CN1480425A - Burning-use bearer for ceramic electronic parts - Google Patents

Burning-use bearer for ceramic electronic parts Download PDF

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Publication number
CN1480425A
CN1480425A CNA031497195A CN03149719A CN1480425A CN 1480425 A CN1480425 A CN 1480425A CN A031497195 A CNA031497195 A CN A031497195A CN 03149719 A CN03149719 A CN 03149719A CN 1480425 A CN1480425 A CN 1480425A
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Prior art keywords
mullite
matrix
mounting device
aluminum oxide
ceramic electronic
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CN1219723C (en
Inventor
博 森
森博
浩明
二本松浩明
司
森笹真司
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NGK Insulators Ltd
NGK Adrec Co Ltd
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NGK Insulators Ltd
NGK Adrec Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/16—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay
    • C04B35/18—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay rich in aluminium oxide
    • C04B35/185—Mullite 3Al2O3-2SiO2
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
    • C04B2235/9623—Ceramic setters properties

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Furnace Charging Or Discharging (AREA)

Abstract

The invention provides fire all bodies to be fired, mounted on a setter, at a uniform temperature independently of their mounted positions and to obtain electronic components having a uniform property while corresponding to upsizing of the setter, compacting of mounting space, and shortening of firing time. The setter 1 for firing the ceramic electronic components is equipped with a base body comprising a ceramic material containing alumina and mullite as main components and a coated layer which is provided on the base body and prevents the reaction with the bodies to be fired. Further, the base body and the coated layer are constituted by using materials capable of realizing that the coefficient of heat conduction of the whole body at 20[deg.]C becomes in a range of 2.7-15.0 W/m*K.

Description

The ceramic electronic component carrier for baking
Technical field
Employed mounting device when the present invention relates to process for calcining manufacturing ceramic electronic component.In more detail, just relate to possess with aluminum oxide, mullite ceramic electronic component carrier for baking as the pottery matrix of main component.
Background technology
Ceramic electronic component carrier for baking (being designated hereinafter simply as " mounting device ") is that mounting (is just become electronic component by sintered body when making the pottery electronic component with process for calcining after burning till, below identical) member, according to its application target or environment for use, need not say and to cause quality of item to worsen with being reacted by sintered body, and for heating up, cool off requirement repeatedly patience is arranged, promptly require resistance to thermal shocks strong.
Always, in such ceramic electronic component carrier for baking, what be widely used is the mounting device that has with the lower section: the adulterant that is made of aluminium oxide particles, and the matrix that constitutes as adulterant and body material with the strong mullite of resistance to thermal shocks and coat this matrix to prevent by the coating of sintered body and matrix reaction.
In addition, in this mounting device always, because by andaluzite (2 (Al 2O 3SiO 2)) or clay and aluminum oxide (Al 2O 3) come the synthetic mullite that constitutes body material, so use chemical theory mol ratio (Al 2O 3/ SiO 2Mol ratio=1.5).
, usually such mounting device is used to a plurality of grillage or saggars of hierarchically loading, and in the manufacturing process of ceramic electronic component, and firing process is the stage of decision speed of aspect of boosting productivity.Therefore, will load the interval of the mounting device of usefulness recently and encrypt, so that a large amount of being loaded on the mounting device by sintered body.In addition, from same viewpoint, also inquire into the test that firing time is shortened.So, obviously, place on such mounting device, aspect characteristics such as resistance to thermal shocks, require goodly, and an urgent demand is by sintered body and the location independent that is loaded on the grillage etc., thereby burnt till under uniform temperature.
But, because of above-mentioned mounting device always can not satisfy such requirement comprehensively, so though have the strong problem that can not obtain uniform properties for the electronic component after burning till of mounting device resistance to thermal shocks when burning till.
That is to say, in mounting device always, the mullite of one of main component of formation matrix is because of having the composition of chemical theory mol ratio, so thermal conductivity low (thermal conductivity of the occasion of void content 0% is 6.0W/mk), be loaded in that grillage etc. is gone up and when using as a plurality of in the reality, be positioned in " loaded " position be positioned near the mounting device the centre of fabrication orientation middle body by sintered body, insufficient because of burning till, the characteristic that can not obtain wishing sometimes.
In view of the above problems, the objective of the invention is to, a kind of ceramic electronic component carrier for baking is provided, it is characterized in that, as the mounting utensil sufficient resistance to thermal shocks is arranged, even and the at interval densification and firing time shortens, the occasion that maximized etc. of mounting device particularly of the loading of mounting device, also can be irrelevant with its " loaded " position, thereby under uniform temperature, burn till, and obtain the goods of uniform properties by sintered body.
Summary of the invention
For solving above-mentioned problem, what the inventor studied with keen determination found that, although have similar aluminum oxide as the mullite of one of main component that constitutes matrix, also can obtain having the mounting device of higher heat conductivity, thereby finish the present invention.
Promptly, the invention provides a kind of ceramic electronic component carrier for baking, be to have the matrix that constitutes by the stupalith that is main component and be arranged on the ceramic electronic component carrier for baking with the coating that is reacted by sintered body of preventing on the matrix with aluminum oxide and mullite, it is characterized in that whole thermal conductivities under 20 ℃ of this matrix and coating are 2.70～15.00W/mk.
In addition, in the present invention, whole thermal diffusivities under 20 ℃ of preferred substrate and coating are 1.25 * 10 -6～6.1 * 10 -6m 2/ s, whole thermal conductivities under 1200 ℃ of preferred substrate and coating are 5.0～20.0W/mk.
In addition, if according to the present invention, a kind of ceramic electronic component carrier for baking can be provided, be to have the matrix that constitutes by the stupalith that is main component and be arranged on the ceramic electronic component carrier for baking with the coating that is reacted by sintered body of preventing on the matrix with aluminum oxide and mullite, it is characterized in that the mullite that constitutes matrix is Al 2O 3/ SiO 2Mol ratio is 1.6～2.4 composition.
In the present invention, preferably this mullite has Al 2O 3/ SiO 2Mol ratio is 1.8～2.1 composition.In addition, be 15/85～50/50 preferably as the aluminum oxide of the main component of adulterant with as the mass ratio (mullite/aluminum oxide) of the mullite of the main component of body material.
Description of drawings
Fig. 1 is the example of 10 mounting devices of the present invention has been loaded in expression by the interval dagger a side-view.
1 ceramic electronic component carrier for baking
1a ceramic electronic component carrier for baking (the 5th layer)
2 interval daggers
Embodiment
Below specify embodiments of the present invention.
Mounting device of the present invention is to have by aluminum oxide and be the matrix that constitutes of the stupalith of main component with the mullite and be arranged on the mounting device with the coating that is reacted by sintered body of preventing on the matrix, it is characterized in that whole thermal conductivities under 20 ℃ of this matrix and coating are 2.70～15.00W/mk.
By this, even in the occasion that a plurality of large-scale mounting devices cryptographically is loaded on grillage etc., when particularly not burning till for a long time, also can make to be positioned in all on the mounting device by sintered body and its mounting location independent and under uniform temperature, burn till, can reduce the fluctuation degree of the characteristic of resulting electronic component.
For this reason, the thermal conductivity of mounting device more preferably of the present invention under 20 ℃ is more than 2.76W/mk, more than 2.80W/mk.
In addition, in the present invention, from this point of fluctuation degree of the characteristic that can further reduce the electronic component that obtains, whole thermal diffusivities under 20 ℃ of preferred substrate and coating are 1.25 * 10 -6～6.1 * 10 -6m 2/ s, more preferably 1.40 * 10 -6～4.20 * 10 -6m 2/ s is preferably 1.40 * 10 especially -6～2.0 * 10 -6m 2/ s.
In addition, in the present invention, during by the sintered body sintering, from making evenly this point of fluctuation degree can reduce article characteristic of sintering temperature, whole thermal conductivities under 1200 ℃ of preferred substrate and coating are 5.0～20.0W/mk.
Below specify mounting device with such characteristic.
In the present invention, have the most stable crystalline structure of corundum type as the aluminum oxide of one of body material main component, from thermotolerance, good this point of thermal-shock resistance, preferred Alpha-alumina.In addition, can enumerate fused alumina, sintered alumina etc. with this Alpha-alumina as host crystal.
In addition, in the present invention, in the stupalith that constitutes matrix, preferably can constitute the aluminum oxide of adulterant.Therefore, as aluminum oxide, preferably its particle diameter is 2.0～0.2mm, and more preferably particle diameter is 1.0～0.5mm.
Secondly, in the present invention, preferably conduct constitutes another main component mullite Al of the stupalith of matrix 2O 3/ SiO 2Mol ratio is 1.6～2.4 composition, is more preferably 1.7～2.1 composition, especially preferably 1.8～2.1, and most preferably be 1.8～2.0 composition.
By this, on the one hand with contain with Al as one of matrix main component 2O 3/ SiO 2Mol ratio has identical substantially resistance to thermal shocks as the mounting utensil of the mullite of chemical theory mol ratio, can also obtain the mounting device of thermal conductivity height, goods that the characteristics fluctuation degree is little simultaneously.
But, the mullite among the present invention also can be mullite that contains the chemical theory mol ratio etc.But owing to can reduce heat conductivity and not good when containing the mullite volume of chemical theory mol ratio, so specifically, preferably its containing ratio is to account for below 5% of whole mullites.
And the mullite among the present invention also can be the mullite that contains glassy phase.But when containing this glassy phase with height ratio, owing to can reduce thermotolerance and heat conductivity, so preferably contain trace ingredients, specifically, preferably its containing ratio is to account for below 1% of whole mullites.
In addition, in the present invention, preferably in the stupalith that constitutes matrix, constitute the mullite of adulterant and body material.In addition, preferably the particle diameter of this mullite is below 2mm, and more preferably particle diameter is below 1mm.
Matrix among the present invention, be below 5/5 preferably as the mullite of the main component of above-mentioned body material and adulterant with as the mass ratio (mullite/aluminum oxide) of the aluminum oxide of the main component of adulterant, more preferably below 4/6, preferred especially below 3/7, most preferably below 2/8.
If the mass ratio of the mullite of matrix and aluminum oxide (mullite/aluminum oxide) is in this scope, just can make the mounting device simultaneously have the resistance to thermal shocks of hope, one side has a high heat conductivity, just can be with its mounting location independent be positioned in all by sintered body on the mounting device burning till under the uniform temperature.
But, when if the mass ratio of aluminum oxide is extremely big, the resistance to thermal shocks of mounting device reduces, thus preferably as the mullite of adulterant and body material main component and as the mass ratio (mullite/aluminum oxide) of the aluminum oxide of adulterant main component below 1/9.
In addition, this matrix also can contain except that the aluminum oxide of main component and for example Na the mullite 2O, TiO 2Deng composition.But contain these impurity for a long time, can reduce the heat conductivity, thermotolerance of mounting device etc. significantly, thereby preferred impurity contains in 0.5% in the material that constitutes matrix.
In addition, because of this matrix heat conductivity is big, so preferably void content is below 30%, more preferably void content is below 10%.
Secondly, as coating of the present invention, the monolayer constructions will that can be independent 1 layer of formation also can be the two-layer above multi-ply construction that design has the middle layer.
In addition, as coating of the present invention, to prevent and be reacted that preferably at least a kind of material selecting constitutes from the group that for example zirconium white, magnesium oxide, aluminum oxide, aluminium oxide-zirconium oxide and spinel are formed by sintered body.
But, in the present invention,, preferably constitute the middle layer of the coating that forms by independent 1 layer of coating that forms or by the multi-ply construction more than 2 layers or at least 1 layer of top layer with aluminum oxide or aluminium oxide-zirconium oxide in order to improve the heat conductivity of mounting device.
On the other hand, the material of coating can be according to constituting by the material of sintered body, the non-reacted high material of preferential selection, for example make the occasion of ferrite material, preferably at least a kind of material by zirconium white, aluminum oxide or aluminium oxide-zirconium oxide constitutes, the occasion of the electrical condenser that making is made of barium titanate preferably is made of zirconium white.
In addition, in coating,, preferably constitute the middle layer with heat conductivity high aluminum oxide or aluminium oxide-zirconium oxide for the occasion that the non-reacted height in top layer is constituted with zirconium white by multi-ply construction.
In the present invention, do not do special restriction for the thickness of coating, but preferably consider the heat conductivity of coating material, adjust its thickness.
Specifically,, can form thicker layer with heat conductivity high when layer, for example use by aluminum oxide or aluminium oxide-zirconium oxide constitute layer time, its thickness can be made as 100～500 μ m.
On the other hand, with heat conductivity low when layer, preferred relatively thinner layer, for example, use by zirconium white constitute layer time, preferably its thickness is made as 50～200 μ m.
In addition, can enumerate interpolation CaO, MgO, CeO or Y as zirconium white 2O 3Deng the stabilized zirconia of stabilization agent, partially stabilizedization zirconium white, not stabilized zirconia or calcium zirconate etc.Equally, can enumerate magnesium oxide-alumina spinel etc., can enumerate aluminum oxide and zirconic mixture or make aluminum oxide and the product of zirconium white solutionizing as aluminium oxide-zirconium oxide as spinel.
In addition, for the coating of the coating of monolayer constructions will and multi-ply construction any, can form with the method that for example spraying, spraying plating etc. are carried out usually, as long as select appropriate means at once according to the thickness of the coating that forms.
More than, the main points that respectively constitute for mounting device of the present invention are illustrated, but in mounting device of the present invention, owing to can burn till a plurality of simultaneously by sintered body, even so below by thickness 5mm, be more preferred from below the 3mm the interval dagger with the mounting device encrypt multilayer load or be fixed on the support, on the stand or constitutes the occasion of burning till the usefulness anchor clamps in the saggar, also can make and under identical temperature, burn till, and can access the electronic component of uniform properties by sintered body.In addition, because heat energy is transmitted to enough rapidly by sintered body, even so in the occasion of the large-scale mounting device that uses the above size of 100mm * 100mm, each is burnt till under identical temperature by sintered body, particularly can also make the firing time shorteningization, thereby obtain the electronic component of uniform properties rapidly and in large quantities.
Below, be described more specifically the present invention with embodiment, but the present invention is not subjected to any restriction of these embodiment.(evaluation method)
(1) resistance to thermal shocks
The mounting device of each embodiment and comparative example is placed on the grillage, will be by ZrO 2The sheet material that constitutes (105mm * 105mm * 3mm) be loaded on each mounting device, in the stove of under this state, packing into, be warming up to 500 ℃ after, sharply cooling under the room temperature stove outside, the naked eyes affirmation has the length of flawless generation and crackle.
Estimate by following: can't see the ◎ that is chosen as that crackle takes place fully, crack length is chosen as zero below 50mm, crack length surpass being chosen as of 50mm *.
(2) thermal conductivity thermal diffusivity
Measure with laser flash method according to the method for putting down in writing among the JIS R1611.At this moment,, the mounting device of each embodiment and each comparative example is prepared 5 respectively to be cut into the cylindric of diameter 10mm, estimate the mean value of these 5 samples as measuring sample.
(3) the fluctuation degree of article characteristic
As shown in Figure 1, by the interval dagger 2 that constitutes with mounting device identical material, the mounting device 1 of each embodiment and each comparative example is loaded 10 layers with the interval of 5mm, the central part of the 5th layer mounting device 1a and with layer peripheral part respectively 10 of mountings burnt till under 1300 ℃, 2 hours condition by sintered body (becoming ceramic condenser after burning till).
After burning till, the electrostatic capacity of each ceramic condenser that measure to take out is obtained mean value to the central part that is positioned in the 5th layer of mounting device with each 10 ceramic condenser of layer peripheral part respectively, its difference 1% with the interior ◎ that is chosen as, 2% is chosen as zero with interior, greater than 2% be chosen as *.
(4) Al 2O 3/ SiO 2Mol ratio
By the angle of diffraction of powder method of X-ray diffraction with 210 of ICDD (International Center for Diffraction Data) evaluations.(embodiment 1)
At first, with fused alumina (median size 0.3mm, maximum particle diameter 1.0mm) 35 quality %, Calcined polishing aluminum oxide 15 quality % (median size 2 μ m), Al 2O 3/ SiO 2Mol ratio is that 1.7 fused mullite (median size 100.0 μ m, maximum particle diameter 0.5mm) 45 quality % mix mutually with clay (median size 5.0mm) 5 quality %, the modulation ceramic raw material.Then,, mixed 20 minutes, make base soil with respect to these ceramic raw material 100 mass parts, as caking agent interpolation methylcellulose gum 0.5 mass parts and water 40 mass parts.Then, this base soil is dropped into the hydraulic pressure molding machine, with 1t/cm 2Molding pressure obtain the tabular formed body of 150mm * 150mm * 4mm.At last, make this formed body after under 80 ℃ dry 8 hours, under 1500 ℃, burnt till 2 hours, make tabular matrix.
Secondly, the easy-sintering aluminum oxide 60 quality % of median size 0.5 μ m and the fused alumina 40 quality % of median size 10 μ m are mixed mutually, add water 30 mass parts, stirred 12 hours, be modulated into the middle layer slip with respect to these mixing raw material 100 mass parts.Then, use spray gun with 5kg/cm 2Air press spray to this slip on the surface of matrix after, under 1400 ℃, carry out burning in 2 hours and handle, forming thickness is the middle layer of 100 μ m.
Then, with water-stable plasma spray coating device, with the 8 quality %Y that contain of median size 100～200 μ m 2O 3Stabilized zirconia particle (stabilization degree 100%) spraying plating to matrix surface, form the upper layer of thickness 200 μ m, make the mounting device of the 150mm * 150mm * 4.6mm of coating with multi-ply construction.(embodiment 2～5 and comparative example 1～3)
Fused alumina, Calcined polishing aluminum oxide, fused mullite and clay are carried out hybrid modulation ceramic raw material and making as shown in table 1 middle layer and top layer respectively with the cooperation ratio shown in the table 1, and in addition all the other carry out similarly to Example 1, make the mounting device.The material of each embodiment and each comparative example is formed conclusion and is shown in Table 1.
Table 1
The matrix ceramic raw material Mullite (Al 2O 3/SiO 2Mol ratio) The middle layer The top layer
Fused alumina Calcined polishing aluminum oxide Fused mullite Clay *1 Raw material Thickness (μ m) Raw material Thickness (μ m)
Embodiment 1 ??35 16 ????45 ????5 ??1.7 Aluminum oxide ??100 Stabilized zirconia ????200
Embodiment 2 ??40 20 ????35 ????5 ??1.7 ??- ??- Stabilized zirconia ????150
Embodiment 3 ??40 30 ????25 ????5 ??1.7 ??- ??- Stabilized zirconia ????170
Comparative example 1 ??35 15 ????45 ????5 ??1.7 ??- ??- Stabilized zirconia ????150
Comparative example 2 ??35 10 ????50 ????5 ??1.7 Aluminum oxide ??100 Stabilized zirconia ????200
Embodiment 4 ??55 20 ????20 ????5 ??1.7 ??- ??- Stabilized zirconia ????160
Embodiment 5 ??65 25 ????5 ????5 ??1.7 ??- ??- Stabilized zirconia ????150
Comparative example 3 ??70 30 ????- ????- ??- ??- ??- Stabilized zirconia ????150
*1 clay: Al 2O 360% (3.0 quality % of matrix ceramic raw material total amount), SiO 235% (1.75 quality % of matrix ceramic raw material total amount), all the other are other compositions.
As shown in table 2, mass ratio (mullite/aluminum oxide) for aluminum oxide in the matrix and mullite is the mounting device of the embodiment 2～4 below 37/63～21/79, thermal conductivity in the time of any one 20 ℃ is more than 2.86W/mk, thermal conductivity in the time of 1200 ℃ is more than 5.2W/mk, and thermal diffusivity is 1.40 * 10 -6m 2All bigger more than the/s.In addition, the fluctuation degree of article characteristic is all very little below 1%.
In addition, be 47/53 and be provided with the mounting device of the embodiment 1 in aluminum oxide middle layer on matrix that the thermal conductivity in the time of 20 ℃ is 2.76W/mk for the mass ratio (mullite/aluminum oxide) of aluminum oxide in the matrix and mullite, thermal diffusivity is 1.26 * 10 -6m 2/ s, which characteristic is all bigger.In addition, the fluctuation degree of article characteristic is below 2% and smaller.In addition, for the mass ratio (mullite/aluminum oxide) of aluminum oxide in the matrix and mullite the mounting device of 5/95 embodiment 5, the thermal conductivity in the time of 20 ℃ is 15.00W/mk, and the thermal conductivity in the time of 1200 ℃ is 20.1W/mk, and thermal diffusivity is 6.68 * 10 -6m 2/ s, which characteristic is all bigger.In addition, the fluctuation degree of article characteristic is below 2% and smaller.
In contrast, for all the other equal mounting devices of the comparative example 1 identical with embodiment 1 except that not establishing the aluminum oxide middle layer, the thermal conductivity in the time of 20 ℃ is 2.62W/mk, and thermal diffusivity is 1.23 * 10 -6m 2/ s, all lower, the fluctuation degree of article characteristic is also big than 2%.
In addition, even for being 52/48 as all the other equal mounting devices of the comparative example 2 identical with embodiment 1 of matrix except the mass ratio (mullite/aluminum oxide) that makes aluminum oxide and mullite, the thermal conductivity in the time of 20 ℃ is 2.36W/mk, and thermal diffusivity is 1.08 * 10 -6m 2/ s, all lower, the fluctuation degree of article characteristic is also big than 2%.
Particularly, only constitute the mounting device of the comparative example 3 of matrix with aluminum oxide, though the thermal conductivity 20 ℃ the time is 17.30W/mk, thermal diffusivity is 6.82 * 10 -6m 2/ s, all very high, but the fluctuation degree of article characteristic is but big than 2%.In addition, particularly be not shown in the table, but the mounting device of comparative example 3 can see that length surpasses the crackle of 50mm, the resistance to thermal shocks extreme difference in the resistance to thermal shocks test.The characteristic of the mounting device of each embodiment and each comparative example is concluded and is shown in Table 2.
Table 2
Thermal diffusivity (* 10 -6m 2/s) Thermal conductivity (W/mK) Article characteristic fluctuation degree
????20℃ ????1200℃
Embodiment
1 ????1.26 ????2.76 ????○
Embodiment 2 ????1.40 ????2.86 ????5.2 ????◎
Embodiment 3 ????1.46 ????3.30 ????6.8 ????◎
Comparative example 1 ????1.23 ????2.62 ????4.8 ????×
Comparative example 2 ????1.08 ????2.36 ????×
Embodiment 4 ????4.16 ????9.60 ????◎
Embodiment 5 ????6.68 ????15.00 ????20.1 ????○
Comparative example 3 ????6.82 ????17.30 ????23.2 ????×
(embodiment 6～10 and comparative example 4,5)
Except using the Al shown in the table 3 respectively 2O 3/ SiO 2Mol ratio, modulate ceramic raw material with cooperation mixed fused alumina, Calcined polishing aluminum oxide, fused mullite and the clay shown in the table 3 and do not establish the middle layer and skin depth is that all the other and embodiment 1 identical carrying out are made the mounting device beyond the 150 μ m.The material of each embodiment and each comparative example is formed conclusion and is shown in Table 3.
Table 3
The matrix ceramic raw material Mullite (Al 2O 3/SiO 2Mol ratio) The middle layer The top layer
Fused alumina Calcined polishing aluminum oxide Fused mullite Clay *1 Raw material Thickness (μ m)
Comparative example 4 ??40 20 ??35 ????5 ????1.5 ????- Stabilized zirconia ????150
Embodiment 6 ??40 20 ??35 ????5 ????1.6 ????- Stabilized zirconia ????150
Embodiment 7 ??40 20 ??35 ????5 ????1.8 ????- Stabilized zirconia ????150
Embodiment 8 ??40 20 ??35 ????5 ????1.9 ????- Stabilized zirconia ????150
Embodiment 9 ??40 20 ??35 ????5 ????2.1 ????- Stabilized zirconia ????150
Embodiment 10 ??40 20 ??35 ????5 ????2.4 ????- Stabilized zirconia ????150
Comparative example 5 ??40 20 ??35 ????5 ????2.5 ????- Stabilized zirconia ????150
As shown in table 4, for using Al 2O 3/ SiO 2Mol ratio is the mounting device of the embodiment 6～10 of 1.6～2.4 mullite, and the fluctuation degree of the characteristic of any one goods is all below 2%, and the heat shock resistance critical temperature is more than 500 ℃, and resistance to thermal shocks is also strong.Particularly for using Al 2O 3/ SiO 2Mol ratio is the mounting device of the embodiment 7～9 of 1.8～2.1 mullite, and the fluctuation degree of its article characteristic is all below 1% and very little.
In contrast, for using Al 2O 3/ SiO 2Mol ratio is the mounting device of the comparative example 4 of 1.5 mullite, and the fluctuation degree of its article characteristic is all big than 2%.
In addition, use Al 2O 3/ SiO 2Mol ratio is the mounting device of the comparative example 5 of 2.5 mullite, though the fluctuation degree of article characteristic all below 2% and smaller, the heat shock resistance critical temperature below 500 ℃ and resistance to thermal shocks poor.The characteristic of the mounting device of each embodiment and each comparative example is concluded and is shown in Table 4.
Table 4
The fluctuation degree of article characteristic Resistance to thermal shocks
Comparative example 4 ????× ????◎
Embodiment 6 ????○ ????◎
Embodiment 7 ????◎ ????◎
Embodiment 8 ????◎ ????◎
Embodiment 9 ????◎ ????◎
Embodiment 10 ????◎ ????○
Comparative example 5 ????◎ ????×
As previously discussed, according to the present invention, a kind of ceramic electronic component carrier for baking that can obtain the uniform properties electronic component is provided, this mounting device can satisfy the maximization of mounting device and load densification at interval and requirement that firing time shortens, can make simultaneously to be positioned in all on the mounting device and can be burnt till under uniform temperature by sintered body and its mounting location independent.

Claims (5)

1. ceramic electronic component carrier for baking, it is characterized in that, this ceramic electronic component carrier for baking has the matrix that is made of the stupalith that with aluminum oxide and mullite is main component and is arranged on preventing and the coating that is reacted by sintered body on this matrix, it is characterized in that
Whole thermal conductivities under 20 ℃ of this matrix and this coating are 2.7～15.0W/mk.
2. ceramic electronic component carrier for baking according to claim 1 is characterized in that, whole thermal diffusivities under 20 ℃ of above-mentioned matrix and above-mentioned coating are 1.25 * 10 -6～6.1 * 10 -6m 2/ s.
3. ceramic electronic component carrier for baking according to claim 1 and 2 is characterized in that, whole thermal conductivities under 1200 ℃ of above-mentioned matrix and above-mentioned coating are 5.0～20.0W/mk.
4. ceramic electronic component carrier for baking, it is characterized in that, this ceramic electronic component carrier for baking has the matrix that is made of the stupalith that with aluminum oxide and mullite is main component and is arranged on preventing and the coating that is reacted by sintered body on this matrix, it is characterized in that
This mullite has Al 2O 3/ SiO 2Mol ratio is 1.6～2.4 composition.
5. ceramic electronic component carrier for baking according to claim 4 is characterized in that above-mentioned mullite has Al 2O 3/ SiO 2Mol ratio is 1.8～2.1 composition.
CNB031497195A 2002-08-09 2003-08-06 Burning-use bearer for ceramic electronic parts Expired - Lifetime CN1219723C (en)

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JP2002233579A JP4298236B2 (en) 2002-08-09 2002-08-09 Manufacturing method for ceramic electronic component firing setter

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CN100406413C (en) * 2004-12-28 2008-07-30 日本碍子株式会社 Clamp for electron component
CN101644540B (en) * 2008-08-04 2012-11-21 日本碍子株式会社 Carrier for baking
CN103502182A (en) * 2011-03-30 2014-01-08 东京窑业株式会社 Heat treatment vessel for lithium-containing compound and method for producing same

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CN102510699A (en) * 2011-09-22 2012-06-20 华为终端有限公司 Mobile terminal
KR102206851B1 (en) 2018-04-18 2021-01-22 주식회사 엘지화학 Cartridge for cell firing
KR102644725B1 (en) * 2020-08-28 2024-03-06 엔지케이 인슐레이터 엘티디 ceramics material
KR102298549B1 (en) 2021-03-08 2021-09-03 마홍설 Sequential transfer type heat treatment automation device through the jig part and automation control part for smart ceramic setter
CN115894000B (en) * 2022-10-10 2023-07-07 武汉理工大学 Mullite-titanium dioxide ceramic matrix composite coating, method, application and coating preparation method
CN115716754A (en) * 2022-11-17 2023-02-28 浙江百岸科技有限公司 Preparation method of sintering bearing plate for high-temperature sintering of nitrogen-oxygen sensor ceramic chip

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100406413C (en) * 2004-12-28 2008-07-30 日本碍子株式会社 Clamp for electron component
CN101644540B (en) * 2008-08-04 2012-11-21 日本碍子株式会社 Carrier for baking
TWI451056B (en) * 2008-08-04 2014-09-01 Ngk Insulators Ltd Calcination with a loader
CN103502182A (en) * 2011-03-30 2014-01-08 东京窑业株式会社 Heat treatment vessel for lithium-containing compound and method for producing same
US9733019B2 (en) 2011-03-30 2017-08-15 Tyk Corporation Container for heat treatment of positive-electrode active material for lithium-ion battery and method for producing the same

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JP2004075399A (en) 2004-03-11
TWI262178B (en) 2006-09-21
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TW200404755A (en) 2004-04-01
CN1219723C (en) 2005-09-21
KR20040014350A (en) 2004-02-14

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