CN2391266Y - Ultrathin illuminous dipolar body display plate - Google Patents
Ultrathin illuminous dipolar body display plate Download PDFInfo
- Publication number
- CN2391266Y CN2391266Y CN 99217908 CN99217908U CN2391266Y CN 2391266 Y CN2391266 Y CN 2391266Y CN 99217908 CN99217908 CN 99217908 CN 99217908 U CN99217908 U CN 99217908U CN 2391266 Y CN2391266 Y CN 2391266Y
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- China
- Prior art keywords
- hole
- face
- panel
- intermediate plate
- circuit substrate
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- Expired - Fee Related
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Abstract
The utility model relates to a light emitting diode body display panel. The utility model is provided for providing a light emitting diode body display panel with simple structure, featheriness, shortness, easy fabrication, low cost and strong market competition ability. The utility model comprises a circuit board, light emitting diode body wafers, intermediate boards, panels and transparent glue, wherein, the light emitting diode body wafers are connected with the circuit board through contacts on the bottom surfaces of the light emitting diode body wafers; through holes and contacts for accommodating the light emitting diode body wafers are arranged on the intermediate plates overlapped on the circuit board; the panels overlapped on the intermediate plates are provided with face holes which are larger than the through holes; the transparent glue is filled in the face holes of the panels and the through holes of the intermediate panels to pack the light emitting diode body wafers.
Description
The utility model belongs to the device that shows variable information, particularly a kind of ultrathin light-emittingdiode display board.
As Fig. 6, shown in Figure 7, on general electric product or the billboard in order to the light-emittingdiode display board of display digit or simple point-like figure, lie on the circuit substrate arranged or arabic numeral " 8 " and be arranged with plural LED Chips for Communication, the contact of this LED Chips for Communication bottom surface is connected on the circuit substrate, will arranges the circuit substrate that is equiped with LED Chips for Communication more and be installed in the rectangle cap.Have perforation on the rectangle cap, and pour in the rectangle cap, make transparent adhesive tape be charged into the perforation of rectangle cap, so that perforation is filled up, and circuit substrate is fixed in the rectangle cap with transparent adhesive tape with respect to LED Chips for Communication.
The light-emittingdiode display board of this structure, its rectangular case is provided with perforation.Therefore, as shown in Figure 8, before charging into transparent adhesive tape, must be attached to rectangle cap outside,,, and carry out encapsulating by the bottom surface of rectangular case again with its counter-rotating so that perforation is sealed with adhesive tape.And in the transparent adhesive tape condensation process, must circuit substrate be pushed down, float to avoid circuit substrate to be subjected to buoyancy effect with weight.After treating that the liquid state transparent adhesive tape condenses into solid, again adhesive tape is torn, can make the light-emittingdiode display board.
This light-emittingdiode display board of commonly using structure because it is with the encapsulation of rectangle cap, makes the thickness of this light-emittingdiode display board bigger, and can't reach compact.
Moreover, before the filling transparent adhesive tape, must seal the perforation of rectangle cap with adhesive tape, and after transparent adhesive tape solidifies, again adhesive tape be torn, causing has inconvenience more and comparatively bothers the puzzlement in the increase manufacture process in manufacture process.
After filling glue, must push down circuit substrate again, can increase trouble and puzzlement in the manufacture process equally with weight.
This in addition rectangle cap of commonly using its outermost top layer of light-emittingdiode display board of structure is a plastic casing, and it is the rectangle stereo structure, and shape is comparatively complicated, thereby increases manufacturing cost, reduces the market competitiveness.
The purpose of this utility model provides a kind of simple in structure, compact, easily manufactured, production cost is low, the market competitiveness is strong ultrathin light-emittingdiode display board.
The utility model comprises circuit substrate, arrange a plurality of LED Chips for Communication be installed on the circuit substrate, closed assembly is in the intermediate plate on the circuit substrate, the closed assembly panel on intermediate plate and the transparent adhesive tape of packaging LED wafer; At the bottom of the LED Chips for Communication, end face is respectively equipped with contact, and be connected on the circuit substrate, from its end face contact routing with its bottom surface contact; Intermediate plate is provided with a plurality of ccontaining arrangements and is installed in the through hole of LED Chips for Communication on the circuit substrate and the contact that connects through routing; Closed assembly has panel in the intermediate plate top; The plurality of through holes corresponding position is provided with a plurality of faces greater than through hole on panel and the intermediate plate; In the gap of transparent adhesive tape filling between panel face and intermediate plate through hole and LED Chips for Communication.
Wherein:
Face on the panel is middle circular hole through hole.
Face on the panel is for being square hole shape through hole.
Face on the panel is for being digital shape through hole.
Because the utility model comprises circuit substrate, a plurality of LED Chips for Communication, intermediate plate, panel and transparent adhesive tape; At the bottom of the LED Chips for Communication, end face is respectively equipped with contact, and be connected on the circuit substrate, from its end face contact routing with its bottom surface contact; The intermediate plate of closed assembly on circuit substrate is provided with the through hole of ccontaining LED Chips for Communication and the contact that connects through routing; Closed assembly through hole corresponding position on panel on the intermediate plate and intermediate plate is provided with the face greater than through hole; The transparent adhesive tape filling in panel face and intermediate plate through hole with the packaging LED wafer.The utility model system is formed by circuit substrate, intermediate plate and the panel closed assembly of thinner thickness, but the thickness behind the attenuate closed assembly makes it compact; Face on the panel is greater than the through hole of intermediate plate, so that transparent adhesive tape can charge into the through hole on the intermediate plate through the face of the superiors' panel, and need not seal and suppress with weight with adhesive tape, is simplified manufacturing course, reduces production costs; Be positioned at outermost panel and be tabular, its global shape is simpler, need not offer complex-shaped mould, thereby reduction manufacturing cost, improve the market competitiveness, not only simple in structure, compact, and easily manufactured, production cost is low, the market competitiveness is strong, thereby reach the purpose of this utility model.
Fig. 1, be the utility model structural representation cut-open view.
Fig. 2, be the utility model decomposition texture schematic sectional view.
Fig. 3, for A among Fig. 2 to view (face is for being the circular hole through hole).
Fig. 4, for A among Fig. 2 to view (face is for being square hole shape through hole).
Fig. 5, for A among Fig. 2 to view (face is for being digital shape through hole).
Fig. 6, be known light-emittingdiode display panel structure schematic sectional view.
Fig. 7, be circuit board structure schematic sectional view in the known light-emittingdiode display board.
Fig. 8, synoptic diagram when being known light-emittingdiode display board filling transparent adhesive tape.
Below in conjunction with accompanying drawing the utility model is further elaborated.
As shown in Figure 1 and Figure 2, the utility model 10 comprises circuit substrate 1, a plurality of LED Chips for Communication 2, intermediate plate 3, panel 4 and transparent adhesive tape 5.2 ends of light-emittingdiode, end face are respectively equipped with contact 21,22.Plural number LED Chips for Communication 2 is arranged and is installed on the circuit substrate 1, and is connected on the circuit substrate 1 with the contact 21 of its bottom surface.Intermediate plate 3 is provided with through hole 31 and the contact 32 that a plurality of ccontaining arrangements are installed in LED Chips for Communication 2 on the circuit substrate 1.Intermediate plate 3 closed assemblies are in circuit substrate 1 top, make to arrange to be installed on the circuit substrate 1 plural LED Chips for Communication 2 and to lay respectively on the intermediate plate 3 in the corresponding through hole 31, and on LED Chips for Communication 2 routing to connect the contact 22,32 of LED Chips for Communication 2 end faces and intermediate plate 3.Plurality of through holes 31 corresponding positions are provided with a plurality of faces 41 greater than through hole 31 on panel 4 and the intermediate plate 3.Panel 4 closed assemblies are in intermediate plate 3 tops.In the gap of transparent adhesive tape 5 fillings between panel 4 faces 41 and intermediate plate 3 through holes 31 and LED Chips for Communication 2, so that LED Chips for Communication 2 is encapsulated in the through hole 31 of intermediate plate 3.
As mentioned above, the utility model 10 is to be formed by circuit substrate 1, intermediate plate 3 and panel 4 closed assemblies.The very thin thickness of circuit substrate 1, intermediate plate 3 and panel 4, but the therefore thickness behind the attenuate closed assembly make it compact.
Moreover the face 41 on the panel 4 is greater than the through hole 31 of intermediate plate 3, so that transparent adhesive tape 5 can charge into the through hole 31 on the intermediate plate 3 through the face 41 of the superiors' panel 4, and need not seal and suppress with weight with adhesive tape, is simplified manufacturing course, reduces production costs.
Be positioned at outermost panel 4 again and be tabular, its global shape is simpler, need not offer complex-shaped mould, thereby reduces manufacturing cost, improves the market competitiveness.
Claims (4)
1, a kind of ultrathin light-emittingdiode display board, it comprises circuit substrate, arrange a plurality of LED Chips for Communication be installed on the circuit substrate and the transparent adhesive tape of packaging LED wafer; At the bottom of the LED Chips for Communication, end face is respectively equipped with contact, and be connected on the circuit substrate, from its end face contact routing with its bottom surface contact; It is characterized in that closed assembly has intermediate plate on described circuit substrate; Intermediate plate is provided with a plurality of ccontaining arrangements and is installed in the through hole of LED Chips for Communication on the circuit substrate and the contact that connects through routing; Closed assembly has panel in the intermediate plate top; The plurality of through holes corresponding position is provided with a plurality of faces greater than through hole on panel and the intermediate plate; In the gap of transparent adhesive tape filling between panel face and intermediate plate through hole and LED Chips for Communication.
2, ultrathin light-emittingdiode display board according to claim 1 is characterized in that face on the described panel is for being the circular hole through hole.
3, ultrathin light-emittingdiode display board according to claim 1 is characterized in that face on the described panel is for being square hole shape through hole.
4, ultrathin light-emittingdiode display board according to claim 1 is characterized in that face on the described panel is for being digital shape through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99217908 CN2391266Y (en) | 1999-08-12 | 1999-08-12 | Ultrathin illuminous dipolar body display plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99217908 CN2391266Y (en) | 1999-08-12 | 1999-08-12 | Ultrathin illuminous dipolar body display plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2391266Y true CN2391266Y (en) | 2000-08-09 |
Family
ID=34009236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 99217908 Expired - Fee Related CN2391266Y (en) | 1999-08-12 | 1999-08-12 | Ultrathin illuminous dipolar body display plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2391266Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003030132A1 (en) * | 2001-09-29 | 2003-04-10 | Agilent Technologies, Inc. | A display and method of manufacture |
| CN104121683A (en) * | 2013-04-27 | 2014-10-29 | 珠海格力电器股份有限公司 | Panel member, air conditioner, and method for manufacturing air conditioner |
-
1999
- 1999-08-12 CN CN 99217908 patent/CN2391266Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003030132A1 (en) * | 2001-09-29 | 2003-04-10 | Agilent Technologies, Inc. | A display and method of manufacture |
| CN104121683A (en) * | 2013-04-27 | 2014-10-29 | 珠海格力电器股份有限公司 | Panel member, air conditioner, and method for manufacturing air conditioner |
| WO2014173319A1 (en) * | 2013-04-27 | 2014-10-30 | 珠海格力电器股份有限公司 | Panel component, air conditioner, and method for manufacturing air conditioner |
| US9574787B2 (en) | 2013-04-27 | 2017-02-21 | Gree Electric Appliances, Inc. Of Zhuhai | Panel component, air conditioner and method for manufacturing air conditioner |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |