near-thermal road length is meant that thermal source is adjacent to the position of heat conductor and the position that heat conductor is adjacent to the thickening casing inwall, the length between its two positions between nearest two points of hot approach, and hot road length is short more good more, and is best=0mm.

Diameter or the width and the thickness of described hot road xsect are meant that one or more right cylinder or rectangular parallelepiped separate side by side or be adjacent to the total size at the minimum position of total size of stack, and this is to realize the purpose important structure.As adopt metal forming individual layer or the less stacked use that adds, and hot road cross-sectional area thermal resistance is bigger, and big width metal forming can increase the area of dissipation of thickening casing inside, makes the corresponding minimizing of the heat that passes to the thickening casing inwall, and the less shielding of the electromagnetic wave of isolation loss is not good enough.

As adopting the thicker use that is added to of the thin metal of multilayer, hot road cross-sectional area will comparatively fast strengthen, and help heat conductor and the contact flexibility of thermal source with the thickening casing inwall.

The diameter or the diagonal line of described near-thermal road xsect are meant that one or more right cylinder or rectangular parallelepiped separate side by side or be adjacent to the total size at the minimum position of total size of stack.In order to keep less thermal resistance, longer as hot road, then hot road cross-sectional area must corresponding increasing, table 2: be for example 4, and the diameter or the diagonal line comparison example of near-thermal road length and near-thermal road xsect.

Table 2: feature ratio:	????3.	????6.	????6.	?????12.	????12.	????24.	????24.	????48.
Table 2: feature ratio:	????3.	????6.	????6.	?????12.	????12.	????24.	????24.	????48.	The near-thermal road length on heat conduction body heat road: the diameter or the diagonal line of heat conduction body heat road xsect:	????9. ????3.	????12. ????2.	????18. ????3.	?????24. ?????2.	????36. ????3.	????48. ????2.	????72. ????3.	????96. ????2.

The thermal source that is adjacent to the thickening casing inwall preferably is allowed a choice, if whole thermals source all are adjacent to thickening casing, effect increases progressively limited, and increases the assembling difficulty.With CPU is this case emphasis, heat maximum, frequency are the highest, lead-in wire at most and volume less, the heat maximum, dispel the heat important, frequency the maximum data stream is maximum, shield important, lead-in wire is maximum, the resonance of fearness electric fan or electric pump.Because hard disk is the sophisticated product of dynamo-electric combination, it is also a lot of go between, and data stream is bigger, and heat is bigger, be afraid of most to vibrate, and also be preferably to the application of this case.

The radiator structure of thickening casing, for the computer circuits parts, and the bigger cabinet type computer of thickening casing and tower computer are because the thickening casing material is thicker, the effect of utilizing thickening casing heat accumulation and shielding all is best, especially require cocksure computer for important events such as server computers, the reliability of heat accumulation has obtained important performance at this.

Nine. technical scheme makes up the heat conductor of heat radiation about thermal source and thickening casing:

Known technology heat conductor or heating radiator and the insulation of thickening casing inwall or contact resistance are bigger, and its structure had not been considered shielding.

The heat conductor of this case is adjacent to thickening casing and contacts, and heat radiation, heat conduction and shielding are all considered, effect also is preferably.

The material of described heat conductor minimumly comprises or has made up: metal or nonmetal heat conductor, rigid or elastic heat conducting body.Heat conductor can select rubber or plastics to manufacture the elastic heat conducting body, and the rigid damage when the elastic heat conducting body can reduce thermal source when mounted with use can suppress resonance.

Described heat conductor shape or structure, minimumly comprise or made up: square, L shaped, U-shaped, cylindrical, square tube shape, heating radiator, heat-conducting plate, internal mix have the elastic heat conducting body of the little metallic object of diameter or thickness＜5mm, can be silk thread or the fractionlet or the comminutions of metal.Tiny metallic object helps shielding and heat conduction.For the thermal source that should consider to insulate, can increase silicon rubber or other insulation course on the top layer of heat conductor.Heat conductor can be selected real core heat conductor or container heat conductor.

Described container heat conductor is meant the various containers that contain liquid or steam, but the selected sealed container heat conductor, also can select at any time can liquid make-up or vapor species through hole container heat conductor arranged.Minimum comprising: the liquid thermal conductivity pipe of sealing, the vapour vessel heat conductor-heat pipe of sealing etc.

Described heat conductor effect is: 1. when the heat-delivery surface and the thickening casing inwall of thermal source, height or direction can give hot road with heat conductor and connect not simultaneously.2. also can strengthen the quantity of heat storage and the temperature difference that reduces each position of thickening casing.3. also can cooperate the thickening casing inwall that thermal source is formed electromagnetic wave isolation and low frequency electromagnetic absorption.4. for the contact contact chip thermal source that compresses mutually that may adopt in the future, heat conductor is fixed alternative heat spreader to the chip thermal source.

Thermal source, heat conductor, thickening casing inwall, its position that is adjacent to mutually can select the Heat Conduction Material of softnesses such as the cushion of heat conductive silica gel or graphite film or aluminium foil or copper film or heat conduction with phase change pad to set up heat-conducting layer, in order to the reinforced heat conduction effect.

Ten. technical scheme makes up the thermal source of heat radiation about thermal source and thickening casing:

1. the various devices of known ordinary circuit board and chip thermal source and CPU socket all are designs in the common surface front of circuit board.

This case can be adjacent to the thickening casing inwall in order to make the chip thermal source, can select the socket with chip thermal source or chip thermal source, and design is at the reverse side of circuit board.Circuit board is in debugging and when maintenance, and CPU should fix interim heating radiator, for this reason, on the CPU socket known heating radiator fixedly card still should keep.

The design of chip thermal source is at the circuit board reverse side, not only utilize the Copper Foil shielding of circuit board surface or interlayer, the mutual interference mutually of control thermal source and other device, and reduced thermal source taking to board area, and original vacant circuit board and the space between the thickening casing inwall have been made full use of, for the volume that reduces board area and complete machine has all been created facility, and because the plane and the thickening casing inwall plane of circuit board are all bigger, thereby avoided the less heating radiator of the area of plane when being installed to CPU, because the more pressure that tilts is big the corner of CPU is damaged by pressure, adopt the structure of CPU at the circuit board reverse side, the thickness of the outer package insulation course of attenuate core cpu that can be suitable, like this, can improve the radiating effect of core cpu greatly, core cpu helps shield effectiveness near large-area metal.

Be connected removable interconvertible small front apron between the keyboard socket of known computer main board and near other socket thereof and the thickening casing.All be that can not moving of fixing can not be changed between the holder of known computer main board plug-in card sheet metal and the thickening casing.

If this case computer is fixed on thermal source at the back side of mainboard, may exist different thickness at thermal source of the same race, in order to guarantee appropriate cooperation the between keyboard socket and near other socket thereof and the thickening casing, and appropriate cooperating between the sheet metal that guarantees plug-in card and its holder can be selected to change or the heat conductor thickness or the heat conductor that increase and decrease between thermal source and the thickening casing have or not; Also can select adopting the elastic heat conducting body between thermal source and the thickening casing; Also can select the small front apron of keyboard socket and near socket thereof and the holder of plug-in card are combined as big baffle plate, and two sides of big baffle plate above the mainboard front can be moved with the chute of thickening casing.

The video card slot of 2. known computer circuit board all designs the middle part at circuit board.

This case for convenience chip thermal source is adjacent to the thickening casing inwall, can select the slot design of video card in position that circuit board keeps to the side.

3. be dispersed in the air for better heat thickening casing and thickening casing inside, and, reducing the heat that is delivered to thickening casing conducts through circuit board, perhaps, crack convection current through circuit board and thickening casing, return thickening casing inside, the passage that thermal insulation board is arranged or be communicated with between the circuit board that can be chosen in thermal source and the thickening casing with the thickening casing outer gas stream.

Described thermal insulation board, with the insulating material manufacturing, all there is corresponding thermal source hole the position of corresponding thermal source so that the heat conductor of thermal source or thermal source through the thermal source hole to the heat conduction of thickening casing inwall.

The material of described passage can be selected: metal, plastics or other material.

The structure of passage is minimum to be comprised or has made up: combination or produce the back combination respectively when thickening casing and channel component are produced simultaneously, and thickening casing makes up with channel component, and is more suitable for portable type; In the interlayer inside of thickening casing and circuit board, be that the limit surrounds passage with the passage rib, thickening casing passage and circuit board combination of channels, more suitable to desk-top type.

At the endpiece of passage, the electric fan or the temperature control electric fan of continuous working can be set for the use of open-air heat temperature.Electric fan can selection and thickening casing or the combination of passage accessory.

The passage rib can make up with heat conductor, can reduce the temperature difference of each position of thickening casing.

4. for make thermal source, heat conductor, the thickening casing inwall is more reliable is adjacent to mutually, can the shell fragment member be arranged in the outside of thermal source and heat conductor and thickening casing inwall tandem compound, its cascaded structure is compressed, the stress point of elastic force is in the outside of its tandem compound, and the direction of elastic force is the direction that thermal source, heat conductor, thickening casing inwall are adjacent to mutually.

Shell fragment can the plastics manufacturing, also can select sheet metal to strike out shell fragment, also can select to turn to Spring Card than hard metal wire, and there is the position of protrusion at the middle part of shell fragment, and the direction that is adjacent to mutually towards thermal source, heat conductor, thickening casing inwall applies elastic force.

Shell fragment fixing can be chosen in the thickening casing inwall in advance with the fixing threaded metallic object of structures such as electric welding or stickup, then fixes with bolt and elastomeric two ends or bolt hole on every side.The fixing of shell fragment also can be fixed with Spring Card with reference to the fixed sturcture of heating radiator.

For as the server multi-CPU structure of more thermal source is arranged on the common circuit board,, all be well suited for applying the pressure that is adjacent to mutually with shell fragment for as the large span clinging structure of thermal source is arranged in the middle part of the circuit board.

Can select driver to be adjacent at the thickening casing inwall for drivers such as hard disks, make things convenient for the dismounting of driver with direct extruding of structure such as selecting shell fragment.Also hard disk can be contained in the inside of hard disk cover, then apply mechanically the shell fragment extruding it is adjacent at the thickening casing inwall together with hard disk.Hard disk adopts the fixing means that adds the hard disk cover to help antidetonation and suppresses resonance.

Each thermal source should disperse to be distributed in each position of thickening casing inwall as far as possible.For example: CPU is fixed on upwards inwall, so that heat is transmitted to other position of thickening casing as early as possible; Because hard disk is compared with other semiconductor devices thermal source, the thermal value of hard disk is less, so main is that hard disk is tried one's best away from other thermal source, so that hard disk better utilization thickening casing inwall is dispelled the heat, hard disk is fixed on the CPU of downward inwall away from big heat; CD drive is fixed on inwall left; High power valve is fixed on inwall to the right.

11. technical scheme makes up the thickening casing of heat radiation about thermal source and thickening casing:

1. the inner circuit board of fixing of erectting of known thickening casing all is fixed on independent metal frame, does not have directly with the thickening casing inwall to be connected.

The fixing circuit board of the inner setting of this case thickening casing can select directly to be fixed on the member of thickening casing inwall, be that the thickening casing inwall has the directly fixing member of erectting circuit board, this structure simplifies the structure greatly, and its member can be with method manufacturing such as thickening casing punching press, accessory electric welding, accessory be gluing or be fixed on the thickening casing inwall.Described fixed component minimumly comprises or has made up: threaded hardware.Described setting circuit board not only comprises 90 ° and stands vertically, and also comprises when the thickening casing inwall to tilt and the situation of circuit board when also tilting, and the setting angle of erectting circuit board is 10～30～60～90 °.

2. for better heat radiation and shielding, can be chosen in the thickening casing inwall and add the hacking processing layer, the method for hacking can be known method, blackout interpolation layers such as sandblast.Thickening casing have resistivity less than gold or silver or other electrodeposition of metals of copper, it is outermost layer or the middle layer or the bottom that this electrodeposited coating can be selected, and can select earlier thickening casing to be electroplated the copper of 30～50 μ m, the silver of re-plating 10～20 μ m.

3. this case can select high power valve directly is fixed on the inwall of thickening casing, is fixed on circuit board reverse side or circuit board next door, has reduced thermal source to greatest extent and has been adjacent to the approach that thickening casing dispels the heat, and has reduced the electric capacity heating temperature on high power valve next door.For the shielding of accentuator plate, can be at the radome of the direct fixing circuit board of thickening casing inwall.

4. for to make thermals source highly different on the common circuit board can both be adjacent to the thickening casing inwall, can be chosen in the thickening casing inwall be provided with the position, just, the size heat conductor corresponding with thermal source, the heat conductor that adds can also be accelerated heat conduction, increase quantity of heat storage, heat conductor can be selected to be adjacent to thickening casing with fixed sturctures such as forging and pressing, electric welding, riveteds.

5. fixing for drivers such as hard disk, CD writer, can with bolt from the outside of thickening casing directly and the screw of driver bottom surface or side fix, also can select hard disk is sealed to anti-noise box inside, to prevent that again the noise box is fixed on the thickening casing inwall, when the bolt end is exposed at thickening casing side or end face, should be beautified the end of bolt.Certainly, for make thermal source on the circuit board more reliable, be adjacent to the thickening casing inwall more easily, the also fixed sturcture that can select bolt end portion to expose, with the bolt circuit board in addition the thread-hole part of side get final product.This case thickening casing outer wall has fixing thermal source or the member of combinations of sources of heat part is arranged.

12. beneficial effect:

1. for the artificial safety problem of computer, the hacker that people generally concentrate on software network takes precautions against, looks into software approachs such as poisoning poison, password encryption, has but ignored computer hardware is carried out effectively directly control.

Thermal source adopts metal shell or proof box shell, has all increased the overall weight of computer, has improved the antitheft of computer complete machine.

The combination of thickening casing and proof box structure or member, with basic, the simplest structure, the more perfect artificial security performance of computer.

2. it is the smaller the better that people look forward to the electromagnetic wave that shell penetrates or leak, and be not only the so-called standard that is confined to the artificial formulation of prior art.Thickening casing suppressed to penetrate mutually inside and outside electromagnetic preferably, suppressed the computer electromagnetic wave to the divulging a secret of information, to personnel's injury, to the interference of electrical equipment, helps to suppress the destruction of High-Power Microwave.

3. the computer casing material is thinner, causes the resonance of thermal source easily, has accelerated the fatigue of circuit block, has reduced the Performance And Reliability of operation, has also increased noise, and especially the reflection of the parts of motor combination such as hard disk, CD-ROM drive is more obvious.

Thickening casing has suppressed the resonance of electromechanical component such as hard disk, CD-ROM drive and shell, helps stabilizing and increasing of electromechanical component performance, has suppressed the generation of resonance noise, has suppressed penetrating of various noises, has reduced interference or the injury of noise to personnel.

4. thickening casing can better realize utilizing the technology of shell heat radiation, especially can better realize various thermals source direct or indirect be adjacent to the technology that outer casing inner wall dispels the heat, having made full use of the large tracts of land that thickening casing contacts with air dispels the heat, the big thermal capacitance that has more made full use of thickening casing or heat conductor is carried out heat accumulation, has suppressed the temperature rise of thermal source.

The temperature of chip core is the highest, also is the fastest, the most obvious, the most important position of conducting heat.Chip directly is adjacent to outer casing inner wall, perhaps to be adjacent to hot road cross-sectional area big and be adjacent to the heat conductor of outer casing inner wall for chip, because circuit board plane and thickening casing inwall plane are all bigger, avoided tilting to damage by pressure chip core, help to promote the application of exposed die core, the packaging insulating layer thickness that helps the attenuate chip core can improve the radiating effect of chip core greatly.

Heat source near thickening casing inwall, reduced the inside and outside temperature difference of thickening casing greatly, reduced the heat of thickening casing inside, improved heat resistance, can be reduced to the air-conditioning that computer provides low temperature to serve, and the bigger effect of generation, reduce air-conditioning quantity, economize Air Conditioning Facilities, economize the air-conditioning power consumption, no air-conditioning noise, highly reliable, low-cost, high-level efficiency, (computer can be used UPS to have improved the ease of use of important computer, air-conditioning must prepare highly energy-consuming, the generator of high noisy), reduced the fault of various contingency, for military, aviation, space flight, meteorological, scientific research, the website, server, key areas such as industrial computer, and high-end applications that must the long-time continuous computing is extremely important.

Reduced the external noise of computer heat radiation device.

Heat source near outer casing can reduce or exempt louvre; Being adjacent to mutually of heat conductor that thermal source and hot road cross-sectional area are bigger and shell; Thermal source is fixed on the interlayer of circuit board reverse side owing to isolation and the Copper Foil and the shell formation of multilayer copper foil, and these all help shielding, have also suppressed the phase mutual interference between the thermal source.

With the house of opening door and window than the shell of doing many louvres, the middle part that stands in the house is than close wall, and scenery is more outside the room of seeing, also can be seen by more room stranger, electromagnetic two-way direct radiation is also similar, and the various configurations of this case all have shielding action separately.

Can more increase the combination weight of shell and suppress to resonate and the generation of noise, can improve the performance and the stability of computer, can reduce even exempt the radiating equipments such as electric fan that noise is arranged, reduce noise source.

Reduce or exempted louvre, suppressed the infringement of dust thermal source.Heat source near outer casing inner wall for combinations such as two-sided heat radiation, shell dispel the heat, external thermometric provide supporting basis, helps the heat radiation of plateau low pressure environment outward.

Environment for contaminated area or vulnerable to pollution such as in hospital, laboratory, especially to poisoning the computer that great infection pathogeny environment uses, thermal source is adjacent to the shell heat radiation, reduced the inside and outside air-flow of thickening casing, having suppressed biological virus, chemical drugs, radiation particle etc. wafts into being detained for a long time even growing in computer inside, having solved the easy pollution computer sterilization difficult problem of contaminated environment again, made things convenient for the processing after easy pollution computer is eliminated, is very important to environmental protection; Thermal source is adjacent to the thickening casing heat radiation, has improved the adaptability of computer to hot environment, has solved the computer operation problem of the anti-pollution inactive environment of air-conditioning.Thermal source is adjacent to the shell heat radiation, has reduced environmental noise and electromagnetic radiation, also has more significance for hospital, laboratory.

Thickening casing has promoted thermal source to be adjacent to the shell heat radiation, and the shell heat radiation has more promoted the realization of this case purpose.

5. thickening casing can better be provided with various separation structures, and separation structure can suppress the phase mutual interference between the thermal source, suppresses the generation of resonance and noise thereof, with separating the leakage that has suppressed electromagnetic wave and noise.

Separation structure has realized that better the many people of a thing multiple use and a machine use.The great number handling cost and the corresponding risk of computer and data thereof have been reduced greatly.Between each post personnel, between system maintenance personnel and the leader, all strengthened responsibility management and internal security and taken precautions against, the safety that satisfies computer system under the various situations has enlarged the range of application of computer with secret, make things convenient for the using method of computer, increased reliability, credibility, availability.

6. thickening casing though increased the cost of shell, has but solved a plurality of for a long time insoluble problems of people.And thickening casing can be easily carry out surface treatment and increase screw to adapt to the upgrading repeatedly of various thermals source shell, reduced eliminating of shell, helps environmental protection.More can one-object-many-purposes in conjunction with separation structure, long-term use more will reduce the hardware of computer and pay wages.

Reliably simple again structure is adopted in this case, has solved a plurality of difficult problems that people need to be resolved hurrily for a long time.The change of outward appearance not only has practicality, has also brought new sensation to people, new visual effect.

At present known computer casing all develops in, lightweight direction thin to material.This case is then opposite, and material with heavy better, has produced the brand-new computer of new features, newtype, new purposes with thick better, weight.

13. Summary of drawings:

Fig. 1, example 1 is that thickening casing 1 is at the corner in 4 rooms displacement structure, vertical view.

Fig. 2, example 2 is that thickening casing 1 is at the placement in 2 rooms and the thermal source displacement structure of thickening casing 1 inside thereof, synoptic diagram.

Fig. 3, example 3 is fixed sturctures of the fender plate 61 of wire hole 51, cut-open view.

Fig. 4 is the AA view of Fig. 3.

Fig. 5, example 4 is receiving slit 19 structures of control signal, synoptic diagram.

Fig. 6, example 5 is switch and the indicating lamp structures thereof that are fixed on thickening casing 1 inwall, synoptic diagram.

Fig. 7, example 6 is orthogonal commodity shelf structures of thickening casing, synoptic diagram.

Fig. 8, example 7 is inclination commodity shelf structures of thickening casing, synoptic diagram.

Fig. 9, example 8 is shield effectivenesses that thermal source 2 is adjacent to thickening casing 1 inwall, synoptic diagram.

Figure 10, example 9 is that a plurality of thermals source are close to the inwall of thickening casing 1 and the near-thermal line structure of heat conductor, synoptic diagram.

Figure 11, example 10 is that thermal source 2 is adjacent to thickening casing 1 interior wall construction, partial enlarged drawing.

Figure 12, example 11 is that other thermal source 2 is adjacent to thickening casing 1 interior wall construction, partial enlarged drawing.

Figure 13 is the side view of Figure 12.

Figure 14, example 12 is chip thermal source metal caps when being fixed on back of circuit board, synoptic diagram.

Figure 15 is the side view of Figure 14.

Table 3 is the title and the numbering of this case member.

Table 3: numbering	The member title	Numbering	The control member title	Numbering	The radiating component title	Numbering	The radiating component title
Table 3: numbering	The member title	Numbering	The control member title	Numbering	The radiating component title	Numbering	The radiating component title	??????1 ??????11 ??????21 ??????31 ??????41 ??????51 ??????61 ??????71	The door closure lock construction element external partition internal partition wire hole wire hole baffle plate rack of thickening casing shell	8，?18 ????9 ????19 ????20 ????28 ????29 ????30 ????38 ????39	Wall electric wire receiving slit reception diode receiving coil board switch on ﹠ off switch light emitting diode	????10 ??2～7 12～17 22～27 32～37 ????40 ????42 ????43 ????44	The flat shim circuit board wire socket circuit board plug-in card of the thread-hole part that the heat carrier set bolt that the electric fan thermal source is corresponding with thermal source is corresponding or sleeve pipe interference source heat carrier	????45 ????46 ????47 ????48 ????49 ????52 ????62 ????72	The depression bar of the socket chip carrier socket of the heat pipe chip thermal source of compression shell fragment supporter spring lever snap ring grab heat carrier

14. embodiment:

Example 1, Fig. 1 in vertical wall 8 and the corner that horizontal wall 18 crosses mutually, has placed thickening casing 1.Upper left, the lower-left of thickening casing 1 outer wall, upper right, position, bottom right have 4 combinations that 4 door closures 11 of lock construction element 21 are arranged respectively.The door closure 11 at upper left position does not have the control receiving circuit, its lock construction element 21 is controlled by the control circuit of other door closure 11 jointly, lower-left, door closure 11 upper right, the bottom right all make up the signal receiving slit 19 of control circuit, managerial personnel are through control circuit, can control the door closure 11 and the inner thermal source thereof in corresponding space, can also control opening of upper left door closure 11, the operation that allows operating personnel limit in the official hour section in other room.

Door closure 11 inside at upper left, the lower-left of thickening casing 1 outer wall, upper right, position, bottom right are divided into 4 spaces, thickening casing 1 and external partition 31 combination live wire holes 51 by external partition 31 with the inside of thickening casing.

Each space separately independently computer system can satisfy the operation of the relevant personnel in each house easily, each computer system also can be selected mutual networking, and each link of networking is protected too.Not only reduce computer casing and added up to cost, protected the total system of computer network especially.

Each space also can be respectively: the hard disk of the classified document of the computer main board of enterprise management and finance and the hard disk of operating system, enterprise management and finance.So, when system maintenance, disconnect the power supply of hard disk, more can control classified document the maintainer of computer system.Each space also can be respectively: financial computer system, other article such as cash.

Example 2, Fig. 2, vertically wall 8 is thickening casing 1, separate about 2 rooms.Respectively there are 3 door closures 11 on upper left, lower-left, the right side of thickening casing 1, and the inside of door closure 11 with thickening casing 1, is divided into 3 spaces by external partition 31.Thickening casing 1 and external partition 31 combination live wire holes 51,, be used between thickening casing 1 inside and outside and the thermal source circuit between each space interconnects.Each wire hole 51 can select combination that various baffle plates 61 are arranged.Left side baffle plate 61 is circular arc baffle plates of 2 end openings.Right side baffle plate 61 is baffle plates of monolateral opening.

Respectively there is 1 internal partition 41 inside of space, lower-left and rightward space, is used for placing or separates and place thermal source or other article.

The thermal source 2 of upper left interior volume is the circuit board of combined chip thermal source, and the chip thermal source of back of circuit board and plug-in card thereof and the inwall of thickening casing 1 are adjacent to.The thermal source 3 of lower-left interior volume is a hard disk.The thermal source 4 of rightward space inside is the main frame of horizontal computer.Between thickening casing 1 inside and outside and interconnect through a plurality of electric wires 9 between each thermal source.The thermal source that has connected the operation power supply can be at the internal operation of thickening casing 1.

Example 3, Fig. 3, the baffle plate 61 of wire hole 51 can select to adopt adjustable structure.Wire hole 41 positions of thickening casing 1 or external partition, about bolt 22 is respectively arranged, bolt 22 passes thickening casing 1 or external partition, passes baffle plate 61, and is with nut 32 combination that baffle plate 61 is fixing.There is the wire hole 51 of opening at the middle part of fender plate 61, and 2 sides of baffle plate 61 respectively have strip hole and hole in parallel, can adjust the openings of sizes in electric wire space according to the combined diameter of electric wire, increases the security in thickening casing 1 inside or each space with this.Fig. 4 is the AA view of Fig. 3.

In addition, also can be chosen in the inwall fixing threaded hole spare of thickening casing 1, the set bolt 22 of baffle plate 61 can be from the internal fixation of thickening casing 1 with safer.

Example 4, Fig. 5 is control signal receiving slit 19 synoptic diagram of thickening casing 1.Control flume 19 can select the signal of various control circuits such as the receiving coil 28 of fixing smart card or infrared receiving diode 20 to receive components and parts; fluid sealants such as infusion epoxy resin can be selected in the inside of receiving slit 19, carry out structural defence and hidden protection to receiving components and parts.

Corresponding reception diode, it is fixing separately that the material internal that also can be chosen in thickening casing 1 is directly got through the structure in hole.

Example 5, Fig. 6 is switch 30 and pilot lamp 39 structural representations thereof that are fixed on thickening casing 1 inwall.Structures such as thread-hole part 32 usefulness spot welding or riveted are fixed on the inwall of thickening casing 1, and circuit board 29 usefulness bolts 22 and thread-hole part 32 combinations are fixing.Circuit board 29 is fixed with button 38, switch contact 30, the pilot lamp 39 of the switch of transparent plastic.When thermal source or the operation of other circuit, pilot lamp 39 is luminous, and light is outwards expressed through on ﹠ off switch 38.Switch contact 30 and pilot lamp 39 built-in has the effect of hidden protection and structural defence.

Example 6, Fig. 7 is orthogonal rack 71 synoptic diagram of thickening casing 1.An inwall fully of thickening casing 1 can be fixed various thermals source, and the central space of thickening casing 1 can select to adopt the left and right sides adjustable rack 71 structures.

Example 7, Fig. 8 is fixing rack 71 synoptic diagram of inclination of thickening casing 1.The outer then top of each of rack 71 respectively with each of thickening casing 1 in the drift angle combination fixing.Various article can be placed in the middle part of rack 71.

Example 8, Fig. 9 is the shield effectiveness that thermal source 2 is adjacent to thickening casing 1 inwall, synoptic diagram.The left and right sides louvre on thickening casing 1 top respectively has an electromagnetic interference (EMI) emissions source 40, and the inwall of thickening casing 1 and middle part have thermal source 2 and thermal source 3 respectively.Thermal source 2 directly externally and the electromagnetic radiation that directly is subjected to all lack than thermal source 3.Thermal source 2 helps to utilize shell 1 to absorb the more low frequency magnetic line of force near shell 1.

Example 9, Figure 10, a plurality of thermals source are close to the inwall of thickening casing 1 and the near-thermal line structure of heat conductor, synoptic diagram.The inwall of thickening casing 1 has the member of direct fixing circuit board 29, thread-hole part 32, thread-hole part 35, have screw solid plate heat conduction body 36, the solid heat conductor 17 in right angle of screw is arranged.

There are many wire sockets 43 in the front of circuit board 29, can be used for external unit and connects.Thermal source 2 is adjacent to thickening casing 1 inwall indirectly through the plate heat conduction body 12 in left side and the U-shaped heat conductor 12 stack combinations heat conduction on right side, its near-thermal road length=ab+bc+cd, the aggregate thickness=e+f at the minimum position of the aggregate thickness of the heat conductor 12 of stack.4 bolts 22 of position symmetry make up with 4 thread-hole parts 32 respectively through flat shim 42, and heat conductor 12, thermal source 2, thickening casing 1 inwall are adjacent to mutually.

The circuit board plug-in card 44 of circuit board 29 is arranged at the bottom in circuit board 29 fronts, thermal source 3 and thermal source 4 are arranged at the bottom of plug-in card 44, thermal source 3 is adjacent to the boss face 13 of thickening casing 1 bottom, the thermal source 4 of large volume directly and thickening casing 1 be adjacent to, bolt 24 and thread-hole part 34 combinations that are fixed on plug-in card 44 are adjacent to thermal source 3 and thermal source 4 and the inwall of thickening casing 1.

The reverse side top of circuit board 8 is fixed with thermal source high power valve 6, and positive and negative 2 of high power valve 6 have heat conductor 36 and insulation support body 46 respectively, and bolt 22 on the lower side is adjacent at thickening casing 1 inwall high power valve 6 with heat conductor 36 combinations.Large-area heat conductor 36 can reduce the temperature difference at thickening casing 1 thermal source 6 positions.

There is the thermal source 5 that is adjacent to thickening casing 1 inwall through liquid container heat conductor 15 at the reverse side middle part of circuit board 29, and liquid container heat conductor 15 can more substantial heat accumulation.2 bolts 25 respectively with thread-hole part 35 that is fixed on thickening casing 1 inwall and heat conductor 36 combinations, bolt 25 large spans fixed shell fragment 45, the inwall of thermal source 5, heat conductor 15, thickening casing 1 is connected mutually is adjacent to.

The thermal source 7 that is adjacent to through L shaped heat conductor 17 and thickening casing 1 inwall is arranged at the reverse side bottom of circuit board 29,2 groups of bolts 27 make up with heat conductor 17 that is fixed on thickening casing 1 inwall and the thread-hole part 37 that is fixed on circuit board 29 respectively, and thermal source 7, heat conductor 17, thickening casing 1 inwall are adjacent to mutually.

Example 10, Figure 11 is the partial enlarged drawing that chip thermal source 2 is adjacent to thickening casing 1 inwall.Chip thermal source 2 and socket 62 thereof are fixed on the front of heat-conducting plate 29.There is through hole at the position that front heat conductor 12 upper ends of thermal source 2 are adjacent to thickening casing 1, the left and right sides on front heat conductor 12 tops, inwall at thickening casing 1 respectively has snap ring 48 and grab 49, spring lever 47 passes the through hole of front heat conductor 12, rely on snap ring 47,48 and grab 49, make front heat conductor 12 be adjacent to thickening casing 1 inwall.Front heat conductor 12 relies on 4 bolts 22 fixing with thread-hole part 32 that is fixed on circuit board 29 and bolt 22 combinations respectively.

The circuit board 29 of thermal source 2 reverse side has through hole, and through hole has passed the heat conductor 12 that heat pipe 52 is arranged, and the bottom, left side of reverse side heat conductor 12 and the inwall of thickening casing 1 are adjacent to.The pro and con of thermal source 2 is adjacent to thickening casing 1 inwall through 2 heat conductors 12 respectively, forms the two-sided heat radiation two-sided shielding of holding concurrently.

Circuit board 29 relies on four bolts 23 fixing with thread-hole part 33 combinations that are fixed on thickening casing 1 inwall respectively.

Example 11, Figure 12 is the partial enlarged drawing that other thermal source 2 is adjacent to thickening casing 1 inwall.Chip thermal source 2 fronts that are fixed on circuit board 29 reverse side directly are adjacent to thickening casing 1 inwall, and the reverse side of thermal source 2 is adjacent to through heat conductor 12 inwall with thickening casing 1, the two-sided heat radiation that the forms thermal source 2 two-sided shielding of holding concurrently.The reverse side of circuit board 29 has 4 bolts 22 to make heat conductor 12 be fixed on the front of circuit board 29 with the combination of the screw of heat conductor 12 respectively.Circuit board 29 is fixing with thread-hole part 33 combinations that are fixed on thickening casing 1 inwall by 4 bolts 23.

Lock thermal source 2 again after being fixed on thickening casing 1 inwall at circuit board 29, the depression bar 72 of chip carrier socket 62 preferably is lengthened to the outside of circuit board 29.Figure 13 is the side view of Figure 12.

Example 12, Figure 14 is the metal cap synoptic diagram of chip thermal source when being fixed on back of circuit board.Circuit board is after Reflow Soldering and wave-soldering are finished, refer back to fluid welding and on steel mesh, scrape the tin cream method, chip thermal source hole to circuit board is coated with tin cream, expose and block the metal cap of periphery then with flanging with intermediate openings, block peripheral position, fuse solder(ing) paste with position, the chip thermal source hole heating that heat gun exposes the metal cap middle part.Fig. 8 and Fig. 9 are respectively the upward view and the front elevations of square metal cover.When the steel mesh that also can be chosen in the circuit board Reflow Soldering is scraped tin cream, the chip thermal source hole of circuit board is coated with tin cream, load onto then chip thermal source or chip thermal source socket and with supporting plate below support holder temporarily, carry out Reflow Soldering simultaneously with the paster circuit board then.

Figure 15 is the side view of Figure 14.

The above is only for referencial use, and unrestricted, can select 26S Proteasome Structure and Function according to actual needs and the otherwise combined application.

Claims

1. the thickening casing of thermal source by thermal source and the combination of metal thickening casing, is characterized in that, the inside of thickening casing, had the one or more connection that has connected the operation power supply thermal source of thickening casing external data line, and the material average thickness of thickening casing is 1.1～1.4mm, contain 1.4mm or, 1.4～1.7mm, contain 1.7mm or, 1.7～2.1mm, contain 2.1mm or, 2.1～2.6mm, contain 2.6mm or, 2.6～3.2mm, contain 3.2mm or,＞3.2mm.

2. according to claim 1, described thermal source, its feature is minimum to be comprised or has made up: indivedual computer part, a complete set of host computer parts, be furnished with case host computer, be furnished with the computer complete machine of case.

3. the thickening casing of thermal source, by thermal source and the proof box combination that is equipped with lock construction element, it is characterized in that the inside of thickening casing, had the connection that connected the operation power supply thermal source of thickening casing external data line, and the material thickness of thickening casing is 1.2～1.4mm, contain 1.4mm or, 1.4～1.7mm, contain 1.7mm or, 1.7～2.1mm, contain 2.1mm or,＞2.1mm.

4. according to claim 1 or 3, described thermal source, its feature is minimum to be comprised or has made up: processor or, north bridge or, hard disk or, CD drive or, high power valve or, fuel cell;

Perhaps, cabinet type computer or, vertical computer or, horizontal computer or, the frame computer or, network computer or, integrated computer or, palm PC or, portable computer or, panel computer or, special purpose computer or, computer peripheral equipment;

Perhaps, overall volume is 43200～64800cm ³, contain 64800cm ³, or, 64800～135900cm ³, contain 135900cm ³, or, 135900～260300cm ³, contain 260300cm ³, or, 260300～440500cm ³, contain 440500cm ³, or, 440500～678000cm ³Host computer; Perhaps, overall volume is 22200～18500cm ³, contain 18500cm ³, or, 18500～14700cm ³, contain 14700cm ³, or, 14700～11000cm ³, contain 11000cm ³, or, 11000～7200cm ³, contain 7200cm ³, or, 7200～3450cm ³, or ,≤3450cm ³Vertical host computer.

5. according to claim 1 or 3, the material average thickness or the material thickness of described thickening casing are meant that choosing 100% of the thickening casing outer wall total area is the material average thickness or the material thickness of thickening casing;

6. according to claim 1 or 3, described thickening casing, its feature is minimum to be comprised or has made up: the thickening casing of metal level and non-metallic layer combination or, contain metal the synthetic material thickening casing or, the combination have hardware thickening casing or, the planar metal plate thickening casing or, have the bending groove the sheet metal thickening casing or, with sheet metal be fixed on the local thickening of thickening casing table wall thickening casing or, local or all be the thickening casing of shape;

Perhaps, the weight of thickening casing is 4～9kg, contain 9kg or, 9～17kg, contain 17kg or, 17～28kg, contain 28kg or, 28～40kg, contain 40kg or, 40～55kg or, 〉=55kg;

Perhaps, the overall volume of thickening casing is 222000～190500cm ³, contain 222000cm ³, or, 190500～156600cm ³, contain 190500cm ³, or, 156600～119000cm ³, contain 156600cm ³, or, 119000～75000cm ³, contain 119000cm ³, or, 75000～4440cm ³, contain 75000cm ³, or ,≤4440cm ³

Perhaps, the overall volume of thickening casing is 222000～291000cm ³, contain 291000cm ³, or, 291000～419000cm ³, contain 419000cm ³, or, 419000～583000cm ³, contain 583000cm ³, or, 583000～778000cm ³, contain 778000cm ³, or, 778000～999000cm ³, or, 〉=999000cm ³

Perhaps, the weight kg of the thickening casing of iron and volume m ³Ratio be 220～600, contain 600 or, 600～1160, contain 1160 or, 1160～1810, contain 1810 or, 1810～2520, contain 2520 or, 2520～3300 or, 〉=3300, the thickening casing of non-iron then changes according to changing ratio with the proportion of iron.

7. according to claim 1 or 3, described thickening casing, the feature of its proof box control member is, in the inside of thickening casing material or, the inwall of thickening casing or, the outer wall of thickening casing, minimumly comprise or made up, external partition or, internal partition or, the shelter of electric wire through-hole or, the socket of data line or, switch and circuit thereof or, the coding-decoding circuit circuit or, remote control circuit or, the magnetic card circuit or, timing circuit;

Perhaps, the number of dead bolt be 2 or, 3 or, 4 or, 〉=5;

Perhaps, the total cross-sectional area of dead bolt is 10～18mm ³, contain 18mm ³, or, 18～33mm ³, contain 3mm ³, or, 33～51mm ³, contain 51mm ³, or, 51～74mm ³, contain 74mm ³, or, 74～99mm ³, or, 〉=99mm ³

Perhaps, the total weight of lock construction element is 99～180g, contain 180g or, 180～327g, contain 327g or, 327～517g, contain 517g or, 517～743g, contain 743g or, 743～999g or, 〉=999g.

8. according to claim 1 or 3, described thermal source, the feature of its radiator structure is, in the inside of thickening casing or, the inwall of thickening casing or, the outer wall of thickening casing, minimumly comprise or made up: heat conductor or, heat pipe or, heating radiator or, electric fan or, the electric fan casket or, the electric fan hole or, electric pump or, semiconductor cooling device;

Perhaps, single thermal source, minimum one or more surface; Perhaps, the minimum one or more surface of single thermal source, the heat conductor that is adjacent to, minimum one or more surface, be adjacent to the minimum one or more surface of thickening casing inwall, and, this heat conductor heat conduction direction xsect, circular heat conductor diameter or square heat conductor width and thickness all are 0.4～1.2mm, contain 1.2mm or, 1.2～5mm, contain 5mm or,＞5mm.；

Perhaps, thermal source is 0～28mm through the near-thermal road length that real core heat conductor or container heat conductor are adjacent to the thickening casing inwall, contains 0mm, or, 28～75mm contains 28mm, or, 75～132mm, contain 75mm, or 132～198mm contains 132mm, or, 198～270mm contains 198mm, or, 〉=270mm, and the diameter of near-thermal road xsect or width and thickness all are 0.4～0.8mm, contain 0.8mm, or, 0.8～2.1mm, contain 2.1mm, or 2.1～4.5mm contains 4.5mm, or, 4.5～8.1mm contains 8.1mm, or, 8.1～13mm, or, 〉=13mm, and near-thermal road length is 0～3 with the diameter of near-thermal road xsect or the ratio of catercorner length, contains 0, or, 3～6, contain 3, or, 6～12, contain 6, or, 12～24, contain 12, or, 24～48, contain 24, or, 〉=48;

Perhaps, with the jack design of chip thermal source or chip thermal source reverse side at circuit board; Perhaps, with the design of the slot of video card in position that circuit board keeps to the side;

Perhaps, between the circuit board of thermal source and shell, have thermal insulation board or with the passage of housing exterior airflow connection; Perhaps, at the thermal source position of thermal source and heat conductor and outer casing inner wall cascaded structure the shell fragment member is arranged;

Perhaps, the thickening casing inwall has the directly fixing member of erectting circuit board; Perhaps, the thickening casing inwall has roughening layer or blackout layer or the resistivity electrodeposited coating less than copper; Perhaps, the thickening casing inwall directly is fixed with the radome of circuit board; Perhaps, the thickening casing inwall is provided with the heat conductor corresponding with heat source position; Perhaps, the thickening casing outer wall has fixing thermal source or the member of combinations of sources of heat part is arranged.