CN1591522A

CN1591522A - Shielding and radiating method for colour display screen electrical appliance heat source

Info

Publication number: CN1591522A
Application number: CN 03157610
Authority: CN
Inventors: 王松
Original assignee: Individual
Current assignee: Individual
Priority date: 2003-08-29
Filing date: 2003-08-29
Publication date: 2005-03-09

Abstract

The present invention relates to a handware structure of colour display screen appliance, and is characterized by that (1) using 'tightly-stuck' structure to implement heat storage, using heat storage to make heat radiation, fully utilizing large heat capacity of external shell or heat conductor to make heat storage; (2). using tightly-stack' structure to implement shielding, inhibiting two-way direct radiation of electromagnetic wave, if the heat source is fixed on the back surface of circuit board, it can obtain better effect; and (3). overcoming the defect of known heat-radiating and shielding technique, providing good matching equipment for several heat radiation combinations, and more providing necessary matching equipment for new-type functional colour screen appliance. Said invention also provides the technical requirement of heat source fixed position of said 'tightly-stuck structure'.

Description

The shielding of color display screen electric appliance thermal source and heat dissipating method

One. technical field ... ... ... ... ... ... .... page or leaf 1

Two. background technology ... ... ... ... ... ... ... ... 1

Three. technical matters ... ... ... ... ... ... ... ... 3

Four. technical scheme ... ... ... ... ... ... ... ... 4

Five. technical scheme is about heat conductor ... ... ... ... ... ... ..5

Six. technical scheme is about shell ... ... ... ... ... ... .5

Seven. technical scheme is about the combination of heat source near outer casing inner wall ... ... ... .7

Eight. technical scheme is about the suitable contrast of various color display screen electric appliances and thermal source thereof ... ..9

Nine. beneficial effect ... ... ... ... ... ... ... ... 11

Ten. Summary of drawings ... ... ... ... ... ... ... ... 12

11. embodiment ... ... ... ... ... ... ... .13

One. technical field:

This case relates to one combined electrical apparatus or the supporting relevant electrical equipment of split with colorful display screen, is called for short: color screen electrical equipment.Relate in particular to the shielding or the heat radiation of color screen electrical equipment.

Described color screen, being meant can active illuminating or passive reflective or the control printing opacity, can display text or the color/graphics of image, minimumly comprise or made up: video screen CRT, liquid crystal display LCD, projection screen, PDP display PDP, field cause screen FED, organic LED screen OLED, 3D screen.

Described color screen electrical equipment, minimum comprising: 1. computer, 2. the audio and video appliances of hard disk, 3. colour TV (containing: analog machine and teaching machine), 4. colored display arranged.

Two. background technology:

Known technology normally dispels the heat with heating radiator, and the thermal source heating radiator big for power consumption also must rely on active radiating elements such as electric fan or electric pump.

A. electric fan or electric pump running, the directly normal operation of influence service thermal source, the plug of electric fan comes off, the power lead of electric fan was joined " computer newspaper " on 05 13rd, 2002 by heating radiator roastingization and problems such as short circuit are more.

The resonance that shake that produces when B. electric fan or electric pump rotate and shake thereof cause, also have of the interference of its inductive load to power supply, all influenced the speed of the contact reliability of hard disk, CPU and near other device and hard disk operation and stable, " the household PC world " 95 pages of in March, 20002 are joined in the frequent deadlock that ginseng cabinet electric fan in " computer newspaper " on January 28th, 2002 and 09 month 09 day causes.

C. the louvre of heating radiator many dusts that waftd into; External electric fan also can suck more dust; Inner electric fan also can be assembled many dusts, various dusts all can influence even damage the stability of various devices because of factor such as the moisture absorption, burn into influence heat radiation, as the contact of internal memory, the running of CD-ROM drive, the operation of hard disk, join " computer newspaper " on October 16th, 2000, on Dec 18th, 2000, on November 5 calendar year 2001, join " electronics newspaper " Dec 2 calendar year 2001.

D. a large amount of dusts must cleaned at regular intervals safeguards, electric fan also will refuel maintenances, and the wear and aging of electric fan is changed, and these have all increased the incidence that the workloads of safeguarding have also increased fault, join on " computer newspaper " August calendar year 2001 27.

E. the heat of heat sink radiates also must have other electric fan once more heat to be discharged shell, and secondary has source heat-dissipating to produce secondary power consumption, has increased configuration amount, workload, the thermal value of power circuit.

The increase configuration of the F. configuration of heating radiator, active radiating element and supporting power-supply system thereof has all increased weight, volume, cost and the structural complexity of computer and the cost of making, assembling, carry, keeping in repair and the difficulty of operation etc.

G. portable machine has been increased power consumption, brought the trouble of use operation and the increase of battery use cost, the increase of battery consumption is unfavorable for environmental protection.

H. known radiating element all is to rely on jump ring to be adjacent to the heat-delivery surface at CPU, because the die sites at CPU middle part is all less, and jump ring is for fixed heat sink part that can be stable, the elastic force of design is all bigger, if the insulating protective layer outside the core cpu is thinner, be easy to when heating radiator is installed by the corner of being crushed by jump ring; For preventing that heating radiator from damaging the corner of CPU by pressure, the outer insulating protective layer of the core of CPU must be thickeied, and the protective seam of thickening has influenced the radiating effect of core cpu greatly, joins on " computer newspaper " Dec calendar year 2001 17.

I. the electric fan noise effect of rotating people's work.

J. big heavier heating radiator on the circuit board has influenced the vibration resistance of system, ginseng " computer is done certainly " 84 pages of in February, 2002.

K. for the computer of many hard disks, server etc. for example is because problems such as power consumption, socket number, reliabilities, with many electric fans or the heat radiation of many electric pumps obviously not improperly.

L. the passage of radiating airflow has taken more outer casing space.

Known heat dissipating method has the semiconductor cooling device heat radiation in addition, though radiating effect increases, but the dewfall condensate water that semiconductor cooling device produces damages the thermal source device easily, and it seems also will be between thermal source and active radiating element, increase the derby that reduces heat transfer and radiating effect again, perhaps, design specialized is controlled heat-conducting plate in addition, with the relieved use of less dewfall ability, join " computer newspaper " on July 31st, 2000, January 1 calendar year 2001.

Along with the raising of hard disk speed, the high temperature that hard disk produces when operation has had influence on the raising of the stable and performance of hard disk operation, and the magnetic storage medium of hard disk is more avoided in high temperature than semiconductor thermal source.Hard disk heat radiation device known on the market is the structure of electric fan casket, and existing describedly has the drawback of source heat-dissipating still to exist.Hard disk is because mutual copy and peculation often needs instrument carefully to operate with bolt, and dismounting bothers.Because the running of hard disk and the resonance between the shell, noise is bigger when making the hard disk operation.Because hard disk directly is fixed on no any protection on the member of enclosure, causes the antidetonation of hard disk not good enough, shell had vibrations slightly when system moved; will influence the operation of hard disk; join on " computer newspaper " April calendar year 2001 16, July 30 calendar year 2001, on 01 28th, 2002.

At present the high-resolution digital televisor is popularized, and computer has laser phonotape and videotape function and also become a reality, and simultaneously, laser audio-video-equipment has the correlation function of computer, also is trend of the times.At present, the heat dissipating method of colour television set, color monitor and laser laser audio-video-equipment but is similar to host computer, rest on the method for radiator heat-dissipation, radiating effect is not good enough, its shell has stayed many louvres in order to dispel the heat, also because high pressure also inspiration many dusts, its drawback and can cause the high-voltage breakdown of high voltage arc, arcing and device as previously mentioned.

Known display interior has several kilovolts high pressure; and shell all is plastics; just high-grade at last had about 0.3 millimeter very thin barricade only; because the thermal source device of display interior all is to rely on radiator heat-dissipation, so also have the louvre of many about 10 mm dias on the barricade usually.Barricade is promptly thin many bigger holes again, and shield effectiveness is well imagined.Especially wait the more public place of personnel in office, the stronger proceeds posterolateral of color monitor electromagnetic radiation is to corresponding many people often, and is bigger to people's health hazard.

The metal shell of known electric brain server all is that iron is zinc-plated.Because the running frequency of computer is very high, the frequency band of radiation is very wide, the centering low frequency radiation, thicker iron shell can play the effect of shielding, and to high frequency radiation because high-frequency vortex resistance, the shield effectiveness of iron shell and zinc coating thereof is not good enough.

At present power consumption is bigger, and in the very high electrical equipment of frequency of operation, computer will be obviously outstanding.The fixed position of known heat sources does not more have the outer casing inner wall of being adjacent to relatively away from outer casing inner wall.The cmos device that is more vulnerable to interference owing to input impedance is very high is used more and more; Because the frequency of operation of device is high more, the digital signal pulse of output is just sharp more, just can disturb the normal operation of other device or assembly more, and the frequency of operation of thermal source is very high, but also can be more and more higher; Because the volume of computer is more and more littler, like this, the phase mutual interference of thermal source and thermal source all can be also increasing to the interference of other assembly.Described assembly comprises: internal modem, television receiver etc. are joined on " computer newspaper " March calendar year 2001 12, on February 25th, 2002.

Because the thermal source of colour television set, color monitor and laser laser audio-video-equipment and the thermal source and the circuit board profile thereof of circuit board and host computer thereof are similar, just this case is used plastic casing instead metal shell in addition., suitable equally by this case to colour television set, color monitor and hard disk audio and video equipment to the improved detailed description of host computer.

Three. technical matters:

Color screen electrical equipment is based on civilian and commercial popularization and application on consumption, and on performance index and stability index based on military and important application scientific research, must consider many special problems simultaneously:

To civilian and commercial, 1. at first profile should be succinctly attractive in appearance; 2. color screen electrical equipment especially computer become the highest electrical equipment of common electrical equipment medium frequency, the digital colour TV of computer combination colour TV and high-resolution high-frequency is being come into the crowd, long-time crowd near contact is more and more, it is low that people require that radiation tries one's best, rather than be satisfied with artificially and formulate ' safety standard ' based on prior art; 3. the quantification of the product for civilian use require cost to try one's best simple can the province then that the end, structure try one's best economized, this is related to the employing and the popularization of civilian new technology; 4. weight, volume are little, are convenient for carrying or move; 5. noise is as far as possible little, helps the working and learning that people stabilize.

To military and scientific research, from other angle color screen electrical equipment is had higher requirement, not only claimed structure is simple, in light weight more, volume is little, and more requiring 6., environment for use can adapt to field or even dirt sand rainwater environment; 7. very high reliability and stability can be arranged: 8. to the also requirement of movability color screen electrical equipment, environmental protection requirement is not only in power saving as much as possible, the requirement of long-time continuous use after the product charging especially.

Described problem is more outstanding with the performance of computer CPU, the frequency of operation numerical value that fast speed improves and frequency of operation has reached significantly, be other any electrical equipment, comprise what colour TV all was difficult to compare, the perviousness of its electromagnetic interference (EMI) and penetrability are improving too, and important shell protection structure does not change, in order to solve the problem that the CPU heat increases, louvre on the shell and electric fan hole are more and more, increasing on the contrary, and so inevitable electromagnetic radiation exceeds standard.

This case purpose:

1. with the structure of ' being adjacent to ', realize heat accumulation, dispel the heat with heat accumulation.Make full use of shell, even only be the common not shell of thickening, the large tracts of land that contacts with air is dispelled the heat, and main is that the big thermal capacitance that makes full use of shell or heat conductor is carried out heat accumulation, suppresses the temperature rise of thermal source.

2. with the structure of ' being adjacent to ', realize shielding.With the house of opening door and window than the shell of doing many louvres, the middle part that stands in the house is than close wall, and scenery is more outside the room of seeing, also can be seen by more room stranger, electromagnetic two-way direct radiation is also similar, and the various configurations of this case all have shielding action separately.

3. overcome the drawback of known heat radiation and shield technology, for the combination of multiple heat radiation provides supporting preferably, more the color screen electrical equipment of new function provides necessary supporting.

Four. technical scheme:

With thermal source as far as possible near outer casing inner wall, then, make thermal source direct or indirect be adjacent to outer casing inner wall, thereby realize shielding and heat radiation.

Be made up of thermal source and shell etc., it is characterized in that: thermal source is 0～33mm through the near-thermal road length that real core heat conductor or container heat conductor are adjacent to outer casing inner wall, contain 0mm or, 33～66mm, contain 33mm or, 66～99mm, contain 66mm or, 99～122mm, contain 99mm or, 122～155mm, contain 122mm or, 155～277mm contains 155mm

And the diameter of near-thermal road xsect or width and thickness all are 0.4～0.8mm, contain 0.8mm or, 0.8～1.6mm, contain 1.6mm or, 1.6～3.2mm, contain 3.2mm or, 3.2～6.4mm, contain 6.4mm or, 6.4～12.8mm, contain 12.8mm or,＞12.8mm

And near-thermal road length is 0～3 with the diameter of near-thermal road xsect or the ratio of catercorner length, contain 0 or, 3～6, contain 3 or, 6～12, contain 6 or, 12～24, contain 12 or, 24～48, contain 24.

Described thermal source is adjacent to outer casing inner wall, and the fixed position that is meant thermal source is as far as possible near outer casing inner wall.

When no heat conductor: a minimum surface of thermal source directly is adjacent to outer casing inner wall, and thermal source is to the hot road length=0mm of outer casing inner wall; The diameter of hot road xsect or width and thickness are meant that thermal source directly contacts xsect with outer casing inner wall; Thermal source and outer casing inner wall to contact the near-thermal road length of xsect and the round diameter of hot road xsect or the ratio of square catercorner length be 0.

The left and right sides louvre on Fig. 1 shell 1 top respectively has an electromagnetic interference (EMI) emissions source 10, and the inwall and the middle part of Fig. 1 and Fig. 2 shell 1 have thermal source 2 and thermal source 3 respectively.The thermal source 2 that directly is adjacent to outer casing inner wall directly externally and the electromagnetic radiation that directly is subjected to all lack than thermal source 3.Thermal source 2 helps to utilize shell 1 to absorb the more low frequency magnetic line of force near shell 1.

When heat conductor: a minimum surface of the low thermal resistance heat conductor that the minimum surface of thermal source is adjacent to is adjacent to the minimum inwall of outer casing inner wall.Described thermal source is adjacent to outer casing inner wall through the low thermal resistance heat conductor, and for shielding, low thermal resistance should be that the hot road xsect of trying one's best big is arranged, and also is bigger shielding surface.

Described near-thermal road length is meant that thermal source is adjacent to the position of heat conductor and the position that heat conductor is adjacent to outer casing inner wall, the length between its two positions between nearest two points of hot approach, and hot road length is short more good more.Certainly, best=0mm.

Diameter or the width and the thickness of described hot road xsect, be meant that one or more right cylinder or rectangular parallelepiped separate side by side or be adjacent to the total size at the minimum position of total size of stack, it must be thicker can selecting heat-conducting block or heat-conducting plate, and this is to realize this case purpose important structure condition.As adopt metal forming individual layer or the less stacked use that adds, and hot road cross-sectional area thermal resistance is bigger, and big width metal forming can increase the area of dissipation of enclosure, makes the corresponding minimizing of the heat that passes to outer casing inner wall, and the less shielding of the electromagnetic wave of isolation loss is not good enough.

As adopting the thicker use that is added to of the thin metal of multilayer, hot road cross-sectional area will comparatively fast strengthen, and help heat conductor and the contact flexibility of thermal source with outer casing inner wall.

The diameter or the diagonal line of described near-thermal road xsect are meant that one or more right cylinder or rectangular parallelepiped separate side by side or be adjacent to the total size at the minimum position of total size of stack.In order to keep less thermal resistance, longer as hot road, then hot road cross-sectional area must corresponding increasing, table 1: be near-thermal road length and the diameter or the diagonal line comparison example of near-thermal road xsect.

Table 1: feature ratio	3	?6	?6	?12	?12	?24	?24	?48
Table 1: feature ratio	3	?6	?6	?12	?12	?24	?24	?48	Near-thermal road length	9	?12	?18	?24	?36	?48	?72	?96
The diameter of xsect or diagonal line	3	?2	?3	?2	?3	?2	?3	?2	Near-thermal road length	9	?12	?18	?24	?36	?48	?72	?96

Because this case structure is that thermal source and outer casing inner wall are close as far as possible, preferably directly be adjacent to, having limited hot road length should be less, the xsect that has limited hot road should be bigger, the ratio that has also limited hot road length and its cross section diagonal length should be less, thereby guaranteed that heat conductor inside can be under the condition of no external force, initiatively effectively with heat transferred to outer casing inner wall.

Certainly,, also electric fan or electric pump can be set, but the setting of electric fan or electric pump and operation are complementary or discontinuity in order to strengthen the operational reliability of thermal source in high load capacity or hot environment.

Described thermal source is adjacent to outer casing inner wall, can select it is characterized in that, to the heat conductor between thermal source, thermal source and the outer casing inner wall, shell, the total power consumption of the active radiating element that dispels the heat in these 3 positions, the minimum long continuously time, as: 0.1～20S, contain 20S or, 20～40S, contain 40S or, 40～59S, contain 59S or, 59～79S, contain 79S or, 79～99S or, 〉=99S on average is 0～0.4W, contain 0.4W or, 0.4～0.8W, contain 0.8W or, 0.8～1.1W, contain 1.1W or, 1.1～1.5W, contain 1.5W or, 1.5～1.9W.The control of its power consumption size minimumly comprises or has made up: the automatic control of the selection of active radiating element or circuit.

This case is when adopting tubular container heat conductor, its inside non-solid is subjected to moving of thermal conductor, minimum be sometime initiatively shift to the outer casing inner wall position from the thermal source position, at this moment, be initiatively heat to be shifted to the outer casing inner wall position from the thermal source position.

Five. technical scheme is about heat conductor:

Described heat conductor minimumly comprises or has made up: real core heat conductor or container heat conductor.

Known technology heat conductor or heating radiator and outer casing inner wall insulation or contact resistance are bigger, and its solid heat conductor structure had not been considered shielding.The heat conductor of tubular container heat conductor inside is to rely on the thrust of electric pump passive mobile fully.

The heat conductor of this case is adjacent to shell and contacts, and heat radiation, heat conduction and shielding are all considered, effect also is preferably.

The material of described heat conductor minimumly comprises or has made up: metal or nonmetal heat conductor, rigid or elastic heat conducting body.Heat conductor can select rubber or plastics to manufacture the elastic heat conducting body, and the rigid damage when the elastic heat conducting body can reduce thermal source when mounted with use can suppress resonance.

Described heat conductor shape or structure, minimumly comprise or made up: square, L shaped, U-shaped, cylindrical, square tube shape, heating radiator, heat-conducting plate, internal mix have the elastic heat conducting body of the little metallic object of diameter or thickness＜5mm, can be silk thread or the fractionlet or the comminutions of metal.Tiny metallic object helps shielding and heat conduction.For the thermal source that should consider to insulate, can increase silicon rubber or other insulation course on the top layer of heat conductor.Heat conductor can be selected real core heat conductor or container heat conductor.

Described container heat conductor is meant the various containers that contain liquid or steam.Can select tubular or circular arc, also can select prismatic.But the selected sealed container heat conductor, also can select at any time can liquid make-up or vapor species through hole container heat conductor arranged.Minimum comprising: the liquid thermal conductivity pipe of sealing, the vapour vessel heat conductor-heat pipe of sealing etc.

Described heat conductor effect is: 1. when the heat-delivery surface and the outer casing inner wall of thermal source, height or direction can give hot road with heat conductor and connect not simultaneously.2. also can strengthen the quantity of heat storage and the temperature difference that reduces each position of shell.When 3. heat conductor is solid, also can cooperate outer casing inner wall that thermal source is formed electromagnetic wave isolation and low frequency electromagnetic absorption.4. for the contact contact chip thermal source that compresses mutually that may adopt in the future, heat conductor is fixed alternative heat spreader to the chip thermal source.

Thermal source, heat conductor, outer casing inner wall, its position that is adjacent to mutually can select the Heat Conduction Material of softnesses such as the cushion of heat conductive silica gel or graphite film or aluminium foil or copper film or heat conduction with phase change pad to set up heat-conducting layer, in order to the reinforced heat conduction effect.

Six. technical scheme is about shell:

Described outer casing inner wall is characterized in that, minimumly comprises or has made up: the door of panel, base plate, side, shell or lid.Described shell position comprises keyboard and keyboard periphery position with the shell combination for the computer of shell and keyboard combination.

Described outer casing inner wall is characterized in that, minimumly comprises or has made up: upwards inwall or, downwards inwall or, left inwall or, to the right inwall or, forward inwall or, inwall backward.Each thermal source should disperse to be distributed in each position of outer casing inner wall as far as possible.For example: CPU is fixed on upwards inwall, so that heat is transmitted to other position of shell as early as possible; Because hard disk is compared with other semiconductor devices thermal source, the thermal value of hard disk is less, so main is that hard disk is tried one's best away from other thermal source, so that hard disk better utilization outer casing inner wall is dispelled the heat, hard disk is fixed on the CPU of downward inwall away from big heat; CD drive is fixed on inwall left; High power valve is fixed on inwall to the right.

Described shell, it is characterized in that, minimumly comprise or made up: the planar metal plate shell, have the bending groove the sheet metal shell, with sheet metal be fixed on case surface and shell, part of local thickening or all be shape shell, metal level and non-metallic layer combined housing, contain the synthetic material shell of metal, join 38 pages of " electronics technology " 2002 years 12 phases.If adopt the synthetic material that contains metal to make shell, its thickness especially fixed sturcture of internals must have specific difference with metal shell.

Described shape shell is meant that the inwall of sheathing material makes up the structure that other hardware is arranged.Minimum comprising: casting, cold forging, milling, hot pressing, extruding.

1. known enclosure is erect fixing circuit board and all is fixed on independent metal frame, does not have directly with outer casing inner wall to be connected.

This case enclosure is erect the member that fixing circuit board can select directly to be fixed on outer casing inner wall, be that outer casing inner wall has the directly fixing member of erectting circuit board, structure is more simplified, its member can be, screw member gluing with shell punching press, accessory electric welding, accessory, pin connections, riveting connection, hook groove with structure manufacturing such as being connected of switch hook or dogging or be fixed on outer casing inner wall, join Fig. 4, Fig. 5, Fig. 6, Fig. 7.Described setting circuit board not only comprises 90 ° and stands vertically, and also comprises when outer casing inner wall to tilt and the situation of circuit board when also tilting, and the setting angle of erectting circuit board is 10～30～60～90 °.

2. for better heat radiation and shielding, can select the hacking of wall interpolation in the enclosure processing layer, the method for hacking can be known method, blackout interpolation layers such as sandblast.Shell have resistivity less than gold or silver or other electrodeposition of metals of copper, it is outermost layer or the middle layer or the bottom that this electrodeposited coating can be selected, and can select earlier shell to be electroplated the copper of 30～50 μ m, the silver of re-plating 10～20 μ m.

3. this case can select high power valve directly is fixed on the inwall of shell, is fixed on circuit board reverse side or circuit board next door, has reduced thermal source to greatest extent and has been adjacent to the approach that shell dispels the heat, and has reduced the electric capacity heating temperature on high power valve next door.For the shielding of accentuator plate, the radome of the direct fixing circuit board of wall in the enclosure.

4. for to make thermals source highly different on the common circuit board can both be adjacent to outer casing inner wall, the outer casing inner wall structure can be selected: shell be provided with the position, just, the size boss face corresponding with thermal source, as adopting thin resilient made shell, boss face can also apply the elastic force that compresses to thermal source, heat conductor, outer casing inner wall cascaded structure.The heat-conducting plate that wall setting in the enclosure is corresponding with thermal source, the heat-conducting plate of interpolation can also be accelerated heat conduction, and heat-conducting plate also can select to be arranged on outer shell outer wall.

5. fixing for drivers such as hard disk, CD writer, can with bolt from the outside of shell directly and the screw of driver bottom surface or side fix, also can select hard disk is sealed to anti-noise box inside, to prevent that again the noise box is fixed on outer casing inner wall, when the bolt end is exposed at shell side face or end face, should be beautified the end of bolt.Certainly, for make thermal source on the circuit board more reliable, be adjacent to outer casing inner wall more easily, the also fixed sturcture that can select bolt end portion to expose, with the bolt circuit board in addition the thread-hole part of side get final product.This case outer shell outer wall has fixing thermal source or the member of combinations of sources of heat part is arranged.

6. the thickness of the stamping material of known shell or welding material all is 0.6～1.0mm.

This case can select to increase the stamping parts of shell or the thickness of weldment material, it can be thicker integral thickness, also can be near certain position of the stamping parts of shell or weldment material especially thermal source, be adjacent to the heat conductor of thickening with fixed sturctures such as forging and pressing, electric welding, riveteds, perhaps, when packing shell into, thermal source is adjacent to the heat conductor of thickening, with the aggregate thickness of the single or multiple lift that increases sheathing material with structures such as bolt or Spring Cards.

Can select the stamping parts of shell or certain position of weldment material or the total average thickness of all sites is 0.9～1.25mm, contain 1.25mm or, 1.25～1.35mm, contain 1.35mm or, 1.35～1.55mm, contain 1.55mm or, 1.55～2.5mm, contain 2.5mm or, 2.5～3.5mm or, 〉=3.5mm.

Usually each plane of shell or the material thickness at position are essentially identical, and at this moment, the total average thickness of sheathing material is meant the average thickness of the total area at each position on each plane of outer shell outer wall.Iff some planes or the position adopt the material of thickening, and the material of general thickness is adopted at other plane or position, so, this case emphasis considers that the general thickness position will exert an influence to the integral heat sink or the shielding of shell.

The total average thickness of the stamping parts of described shell or weldment material is meant that choosing 100% of the thickening casing outer wall total area is the material average thickness or the material thickness of thickening casing;

Perhaps, the material thickness of choosing thickening casing is tried one's best thick, and the average thickness on 2 close planes mutually, is the material average thickness or the material thickness of thickening casing;

Perhaps, choose the as far as possible thin position of material thickness of thickening casing, choose 100～68% of the outer shell outer wall total area, contain 68% or, 68～45%, contain 45% or, 45～30%, contain 30% or, 30～22%, contain 22% or, 22～20% or ,≤20% average thickness.

Give an example 2: the thickening casing of certain computer, adopted multiple thickness of material, the % ratio of the thickness of its various materials and the shared total area is respectively: 0.8mm and 17%; 1mm and 3%; 1.5mm with 19%; 10mm and 61%.If calculating average thickness with the total area is 6.49mm.Because has adopted at some positions will be slightly influential to this case effect than thin material, if strict this case effect of pursuing, then can be at the thin as far as possible position of the material thickness of thickening casing, choose some positions of the outer shell outer wall total area, can select 30% of the total area to limit, then average thickness is 1.05mm, ginseng table 2.

Table 2: the thickness mm of various materials ²	????0.8	????1	????1.5	????10	Average thickness
Table 2: the thickness mm of various materials ²	????0.8	????1	????1.5	????10	Average thickness	Various materials account for the ratio of the total area	????17％	????3％	????19％	????61％	????6.55
Select the total area 45%, material accounts for the ratio of the total area	????17％	????3％	????19％	????6％		Various materials account for the ratio of the total area	????17％	????3％	????19％	????61％	????6.55
	????17％	????3％	????19％	????6％		Various materials account for the ratio of choosing the position area	????38％	????7％	????42％	????13％	????2.34
Select the total area 40%, material accounts for the ratio of the total area	????17％	????3％	????19％	????1％			????38％	????7％	????42％	????13％	????2.34
	????17％	????3％	????19％	????1％		Various materials account for the ratio of choosing the position area	????43％	????8％	????48％	????3％	????1.38
Select the total area 35%, material accounts for the ratio of the total area	????17％	????3％	????35％-17％-3％-19％＝15％				????43％	????8％	????48％	????3％	????1.38
	????17％	????3％	????35％-17％-3％-19％＝15％			Various materials account for the ratio of choosing the position area	????49％	????9％	????15％/35％＝43％		????1.12
Select the total area 30%, material accounts for the ratio of the total area	????17％	????3％	????30％-17％-3％-19％＝10％				????49％	????9％	????15％/35％＝43％		????1.12
	????17％	????3％	????30％-17％-3％-19％＝10％			Various materials account for the ratio of choosing the position area	????57％	????10％	????10％/30％＝33％		????1.05

7. this case thermal source is adjacent to outer casing inner wall, has shortened hot road greatly, can select suitable reduction for the thickness requirement of shell.Heat conductor that thermal source or thermal source are adjacent to and outer casing inner wall are adjacent to the mean value of the aggregate thickness at position, with the ratio of the mean value of the aggregate thickness of shell all surfaces be 1.9～2.1, contain 2.1 or, 2.1～2.5, contain 2.5 or, 2.5～2.9, contain 2.9 or, 2.9～3.4, contain 3.4 or, 3.4～3.9 or, 〉=3.9.

Seven. technical scheme is about the combination of heat source near outer casing inner wall:

1. the various devices of known ordinary circuit board and chip thermal source and CPU socket all are designs in the common surface front of circuit board.

This case can be adjacent to outer casing inner wall in order to make the chip thermal source, can select the socket with chip thermal source or chip thermal source, and design is at the reverse side of circuit board.For the welding of the chip thermal source or the chip thermal source socket of circuit board reverse side, can select by hand or all can weld automatically.For example: circuit board is after Reflow Soldering and wave-soldering are finished, refer back to the tin cream method of on steel mesh, scraping of fluid welding, chip thermal source hole to pcb board is coated with tin cream, expose and block the metal cap of periphery then with flanging with intermediate openings, block peripheral position, with position, the chip thermal source hole heating solder(ing) paste that heat gun exposes the metal cap middle part, Fig. 8 and Fig. 9 are respectively the upward view and the front elevations of square metal cover.When the steel mesh that also can be chosen in the pcb board Reflow Soldering is scraped tin cream, the chip thermal source hole of pcb board is coated with tin cream, load onto then chip thermal source or CPU socket and with supporting plate below support holder temporarily, carry out Reflow Soldering simultaneously with the paster pcb board then.

Circuit board is in debugging and when maintenance, and CPU should fix interim heating radiator, for this reason, on the CPU socket known heating radiator fixedly card still should keep.

The design of chip thermal source is at the circuit board reverse side, not only utilize the Copper Foil shielding of circuit board surface or interlayer, the mutual interference mutually of control thermal source and other device, and reduced thermal source taking to board area, and original vacant circuit board and the space between the outer casing inner wall have been made full use of, for the volume that reduces board area and complete machine has all been created facility, and because the plane and the outer casing inner wall plane of circuit board are all bigger, thereby avoided the less heating radiator of the area of plane when being installed to CPU, because the more pressure that tilts is big the corner of CPU is damaged by pressure, adopt the structure of CPU at the circuit board reverse side, the thickness of the outer package insulation course of attenuate core cpu that can be suitable, like this, can improve the radiating effect of core cpu greatly, core cpu helps shield effectiveness near large-area metal.

Be connected removable interconvertible small front apron between the keyboard socket of known computer main board and near other socket thereof and the shell.All be that can not moving of fixing can not be changed between the holder of known computer main board plug-in card sheet metal and the shell.

If this case computer is fixed on thermal source at the back side of mainboard, may exist different thickness at thermal source of the same race, in order to guarantee appropriate cooperation the between keyboard socket and near other socket thereof and the shell, and appropriate cooperating between the sheet metal that guarantees plug-in card and its holder can be selected to change or the heat conductor thickness or the heat conductor that increase and decrease between thermal source and the shell have or not; Also can select adopting the elastic heat conducting body between thermal source and the shell; Also can select the small front apron of keyboard socket and near socket thereof and the holder of plug-in card are combined as big baffle plate, and two sides of big baffle plate above the mainboard front can be moved with the chute of shell.

The video card slot of 2. known computer circuit board all designs the middle part at circuit board.

This case for convenience chip thermal source is adjacent to outer casing inner wall, can select the slot design of video card in position that circuit board keeps to the side.

3. be dispersed in the air for better heat shell and enclosure, and, reducing the heat that is delivered to shell conducts through circuit board, perhaps, crack convection current through circuit board and shell, return enclosure, can be chosen in have between the circuit board of thermal source and the shell thermal insulation board or with the passage of housing exterior airflow connection.

Described thermal insulation board, with the insulating material manufacturing, all there is corresponding thermal source hole the position of corresponding thermal source so that the heat conductor of thermal source or thermal source through the thermal source hole to outer casing inner wall heat conduction.

The material of described passage can be selected: metal, plastics or other material.

The structure of passage is minimum to be comprised or has made up: combination or produce the back combination respectively when shell and channel component are produced simultaneously, and shell makes up with channel component, and is more suitable for portable type; In the interlayer inside of shell and circuit board, be that the limit surrounds passage with the passage rib, outer shell passage and circuit board combination of channels, more suitable to desk-top type.

At the endpiece of passage, the electric fan or the temperature control electric fan of continuous working can be set for the use of open-air heat temperature.Electric fan can selection and shell or the combination of passage accessory.

The passage rib can make up with heat conductor, can reduce the temperature difference of each position of shell.

4. thermal source, heat conductor, outer casing inner wall are more reliable to be adjacent to mutually in order to make, can the shell fragment member be arranged in the outside of thermal source and heat conductor and outer casing inner wall tandem compound, its cascaded structure is compressed, the stress point of elastic force is in the outside of its tandem compound, and the direction of elastic force is the direction that thermal source, heat conductor, outer casing inner wall are adjacent to mutually.

Shell fragment can the plastics manufacturing, also can select sheet metal to strike out shell fragment, also can select to turn to Spring Card than hard metal wire, and there is the position of protrusion at the middle part of shell fragment, and the direction that is adjacent to mutually towards thermal source, heat conductor, outer casing inner wall applies elastic force.

Shell fragment fixing can select in the enclosure wall in advance with the fixing threaded metallic object of structures such as electric welding or stickup, then fixes with bolt and elastomeric two ends or bolt hole on every side.The fixing of shell fragment also can be fixed with Spring Card with reference to the fixed sturcture of heating radiator.

For as the server multi-CPU structure of more thermal source is arranged on the common circuit board,, all be well suited for applying the pressure that is adjacent to mutually with shell fragment for as the large span clinging structure of thermal source is arranged in the middle part of the circuit board.

Can select to make driver be adjacent to wall in the enclosure for drivers such as hard disks, make things convenient for the dismounting of driver with direct extruding of structure such as selecting shell fragment.Also hard disk can be contained in the inside of hard disk cover, then apply mechanically the shell fragment extruding and make it be adjacent to wall in the enclosure together with hard disk.Hard disk adopts the fixing means that adds the hard disk cover to help antidetonation and suppresses resonance.

Can also adopt the sheet metal circuit structure.In the combination of the surface of sheet metal insulation course is arranged, the combination of side surface in addition of insulation course has layer printed circuit board.Sheet metal can be selected aluminium or copper product.Insulcrete can be selected to apply or stick on metal sheet surface with pottery or high-temperature resistance plastice or resin manufacture.The thermal source that is fixed on layer printed circuit board is adjacent to insulation course, with the insulation course is heat conductor, is adjacent to through sheet metal and outer casing inner wall again, also can be chosen in heat source position and make the insulation course vacancy, be fixed on the thermal source of layer printed circuit board, through the vacancy of insulation course directly and sheet metal and outer casing inner wall be adjacent to.Described metal plate structure comprises modular circuit and thick film circuit.

Eight. technical scheme is about the suitable contrast of various color display screen electric appliances and thermal source thereof:

Described computer is meant the various electrical equipment of processor and input media or control device.Described input media or control device minimumly comprise or have made up: keyboard, mouse, touch-screen, acoustic control, remote control, smart card.

Described computer, compatible computer of minimum comprising: IBM and Apple Computers; Minimum comprising: server, workstation, industrial computer, business PC, family expenses machine; Minimum comprising: display screen part and host machine part; Minimum comprising: cabinet type computer or, desktop computer or, network computer or, pocket computer or, integrated computer or, palm PC or, portable computer or, panel computer or, special purpose computer or, computer peripheral equipment or, the computer external module.

A. described cabinet type computer is meant the computer that place on various suitable ground, minimum comprising: the computer that tower computer server etc. are heavier.

B. described desktop computer is meant the computer that various suitable desktops are placed, minimum comprising: horizontal computer (containing: rack server, blade server), vertical computer.

C. described network computer is meant the desktop computer of no hard disk.

D. described pocket computer is meant the host computer of small-sized no display screen.

E. described integrated computer is meant that combined display screen is at 14.5～15.5 o'clock, contain at 15.5 o'clock or, 15.5～16.5 o'clock, contain at 16.5 o'clock or, 16.5～17.5 o'clock, contain at 17.5 o'clock or, 17.5～18.5 o'clock, contain at 18.5 o'clock or, 18.5～19.5 o'clock, contain at 19.5 o'clock or,＞19.5 o'clock computer can have been selected or on-keyboard, for example: the computer that 17 o'clock display screens and keyboard are arranged.

F. described palm PC is meant that combined display screen is at 1～6.5 o'clock, contain at 6.5 o'clock or, 6.5～8 o'clock, contain at 8 o'clock or, 8～9.5 o'clock, contain at 9.5 o'clock or, 9.5～11 o'clock, contain at 11 o'clock or,, contain 12.5 o'clock computer at 11～12.5 o'clock.For example: the notepad computer.

G. described portable computer is meant that the display screen of combination is bigger than palm computer, and is littler than integrated computer, and display screen is with upset commissure and keyboard combination, and the computer of radiating electric fan or heat radiation electric pump is arranged, for example: the mobile PC of no cell arrangement.

H. described panel computer is meant that the display screen of combination is bigger than palm computer, and is littler than integrated computer, gets rid of other computer of portable computer, for example: the computer of board PC, intelligent display, radio display, electronic reader, rotatable display screen etc.

I. described special purpose computer is meant display, video player, game machine, mobile phone, wrist-watch, the colour TV of CPU and other professional computer.

J. described computer peripheral equipment, minimum comprising: display, switch, router, hub, modulator-demodular unit, disk array, projector.

K. described computer external module minimumly comprises or has made up: the various outside removable drives that use.

This case utilizes ' being adjacent to ' structure of this case to dispel the heat or shield to various color screen electrical equipment and thermal source thereof, and its effect has bigger difference.

Cabinet type computer and the desktop computer bigger for shell are thicker owing to sheathing material, the effect of utilizing shell heat accumulation and shielding all is best, the more important thing is that for server especially important events are required cocksure computer, the reliability of heat accumulation has obtained important performance at this.

For panel computer and special purpose computer, because frivolous, the low consumption of lay special stress on, noiselessness, though utilize the direct quantity of heat storage of this case to decrease, but should adopt the CPU heat itself of low consumption and relative low speed also less usually by the series computer, this case thermal source is adjacent to the structure of shell and can works good greatly, externally be adjacent to the structure that thermal store carries out big heat heat accumulation, can resolve a heat accumulation difficult problem fully.

For portable computer,, utilize then relative other computer of importance of this case structure lower slightly because to frivolous, low consumption, especially noiseless custom requires relatively low.

This case also can be used for the electrical equipment of part achromaticity display screen, and just necessity and applicability decrease.

Described thermal source minimumly comprises or has made up: processor or, north bridge or, hard disk or, CD drive or, the power supply high-power switch tube on mainboard surface or, the high-power switch tube of power supply unit inside or, the high-frequency inductor coil or, battery, and the assembly of thermal source.

Described processor minimumly comprises or has made up: microprocessor MPU, central processor CPU, image processor GPU, digital signal processor DSP, single-chip, integrated chip, System on Chip/SoC.Described single-chip is meant one or more processor chips and the integrated chip that is manufactured on single chip of other computer chip.Described integrated chip is meant the chip with one or more processor chips and the integrated encapsulation of other computer chip.The interface of processor, can select for use arbitrarily, minimumly comprise or made up: the slot contact of the stitch interface of common plane, similar Slot1 on the CPU next door, ginseng Figure 20 and the CPU and mainboard contacting that may adopt in the future with contact extruding conduction, the heat radiation plane and the shell that can be processor are adjacent to, and also can select is that the side surface direction of processor is adjacent to through heat conductor and shell.

When adopting the structure of CPU and motherboard contact conduction, can select with the mainboard back side or, positive CPU, earlier have the thin slice frame of fixture to contact to locate with the periphery of CPU with periphery or, there is the heat conductor of fixture to contact the location with periphery earlier with the surface of CPU, then directly be adjacent to outer casing inner wall or, be adjacent to outer casing inner wall through heat conductor.

Described CD drive minimumly comprises or has made up: CD-R, CD-RW, DVD-R, DVD+R, DVD-RW, DVD+RW.

Described high power valve minimumly comprises or has made up: the triode of power-supply system, diode.

Described battery, minimum comprising: rechargeable battery, fuel cell.The thermal value of fuel cell is also more many greatly than rechargeable battery, but the power capacity of fuel cell is very big, be subject to people's attention,, its heat radiation can be directly carried out with reference to the radiator structure of other thermal source of this case for the effect of its heat radiation will directly influence the promotion and application of fuel cell.

The assembly of described thermal source minimumly comprises or has made up: made up the circuit board of processor, made up hard disk external portable hard drive, made up the power supply unit of high power valve.

The thermal source that is adjacent to outer casing inner wall preferably is allowed a choice, if whole thermals source all are adjacent to shell, effect increases progressively limited, and increases the assembling difficulty.With CPU is this case emphasis, heat maximum, frequency are the highest, lead-in wire at most and volume less, the heat maximum, dispel the heat important, frequency the maximum data stream is maximum, shield important, lead-in wire is maximum, the resonance of fearness electric fan or electric pump.The known technology radiating element is isolated to be fixed on chip surface, damages the exposed die core easily by pressure.

This case chip directly is adjacent to outer casing inner wall, perhaps to be adjacent to hot road cross-sectional area big and be adjacent to the heat conductor of outer casing inner wall for chip, because the temperature of chip core is the highest, it also is the fastest, the most obvious, the most important position of conducting heat, circuit board plane and outer casing inner wall plane are all bigger, have avoided tilting to damage chip core by pressure, help to promote the use of exposed die core, the packaging insulating layer thickness that helps the attenuate chip core can improve the radiating effect of chip core greatly.

Because hard disk is the sophisticated product of dynamo-electric combination, it is also a lot of go between, and data stream is bigger, and heat is bigger, be afraid of most to vibrate, and also be preferably to the application of this case.

Nine. beneficial effect:

Known technology:, do not considered the structure of near-thermal road length with the emphasis that is chosen as of heat-transfer device and radiating element; The diameter of near-thermal road xsect or the structure of width and thickness had not been considered; Near-thermal road length and the diameter of near-thermal road xsect or the ratio structure of catercorner length had not been considered; Do not considered described unitized construction yet; Do not considered more that described unitized construction was used for heat radiation and shielding.

People get used to after heat source position is fixing, consider to adopt what scheme again, and adopt what radiating equipment, and the heat absorption of thermal source behind radiating equipment, is dispersed housing exterior again.People get used to block heating radiator, have ignored the shell heat accumulation of sheet.

This case technology: realize heat radiation to be adjacent to, realize shielding to be adjacent to heat accumulation.Structure with ' being adjacent to ' is attached most importance to.

Before this case heat source position is fixing, consider earlier which position thermal source is fixed on, and thermal source directly is adjacent to or more close outer casing inner wall, make heat be delivered to shell as early as possible and store or distribute.Improved radiating effect, changed color screen electrical equipment, especially computer must rely on radiating element to disperse the idea that heat dispels the heat.

The raising of performance causes the increase of thermal source heat and the increase of thermal source device number easily, is to be difficult to solve highly reliable, contradiction cheaply with known method.This case has reduced in the shell and the outer temperature difference of shell, has reduced in the shell and has flowed with the shell outer air, has desalinated in the shell and the outer difference of shell for heat radiation.With an almost nil cost and an absolute reliable difficult problem that has solved insoluble highly reliable, low-cost, the low-noise heat radiation of people for many years, such heat radiation also helps shielding, be that people are long-expected.

Heat source near outer casing inner wall, reduced the temperature difference on the inside and outside hot road of shell greatly, reduced the heat of enclosure, improved heat resistance, can reduce dependence to the air-conditioning of low temperature service, and the bigger effect of generation, reduced the electromagnetic interference (EMI) of air conditioner motor, reduced the spending of air-conditioning and machine room thereof, reduced the air-conditioning power consumption, reduced the air-conditioning noise, highly reliable, low-cost, high-level efficiency, indirect raising convenience (computer can be used UPS, air-conditioning must prepare highly energy-consuming, the generator of high noisy), directly and the high reliability of indirect effect, prevented the fault of various contingency, for military, aviation, space flight, meteorological, scientific research, the website, server, key areas such as industrial computer, and high-end applications that must the long-time continuous computing is extremely important.

Thermal source is adjacent to outer casing inner wall, has improved the resonant frequency after shell makes up, and has suppressed the resonance of shell, helps the raising of complete machine performance and stability.

1. heat source near outer casing can reduce or exempt louvre; 2. heat conductor that thermal source and hot road cross-sectional area are bigger and shell is adjacent to mutually; 3. thermal source is fixed on the circuit board reverse side because the interlayer that the isolation of multilayer copper foil and Copper Foil and shell form has suppressed the mutual interference mutually of thermal source with other device, these all help shielding; The electromagnetic radiation that helps to prevent computer causes leakage of information; Help to prevent destruction by High-Power Microwave.

This case has overcome the A～L drawback of the described known technology of background technology to greatest extent, and the known technology drawback is become this case effect.

Cooperate subplans such as thickening casing, the temperature rise of thermal source can be effectively controlled in cooperation that need not active radiating element at conventional environment, has reduced the necessity that active radiating element uses greatly.For higher standard or deal with possible abominable environment for use, can select heat radiator dedicated of temperature control electric fan etc. for use, but radiating element only is the effect of assisting, rather than necessary.

Environment for contaminated area or vulnerable to pollution such as in hospital, laboratory, especially to poisoning the computer that great infection pathogeny environment uses, thermal source is adjacent to the shell heat radiation, reduced the inside and outside air-flow of thickening casing, having suppressed biological virus, chemical drugs, radiation particle etc. wafts into being detained for a long time even growing in computer inside, having solved the easy pollution computer sterilization difficult problem of contaminated environment again, made things convenient for the processing after easy pollution computer is eliminated, is very important to environmental protection.Thermal source is adjacent to the thickening casing heat radiation, has reduced the dependence of computer to air-conditioning, has reduced the pollution problem of air-conditioning.Thermal source is adjacent to the shell heat radiation, has reduced environmental noise and electromagnetic radiation, also has more significance for hospital, laboratory.

It is especially significant to recording places such as radio station, TV station, electronic teaching to have reduced noise.

Known people are important in order to understand, big heat thermal source, as: the temperature of CPU, adopt the electronic temperature measurement system usually, not only cost is higher, and the observation temperature is convenient inadequately.

The temperature of this case outer shell outer wall and the close together of thermal source, the temperature difference is less, can select increases the heat sensitive paint layer at the outer wall of shell, variable color batching according to different temperature, can draw various patterns or directly indicate corresponding temperature value, also can select heat sensitive paint is coated with other component surface that is painted on outer shell outer wall.Not only cost is lower, and observes temperature conveniently, the more important thing is that confidence level and reliability are very high, has practicality and ornamental, can bring new outward appearance sensation to people.

Heat source near outer casing inner wall is for combinations such as two-sided heat radiation, shell dispel the heat outward, external thermometric provide supporting basis.Reduce or the sealed heat-dissipating hole, dustproof sand control, waterproof are damp proof, anti-to be stolen novel color screen electrical equipment such as tamper-proof technical foundation is provided in order to make, and helps the heat radiation of plateau low pressure environment.

This case exposes the change or the interpolation of member, not only has practicality, also can make things convenient for various people's operating habits and special requirement, has also brought new sensation to people, new visual effect.

Ten. Summary of drawings:

Table 3: member numbering.

Numbering	The member explanation	Numbering	The member explanation
Numbering	The member explanation	Numbering	The member explanation	??1	Shell	??8	Circuit board
??10	Interference source	??18	Circuit board multioutlet socket	??1	Shell	??8	Circuit board
??10	Interference source	??18	Circuit board multioutlet socket	??2～7	Thermal source	??9	Shell fragment
??12～17	The heat conductor corresponding with thermal source	??19	Flat shim	??2～7	Thermal source	??9	Shell fragment
??12～17	The heat conductor corresponding with thermal source	??19	Flat shim	??22～27	The auxiliary heat conductor corresponding with thermal source	??28、29	Gas passage
??62	The thermal source socket	??30	Electric fan	??22～27		??28、29	Gas passage
??62	The thermal source socket	??30	Electric fan	??31～37	Bolt	??48、49	Snap ring, grab
??41～47	The thread-hole part corresponding with bolt	??50	Spring lever	??31～37	Bolt	??48、49	Snap ring, grab
??41～47	The thread-hole part corresponding with bolt	??50	Spring lever	??51～57	The sleeve pipe corresponding with bolt	??58	Video card

P1 Fig. 1 is a technical matters about thermal source directly outwards and the electromagenetic wave radiation synoptic diagram that directly is subjected to.

P1 Fig. 2 is the synoptic diagram of technical matters about the directly outside radiated electromagnetic wave of thermal source.

P1 Fig. 3 is an example 1, the synoptic diagram on the near-thermal road of the heat source near outer casing inner wall of desk-top color screen electrical equipment such as vertical computer and heat conductor.

P1 Fig. 4 is that shell 1 inside of shape manufacturing has up-small and down-big square groove, the enlarged drawing of square groove and 41 combinations of cylindricality blind hole thread-hole part.

P1 Fig. 5 is that shell 1 inwall of shape manufacturing has up big and down small dovetail groove, the enlarged drawing of dovetail groove and 41 combinations of cylindricality through hole thread-hole part.

P1 Fig. 6 is that shell 1 inwall of shape manufacturing has up big and down small dovetail groove, the enlarged drawing of dovetail groove and 41 combinations of sheet metal bayonet socket thread-hole part.

P1 Fig. 7 is the shell 1 of shape or sheet metal manufacturing and the enlarged drawing of sheet metal opening thread-hole part 41 combinations.

P1 Fig. 8 is an example 2, the side view of the heat source near outer casing inner wall of small-sized color screen electrical equipment such as panel computer.

P2 Fig. 9 is when being used for chip thermal source and socket thereof and being fixed on the circuit board reverse side, peripheral devices is blocked the metal cap upward view of hot blast.

P2 Figure 10 is Fig. 3 front elevation.

P2 Figure 11 is an example 3, and the thermal source of fluoroscopic color monitor or colour television set is adjacent to the vertical view of outer casing inner wall.

P2 Figure 12 is an example 4, the fixation side view of the circuit board of desk-top color screen electrical equipment such as vertical computer and the passage skeleton view between the shell and hard disk, CD-ROM drive.

P2 Figure 13 is the hard disk cover stereographic map of Fixed disk.

P2 Figure 14 is an example 5, and the CPU that is fixed on the stitch contact of circuit board reverse side is adjacent to the amplification front elevation that two-sided shielding is held concurrently in the two-sided heat radiation of outer casing inner wall.

P2 Figure 15 is Figure 14 left view.

P3 Figure 16 is an example 6, and the CPU that is fixed on the stitch contact in circuit board front is adjacent to the amplification front elevation of outer casing inner wall through heat conductor.

P3 Figure 17 is Figure 16 left view.

P3 Figure 18 is an example 7, and the CPU that is fixed on the stitch contact in circuit board front is adjacent to the amplification front elevation that two-sided shielding is held concurrently in the two-sided heat radiation of outer casing inner wall.

P3 Figure 19 is Figure 18 left view.

P3 Figure 20 is an example 8, and the CPU of slot contact is adjacent to the amplification front elevation of outer casing inner wall.

P3 Figure 21 is an example 9, and the CPU that is fixed on the stitch contact in circuit board front is adjacent to other enlarged left view that two-sided shielding is held concurrently in the two-sided heat radiation of outer casing inner wall.

P4 Figure 22 is an example 10, and there is the shell vertical view of rectangular through hole sheathing material inside.

11. embodiment:

Example 1, Fig. 3 are the synoptic diagram that multiple thermal source is close to the near-thermal road of the inwall of thickening casing 1 and heat conductor.The inwall of desk-top color screen electric appliance casing 1 has is directly fixing the member of vertical cube to circuit board 8, and the heat conductor 15 and the thread-hole part 44 of screw arranged, and so fixedly is different and known technology.

There is multioutlet socket 18 in the front of circuit board 8, can be used for external unit and connects.Thermal source 2 is through U-shaped heat conductor 12 and be adjacent to the heat conductor 22 of stack, is adjacent to shell 1 inwall indirectly, near-thermal road length=ab+bc+cd, and heat conductor 12 and heat conductor 22 are adjacent to the aggregate thickness=e+f at the minimum position of stack aggregate thickness.Bolt 31 and bolt 32 make up with thread-hole part 41 and thread-hole part 42 respectively through flat shim 19, and heat conductor 22, heat conductor 12 and thermal source 2 are adjacent to mutually with shell 1.

The positive basifacial of circuit board 8 has the slot of video card 58, thermal source 3 and thermal source 4 are arranged at the bottom of video card 58, thermal source 3 is adjacent to the boss face 11 of shell 1 bottom, the thermal source 4 of large volume directly is adjacent to shell 1, and bolt 35 is adjacent to the inwall of thermal source 3 and thermal source 4 and shell 1 with thread-hole part 45 combinations of video card 58.

The reverse side top of circuit board 8 is fixed with high power valve 5, two limits have insulating mat 43 and heat-conducting plate 15 respectively about high power valve 5, heat-conducting plate 15 inside have screw to be fixed on the inwall of shell 1, and heat-conducting plate 15 is adjacent at shell 1 inwall high power valve 5 with bolt 33 combinations.Large-area heat-conducting plate 15 can reduce the temperature difference at shell 1 thermal source position.

The reverse side of circuit board 8 has the thermal source 6 that is adjacent to shell 1 inwall through liquid container heat conductor 16, liquid container heat conductor 16 can be a large amount of heat accumulation, bolt 33 and bolt 34 make up with thread-hole part 43 that is fixed on shell 1 inwall and thread-hole part 44 respectively, bolt 33 and bolt 34 large spans fixed shell fragment 9, the tandem compound of thermal source 6, heat conductor 16, outer casing inner wall is adjacent to.

There is the thermal source 7 that is adjacent to through L shaped heat conductor 17 and shell 1 inwall the reverse side below of circuit board 8, bolt 36 and bolt 37 make up with thread-hole part 46 that is fixed on shell 1 inwall and the thread-hole part 47 that is fixed on circuit board 8 respectively, and thermal source 7, heat conductor 17, shell 1 inwall are adjacent to mutually.

For better this case purpose that realizes, the material of thickening has been adopted on the right side of shell 1, and can select is common sheet metal, and also can select is shape.Fixing for being adjacent to of thermal source and shell 1, can select to pass the fixedly thread-hole part of thermal source of shell aperture with bolt; Can select screw, clamp thermal source with bolt combination sheathing material inside; Can select thread-hole part, clamp thermal source with the bolt combination outer casing inner wall; The Spring Card structure that can select electricity consumption brain heating radiator is thermal source fixedly.For the unitized construction of the outer casing inner wall and the thread-hole part of shape, can select monolateral or bilateral up or down flat mouthful or the groove of angle or nock.

Fig. 4 is that shell 1 inside of shape manufacturing has up-small and down-big square opening groove, square groove and 41 combinations of cylindricality blind hole thread-hole part.

Fig. 5 is that shell 1 inwall of shape manufacturing has up big and down small bird tail dovetail groove, dovetail groove and 41 combinations of cylindricality through hole thread-hole part.

Fig. 6 is that shell 1 inwall of shape manufacturing has up big and down small bird tail dovetail groove, dovetail groove and 41 combinations of sheet metal bayonet socket thread-hole part.

Fig. 7 is the shell 1 and 41 combinations of sheet metal opening thread-hole part that shape or sheet metal are made, and that thread-hole part 41 and shell 1 fixing can be selected is gluing, spot welding, riveted.

Example 2, Fig. 8 are small-sized color screen electrical equipment, and there is the thermal source 2 that is fixed on socket 62 at the rear of circuit board 8, also have the thermal source 3 that is adjacent to shell 1 inwall through square heat conductor 13, directly are adjacent to the thermal source 4 of shell 1 inwall in addition, the thermal source 5 of also useful insulating mat 52 bed hedgehoppings.Bolt 31 and bolt 32 cooperate shell fragments 9 respectively with the thread-hole part 41 and thread-hole part 42 combinations of circuit board 8 upper fixed, thin shell 1 and thermal source 3 and thermal source 4 are adjacent to.

Example 3, Figure 11 are the thermal source 2 of fluoroscopic color monitor or colour television set and the inwall that thermal source 3 is adjacent to shell 1.The reverse side of circuit board 8 has thermal source 2 and thermal source 3, directly is adjacent to the inwall of shell 1.For non-fluoroscopic panel computer or colour television set with reference to other exemplary construction.

Example 4, the desk-top color screen electrical equipment of Figure 12, shell 1 and through type passage 28 and labyrinth passage 29 with the circulation of shell 1 extraneous gas are fixedly arranged between the circuit board of thermal source 5, be used to cooperate heat accumulation and under the heat environment, be shell 1 heat accumulation and heat radiation better, electric fan 30 more cooperates field or rugged surroundings to use.The left side of shell 1 respectively has thermal source CD-ROM drive 2, thermal source CD-ROM drive 3, thermal source assembly that the hard disk 4 of seal box is arranged up and down, all is directly to be adjacent to shell 1 inwall.

Hard disk 4 also can be selected behind the hard disk cover of load map 13 fixing again, better antidetonation, noise reduction sound, resonance is fallen.

Example 5, Figure 14 and Figure 15, CPU thermal source 2 fronts that are fixed on circuit board 8 reverse side directly are adjacent to shell 1 inwall, and the reverse side of thermal source 2 also is adjacent to through heat conductor 12 inwall with shell 1, the two-sided heat radiation that the forms thermal source 2 two-sided shielding of holding concurrently.The reverse side of circuit board 8 has four bolts 31 to make heat conductor 12 be fixed on the front of circuit board 8 with the combination of the screw of heat conductor 12 respectively.Circuit board 8 is fixing with thread-hole part 43 combinations that are fixed on shell 1 inwall by four bolts 33.Lock thermal source 2 again after being fixed on shell 1 inwall at circuit board 8, the socket check lock lever 62 of thermal source 2 preferably is lengthened to the outside of circuit board 8.

Example 6, Figure 16 and Figure 17, the CPU thermal source 2 that is fixed on circuit board 8 fronts is adjacent to shell 1 inwall through heat conductor 12.The flexible thing 20 of the reverse side of the thermal source 2 that socket 62 cooperates is supported the thermal source 2 more reliable heat conductors 12 that are adjacent to.After relying on four groups of bolts 31, bolt 32, thread-hole part 41 to make up, heat conductor 12 is fixed on the front of circuit board 8, heat conductor 12 has cross through hole near the position of shell 1, the inwall of the left and right sides shell 1 of heat conductor 12 respectively has snap ring 48 and grab 49, spring lever 50 passes the through hole of heat conductor 12, relies on snap ring 48, grab 49, spring lever 50 to make heat conductor 12 be adjacent to shell 1 inwall.Circuit board 8 relies on quadruplet bolt 33 and sleeve pipe 53 fixing with the screw combination of shell 1 inwall respectively.

For the contact contact chip thermal source 2 that compresses mutually that may adopt in the future, with heat conductor 12 alternative heat spreader being fixed on the circuit board front to chip thermal source 2 is can direct applied structure.

Example 7, Figure 18 and Figure 19, the CPU thermal source 2 that is fixed on circuit board 8 fronts is adjacent to shell 1 inwall through heat conductor 12, and circuit board 8 through holes of thermal source 2 reverse side have passed the heat conductor 22 that heat pipe 72 structures are arranged, thermal source 2 reverse side are adjacent to shell 1 inwall through heat conductor 22, form the two-sided heat radiation two-sided shielding of holding concurrently.Heat conductor 12 has vertical through holes near the position of shell 1, and the inwall of lower and upper shell 1 of heat conductor 12 respectively has snap ring 48 and grab 49, and spring lever 50 passes the through hole of heat conductor 12, relies on snap ring 48 and grab 49 to make heat conductor 12 be adjacent to shell 1 inwall.Circuit board 8 relies on four bolts 33 fixing with thread-hole part 43 combinations that are fixed on shell 1 inwall respectively.

Example 8, Figure 20, the CPU thermal source 2 of slot contact is adjacent to shell 1 inwall through heat conductor 12, and thermal source 2 compresses and relies on the circuit board 8 and the inwall of shell 1 to be adjacent to thermal source 2 with socket 62 combinations and circuit board conduction, heat conductor 12.

The CPU thermal source 2 that example 9, Figure 21 are fixed on circuit board 8 fronts is adjacent to shell 1 inwall through L shaped heat conductor 12, and the reverse side of thermal source 2 is adjacent to through heat conductor 22 inwall with shell 1, forms the two-sided heat radiation two-sided shielding of holding concurrently.Heat conductor 12 has vertical through holes near the position of shell 1, relies on the spring lever 50 of below that the heat conductor 12 and the inwall of shell 1 reliably are adjacent to.

Example 10, sheathing material inside have the shell vertical view of rectangular through hole.Its front portion is fixed with circuit board, and the periphery of outer casing inner wall is thermal source fixedly.

Owing to the effect of bleeding of rectangular through hole, accelerated the gas velocity of passive states greatly, assisted thermal source to be adjacent to the heat radiation practical function of outer casing inner wall greatly.

I confirm through experiment, for the long heating radiator of the fin of vertical fixing, in common opening radiating state, as the outboard end of fin is sealed with adhesive tape, make fin form long airflow duct, its temperature rise curve will be similar to the pressure limiting voltage stabilizing curve of stabilivolt, will limit the temperature rise of thermal source greatly.

The above is only for referencial use, and unrestricted, can select 26S Proteasome Structure and Function according to actual needs and the otherwise combined application.

Claims

1. the shielding of color display screen electric appliance thermal source and heat dissipating method are made up of thermal source and shell etc., it is characterized in that: thermal source is 0～33mm through the near-thermal road length that real core heat conductor or container heat conductor are adjacent to outer casing inner wall, contain 0mm, or 33～66mm contains 33mm, or, 66～99mm contains 66mm, or, 99～122mm, contain 99mm, or 122～155mm contains 122mm, or, 155～277mm contains 155mm, and the diameter of near-thermal road xsect or width and thickness all are 0.4～0.8mm, contain 0.8mm, or 0.8～1.6mm contains 1.6mm, or, 1.6～3.2mm contains 3.2mm, or, 3.2～6.4mm, contain 6.4mm, or, 6.4～12.8mm contains 12.8mm, or,＞12.8mm, and near-thermal road length is 0～3 with the diameter of near-thermal road xsect or the ratio of catercorner length, contain 0, or, 3～6, contain 3, or, 6～12, contain 6, or, 12～24, contain 12, or, 24～48, contain 24.

2. according to claim 1, described thermal source is adjacent to outer casing inner wall, can select it is characterized in that, to the heat conductor between thermal source, thermal source and the outer casing inner wall, shell, the total power consumption of the active radiating element that dispels the heat in these 3 positions, minimum continuous 0.1～20S, contain 20S or, 20～40S, contain 40S or, 40～59S, contain 59S or, 59～79S, contain 79S or, 79～99S or, 〉=99S on average is 0～0.4W, contain 0.4W or, 0.4～0.8W, contain 0.8W or, 0.8～1.1W, contain 1.1W or, 1.1～1.5W, contain 1.5W or, 1.5～1.9W.

3. according to claim 1, described outer casing inner wall is characterized in that, minimumly comprises or has made up: the door of panel, base plate, side, shell or lid, with the keyboard and the keyboard periphery position of shell combination.

4. according to claim 1, described shell, it is characterized in that, minimumly comprise or made up: the planar metal plate shell, have the bending groove the sheet metal shell, with sheet metal be fixed on case surface and shell, the part of local thickening or all be shell, the metal casting of shape shell, metal level and non-metallic layer combined housing, contain the shell of the synthetic material structure of metal.

5. according to claim 1, described shell minimumly comprises or made up: outer casing inner wall has the directly fixing member of erectting circuit board; Perhaps, outer casing inner wall has roughening layer or blackout layer or the resistivity electrodeposited coating less than copper; Perhaps, outer casing inner wall directly is fixed with the radome of circuit board; Perhaps, shell is provided with boss face corresponding with heat source position or heat-conducting plate; Perhaps, outer shell outer wall has fixing thermal source or the member of combinations of sources of heat part is arranged; Perhaps, certain position of the stamping parts of shell or weldment material or the total average thickness of all sites are 0.9～1.25mm, contain 1.25mm or, 1.25～1.35mm, contain 1.35mm or, 1.35～1.55mm, contain 1.55mm or, 1.55～2.5mm, contain 2.5mm or, 2.5～3.5mm or, 〉=3.5mm; Perhaps, heat conductor that thermal source or thermal source are adjacent to and outer casing inner wall are adjacent to the mean value of the aggregate thickness at position, with the ratio of the mean value of the aggregate thickness of shell all surfaces be 1.9～2.1, contain 2.1 or, 2.1～2.5, contain 2.5 or, 2.5～2.9, contain 2.9 or, 2.9～3.4, contain 3.4 or, 3.4～3.9 or, 〉=3.9.

6. according to claim 5, the total average thickness of the stamping parts of described shell or weldment material is meant that choosing 100% of the thickening casing outer wall total area is the material average thickness or the material thickness of thickening casing;

Perhaps, the material thickness of choosing thickening casing is tried one's best thick, and the average thickness on 2 close planes mutually, is the material average thickness or the material thickness of thickening casing; Perhaps, choose the as far as possible thin position of material thickness of thickening casing, choose 100～68% of the outer shell outer wall total area, contain 68% or, 68～45%, contain 45% or, 45～30%, contain 30% or, 30～22%, contain 22% or, 22～20% or ,≤20% average thickness.

7. according to claim 1, described thermal source is adjacent to the structure of outer casing inner wall, can select it is characterized in that, minimumly comprises or has made up: with the jack design of chip thermal source or the chip thermal source reverse side at circuit board; Perhaps, with the design of the slot of video card in position that circuit board keeps to the side; Perhaps, between the circuit board of thermal source and shell, have thermal insulation board or with the passage of housing exterior airflow connection; Perhaps, in the outside of thermal source and heat conductor and outer casing inner wall cascaded structure the shell fragment member is arranged; Perhaps, adopt the sheet metal circuit structure.

8. according to claim 1, described thermal source, minimum comprising: cabinet type computer, or, desktop computer, or, network computer, or, pocket computer, or, integrated computer, or, palm PC, or, portable computer, or, panel computer, or, special purpose computer, or, computer peripheral equipment, or, the computer external module, or, the audio and video appliances of hard disk is arranged, or, colour TV, or, colored display, the processor that its inside has, or, north bridge, or, hard disk, or, CD drive, or, the power supply high-power switch tube on mainboard surface, or, the high-power switch tube of power supply unit inside, or, the high-frequency inductor coil, or, fuel cell, and the assembly of thermal source.

9. according to Claim 8, described integrated computer is meant that combination has 14.5～15.5 inch, contain 15.5 inch or, 15.5～16.5 inch, contain 16.5 inch or, 16.5～17.5 inch, contain 17.5 inch or, 17.5～18.5 inch, contain 18.5 inch or, 18.5～19.5 inch, contain 19.5 inch or, the various combined computers of＞19.5 inch display screens can have been selected or on-keyboard.

10. according to Claim 8, described palm PC is meant that combined display screen is 1～6.5 inch, contain 6.5 inch or, 6.5～8 inch, contain 8 inch or, 8～9.5 inch, contain 9.5 inch or, 9.5～11 inch, contain 11 inch or, 11～12.5 inch contain the computer of 12.5 inch.