CN1485257A - Transfer method - Google Patents
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- CN1485257A CN1485257A CNA031548318A CN03154831A CN1485257A CN 1485257 A CN1485257 A CN 1485257A CN A031548318 A CNA031548318 A CN A031548318A CN 03154831 A CN03154831 A CN 03154831A CN 1485257 A CN1485257 A CN 1485257A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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Abstract
A rail-guidedpable of preve transfer system, canting the reduction of the operation rate of manufacturing equipments on a manufacturing line such as a semiconductor manufacturing line etc., is provided. Two RGVs 11A and 11B are arranged in advance on one transfer rail 3 laid between two stockers BS1 and BS2. For example, when maintenance of the manufacturing equipment EQ8 provided between the stockers BS1 and BS2 is done, a transfer region MA1 of the RGV 11A is set from the stocker BS1 to the manufacturing equipment EQ7 and a transfer region MA2 of the RGV 11B is set from the stocker BS2 to the manufacturing equipment EQ9.
Description
Technical field
The present invention relates to transportation techniques, particularly about being applicable to that rail transports the otherwise effective technique of system.
Technical background
For example in semiconductor fabrication lines, be accompanied by the heavy caliberization of semiconductor wafer (calling wafer in the following text), because the weight of per 1 wafer is also in progressively increase, so transport the automatic processingization of wafer also in development by machinery.
For example, as プ レ ス ジ ャ one Na Le company of Co., Ltd. [the monthly magazine quartz conductor world] that puts down on December 20th, 9 (1997) distribution the 131st page-149 pages put down in writing in the semiconductor fabrication lines of wafer of corresponding diameter 300mm, various manufacturing installations (comprising testing fixture) are divided into the device group who is called separation, with the separation is unit, is configured in the dust free room.Therefore, it is also corresponding that wafer transports system automatically, be divided between separation transport, transport in the separation, the key element (assembly) of stacking device etc. and constituting.
Among these assemblies, between separation, transporting, the general overhead method of shipment that is known as OHS (OverHead Shuttle) that uses.In addition, in in separation, transporting, use travel automatically in orbit be known as RGV (Rail Guided Vehicle) transport that vehicle, trackless travel automatically be known as AGV (Automatic Guided Vehicle) transport vehicle or as the OHT (Over-head Hoisttransport) of one of overhead method of shipment etc.
For example, open in the flat 8-153767 communique the spy, following technology is disclosed, on 1 guide rail, dispose on guide rail movably that 2 stylobate sheets transport robot, specify each substrate to transport the zone of the work of robot, by between a plurality of substrate processing devices, transport the substrate of wafer, colour filter usefulness substrate, thermal head usefulness substrate and printed substrate etc., pursue the raising of transporting processing capacity.
Present inventors transport system with regard to the rail that uses RGV and study.Because RGV travels on the track of guide rail etc., so compare with AVG that trackless travels, making stably travels becomes possibility.Therefore, control travel also easy.Present inventors have found following problem using such RGV rail to transport in the system.
That is, using the RGV rail to transport in the system, from the complicated and system that transports for fear of the design of transporting system and system's formation (control) purpose that cost rises is being set, generally is that a RGV is gone up to the single line track.But, in the manufacturing line of semiconductor fabrication lines etc., can produce the maintenance of manufacturing installation (comprising testing fixture), the unconventional operation of setting up and newly establishing etc. etc., enter under the situation of manufacturing installation from the single line rail side the operating personnel, for guaranteeing operating personnel's safety, be necessary to cut off and transport circuit, RGV can not be entered produce the position of this unconventional operation etc. in the position that produces this unconventional operation etc.Therefore, transport at partition under the situation of circuit, RGV is the boundary with the position that produces unconventional operation etc., can only have the low problem of external operation ratio of manufacturing installation in manufacturing installation group's side work.
The purpose of this invention is to provide a kind of low rail of external operation ratio of the manufacturing installation in the manufacturing line of semiconductor fabrication lines etc. that can prevent and transport system.
Above-mentioned and other purpose and new feature of the present invention, from the record and accompanying drawing of this specification sheets, can be clear and definite.
Summary of the invention
If the summary of the representative article among simple declaration the application in the disclosed invention is then as described below.
That is, the present invention is to use single line track that links between a plurality of manufacturing installations and a plurality of conveyers that move along above-mentioned single line track, and will be transported body and transport to above-mentioned manufacturing installation,
(a) above-mentioned each conveyer all has the form of transporting in the 1st stage and the 2nd stage,
(b) the 2nd transport zone of the 1st transport zone of the above-mentioned conveyer in above-mentioned the 1st stage and above-mentioned conveyer in above-mentioned the 2nd stage is different scope.
In addition, the present invention is to use single line track that links between a plurality of manufacturing installations and a plurality of conveyers that move along above-mentioned single line track, and will be transported body and transport to above-mentioned manufacturing installation,
(a) above-mentioned each conveyer all has the form of transporting in the 1st stage and the 2nd stage when cutting off above-mentioned single line track,
(b) the 2nd transport zone of the 1st transport zone of the above-mentioned conveyer in above-mentioned the 1st stage and above-mentioned conveyer in above-mentioned the 2nd stage is different scope.
In addition, the present invention is to use single line track that links between a plurality of manufacturing installations and a plurality of conveyers that move along above-mentioned single line track, and will be transported body and transport to above-mentioned manufacturing installation,
(a) above-mentioned each conveyer all has the form of transporting in the 1st stage and the 2nd stage beyond above-mentioned the 1st stage of the situation that produces difference on the external operation ratio of above-mentioned a plurality of conveyers,
(b) the 2nd transport zone of the 1st transport zone of the above-mentioned conveyer in above-mentioned the 1st stage and above-mentioned conveyer in above-mentioned the 2nd stage is different scope.
In addition, the present invention is to use single line track that links between a plurality of manufacturing installations and a plurality of conveyers that move along above-mentioned single line track, and will be transported body and transport to above-mentioned manufacturing installation,
(a) above-mentioned each conveyer all has with the above-mentioned form of transporting that is transported the 1st stage and the 2nd stage beyond above-mentioned the 1st stage of the situation that produces difference on the wait time that body is transported to above-mentioned a plurality of manufacturing installations,
(b) the 2nd transport zone of the 1st transport zone of the above-mentioned conveyer in above-mentioned the 1st stage and above-mentioned conveyer in above-mentioned the 2nd stage is different scope.
In addition, per 1 above-mentioned the 1st transport zone and above-mentioned the 2nd transport zone of above-mentioned a plurality of conveyers are spaced from each other with other above-mentioned the 1st transport zone and above-mentioned the 2nd transport zone of above-mentioned conveyer.
Description of drawings
Fig. 1 is system is transported in expression as the wafer full automaticity of the semiconductor fabrication lines of embodiments of the present invention 1 all birds-eye vieies.
Fig. 2 is that expression wafer full automaticity shown in Figure 1 transports the birds-eye view of the part of system.
Fig. 3 is illustrated in wafer full automaticity shown in Figure 1 to transport in the part of system, carries out the birds-eye view of newly establishing or set up situation of manufacturing installation.
Fig. 4 is illustrated in wafer full automaticity shown in Figure 1 to transport in the part of system, carries out the birds-eye view of newly establishing or set up situation of manufacturing installation.
Fig. 5 is illustrated in wafer full automaticity shown in Figure 1 to transport in the part of system, carries out the birds-eye view of situation of the maintenance of manufacturing installation.
To be expression transport the birds-eye view of the part of system as the wafer full automaticity of the semiconductor fabrication lines of embodiments of the present invention 2 to Fig. 6.
Fig. 7 is system is transported in expression as the wafer full automaticity of the semiconductor fabrication lines of embodiments of the present invention 3 all birds-eye vieies.
Fig. 8 is that expression wafer full automaticity shown in Figure 7 transports the birds-eye view of the part of system.
Fig. 9 is illustrated in wafer full automaticity shown in Figure 7 to transport in the part of system, carries out the birds-eye view of newly establishing or set up situation of manufacturing installation.
Figure 10 is illustrated in wafer full automaticity shown in Figure 7 to transport in the part of system, carries out the birds-eye view of newly establishing or set up situation of manufacturing installation.
Figure 11 is illustrated in wafer full automaticity shown in Figure 7 to transport in the part of system, carries out the birds-eye view of situation of the maintenance of manufacturing installation.
To be expression transport the birds-eye view of the part of system as the wafer full automaticity of the semiconductor fabrication lines of embodiments of the present invention 4 to Figure 12.
The specific embodiment
Below, with reference to the accompanying drawings, describe embodiments of the present invention in detail.In addition,, give prosign, omit its explanation repeatedly parts with same function at the whole accompanying drawings that are used for illustrating embodiment.
(embodiment 1)
Fig. 1 is all birds-eye vieies that the expression and the wafer full automaticity of the corresponding semiconductor fabrication lines of wafer of for example diameter 300mm transport system.
The various manufacturing installation EQ (comprising testing fixture) that are used for annealing device that quartz conductor makes, ion implantation apparatus, Etaching device, film formation device, washing equipment, photoresist application device, exposure device etc. are divided into a plurality of separations (device group), are configured in the dust free room CR.These various manufacturing installation EQ implement to handle to wafer respectively.Like this, it is corresponding with this configuration that the wafer full automaticity in dust free room CR transports system, is to be transported the stacking device BS that system and transfer respectively transport system and constituted by a plurality of.
Transporting of wafer set between each stacking device (being transported body) is that the system that transports by being arranged in the dust free room CR carries out.On the other hand, transporting of the wafer set of relevant manufacturing installation is by carrying out being layed in RGV (Rail Guided Vehicle) (conveyer) 11 that transporting of dust free room CR travel on the guide rail (single line track) 3.That is, the system that transports of present embodiment 1 is that rail transports system.In the present embodiment, group is meant under equal conditions and makes, and under equal conditions implements the complex of the wafer of (perhaps having implemented) various processing.It is shared by 2 RGV11 that this transports guide rail 3.RGV11 controls its mode of operation by carrying out the drive-control system that electric property continues (omitting diagram) with RGV11.
Fig. 2 is the birds-eye view of the part of the expression system that transports shown in Figure 1.
Between 2 stacking device BS1, BS2, lay 1 and transport guide rail 3, transport on the guide rail 3 at this, dispose 2 RGV11A, 11B.In addition, between stacking device BS1, BS2, dispose for example manufacturing installation EQ1-EQn of n platform (n＞9).
In present embodiment 1,, set the transport zone that can travel respectively (the 1st transport zone) MA1, the MA2 of RGV11A, 11B respectively at first as the 1st stage.The setting of this transport zone MA1, MA2 is undertaken by above-mentioned drive-control system.At this moment, for example manufacturing installation EQ6 under the situation that the both sides of transport zone MA1, MA2 repeat, from RGV11A when manufacturing installation EQ6 moves into wafer set, before RGV11A just is stuck in manufacturing installation EQ6.At this moment, even the wafer set that the oriented manufacturing installation EQ6 of RGV11B moves into also because before RGV11A is stuck in manufacturing installation EQ6, and makes RGV11B can't advance to manufacturing installation EQ6.That is, because all wafer set of RGV11B can not be moved into manufacturing installation EQ6, so transport inefficiency exactly for RGV11B.Therefore, in present embodiment 1, part or all of setting transport zone MA1, MA2 do not repeat.Shown in Figure 2 transporting in the system, can represent for example that transport zone MA1 is the scope from stacking device BS1 to manufacturing installation EQ5, transport zone MA2 is the scope from manufacturing installation EQ6 to stacking device BS2.In view of the above, can prevent since 2 RGV11A, 11B hinder mutual preceding so that cause transport the low of efficient.
In addition, for example any one among the manufacturing installation EQ6-EQn of stacking device BS1 in being configured in transport zone MA2 that has in being configured in transport zone MA1 transported under the situation of wafer set, can should organize in the system that transports by other be transported to stacking device BS2 from stacking device BS1 after, be transported on the desired manufacturing installation that is configured in the transport zone MA2 from stacking device BS2 by RGV11B.
In addition, for not making the inefficiency of transporting of RGV11A, 11B, and RGV11A, 11B do not hinder mutual travelling, if can control the engineering of transporting based on the wafer set of RGV11A, 11B, then can set part or all repetition of transport zone MA1, MA2 yet.In this case, because the path of transporting of group is not to determine generally, so can according to circumstances suitably select to transport the path.
Fig. 3 and Fig. 4 are birds-eye vieies, are illustrated between stacking device BS1 and the stacking device BS2, carry out newly establishing of the manufacturing installation different with manufacturing installation EQ1-EQn, perhaps with manufacturing installation EQ1-EQn in the situation of setting up of any one identical manufacturing installation.
For example, as shown in Figure 3, between stacking device BS1 and stacking device BS2, carrying out newly establishing of the manufacturing installation different with manufacturing installation EQ1-EQn, perhaps with manufacturing installation EQ1-EQn in the setting up of any one identical manufacturing installation the time (the 2nd stage), import gradually successively from position near stacking device BS1 and stacking device BS2.For example, in position near stacking device BS1, manufacturing installation EQ1-EQ3 is set, in position near stacking device BS2, be provided with under the situation of manufacturing installation EQ8-EQn, zone between manufacturing installation EQ3 and manufacturing installation EQ8 (the 1st zone), when importing manufacturing installation EQ4-EQ7, from close manufacturing installation EQ3, the position of EQ8 begins to import gradually successively manufacturing installation EQ4-EQ7, match therewith, because RGV11A, 11B transport zone MA1 separately, MA2 progressively expands the manufacturing installation of importing successively to, so set new transport zone (the 2nd transport zone) MA1 successively gradually, MA2.In view of the above, wafer set can be moved into successively the manufacturing installation EQ4-EQ7 that imports.
In addition, as shown in Figure 4, between stacking device BS1 and stacking device BS2, carrying out newly establishing of the manufacturing installation different with manufacturing installation EQ1-EQn, perhaps with manufacturing installation EQ1-EQn in the setting up of any one identical manufacturing installation the time (the 2nd stage), also can near the position of stacking device BS1 to stacking device BS2, import manufacturing installation EQ4-EQ7 successively.For example, in position near stacking device BS1, manufacturing installation EQ1-EQ3 is set, in position near stacking device BS2, be provided with under the situation of manufacturing installation EQ8-EQn, zone between manufacturing installation EQ3 and manufacturing installation EQ8 (the 1st zone), when importing manufacturing installation EQ4-EQ7, begin to import gradually successively manufacturing installation EQ4-EQ7 from position near manufacturing installation EQ3, match therewith, because the transport zone MA1 of RGV11A progressively expands the manufacturing installation of importing successively to, so set new transport zone (the 2nd transport zone) MA1 successively gradually.In view of the above, wafer set can be moved into successively the manufacturing installation EQ4-EQ7 that imports.
When the importing operation of carrying out manufacturing installation as described above, for example, consider that the operating personnel enters the ingress area of manufacturing installation from rail track 3 sides, for guaranteeing operating personnel's safety, zone in the importing operation of carrying out manufacturing installation will cut off rail track 3, and RGV can not be entered.At this moment, only disposing on the rail track 3 under the situation of 1 RGV, RGV can only transport operation on a certain side of transport zone MA1, MA2.Therefore, can not transport in the opposing party's the manufacturing installation of transport zone MA1, MA2 of operation being disposed at RGV, wafer set can not be moved into, and worries to have the low problem of external operation ratio of manufacturing installation.On the other hand, if according to the introducing mechanism of the manufacturing installation that uses the illustrated present embodiment 1 of Fig. 3 and Fig. 4 and the expansion mechanism of transport zone MA1, MA2, then on transport zone MA1, MA2, distinguish pre-configured RGV11A, 11B.In view of the above, can prevent that wafer set can not be moved in a side's who is disposed at transport zone MA1, MA2 manufacturing installation, the generation of the low inferior problem of the external operation ratio of manufacturing installation.Consequently, can prevent extension by the semiconductor fabrication lines manufactured finished TAT of present embodiment 1.
Fig. 5 is a birds-eye view, and expression comprises checks or repair any one the situation of maintenance among the manufacturing installation EQ1-EQn that for example is arranged between stacking device BS1 and the stacking device BS2.
Under the situation of the maintenance of any one in the manufacturing installation EQ1-EQn that is arranged between stacking device BS1 and the stacking device BS2, for example consider that the manufacturing installation direction that the operating personnel safeguards from rail track 3 side direction enters, for guaranteeing operating personnel's safety, cut off rail track 3, make RGV can not enter into the zone of the maintenance of carrying out manufacturing installation.Even under such situation, only disposing on the rail track 3 under the situation of 1 RGV, RGV can only transport operation on a certain side of transport zone MA1, MA2.Therefore, can not transport in the opposing party's the manufacturing installation of transport zone MA1, MA2 of operation being disposed at RGV, wafer set can not be moved into, and worries to have the low problem of external operation ratio of manufacturing installation.
Therefore, in present embodiment 1, as shown in Figure 5, under the situation that the manufacturing installation EQ8 that for example is arranged on the zone (the 1st zone) between manufacturing installation EQ7 and the manufacturing installation EQ9 is safeguarded (the 2nd stage), utilize in advance 2 RGV11A, 11B to be configured in and transport on the guide rail 3, transport zone (the 2nd transport zone) MA1 that makes RGV11A is that the transport zone of RGV11B (the 2nd transport zone) MA2 is to manufacturing installation EQ9 from stacking device BS2 from stacking device BS1 to manufacturing installation EQ7.In view of the above, can prevent that wafer set can not be moved in a side's who is disposed at transport zone MA1, MA2 manufacturing installation, the generation of the low inferior problem of the external operation ratio of manufacturing installation.Consequently, can prevent extension by the semiconductor fabrication lines manufactured finished TAT of present embodiment 1.
(embodiment 2)
Then, transporting system with regard to the wafer full automaticity of present embodiment 2 describes.
As shown in Figure 6, the system that transports that the wafer full automaticity of present embodiment 2 transports system is identical with above-mentioned embodiment 1, is to transport guide rail 3,2 RGV11A, 11B and be configured in and transport on the guide rail 3 laying 1 between 2 stacking device BS1, the BS2.In addition, for example the manufacturing installation EQ1-EQn (comprising testing fixture) of n platform (n＞9) is configured between stacking device BS1, the BS2.
Present embodiment 2 is the external operation ratio levelizations that make external operation ratio and the manufacturing installation EQ1-EQn of RGV11A, 11B.In the present embodiment, the external operation ratio of RGV11A, 11B was meant with respect to the time of transporting system works (time that can serve), in fact the work-hours of RGV11A, 11B (time of having served), the external operation ratio of manufacturing installation EQ1-EQn was meant with respect to manageable time of manufacturing installation, the in fact processing time of manufacturing installation EQ1-EQn.
Even in present embodiment 2, also the embodiment 1 with above-mentioned is identical, at first, as the 1st stage, set respectively can make transport zone (the 1st transport zone) MA1, the MA2 that RGV11A, 11B travel respectively after, make and transport system works.Here, be from stacking device BS1 to manufacturing installation EQ8 for example by making transport zone MA1, transport zone MA2 is to manufacturing installation EQ9 from stacking device BS2, under the situation that produces difference on the external operation ratio of RGV11A, 11B, it is poor to worry to produce on the wait time of the group that is included in the group wait time of the manufacturing installation on the transport zone MA1 and is included in the manufacturing installation on the transport zone MA2.In this case, because for the long manufacturing installation of group wait time, external operation ratio is low, so worry the extension of the finished product TAT that produces by the semiconductor fabrication lines of present embodiment 2.
Therefore, in present embodiment 2, for example the external operation ratio of RGV11A is about 70%, the external operation ratio of RGV11B is about 50%, producing on the external operation ratio of RGV11A, 11B under the situation of difference, by enlarging respectively or dwindling transport zone MA1, MA2,, progressively set new transport zone (the 2nd transport zone) MA1, MA2 (the 2nd stage) so that the external operation ratio of RGV11A, 11B is same degree (for example being about 60%).For example,, transport zone MA2 is expanded to from stacking device BS2 to manufacturing installation EQ6 if by transport zone MA1 being narrowed down to from stacking device BS1 to manufacturing installation EQ5, so that the external operation ratio of RGV11A, 11B is a same degree, then just can be like this.In view of the above, the group wait time that can dwindle the manufacturing installation EQ1-EQ5 that is included among the transport zone MA1 and the group wait time that is included in the manufacturing installation EQ6-EQn among the transport zone MA2 is poor.Its result be because can make the external operation ratio levelization of manufacturing installation EQ1-EQn, so can prevent the extension of the one-tenth TAT of the semiconductor fabrication lines manufacturing by present embodiment 2.Promptly, by processing time (implementing to handle the required time with respect to wafer), processing frequency and processing period (handling the irregular of frequency) etc. with each manufacturing installation EQ1-EQn serves as that transport zone MA1, MA2 are set in the basis, because can shorten the group wait time in each manufacturing installation EQ1-EQn, so can shorten semiconductor fabrication lines manufactured finished TAT by present embodiment 2.
(embodiment 3)
Fig. 7 is all birds-eye vieies that the wafer full automaticity of the semiconductor fabrication lines of expression present embodiment 3 transports system.
Even in present embodiment 3, also identical with above-mentioned embodiment 1, various manufacturing installation EQ (comprising testing fixture) are divided into a plurality of separations (device group), are configured in the dust free room CR.In addition, transporting of the wafer set between each stacking device is that the system that transports by being arranged in the dust free room CR carries out.Transporting of the wafer set of relevant manufacturing installation, be by carrying out at the ground RGV11 that travels on the guide rail 3 that transports that is layed in dust free room CR, in present embodiment 3, be to transport guide rail 3 with 1 to link 3 stacking device BS, be shared 1 of 3 RGV11 transport guide rail 3.
Fig. 8 is that expression wafer full automaticity shown in Figure 7 transports the birds-eye view of the part of system.
As shown in Figure 8, lay 1 and transport guide rail 3,, transport on the guide rail 3, dispose 3 RGV11A, 11B, 11C at this to link 3 stacking device BS1, BS2, BS3.In addition, between stacking device BS1, BS2, dispose for example manufacturing installation EQ1A-EQnA of n platform (n＞7), in addition, between stacking device BS2, BS3, dispose for example manufacturing installation EQ1B-EQnB of n platform (n＞7).
Even in present embodiment 3, also identical with above-mentioned embodiment 1, at first as the 1st stage, set transport zone (the 1st transport zone) MA1, MA2, MA3 that RGV11A, 11B, 11C can travel respectively respectively.At this moment, at manufacturing installation EQ4A for example under the situation that this two side of transport zone MA1, MA2 repeats, with wafer set when RGV11A moves into manufacturing installation EQ4A, before RGV11A is stuck in manufacturing installation EQ4A.At this moment, though the wafer set that the oriented manufacturing installation RQ4A of RGV11B moves into, also because before RGV11A is stuck in manufacturing installation EQ4A, so RGV11B can not advance to manufacturing installation EQ4A.That is,, transport inefficiency so just become for RGV11B because there is the wafer set of RGV11B can not move into manufacturing installation EQ4A.In addition, even under the situation that this two side of transport zone MA2, MA3 repeats, also can be described as identical at for example manufacturing installation EQ4B.Therefore, in present embodiment 3, part or all of transport zone MA1, MA2, MA3 be set at do not repeat.Shown in Figure 8 transporting in the system, represented that for example transport zone MA1 is the scope from stacking device BS1 to manufacturing installation EQ4A, transport zone MA2 is the scope from manufacturing installation EQ5A to manufacturing installation EQ4B, and transport zone MA3 is the scope from manufacturing installation EQ5B to stacking device BS3.In view of the above, can prevent owing to 3 RGV11A, 11B, 11C hinder mutual advance produce transport the low of efficient.
In addition, identical with above-mentioned embodiment 1, for example having from being disposed at the stacking device BS1 in the transport zone MA1, the any one party of manufacturing installation EQ5A-EQ4B in being disposed at transport zone MA2 is transported under the situation of wafer set, can be in the system that transports by other, should organize be transported to stacking device BS2 from stacking device BS1 after, by RGV11B, be transported on the desirable manufacturing installation that is disposed in the transport zone MA2 from stacking device BS2.In addition, in that being arranged, any one party from the manufacturing installation EQ5B-EQnB of stacking device BS1 in being disposed at transport zone MA3 transports under the situation of wafer set, for carrying out the situation of transporting to other transport zone from stacking device BS2, and carry out from stacking device BS3 also can using same mechanism to the situation that other transport zone transports.
In addition, even in present embodiment 3, if make RGV11A, 11B, 11C to transport efficient not low, and make RGV11A, 11B, 11C not hinder mutual travelling, thereby can control the engineering of transporting, then also part or all of transport zone MA1, MA2, MA3 can be set at repetition based on the group of RGV11A, 11B, 11C.In this case, because the path of transporting of group is not to determine generally, so can according to circumstances suitably select to transport the path.
Fig. 9 and Figure 10 are birds-eye vieies, be illustrated between stacking device BS1 and the stacking device BS2 and between stacking device BS2 and stacking device BS3, carry out and newly the establishing of manufacturing installation EQ1A-EQnA and the manufacturing installation different with manufacturing installation EQ1B-EQnB, perhaps with manufacturing installation EQ1A-EQnA and with manufacturing installation EQ1B-EQnB in the situation of setting up of any one identical manufacturing installation.
As shown in Figure 9, between stacking device BS1 and stacking device BS2, carrying out and newly the establishing of manufacturing installation EQ1A-EQnA and the manufacturing installation different with manufacturing installation EQ1B-EQnB, perhaps with manufacturing installation EQ1A-EQnA and with manufacturing installation EQ1B-EQnB in the setting up of any one identical manufacturing installation the time (the 2nd stage), with use Fig. 3 identical by the illustrated situation of above-mentioned embodiment 1, also be that the position from close stacking device BS1 and stacking device BS2 begins progressively to import successively.Equally, between stacking device BS2 and stacking device BS3, carrying out and newly the establishing of manufacturing installation EQ1A-EQnA and the manufacturing installation different with manufacturing installation EQ1B-EQnB, perhaps with manufacturing installation EQ1A-EQnA and with manufacturing installation EQ1B-EQnB in the setting up of any one identical manufacturing installation the time, also be to begin progressively to import successively from position near stacking device BS2 and stacking device BS3.For example, prefer following situation, between stacking device BS1 and stacking device BS2, in position near stacking device BS1, manufacturing installation EQ1A, EQ2A are set, position near stacking device BS2 is provided with manufacturing installation EQ7A-EQnA, between stacking device BS2 and stacking device BS3, in position near stacking device BS2, manufacturing installation EQ1B, EQ2B are set, and the position near stacking device BS3 is provided with manufacturing installation EQ7B-EQnB.Here, zone between manufacturing installation EQ2A and manufacturing installation EQ7A (the 1st zone), when importing manufacturing installation EQ3A-EQ6A, from position near manufacturing installation EQ2A, EQ7A, import manufacturing installation EQ3A-EQ6A successively gradually, match therewith, separately transport zone MA1, the MA2 of RGV11A, 11B also expands the manufacturing installation of importing successively gradually to.Equally, zone between manufacturing installation EQ2B and manufacturing installation QE7B (the 1st zone), when importing manufacturing installation EQ3B-EQ6B, from position near manufacturing installation EQ2B, EQ7B, import manufacturing installation EQ3B-EQ6B successively gradually, match therewith, separately transport zone MA2, the MA3 of RGV11B, 11C also expands the manufacturing installation of importing successively gradually to.Like this, set new transport zone (the 2nd transport zone) MA1, MA2, MA3 successively gradually, can successively wafer set be moved into manufacturing installation EQ3A-EQ6A and the manufacturing installation EQ3B-EQ6B that is imported into.
In addition, as shown in figure 10, also can near the position of stacking device BS1 to stacking device BS2, import manufacturing installation EQ3A-EQ6A successively gradually, match therewith, the transport zone MA1 of RGV11A expands the manufacturing installation of importing successively gradually to, can successively wafer set be moved into the manufacturing installation EQ3A-EQ6A that is imported into.Equally, also can near the position of stacking device BS2 to stacking device BS3, import manufacturing installation EQ3B-EQ6B successively gradually, match therewith, the transport zone MA2 of RGV11B expands the manufacturing installation of importing successively gradually to, can successively wafer set be moved into the manufacturing installation EQ3B-EQ6B that is imported into.
As illustrated in the above-mentioned embodiment 1, because cut off rail track 3, the zone of the importing operation that RGV can not be entered carry out manufacturing installation, so only disposing on the rail track 3 under the situation of 1 RGV, RGV can only transport operation in any one position in transport zone MA1, MA2, MA3.On the other hand, expansion mechanism according to the introducing mechanism of the manufacturing installation that uses the illustrated present embodiment 3 of Fig. 9 and Figure 10 and transport zone MA1, MA2, MA3 is configured in RGV11A, 11B, 11C respectively on transport zone MA1, MA2, the MA3 in advance.In view of the above, can prevent that wafer set from can not move in the manufacturing installation of any 2 positions that are disposed at transport zone MA1, MA2, MA3, the low problem of external operation ratio of manufacturing installation takes place.Consequently can prevent the extension of the product TAT of the semiconductor fabrication lines manufacturing by present embodiment 3.
In addition, as mentioned above, by 3 RGV of configuration on rail track 3, in zone along rail track 3, dispose the stacking device identical with RGV quantity, with compare by the situation (with reference to Fig. 3 and Fig. 4) of illustrated 2 RGV of configuration of above-mentioned embodiment 1 and the stacking device identical with RGV quantity, can at length set and separately the corresponding transport zone of RGV.In view of the above,, compare, can at length set and the corresponding transport zone of RGV separately according to purposes with above-mentioned embodiment 1 according to present embodiment 3.For example, compare, when importing to manufacturing installation in the semiconductor fabrication lines, can easily set the scope of transporting that corresponding RGV is set with the configuration of manufacturing installation with above-mentioned embodiment 1.
But, in present embodiment 3, be with 3 RGV of configuration on rail track 3, in zone along rail track 3, the situation that the stacking device identical with RGV quantity is set is that example describes, RGV needn't be defined as 3, also can dispose more RGV, can also use match the therewith mechanism of stacking device of quantity of configuration.In view of the above, because can set in more detail and separately the corresponding transport zone of RGV, so set easily further and the corresponding scope of transporting of purposes.
Figure 11 is a birds-eye view, and expression for example comprises and checking or the situations of the maintenance of repairing etc. any 2 among the manufacturing installation EQ1A-EQnA that is provided with between stacking device BS1 and stacking device BS3 and the manufacturing installation EQ1B-EQnB.
Identical with above-mentioned embodiment 1, even under the manufacturing installation EQ1A-EQnA and any 2 situations about safeguarding among the manufacturing installation EQ1B-EQnB that between stacking device BS1 and stacking device BS3, are provided with, also be to cut off rail track 3, make RGV can not enter into the zone of the maintenance of carrying out manufacturing installation.Even under such situation, only disposing on the rail track 3 under the situation of 1 RGV, RGV also can only transport operation in any one zone in transport zone MA1, MA2, MA3.Therefore, wafer set can not be moved into to be configured in RGV and can not to transport in other the manufacturing installation of 2 transport zones of operation, worries the low problem of external operation ratio of manufacturing installation.
Therefore, in present embodiment 3, as shown in figure 11, for example to the manufacturing installation EQ6A that is arranged on the zone (the 1st zone) between manufacturing installation EQ5A and the manufacturing installation EQ7A and be arranged on manufacturing installation EQ5B and manufacturing installation EQ7B between the manufacturing installation EQ6B in zone (the 1st zone) situation of maintaining under (the 2nd stage), utilize 3 RGV11A, 11B, 11C are pre-configured in and transport on the guide rail 3.Promptly, transport zone (the 2nd transport zone) MA1 that makes RGV11A is from stacking device BS1 to manufacturing installation EQ5A, transport zone (the 2nd transport zone) MA2 that makes RGV11B is from manufacturing installation EQ7A to manufacturing installation EQ5B, and transport zone (the 2nd transport zone) MA3 that makes RGV11C is to stacking device BS3 from manufacturing installation EQ7B.In view of the above, can prevent that wafer set from can not be moved in the manufacturing installation that is configured in any 2 zones among transport zone MA1, MA2, the MA3, low problem takes place in the external operation ratio of manufacturing installation.Consequently can prevent extension by the semiconductor fabrication lines manufactured finished TAT of present embodiment 3.
As mentioned above, by 3 RGV of configuration on rail track 3, in zone along rail track 3, dispose the stacking device identical with RGV quantity, even under to 2 situations about safeguarding in the manufacturing installation that is provided with along rail track 3, also can not make the external operation ratio of manufacturing installation low, thereby transport wafer set.In addition, RGV is not limited to 3, by disposing more RGV, disposes the stacking device of the quantity that matches therewith, even under the situation that the manufacturing installation more than 2 is safeguarded, also can not make the external operation ratio of manufacturing installation low, thereby transport wafer set.
According to present embodiment 3 as described above, also can obtain the effect identical with above-mentioned embodiment 1.
(embodiment 4)
Then, transporting system with regard to the wafer full automaticity of present embodiment 4 describes.
As shown in figure 12, the system that transports that the wafer full automaticity of present embodiment 4 transports system is identical with above-mentioned embodiment 3, be lay 1 link 3 stacking device BS1, BS2, BS3 transport guide rail 3, transporting on the guide rail 3, dispose 3 RGV11A, 11B, 11C.In addition, between stacking device BS1, BS2, dispose for example manufacturing installation EQ1A-EQnA (comprising testing fixture) of n platform (n＞7), between stacking device BS2, BS3, dispose for example manufacturing installation EQ1B-EQnB (comprising testing fixture) of n platform (n＞7).
Present embodiment 4 is identical with above-mentioned embodiment 2, is the external operation ratio levelization that makes RGV11A, 11B, 11C.In addition, the external operation ratio of relevant manufacturing installation EQ1A-EQnA and manufacturing installation EQ1B-EQnB also is a levelization.
Even in present embodiment 4, also identical with above-mentioned embodiment 3, at first as the 1st stage, after setting transport zone (the 1st transport zone) MA1, MA2 that RGV11A, 11B, 11C can travel respectively, MA3 respectively, make and transport system works.Here, be from stacking device BS1 to manufacturing installation EQ4A for example by making transport zone MA1, transport zone MA2 is to manufacturing installation EQ4B from manufacturing installation EQ5A, transport zone MA3 is to manufacturing installation EQ5B from stacking device BS3, producing on the external operation ratio of RGV11A, 11B, 11C under the situation of difference, the group wait time of the manufacturing installation of worry in being contained in transport zone MA1, with the group wait time that is contained in the manufacturing installation among the transport zone MA2, poor with generation on the group wait time that is contained in the manufacturing installation among the transport zone MA3.In this case, because for the long manufacturing installation of group wait time, external operation ratio is low, so worry extension by the semiconductor fabrication lines manufactured finished TAT of present embodiment 4.
Therefore, in present embodiment 4, for example the external operation ratio of RGV11A is about 40%, the external operation ratio of RGV11B is about 60%, the external operation ratio of RGV11C is about 80%, producing on the external operation ratio of RGV11A, 11B, 11C under the situation of difference, by enlarging respectively or dwindling transport zone MA1, MA2, MA3, so that the external operation ratio of RGV11A, 11B, 11C is same degree (for example about 60%), thereby progressively set new transport zone (the 2nd transport zone) MA1, MA2, MA3 (the 2nd stage).For example, by transport zone MA1 is expanded to from stacking device BS1 to manufacturing installation EQ6A, transport zone MA2 is changed to from manufacturing installation EQ7A to manufacturing installation EQ6B, transport zone MA3 is narrowed down to from stacking device BS2 to manufacturing installation EQ7B, if can make the external operation ratio of RGV11A, 11B, 11C is same degree, then just can be like this.In view of the above, can dwindle the group wait time of the manufacturing installation EQ1A-EQ6A that is included among the transport zone MA1, with the group wait time that is included in the manufacturing installation EQ7A-EQ6B among the transport zone MA2, poor with the group wait time that is included in the manufacturing installation EQ7B-EQnB among the transport zone MA3.Its result is because can make the external operation ratio levelization of manufacturing installation EQ1A-EQnA and manufacturing installation EQ1B-EQnB, so can prevent the extension by the semiconductor fabrication lines manufactured finished TAT of present embodiment 4.Promptly, identical with above-mentioned embodiment 2, by processing time separately, processing frequency and processing period (it is irregular to handle frequency) etc. with manufacturing installation EQ1A-EQnA and manufacturing installation EQ1B-EQnB serves as that transport zone MA1, MA2, MA3 are set in the basis, because can shorten, so can shorten semiconductor fabrication lines manufactured finished TAT by present embodiment 4 at manufacturing installation EQ1A-EQnA and the group wait time in manufacturing installation EQ1B-EQnB.
In addition, in above-mentioned present embodiment 4, be just on rail track 3, to dispose 3 RGV, in zone along rail track 3, the situation that disposes the stacking device identical with RGV quantity is that example is represented, RGV needn't be defined as 3, also can dispose more RGV, disposes the stacking device of the quantity that matches therewith.
According to present embodiment 4 as described above, also can obtain the effect identical with above-mentioned embodiment 2.
More than, according to the working of an invention mode, understand that specifically the present invention is not limited to above-mentioned embodiment, in the scope that does not break away from its purport, much less can carry out various changes by the invention that the present inventor did.
In addition, in the above-described embodiment, the situation that just the present invention is applicable to the system that transports of the wafer set in semiconductor fabrication lines is illustrated, also go for the system that transports beyond semiconductor fabrication lines, for example the system that transports in the manufacturing line of Liquid Crystal Display (LCD).
If in the invention of delivering according to the application, by representative invention gained To effect carry out simple declaration, then as follows.
(1) even in the situation of cutting off rail track (single-line railway) because can with Being transported body is transported to be arranged on and is cut off zone (in addition, zone (the 1st transport zone) 2 transport zones) on the manufacturing installation (comprising testing fixture), so can prevent from making dress The operation ratio of putting low.
(2) because at rail track (single-line railway) many RGV (transveyers are set Structure), according to the operation ratio of each RGV, set the transport zone the (the 2nd of each new RGV Transport zone), so can make the operation ratio of each RGV and transport based on RGV and be transported The operation ratio level of the manufacturing installation of body (comprising testing fixture).
Claims (19)
1. one kind is transported method, use single line track that links between a plurality of manufacturing installations and a plurality of conveyers that move along above-mentioned single line track, to be transported body transports to above-mentioned manufacturing installation, it is characterized in that, above-mentioned conveyer separately all has the form of transporting in the 2nd stage after the 1st stage and above-mentioned the 1st stage, and the 2nd transport zone of the 1st transport zone of the above-mentioned conveyer in above-mentioned the 1st stage and above-mentioned conveyer in above-mentioned the 2nd stage is different scope.
2. the method for transporting as claimed in claim 1, it is characterized in that, above-mentioned the 1st transport zone of one of above-mentioned a plurality of conveyers and above-mentioned the 2nd transport zone are spaced from each other with other above-mentioned the 1st transport zone and above-mentioned the 2nd transport zone of above-mentioned conveyer.
3. the method for transporting as claimed in claim 1 is characterized in that, above-mentioned conveyer is on above-mentioned single line track or along its RGV that travels.
4. the method for transporting as claimed in claim 1 is characterized in that, the above-mentioned body that is transported is that diameter is the above semiconductor wafer group of 300mm.
5. one kind is transported method, use single line track that links between a plurality of manufacturing installations and a plurality of conveyers that move along above-mentioned single line track, to be transported body transports to above-mentioned manufacturing installation, it is characterized in that, in the above-mentioned conveyer at least one has the form of transporting in the 1st stage and the 2nd stage when cutting off above-mentioned single line track, and the 2nd transport zone of the 1st transport zone of the above-mentioned conveyer in above-mentioned the 1st stage and above-mentioned conveyer in above-mentioned the 2nd stage is different scope.
6. the method for transporting as claimed in claim 5, it is characterized in that, above-mentioned the 1st transport zone of one of above-mentioned a plurality of conveyers and above-mentioned the 2nd transport zone are spaced from each other with other above-mentioned the 1st transport zone and above-mentioned the 2nd transport zone of above-mentioned conveyer.
7. the method for transporting as claimed in claim 5 is characterized in that, during at least one that state the maintenance of conveyer, above-mentioned manufacturing installation on the implementation newly established or set up, in above-mentioned maintenance, the position newly establishing or set up, cuts off above-mentioned single line track.
8. the method for transporting as claimed in claim 5 is characterized in that, above-mentioned conveyer is on above-mentioned single line track or along its RGV that travels.
9. the method for transporting as claimed in claim 5 is characterized in that, the above-mentioned body that is transported is that diameter is the above semiconductor wafer group of 300mm.
10. one kind is transported method, use the single line track that links between a plurality of manufacturing installations, with a plurality of conveyers along above-mentioned single line track action, to be transported body transports to above-mentioned manufacturing installation, it is characterized in that, above-mentioned conveyer separately all has the form of transporting in the 1st stage and the 2nd stage, the 1st stage was the situation that produces difference at the external operation ratio of above-mentioned a plurality of conveyers, the 2nd stage was compared with above-mentioned the 1st stage, the difference of above-mentioned external operation ratio is little, and the 2nd transport zone of the 1st transport zone of the above-mentioned conveyer in above-mentioned the 1st stage and above-mentioned conveyer in above-mentioned the 2nd stage is different scope.
11. the method for transporting as claimed in claim 10, it is characterized in that, above-mentioned the 1st transport zone of one of above-mentioned a plurality of conveyers and above-mentioned the 2nd transport zone are spaced from each other with other above-mentioned the 1st transport zone and above-mentioned the 2nd transport zone of above-mentioned conveyer.
12. the method for transporting as claimed in claim 10, it is characterized in that the 2nd transport zone of the above-mentioned conveyer in above-mentioned the 2nd stage is with the processing time of the above-mentioned a plurality of manufacturing installations in above-mentioned the 1st stage, handles frequency and processing period is that benchmark is set.
13. the method for transporting as claimed in claim 10 is characterized in that, above-mentioned conveyer is on above-mentioned single line track or along its RGV that travels.
14. the method for transporting as claimed in claim 10 is characterized in that, the above-mentioned body that is transported is that diameter is the above semiconductor wafer group of 300mm.
15. one kind is transported method, use the single line track that links between a plurality of manufacturing installations, with a plurality of conveyers along above-mentioned single line track action, to be transported body transports to above-mentioned manufacturing installation, it is characterized in that, above-mentioned conveyer separately all has the form of transporting in the 1st stage and the 2nd stage, the 1st stage was in the above-mentioned situation that produces difference on the wait time that body is transported to above-mentioned a plurality of manufacturing installations that is transported, the 2nd stage was compared with above-mentioned the 1st stage, the difference of above-mentioned wait time is little, and the 2nd transport zone of the 1st transport zone of the above-mentioned conveyer in above-mentioned the 1st stage and above-mentioned conveyer in above-mentioned the 2nd stage is different scope.
16. the method for transporting as claimed in claim 15, it is characterized in that, above-mentioned the 1st transport zone of one of above-mentioned a plurality of conveyers and above-mentioned the 2nd transport zone are spaced from each other with other above-mentioned the 1st transport zone and above-mentioned the 2nd transport zone of above-mentioned conveyer.
17. the method for transporting as claimed in claim 15, it is characterized in that the 2nd transport zone of the above-mentioned conveyer in above-mentioned the 2nd stage is with the processing time of the above-mentioned a plurality of manufacturing installations in above-mentioned the 1st stage, handles frequency and processing period is that benchmark is set.
18. the method for transporting as claimed in claim 15 is characterized in that, above-mentioned conveyer is on above-mentioned single line track or along its RGV that travels.
19. the method for transporting as claimed in claim 15 is characterized in that, the above-mentioned body that is transported is that diameter is the above semiconductor wafer group of 300mm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002251202A JP2004095626A (en) | 2002-08-29 | 2002-08-29 | Method for transportation |
| JP251202/2002 | 2002-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1485257A true CN1485257A (en) | 2004-03-31 |
Family
ID=31972669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA031548318A Pending CN1485257A (en) | 2002-08-29 | 2003-08-20 | Transfer method |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20040042878A1 (en) |
| JP (1) | JP2004095626A (en) |
| KR (1) | KR20040019892A (en) |
| CN (1) | CN1485257A (en) |
| TW (1) | TW200406350A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104555728A (en) * | 2013-10-15 | 2015-04-29 | 华亚科技股份有限公司 | Suspended transport system |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4589853B2 (en) * | 2005-09-22 | 2010-12-01 | 東京エレクトロン株式会社 | Substrate transport system and substrate transport method |
| TW200911654A (en) * | 2007-09-06 | 2009-03-16 | Asyst Technologies Japan Inc | Storage, transporting system and storage set |
| JP5369419B2 (en) * | 2007-10-18 | 2013-12-18 | 村田機械株式会社 | Storage system with storage, storage set and storage |
| US9229446B2 (en) * | 2012-05-08 | 2016-01-05 | International Business Machines Corporation | Production line quality processes |
-
2002
- 2002-08-29 JP JP2002251202A patent/JP2004095626A/en not_active Withdrawn
-
2003
- 2003-08-12 KR KR1020030055665A patent/KR20040019892A/en not_active Application Discontinuation
- 2003-08-15 US US10/641,057 patent/US20040042878A1/en not_active Abandoned
- 2003-08-18 TW TW092122645A patent/TW200406350A/en unknown
- 2003-08-20 CN CNA031548318A patent/CN1485257A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104555728A (en) * | 2013-10-15 | 2015-04-29 | 华亚科技股份有限公司 | Suspended transport system |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200406350A (en) | 2004-05-01 |
| JP2004095626A (en) | 2004-03-25 |
| KR20040019892A (en) | 2004-03-06 |
| US20040042878A1 (en) | 2004-03-04 |
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