CN1488128A - A display and method of manufacture - Google Patents
A display and method of manufacture Download PDFInfo
- Publication number
- CN1488128A CN1488128A CNA018223516A CN01822351A CN1488128A CN 1488128 A CN1488128 A CN 1488128A CN A018223516 A CNA018223516 A CN A018223516A CN 01822351 A CN01822351 A CN 01822351A CN 1488128 A CN1488128 A CN 1488128A
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- circuit board
- reflecting body
- resin
- board arrangement
- equipment
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- 238000000034 method Methods 0.000 title claims description 40
- 238000004519 manufacturing process Methods 0.000 title claims description 23
- 229920005989 resin Polymers 0.000 claims abstract description 85
- 239000011347 resin Substances 0.000 claims abstract description 85
- 239000000758 substrate Substances 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- 238000003491 array Methods 0.000 claims description 2
- 238000004382 potting Methods 0.000 claims description 2
- 230000000295 complement effect Effects 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 abstract description 14
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 208000034189 Sclerosis Diseases 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000009958 sewing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
- G09F9/3023—Segmented electronic displays
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
Abstract
An surface mount seven segment LED display comprises a rectangular reflector body and an 'I' shaped PCB. The PCB has positioning holes, holes for epoxy and conductive holes. The PCB has a pair of V-shaped recessed towards its shorter edges. The reflector body has a flat front face and a hollow inner area and rear side walls. The hollow inner area includes locator pins for fixing the PCB. Further the reflector has a pair of ridges on its ends to hold the recesses of the PCB. The assembly of a compact reflector and a thin PCB is encapsulated by a resin/hardener epoxy.
Description
Technical field
The present invention relates to display and manufacture method thereof, relate in particular to the mounted on surface active display, though not necessarily uniquely, be particularly related to the seven-segment table face active display is installed.
Background technology
In many electronic installations, multiple stage displays such as seven-segment display are generally done visual demonstration with specific numeral or character to the user.Existing seven-segment display has various sizes and color.This class color is generally green, red, orange, Bai Hehuang, but display also can be used other color, decides on user's requirement.
Usually, the display of single figure place comprises seven sections that are generally rectangle, and light emitting diode is lined up the figure of eight, lights the section of various combination in seven sections, can form different symbols on display.Sometimes also near seven sections, be provided with littler center of circle luminescence segment.These seven sections are used for designation number and character, and littler luminescence segment is used for radix point or fullstop indication.
With reference to Fig. 1-4 a kind of known seven-segment display is described.Fig. 1 is the front elevation of this display, and Fig. 2 is the skeleton view of the back side to the side, and Fig. 3 is the sectional view of seeing from the side along display length, and Fig. 4 is the known circuit figure of this class display.
This display has three critical pieces, i.e. rectangular reflection body (10), rectangle printed circuit board (PCB) (PCB) (20) and translucent epoxy (30).
Film is moulded reflecting body (10) and is had front (11), two sidewalls and two end arms, the no back side, and its hollow core forms cavity (12).Positive (11) have seven rectangle sector holes and a circular hole (13h) in its (13a-13g), (116) extend into cavity (12) to this circular hole to the back from the front (11a) of positive (11).These seven sector holes (13a-13g) are elongated, are the shapes of seven display segments, and longer than back (11b) in the front (11a) of positive (11), because elongated hole (13a-13g) is just long more the closer to positive (11a).
PCB (20) has front (21) and the back side (22), and 8 light emitting diodes (23a-23h) are arranged on the front.Well-known in this area, these diodes are separated by circuit, being energized and lighting, and when control circuit requires, the diode combinations of expectation are lighted simultaneously.At this moment, the terminal of various circuit shown in Figure 4 is received 10 terminal pins (24a-24j), these terminal pins extend back from PCB (20) back side.
PCB (20) is arranged in reflecting body (10) in cavity (12), through being shaped and settling 8 diodes (23a-23h), each diode (23a-23h) is right after in corresponding sector hole (13a-13g) or circular hole (13h) back.Therefore, when diode (23a-23h) excited target, can see that it is luminous from reflecting body (10) front by corresponding hole (13a-13h).
Also in the cavity (12) of reflecting body (10), it fills 8 holes (13a-13h) to epoxy resin (30), fills the space between positive (11) back (11b) and PCB (20) front (21), also by its back side of PCB edges cover (22).Resin not only makes light scatter to the front of hole (13a-13h) from diode (23a-23h), has also sealed the front (21) of PCB (20) and the space between positive (11) back of reflecting body (10) (11b), with PCB (20) seal in place.
Fig. 4 illustrates two class light-emitting diode displays, public anode and the known internal circuit diagram of common cathode.Each a end of 8 light emitting diodes (23a-23h) connects into public anode or common cathode form usually.The driving pin (24a-24j) relevant each light emitting diode (23a-23h) is connected with driving voltage selectively, just can show different symbols.The user selects the type form of public anode or common cathode according to the voltage type of peripherals.
The manufacturing of this class display requires to inject cavity (12) with liquid-state epoxy resin (30), and PCB (20) immersion allows device solidify wherein up to covering its back side (22) again.Perhaps, earlier PCB is inserted cavity (12), the resin that reinjects (30) solidifies up to covering PCB (20) back side again.
The display of two kinds of manufacture method generations is all quite thick.Cavity (12) must be firmly got is enough to allow resin (30) cover PCB, and resin (30) amount that allows to use has certain variation.Moreover 10 pins (24a-24j) that come from PCB (20) are from reflecting body (10) certain distance that extends back.Because of PCB (20) inserts cavity (12) fully,, make each edge of PCB (20) have enough spaces to flow on every side in addition for resin (30) so reflecting body (10) must be longer wideer than PCB.
For the display segment of fixed measure, seem length and width and dark of the display that obtains.Also explanation when making reflecting body (10), has been used epoxy resin (30) and molded plastics too much.When forming bigger display, use a plurality of these type of seven-segment displaies together, this means that each bigger reflecting body has increased the overall dimensions of this class display, is an impediment to subminiaturization.
In addition, use metal pins (24a-24j) to increase cost and not convenient property.This class pin (24a-24j) must brute force be coupled on the PCB (20).In view of the production deviation of this processing, reduced the reliability of gained PCB.But pin (24a-24j) is essential because not so the contact on the PCB (20) to be sealed in epoxy resin (30) below.
One of subject matter of multiple stage display manufacture method is to manage to reduce bubble to stay the interior possibility of epoxy resin at present, and epoxy resin can be stationed at the light emitting diode on the PCB front and be passed through between its radiative resin filling sector hole, and this bubble can influence the performance of multiple stage display.
In a kind of way, for eliminating bubble, current production method relies on PCB is immersed epoxy resin, guarantees bubble is discharged resin.Certainly, so just PCB is completely enclosed within the epoxy resin, causes the foregoing component size that increased, and limited and made the pin that this class stretches out and extend through the display of epoxy on every side from PCB.
Pin as the connection of multiple stage display, just more be difficult to provide can mounted on surface display.Form for adapting to any mounted on surface, the pin that needs to stretch out curves the right angle, and this just is unsuitable for automatic processor multiple stage display is matched with all bigger elements of formation.
When configuration epoxy resin provided preferred methods to discharged air or in reflecting body, other designed reliability also was feasible, comprising the unit that is easier to mounted on surface.
Goal of the invention
Require cheap slim mounted on surface display in the industry today.Purpose of the present invention is that part alleviates some problem of known display at least, and thinner more honest and cleaner display is provided, or is at least the selection that the public provides usefulness.
Summary of the invention
According to first aspect present invention, a kind of display device is provided, it comprises
Reflecting body with positive and sidewall, by described side walls enclose, described hollow section is arrived by described front in the hole to hollow section in the back in described front;
Circuit board is fitted in the described reflecting body back side, and extends fartherly along first direction at least than described reflecting body side wall inner surfaces, with spaced apart in the same way,
Adapting device is used to cooperate the relative position of reflecting body and circuit board; Wherein
Inside surface is a first side wall along the equidirectional sidewall that separates closelyer than described circuit board scope;
Circuit board comprises and send light portion, is configured to send light to described hole when this circuit board is fitted on the described reflecting body back side.
Preferably, cooperation device comprises:
The slot device of described circuit board arrangement front surface; With
Corresponding to the described slot device and the projection arrangement of extending behind from reflecting body, it can extend at reflecting body the first side wall top.Described the first side wall has length and width, and described projection arrangement does not preferably extend through the whole width at the first side wall top.
Groove arrangement even can comprise at least two grooves, they are towards described circuit board arrangement opposed edges and extend through described front surface; With
Corresponding jut comprises the spine of extending along circuit board opposing sidewalls top.
This kind groove can be a V-arrangement, and described spine is an inverted V-shaped.
In this preferred aspect, described sidewall comprises at least two second relative sidewalls, and to be its inside surfaces separate greatlyyer sidewall along the scope of same direction ratio circuit board arrangement for they.Described second sidewall is higher than the first side wall, thereby when being fitted into described circuit board arrangement on the reflecting body back side, the rear surface of circuit board arrangement flushes with described second top side wall basically, and tight almost between described second sidewall and the described circuit board arrangement.
And, after display is installed, when described circuit board arrangement is fitted on the reflecting body back side, described circuit board arrangement extends beyond the outside surface of described the first side wall along described first direction at least, like this, described circuit board arrangement extends beyond on the part of described the first side wall outside surface at it, can have contact point to the described light portion that send.
In described the first side wall outside, described circuit board arrangement is along the direction perpendicular to described first direction, extends into aptly with another sidewall outside surface to flush, and circuit board arrangement is " I " type.
In display, when circuit board arrangement is fitted on the described reflecting body back side, send light portion position with one-to-one relationship advantageously corresponding to the position of reflecting body mesopore.
When circuit board arrangement is fitted on the described reflecting body back side, there is not the corresponding projection of extending in its at least one first hole.
The described hollow section of described reflecting body is the cavity in the described behind that is just facing described positive front extension but do not arriving in the positive container portions, described container portions of comprising behind of described reflecting body.
When becoming on circuit board arrangement being fitted into the described reflecting body back side, make the circuit board arrangement front surface be attached to the described back side in reflecting body front according to the equipment disposition of an aspect.
Described circuit board arrangement is the printed circuit board of a band light emitting diode ideally.
Preferably, reflecting body has seven described holes by described front at least, forms 8 fonts.
End product comprises light emission resin in by the described hole in described front and in the hollow section between reflecting body and the described circuit board arrangement front surface, salable described hollow section and described circuit board arrangement is sealed in described reflecting body.Tree refers to also flow into any container portions.
In described circuit board arrangement location or before installing to described reflecting body behind, can be equipped with quantitative described resin to the described hole of hollow section and described reflecting body, and described resin is by the counter described hole of allocating described hollow section and described reflecting body into, described at least one first hole.
The present invention also comprises the display device that contains a plurality of above equipment arrays, also comprises the electronic installation that contains above equipment.
According to another aspect, a kind of method of making the display device of above-mentioned definition is proposed, comprise step:
Resin charged in the hole and the described hollow section of reflecting body of above definition in; With
Circuit board arrangement as defined above is fitted on the described reflecting body back side.
The described resin steps of filling preferably is filled into the surface level that is not higher than described sidewall and cooperation device top to reflecting body.
According to another aspect, a kind of method of making the display device of above-mentioned definition is proposed, comprise step:
Be equipped with the circuit board arrangement of above-mentioned definition, and open first hole of at least one above-mentioned definition at the reflecting body back side of above-mentioned definition; With
By described at least one first hole resin is charged into the hollow section and the hole of described reflecting body, to fill up space and partially filled described at least one first hole that limits between reflecting body and the circuit board arrangement front surface.
According to another aspect, a kind of method of making display device is proposed, comprise step:
Reflective array is installed on the substrate on the mounting blocks battle array, the reflecting body front outwardly,
There are the framework in aperture, front and described framework flush that described reflecting body is extended by described aperture in equipped the inside on described reflective array;
Framework is installed on the substrate;
Flush surfaces to framework and reflecting body front adds bonding die;
In substrate, take out bonding die, framework and reflecting body assembly;
Resin is charged into reflecting body; With
Circuit board arrangement is fitted on the described reflecting body back side.
Fill resin steps and be prior to or subsequent to the equipped step of circuit board arrangement.
Reflecting body has sidewall, fills resin steps and preferably reflecting body is filled into the surface level that is not higher than described top side wall.
Said method also comprises step:
Make resin solidification, thereby circuit board arrangement is sealed in described reflecting body; With
From reflecting body, take out bonding die and framework.
These methods can be used the circuit board arrangement and the reflecting body of above-mentioned definition.
On the other hand, the display that provides comprises:
-reflecting body has front plate and substantial lateral and extends to described front plate principal plane to limit the sidewall of its back hollow section;
-at least one from described panel front by the aperture of described front plate to described hollow section;
-be positioned at described hollow section or near described front plate back and its at least one luminophor are aimed at described aperture by described front plate circuit board;
-be positioned at described front plate back and be used to preserve front plate and vectorial at least one plastic holding device of circuit board resin; With
Receive another container at least of residual resin behind-arrangement the circuit board.
Another aspect of the present invention can comprise a kind of method of making display device, this equipment has a reflecting body, it extends transverse to sidewall to limit described front plate back hollow section from front plate, also has at least one aperture, from the front by described front plate to described hollow section, and a circuit board, be positioned at least one luminophor can be positioned to by described front plate aim in the described hollow section in described aperture or near, the method comprising the steps of:
The resin that is contained in measured quantity at least one plastic holding device is placed in described front plate back and described at least one aperture;
Back in the described back of described front plate is positioned to energy and described resin to described circuit board;
Described circuit board is pushed a certain position, residual resin is pushed be positioned at another container of the described front plate of described reflecting body back, air is discharged in the zone between front plate and the circuit board; With
Allow described hardening of resin, described circuit board is remained in position.
Description of drawings
With limiting examples the present invention is described with reference to the accompanying drawings, wherein:
Fig. 1 is the front elevation of prior art seven-segment display;
Fig. 2 is the skeleton view of known display among Fig. 1;
Fig. 3 is the cross section by known display among Fig. 1;
Fig. 4 illustrates the known interior circuit diagram of seven-segment display;
Fig. 5 is the skeleton view that is used for the PCB of one embodiment of the invention;
Fig. 6 is the sectional view of PCB among Fig. 5;
Fig. 7 is the skeleton view that is used for the reflecting body of one embodiment of the invention;
Fig. 8 is the front elevation of the display of one embodiment of the invention;
Fig. 9 is the cross section by Fig. 8 display;
Figure 10 is used for the simplification cross section of the reflecting body view of one embodiment of the invention;
Figure 11 is reflecting body and the preceding cross section of PCB assembling in one embodiment of the invention;
Figure 12 is the cross section of the display of one embodiment of the invention;
Figure 13 is the cross section of the display of another embodiment of the present invention;
Figure 14 a-14f illustrates the manufacturing method of display device of another embodiment of the present invention;
Figure 15 a-15c illustrates the manufacturing method of display device of another embodiment of the present invention; With
Figure 16 is the front elevation of further embodiment of this invention.
Detailed description of the present invention
The example display of first embodiment of the invention comprises the light-emitting diode display of mounted on surface, and it has PCB shown in Figure 5 (50), and its circuit board and reflecting body (70) are shown in Fig. 7.
In detail, the I shape rectangle PCB (50) shown in Fig. 5 and 6 has the front (50a) and the back side (50b).PCB (50) has long size along first direction (along the length of I), and is longer than corresponding length between all inside surfaces of preparing to use of reflecting body (70) end arm (78).With the short size of first direction quadrature in (passing the width of I main body), PCB is shorter than the respective length between all inside surfaces of reflecting body (70) sidewall.
In the position of PCB (50) positive (50a), the groove of V-shaped groove (61) form of a pair of PCB of passing (50) width is arranged corresponding to corresponding reflecting body (70) end arm (78).
Location before and after a pair of pilot hole (51) of PCB (50) passes towards its relative diagonal angle, front-back is passed once more along its length in other four resin holes (52), pilot hole (51) helps PCB (50) is positioned on its reflecting body (70), and resin hole (52) then allow resin backfill or release (describing below).
PCB (50) has printed wire (54) at rear side (50b), utilizes conduction logical plating hole (53) to be electrically connected to PCB front (50a).PCB (50) positive (50a) is equipped with light emitting diode in its relevant bits.The circuit of PCB (50) can be a circuit common, as uses shown in Figure 4 and aforesaid circuit diagram.In PCB (50) end, the back side, along short edge (promptly along I top and bottom), exposed printed wire (54) connects display and fabricated section and relevant peripheral cell as the contact.
Fig. 7 illustrates the skeleton view for the example reflecting body (70) of the PCB use of Fig. 5 and 6.Reflecting body (70) has front (70a) and four rear walls (72,78), limits a hollow section between the positive back side (70b) and the sidewall (72,78).
Two the short sidewalls (78) in reflecting body (70) end have the projection of inverted V-shaped ridged formula along its top, they extend along the length of these sidewalls, but not exclusively pass its width.Ridge point (73) and PCB (50) go up corresponding groove (61) and work in coordination with at the fixing relative position of PCB (50) and reflecting body (70) of assembly process.In addition, they also provide a surface level that limits hollow section in the surface level top of behind, front (70b).
Longer sidewall (72) along reflecting body (70) side is higher than short sidewall (78).In this preferred embodiment, when being combined together, they flush with PCB (50) back side (50b).
Reflecting body (70) also has a pair of its positive register pin (71) of (70b) behind that is positioned at, and each register pin (71) is allocated PCB (50) into and gone up positioning hole corresponding (51), and PCB is positioned reflecting body (70).
Know that reflecting body front (70a) has the sector hole (74a-74g) of seven 8 fonts, there is a circular hole (74h) the inside, and these holes extend to the back side (70b) from the front (70a) in front.(74a-74g) is elongated for sector hole, and longer than the back side (70b) at reflecting body (70) positive (70a).Each hole (74a-74h) is respectively in the last position corresponding to certain light emitting diode (83) of PCB (50).When PCB (50) was contained on reflecting body (70) back side, each diode was allocated lining, hole (74a-74h) respectively into.
Above the back side (70b) in reflecting body (70) front, a pair of central container (77) that is positioned between seven sector holes (74a-74g) is arranged.One side in office is provided with side container (76) between sector hole (74a-74g) and the longer sidewall (72) in addition.
Reflecting body (70) passes through the permanent fixation with the resin adjunction assembling of combination resin/sclerosis epoxy form with PCB (50).Fig. 8 front shows the assembly of finishing, and the sector hole of potting resin forms reflecting body section (83a-83h).Fig. 9 illustrates the cross section of passing Fig. 8 along straight line A-A.
The manufacture method of example is described referring now to Figure 10-12.
According to this method, the front (70a) of reflecting body (70) all uses the resin/sclerosis epoxy (85) of fusing to fill with the hole (74a-74h) in the hollow section.Place PCB (50) reflecting body (70) back side correctly to locate then, the spine (73) on the short sidewall (78) is charged in the groove (61) of PCB (50) lining, register pin (71) is allocated positioning hole corresponding (51) among the PCB (50) into.The front (50a) of PCB (50) also leans against on the positive back side (70b) of reflecting body (70).PCB (50) utilizes the resin in positive (70a) and container (77) mesopore to be held in place.Residual resin from hollow section is forced into lining, resin hole (52) before sclerosis, as forming crescent (minisci) (171) in lining, resin hole (52) as shown in Figure 9.Also residual resin is pushed side container (76).
PCB (50) end is gone up at distolateral wall (78) and is extended, and these extensions also stretch out along orthogonal directions, but do not exceed the outside surface of longer sidewall (72), so flush with these walls (72).The back side (50b) of PCB (50) also flushes with the top of longer sidewall (72).The survey edge of PCB (50) is also along its length contact longer sidewall (72), prevents that resin from sewing.Therefore, whole packaging part is level and smooth, shallow, rectangular.
Amount of resin is limited to or is fixed as the surface level that does not exceed spine (73) top, surplus just is not constrained to and flows to the top (50b) of PCB (50) or overflow reflecting body (70) end by resin hole (52) like this, keeps the appearance of clean and tidy, the flat back of the body of display and rectangle.
Figure 13 illustrates the display of producing by second method.Reflecting body (70) and PCB (50) are as shown previously with described, but PCB enters reflecting body (70) at resin and goes up the location at reflecting body (70) before, individual will correctly the location as previously mentioned, resin (85) is just sent from PCB (50) back side (50b) by resin hole (52).
Same restriction amount of resin makes resin fill up the hole 74a-74h in front (70a)), residual resin is inhaled into container (76) and forms crescent (minisci) (211) in the behind of display body front (70) (70b).Some resin is also stayed in the resin hole (52).
The details of these methods is described now.Be described in the situation that dress PCB (50) sends into resin reflecting body (70) before earlier.
Shown in Figure 14 a and 14b, reflecting body (70) array is clipped on mounting blocks (91) array on the substrate (92), the luminous front (70a) of each reflecting body (70) is faced up.
(shown in Figure 14 c) then installs to steelframe (111) on reflecting body (70) array, and installs to substrate (92) with mount pin (112).Steelframe (111) has the array of apertures of reception corresponding reflecting body (a 70) array, and the light-emitting area (70a) of each reflecting body (70) is flushed with the end face of frame (111).
Then (shown in Figure 14 d) sticks bonding die (113) to steelframe (111) with the end face that reflecting body (70) array flushes.Bonding die is banded to single array, to the more bonding die of two-dimensional array.The purpose of pasting bonding die (113) is to guarantee that the positive maintenance of reflecting body (70) array is smooth together.Then, in bonding die (113), steelframe (111) and reflecting body (70) assembly, take out mount pin (112) and substrate (92).
Then this assembly is inverted to the position shown in Figure 14 e, makes bonding die (113) below frame (111) and reflecting body (70), the hollow surface of reflecting body (70) faces up.
So at room temperature, the resin/sclerosis epoxy (85) of combination is sent into the hollow section of reflecting body (70) through nozzle (132) from epoxy vessel (131) lining of weight controlled.
Afterwards, Figure 14 f illustrates and is contained in reflecting body (70) PCB array (50) behind.Resin (85) reflecting body (70) and PCB (50) and permanent fixation together.After the sclerosis, take out bonding die (113), obtain manufactured goods from reflective array front (70a).
Refer again to Figure 15 a～15c and describe second method.Preceding four steps are with the same with reference to the described last manufacture method of Figure 14 a～14d, and (Figure 15 a) below being positioned to make bonding die (113) after the assembly of steelframe (111), bonding die (113) and reflecting body (70) is put upside down.At this moment, not that resin is sent into reflecting body (70), Figure 15 b illustrates PCB (50) array that is contained on the reflecting body (70).
(shown in Figure 15 c) then, the epoxy feeder (131) of weight controlled is sent into the resin/rigidizer (85) of fixed amount behind through being positioned at nozzle (132) on the feeder (131) by epoxy hole (52).The amount of giving of epoxy (85) makes residual epoxide suck container (76) through limiting, and forms crescent (minisci) (211) in display body (70) positive (70b) behind.
Mounted on surface active display by above all embodiment make can be applied to various electronic installations, and the dense property of display makes it more be applicable to slim or the multi-layered type display.
The present invention is not individual to be limited to above-mentioned all embodiment, can change.For example, the ridge that is positioned at the distolateral wall of reflecting body is to also being positioned at long sidewall, and the groove on the PCB can be correspondingly towards the long edge setting of PCB.Like this, remaining PCB and contact can be extended at side rather than end.This display is shown in Figure 16, is fit to vertical stacks stratotype display.
Perhaps, require projection and groove cooperation device to be positioned at distolateral or side, all ends and a side, or any end on demand, side combination, correspondingly extend in the reflecting body outside from a side, two sides, three sides or four sides the contact.Display not necessarily rectangular (or square) can be irregularly shaped, polygon (as triangle), circular or almost arbitrary shape.In addition, also available other cooperation device as can not extending along whole side length, can use pin and hole or other device.
The side that PCB does not extend thereon preferably flushes with the PCB back side, but also not necessarily, the PCB back side can be higher or low.
Above PCB is described as be positioned at the positive back side, can make into has a space between the two, although be a little space preferably, have the height of LED on PCB as individual, can make resin flows like this, when giving especially rearward.
Display is described as seven-segment display for example, but the present invention is not so limited.It can have any hole count in the front, from a hole up or a plurality of hole up, with the shape and any demonstration of wanting of pattern generating of arbitrary expectation, as producing Rome, Greece, Cyrillic or Arabic or Chinese and japanese character etc.
PCB is described as and has light emitting diode, and other send electro-optical device suitable equally, as utilizes reaction or other device of heat emission, laser, resin (or other filler) element (as phosphorus) and emitting electrons.The present invention also is not limited to the spectrum that can be seen by people's naked eyes in fact, can be used to provide the demonstration that can see with other EMR spectrum.
In addition, send electro-optical device not necessarily on PCB, other circuit board arrangement is available equally, comprises it being chemistry or biological device basically.
All exemplary methods show the array of 5 reflecting bodys, and certainly, this array can comprise that any amount follows and/or the reflecting body of row or alternate manner arrangement.
To artificial plug-in mounting rather than surface mounting technique, PCB can be had the installation metallic pin instead, resin is sent into from the side by the hole of reflecting body side.Pilot hole on the PCB can be different with the interior register pin quantity of reflecting body.Similarly, the resin hole number also can change, but in order to reduce air bubble problem, has two at least.
In other embodiment of the present invention, obviously can adopt aspects content of the present invention and need not the whole solution that present embodiment is described.
As shown in this embodiment, this equipment is tried hard to keep no bubble in the epoxy between LED and reflecting body front and be need not complete submergence PCB with different mechanism.During the manufacturing, epoxy mainly is positioned at center well portion (77) and hole (74a-h) in reflecting body, and this is to be slightly larger than with controlled amount of resin to fill up fully that the required amount in space realizes between reflecting body and the PCB.When loading onto PCB, residual resin is pressed into side container 76 and by the aperture 52 in the PCB, makes to require the zone of epoxy to overflow, and as directly below PCB, and LED also allows to overflow and do not cover the back side of PCB self.
Can quote these aspect contents of the present invention, but need not the relative side of PCB overlapping reflecting body, also need not present embodiment and be arranged on cooperating slot and projection on the joining edge.The PCB that overlaps is the tie point of easier realization mounted on surface obviously, but quotes the content of these additional aspect of the relevant exhaust of the present invention, less low profile reflecting body still can be provided and need not the overlapping part of PCB.But still embedding of PCB (nest) perhaps flushes with the reflecting body back side in all four sidewalls of reflecting body simply.
For the minimum residual resin of the appointment of using in the reflecting body, the position of PCB is very important, so can use register pin 71, other steady arm is set perhaps, as the support of PCB itself, perhaps directly locatees in the reflecting body marginal portion.
Though the PCB that this preferred embodiment is attempted to provide a kind of surface-mountable multiple stage display and overlapping is provided, but the residual resin container that is provided with in the application reflecting body, simultaneously still with classic method the tie point of pin as PCB self, can provide than previously known littler more dense multiple stage display.
Though described the present invention with all embodiment and modification, within the scope of the present invention, those skilled in the art understand admissible other all form.
Claims (59)
1. display device is characterized in that comprising:
Reflecting body has front and sidewall, and hollow section also has by the hole of described front to described hollow section in described positive back and by described side walls enclose;
Circuit board arrangement is used to be fitted into the described reflecting body back side, and extends to such an extent that the same at least first direction in edge separates than described reflecting body side wall inner surfaces is farther along at least one first direction; With
Cooperation device is used for fixing the relative position of reflecting body and circuit board arrangement; Wherein
Its inside surface is a first side wall along the sidewall that the described circuit board scope of same direction ratio separates nearerly; With
Described circuit board arrangement comprises and send light portion, and send light towards described hole when being configured to be fitted into circuit board arrangement on the described reflecting body back side.
2. equipment as claimed in claim 1 is characterized in that cooperation device comprises;
Groove arrangement in the described circuit board arrangement front; With
Corresponding to the described groove arrangement and the projection arrangement of extending behind from reflecting body.
3. equipment as claimed in claim 2 is characterized in that, its inside surface must the sidewall nearer than the scope of described circuit board arrangement be a first side wall along same direction at interval, and described projection arrangement is extended from reflecting body the first side wall top.
4. equipment as claimed in claim 3 is characterized in that described the first side wall has length and width, and described projection arrangement does not extend through whole width at the first side wall top.
5. as each described equipment in claim 3 or 4, it is characterized in that groove arrangement comprises at least two towards described circuit board arrangement opposed edges and extend through the groove in its described front; Comprise the spine of extending with corresponding projection arrangement along the relative sidewall napex of reflecting body.
6. equipment as claimed in claim 5 is characterized in that, described groove is a V-arrangement, and described spine is an inverted V-shaped.
7. as each described equipment in the claim 3 to 6, it is characterized in that described reflecting body is elongated, described projection arrangement is arranged on the first side wall of described reflecting body opposite end.
8. aforementioned arbitrary equipment as claimed in claim, it is characterized in that, inside surface must be than described circuit board arrangement scope along equidirectional interval, nearer sidewall is a first side wall, described sidewall comprises at least two second relative sidewalls, and they are sidewalls that inside surface must be more farther than circuit board arrangement scope along equidirectional interval.
9. equipment as claimed in claim 8 is characterized in that, described second sidewall is higher than the first side wall.
10. equipment as claimed in claim 9 is characterized in that, when described circuit board arrangement was fitted on the reflecting body back side, described equipment disposition became the rear surface of circuit board arrangement is flushed with described second top side wall basically.
11., it is characterized in that when described circuit board arrangement was fitted on the reflecting body back side, described equipment disposition became to make between described second sidewall and the described circuit board arrangement almost tight as claim 8,9 or 10 described equipment.
12. aforementioned arbitrary equipment as claimed in claim, wherein inside surface must be a first side wall than the nearer sidewall of described circuit board arrangement scope along equidirectional interval, when described circuit board arrangement was fitted on the reflecting body back side, described equipment disposition became to make described circuit board arrangement extend beyond the outside surface of described the first side wall along described first direction at least.
13. equipment as claimed in claim 12 is characterized in that, described circuit board arrangement has on it extends beyond the part of described the first side wall outside surface and is used for the described contact of sending light portion.
14., it is characterized in that in described the first side wall outside, described circuit board arrangement is along extending to such an extent that flush with another sidewall outside surface perpendicular to the direction of described first direction as claim 12 or 13 described equipment.
15. aforementioned each weighed described equipment, the described sidewall of wherein said reflecting body forms rectangle.
16. equipment as claimed in claim 15 is characterized in that, according to as claim 13 or 14, wherein said circuit board arrangement is an I shape.
17. as the described equipment of above-mentioned each claim, wherein
Described reflecting body also comprises the register pin that extends rearwards from the back side in described front; With
Described circuit board arrangement also comprises wherein the hole corresponding to described register pin.
18. equipment as claimed in claim 17, wherein said register pin is towards the relative diagonal orientation in the described back side in described front.
19. aforementioned arbitrary equipment as claimed in claim is characterized in that, when circuit board arrangement was fitted on the described reflecting body back side, described equipment disposition becomes to make sent light portion position with the position of one-to-one relationship corresponding to all holes in the reflecting body.
20. as the described equipment of above-mentioned each claim, it is characterized in that circuit board arrangement has at least one first hole, when circuit board arrangement is fitted into the described reflecting body back side, the complementary protuberance of not extending within it there.
21. as the described equipment of above-mentioned each claim, it is characterized in that, the described hollow section of described reflecting body comprises container portions in the behind in described reflecting body front, and described container portions is to extend but the hole that do not arrive to described positive front in the behind in described front.
22. as the described equipment of above-mentioned each claim, it is characterized in that, be configured, when circuit board arrangement is configured to the described reflecting body back side, make the front of circuit board arrangement be close to the described back side in described reflecting body front.
23. aforementioned arbitrary equipment as claimed in claim is characterized in that described circuit board arrangement is a printed circuit board (PCB).
24., it is characterized in that the described light portion that send is a light emitting diode as the described equipment of above-mentioned each claim.
25. the described equipment of arbitrary as described above claim is characterized in that, has at least 7 by the described positive described hole that forms 8 fonts.
26. the described equipment of arbitrary as described above claim, it is characterized in that, described by the hole in described front in and also contain light emission resin in the hollow section between the above circuit board arrangement front surface of reflecting body, to seal described hollow section and described circuit board arrangement be sealed to described reflecting body.
27. equipment as claimed in claim 26 is characterized in that, as claim 21, wherein said resin also is positioned at described container portions according at least.
28., it is characterized in that as claim 20, wherein said resin also is positioned at described at least one first hole of described circuit board arrangement according at least as claim 26 or 27 described equipment.
29., it is characterized in that as claim 24, described equipment is the mounted on surface light emitting diode indicator according at least as the described equipment of claim 26～28.
30., it is characterized in that described circuit board arrangement is before the location as the described equipment of claim 26～29, the described resin of fixed amount is all given birth in the described hole of hollow section and described reflecting body.
31. as the described equipment of claim 26～29, it is characterized in that, as claim 20, wherein said circuit board arrangement is fitted on the described reflecting body back side according at least, and described resin is by described at least one first hole and described hollow section that charges into and the described hole of described reflecting body.
32. according to aforementioned arbitrary display device that comprises many equipment arrays as claim.
33. comprise the electronic installation of aforementioned arbitrary display device as claim.
34. the method for the display device that manufacturing such as claim 1～30 are fixed is characterized in that comprising step:
Resin charge into as the hole of claim 1～25 definition and as described in the reflecting body hollow section; With
As described in circuit board arrangement as claim 1～25 definition is fitted on the back side of reflecting body.
35. as the method for claim 34, the wherein said resin steps of filling is filled into the surface level of reflecting body at the top that is not higher than described sidewall and cooperation device.
36. as the method for claim 34 or 35, wherein circuit board arrangement has at least one first hole as claim 20 definition; And described equipped step makes the residual resin in the described reflecting body hollow section upwards flow into described at least one first hole.
37. the method for the display devices of manufacturing such as claim 1～29 and 31 definition is characterized in that comprising step:
Equipped circuit board arrangement as claim 1～25 definition is opened at least one first hole as claim 20 definition on the reflecting body back side as claim 1～25 definition; With
By described at least one first hole resin is charged into the hole of hollow section and described reflecting body, being filled in the space that limits between reflecting body and the circuit board arrangement front surface, and partially filled described at least one first hole.
38. a method of making display device is characterized in that comprising step:
Reflective array is installed on the substrate above the mounting blocks array, make the reflecting body front outwardly;
The framework that the aperture is arranged in being equipped with on described reflective array makes described reflecting body by the front of described aperture extension and the flush of described framework;
Framework is installed to above the substrate;
Flush surfaces to framework and reflecting body front is pasted bonding die;
From substrate, take out bonding die, framework and reflecting body assembly;
Resin is charged into reflecting body; With
Circuit board arrangement is fitted on the described reflecting body back side.
39., wherein fill resin steps prior to equipped circuit board arrangement step as the method for claim 38.
40. as the method for claim 39, wherein reflecting body has sidewall, fills resin steps and the reflecting body surface level is filled into is not higher than described top side wall.
41. as the method for claim 38, wherein equipped circuit board arrangement step is prior to filling resin steps, and the hole of resin by the circuit board arrangement back side charges into described reflecting body.
42. as the method for claim 38～41, wherein equipped circuit board arrangement step comprise each independently circuit board arrangement be fitted into the described reflecting body back side.
43., it is characterized in that the potting resin step comprises controlled described amount of resin filled and enters described reflecting body as each described method in the claim 38～42.
44. as each described method in the claim 38～43, it is characterized in that, also comprise step:
Cured resin is sealed to described reflecting body to circuit board arrangement; With
From reflecting body, take out bonding die and framework.
45. the method as claim 38～44 is characterized in that, reflecting body and circuit board arrangement are by defining as claim 1～25.
46. the method as claim 38～44 is characterized in that, described method is the method for making as claim 26～31 display device.
47. comprise a plurality of by the display device of making the array of described equipment as claim 34～46 method.
48. comprise electronic installation by the display device of making as claim 34～46 method.
49. manufacturing such as preceding the description with reference to accompanying drawing 5～16 basically and the method for illustrated display device.
50. basically as preceding display device with reference to accompanying drawing 5～16 descriptions and illustrated method body plan and configuration.
51. a display device is characterized in that, comprising:
Reflecting body with front plate and sidewall, described sidewall substantial lateral extend to the principal plane of described front plate to limit a hollow section in described front plate back;
At least one from described panel front by the aperture of described front plate to described hollow section;
In described hollow section or near be positioned the circuit board of described front plate back, its at least one
Luminophor is aimed at described aperture by described front plate;
Be positioned at least one plastic holding device of described front plate rear surface, be used to preserve the resin medium of front plate and circuit board; With
At least another container is used to receive remaining resin when settling circuit board.
52. the display device as claim 51 is characterized in that, described plastic holding device is positioned the centre of reflecting body sidewall.
53. the display device as claim 52 is characterized in that, described another container at least is positioned near the described reflecting body sidewall.
54. the display device as claim 50 is characterized in that, at least one aperture device in circuit board, the resin horizontal face when settling below the indicating circuit plate.
55. the display device as claim 50 is characterized in that, described circuit board is pressed close to and is extended beyond a pair of relative sidewall of described reflecting body.
56. the display device as claim 55 is characterized in that, the conductible tie point of described circuit board is arranged on the part that extends beyond the described sidewall of described reflecting body, so that the mounted on surface of described display to be provided.
57. method of making display device, described equipment have the horizontal expansion sidewall from front plate extend with the reflecting body that limits described front plate back hollow section and by described front plate the aperture of at least one from the front to described hollow section, and the circuit board that is located on or near described hollow section, described hollow section has at least one luminophor that can be positioned to aim at described aperture by described front plate, it is characterized in that described method comprises step:
The resin of measured quantity is put at least one plastic holding device and described at least one aperture that places described front plate back;
The described circuit board of the described back of described front plate is positioned to energy and described resin;
Described circuit board is pushed a certain position, residual resin is clamp-oned be arranged on another container of described reverberator front panel back, air is discharged zone between front panel and circuit board; With
Make described hardening of resin so that described circuit board is fixed.
58. method as claimed in claim 57 is characterized in that, described circuit board comprises at least one hole, and pushes circuit board to reflecting body up to form the resin crescent in described hole.
59. method as claimed in claim 57 is characterized in that, described step is carried out by automatic manufacturing device.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2001/001464 WO2003030132A1 (en) | 2001-09-29 | 2001-09-29 | A display and method of manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1488128A true CN1488128A (en) | 2004-04-07 |
| CN1228749C CN1228749C (en) | 2005-11-23 |
Family
ID=4574865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN01822351.6A Expired - Lifetime CN1228749C (en) | 2001-09-29 | 2001-09-29 | A display and method of manufacture |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN1228749C (en) |
| WO (1) | WO2003030132A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101322171B (en) * | 2005-06-07 | 2010-12-01 | 尼科劢迪公司 | Ultra-thin alphanumeric display |
| CN103137053A (en) * | 2011-11-28 | 2013-06-05 | 亿光电子工业股份有限公司 | Seven-section displayer |
| CN107044608A (en) * | 2016-02-04 | 2017-08-15 | 法雷奥照明公司 | Illumination or signal indicating device for motor vehicles |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10239090B4 (en) * | 2002-08-26 | 2006-08-24 | Robert Seuffer Gmbh & Co. Kg | Display device and method of manufacture |
| SE525625C2 (en) * | 2003-06-17 | 2005-03-22 | Ali Shafiei | Controlling system adapted to control a segmented display |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6048036B2 (en) * | 1979-07-09 | 1985-10-24 | 株式会社東芝 | semiconductor light emitting display device |
| GB9204049D0 (en) * | 1992-02-26 | 1992-04-08 | Rudd Desmond G | Information displays |
| US5991160A (en) * | 1995-12-27 | 1999-11-23 | Infineon Technologies Corporation | Surface mount LED alphanumeric display |
| CN2341222Y (en) * | 1998-07-20 | 1999-09-29 | 汪光樾 | Series number display device |
| CN2346025Y (en) * | 1998-11-06 | 1999-10-27 | 陈兴 | Light emitting diode display device |
| CN2391266Y (en) * | 1999-08-12 | 2000-08-09 | 何英明 | Ultrathin illuminous dipolar body display plate |
-
2001
- 2001-09-29 CN CN01822351.6A patent/CN1228749C/en not_active Expired - Lifetime
- 2001-09-29 WO PCT/CN2001/001464 patent/WO2003030132A1/en active Application Filing
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101322171B (en) * | 2005-06-07 | 2010-12-01 | 尼科劢迪公司 | Ultra-thin alphanumeric display |
| CN103137053A (en) * | 2011-11-28 | 2013-06-05 | 亿光电子工业股份有限公司 | Seven-section displayer |
| CN103137053B (en) * | 2011-11-28 | 2016-07-06 | 亿光电子工业股份有限公司 | seven-segment display |
| CN107044608A (en) * | 2016-02-04 | 2017-08-15 | 法雷奥照明公司 | Illumination or signal indicating device for motor vehicles |
| CN107044608B (en) * | 2016-02-04 | 2021-09-03 | 法雷奥照明公司 | Lighting or signalling device for a motor vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003030132A1 (en) | 2003-04-10 |
| CN1228749C (en) | 2005-11-23 |
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