CN1467835A - Lead frame adapting to integrate circuit miniaturization trend - Google Patents
Lead frame adapting to integrate circuit miniaturization trend Download PDFInfo
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- CN1467835A CN1467835A CNA021405832A CN02140583A CN1467835A CN 1467835 A CN1467835 A CN 1467835A CN A021405832 A CNA021405832 A CN A021405832A CN 02140583 A CN02140583 A CN 02140583A CN 1467835 A CN1467835 A CN 1467835A
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- lead
- group
- limit
- foot
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/4826—Connecting between the body and an opposite side of the item with respect to the body
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- Lead Frames For Integrated Circuits (AREA)
Abstract
A wiring holder with small scale integrated circuit characterized by that, the distribution and arranging mode of the each inward ends of the existing wiring holder, increasing the adjacent interval between them without being influenced by the limited available space. As a result the invention can lower the difficulty of the packing process of the small scale integrated circuit improve the quality ratio of the integrated circuit packing process and reduce the manufacturing cost.
Description
Technical field
Interior the pin pin of the relevant a kind of increase lead frame (Lead Frame) of the present invention is apart from the scheme of (lnner LeadPitch), and this lead frame is used for integrated circuit and encapsulates and utter a sound or a word that it more is applicable to lead chord position packaging operation of (Lead on Chip) above the chip type integrated circuit.
Background technology
Integrated circuit encapsulation procedure existing LOC (lead frame is arranged in chip type integrated circuit top), the structure of lead frame (lead frame 1 as shown in Figure 1) is divided into two row's lead foots 11,12 usually, respectively comprise a plurality of lead foots, outside terminal 13,14 directions of stretching out that two row's lead foots 11,12 respectively comprise inwardly terminal 15,16, the two row's lead foots of outwards terminal 13,14 and one row of a row are opposite; Inside terminal 15,16 of two row's lead foots, for cooperating the size of integrated circuit, must be positioned at a quadrilateral area 17, across a headspace 18 and relatively, with make things convenient for integrated circuit and each lead foot (normally it is inwardly terminal) be electrically connected operation (for example install bonding wire 20 in these inwardly terminal 15,16 and each weld pad 100 of integrated circuit between, these bonding wires 20 must pass this headspace 18).As shown in Figure 1, in the existing lead frame 1, each of its two rows lead foot 11,12 inwardly end 15,16 is positioned at central quadrangle (or other are corresponding to shape of chip type integrated circuit size) zone 17, become two alignment arrays to be evenly distributed between two parallel edges 171,173 of this quadrangle 17, vertical this two parallel edges 171,173 of this two alignment array, and an apart headspace 18, pass through so that each weld pad 100 that carries out integrated circuit and these inside being electrically connected between ends 15,16 for bonding wire 20.
The dependency structure of above-mentioned existing LOC (lead frame be positioned at chip type integrated circuit top) the used lead frame of encapsulation procedure, can with reference to No. 5,545,920, United States Patent (USP) case with 5,872, No. 398.
The development trend of constantly dwindling along with the integrated circuit size, can dwindle (the weld pad spacing of the integrated circuit (IC) wafer after for example size is dwindled is also dwindled) gradually for the space of arranging these lead foots 11,12 (containing terminad 15,16 in these) in the lead frame, pin between adjacent two lead foots (or adjacent two inside ends) is apart from must correspondingly dwindling, cause the degree of difficulty of integrated circuit encapsulation (for example each lead foot welding lead) to heighten, also make the yield of integrated circuit encapsulation procedure reduce, cost significantly improves.Therefore the present invention proposes a solution, to adapt to the diminishing development trend of integrated circuit size, it changes in lead frame 1 these inwardly terminal 15,16 modes arranged evenly, so that the pin between these lead foots 11,12 (or these inwardly terminal 15,16) is overcome apart from the development bottleneck that must dwindle in lead frame 1.
Summary of the invention
One of the object of the invention is, a kind of lead frame that adapts to integrated circuit miniaturization trend is provided, it can change the arrangement or the distribution mode of the inside end of each lead foot in the lead frame, in limited free space, these inwardly terminal adjacent distances are between the two increased, reduce the degree of difficulty of the encapsulation procedure of integrated circuit miniaturization, promote the yield of integrated circuit encapsulation procedure, reduce production costs.
Two of the object of the invention is, changes the arrangement or the distribution mode of the inside end of each lead foot in the lead frame, suffered from the too little processing procedure bottleneck of pin pin distance in each lead foot to overcome the development trend that the integrated circuit size dwindles.
The present invention is characterised in that, the size and shape that cooperates integrated circuit (especially chip type integrated circuit), in limited zone, the inside end of each lead foot in the lead frame is made preferable arranged distribution, and the interior pin pin that makes these lead foots is apart from (or inwardly terminal adjacent distance between the two) more existing obvious increase.
One of invention typical example of the present invention is a kind of lead frame that is used for the integrated circuit encapsulation, and it comprises:
One first group of a plurality of lead foot;
One second group of a plurality of lead foot; And
The zone that one quadrangle is surrounded (a for example zone corresponding to the integrated circuit (IC) wafer upper surface);
Above-mentioned this lead foot comprises a still less outwards terminal and inside end, the zone that the inside end of these lead foots all is positioned at this quadrangle and is surrounded, the inside end of this first group of each lead foot and the inside end of this second group of each lead foot, across a kind of distance and relatively, this tetragonal first limit becomes vertical with second limit, this tetragonal first limit is parallel with the 3rd limit, this the first group inside end with this second group of each lead foot, intersperse among one by one respectively between this first limit and the 3rd limit, these are inwardly terminal far away more apart from this first limit, just near more apart from this second limit, arrange to make the same group of respectively adjacent spaces of the inside end of this lead foot thus, bigger compared with prior art (as shown in Figure 1 191), respectively the interior pin pin of this lead foot can be bigger apart from (equaling the same group of respectively adjacent spaces of the inside end of this lead foot at least) also just to make same group.When above-mentioned lead frame was used for the LOC encapsulation, this kind distance between the inside end of this first group of each lead foot and the inside end of this second group of each lead foot was for the ease of being electrically connected the operation of these lead foots and integrated circuit (being positioned at the lead frame below).For example, be wired between each weld pad of these inside ends and at least one integrated circuit for the ease of installation.This kind distance can be a fixed value, also can not be fixed value and along with respectively should inwardly terminal position and become, unique conditional be that this kind distance will allow these lead foots be convenient to execution with the operation that is electrically connected of integrated circuit.
In the above-mentioned lead frame, the outside end of this first group of lead foot and this second group of lead foot stretches out towards a first direction and a second direction respectively, this second direction and this first direction different (for example a kind of situation: this second party supports or opposes towards this first direction).
In the above-mentioned lead frame, the position of the inside end of this first group of each lead foot can coexist on one first straight line, also can difference in a straight line, and the position of the inside end of this second group of each lead foot can coexist on one second straight line, also can difference in a straight line, this second straight line can parallel this first straight line, also can not parallel this first straight line.
Two of typical example of the present invention is a kind of lead frames that are used for the integrated circuit encapsulation, and it comprises:
One first group of a plurality of lead foot;
One second group of a plurality of lead foot of lead foot; And
The zone that one hexahedron is surrounded (for example a shape, the big or small three-dimensional space that can hold) for conducting wire frame structure;
In two the lead frame of the invention described above invention typical example, it is inwardly terminal that this lead foot comprises at least one outside end and, the zone that the inside end of these lead foots all is positioned at this hexahedron and is surrounded, the inside end of this first group of each lead foot and the inside end of this second group of each lead foot, across a kind of distance and relatively, this hexahedral first becomes vertical with second, this hexahedral first parallel with the 3rd, this the first group inside end with this second group of each lead foot, intersperse among one by one respectively between this first and the 3rd, these are inwardly terminal far away more apart from this first, just near more apart from this second, arrange to make the same group of respectively adjacent spaces of the inside end of this lead foot thus, bigger compared with prior art (as shown in Figure 1 191), respectively the interior pin pin of this lead foot can be bigger apart from (equaling the same group of respectively adjacent spaces of the inside end of this lead foot at least) also just to make same group.
Lead frame as one of typical example of the present invention, in two the lead frame of typical example of the present invention, this kind distance is to be electrically connected operation (for example install and be wired between each weld pad of these inside ends and at least one integrated circuit) for the ease of carrying out between these lead foots and the integrated circuit below it, it can be a fixed value, it also can not fixed value and along with respectively should inwardly terminal position and become, unique conditional be that this kind distance will allow these lead foots be convenient to execution with the operation that is electrically connected of integrated circuit.
Lead frame as one of typical example of the present invention, in two the lead frame of invention typical example of the present invention, the outside end of this first group of lead foot and this second group of lead foot stretches out towards a first direction and a second direction respectively, this second direction and this first direction different (for example wherein a kind of situation: this second party supports or opposes towards this first direction).
In two the lead frame of the invention described above typical example, the position of the inside end of this first group of each lead foot can coexist on one first given plane of dual space, also can not coexist on the plane, and the position of the inside end of this second group of each lead foot can coexist on one second given plane of dual space, also can not coexist on the plane, this second given plane can parallel this first given plane, also can not parallel this first given plane.
In two the lead frame of the invention described above typical example, the inside end of this first group of each lead foot scatters respectively with the inside end of this second group of each lead foot one by one, between this hexahedral first and the 3rd, and the adjacent spaces distance of the inside end of the adjacent spaces of the inside end of this first group of each lead foot distance and this second group of each lead foot, compare with a gap set point, its difference is less than a gap error feasible value.
Three of invention typical example of the present invention is a kind of lead frames that are used for the integrated circuit encapsulation, and it comprises:
It is inwardly terminal that a plurality of lead foots, this lead foot comprise at least one outside end and; And
The zone that one quadrangle is surrounded, this tetragonal first limit becomes vertical with second limit, and this tetragonal first limit is parallel with the 3rd limit;
The zone that the inside end of these lead foots all is positioned at this quadrangle and is surrounded, and become a row to be distributed between this first limit and the 3rd limit, these are inwardly terminal far away more apart from this first limit, just near more apart from this second limit, make the respectively adjacent spaces of the inside end of this lead foot thus, bigger compared with prior art (as shown in Figure 1 191), respectively the interior pin pin of this lead foot can be bigger apart from (still less equaling the same group of respectively adjacent spaces of the inside end of this lead foot) also just to make same group.
The direction that the outside end of these lead foots stretches out can be identical, with suit (for example lead frame only has a row outwards terminal, and it stretches out in the same direction, is electrically connected the application that maybe will save the plane connection space to adapt to single direction).The direction that the outside end of these lead foots stretches out also can be different (for example vertical these tetragonal second limits, parallel this tetragonal second limit of another person), to cooperate another special applications.Because the present invention can provide the bigger inwardly terminal adjacent spaces (or interior pin pin distance) of lead foot in certain zone, whole lead foots of the existing lead frame of the historical facts or anecdotes outwards degree of difficulty of terminal application of stretching out are in the same direction greatly reduced.Apparently, in three the lead frame of the invention described above typical example, the inside end of these lead foots, also can be according to the inside end of each lead foot of two of the invention described above invention typical example, its position can be on same straight line, but be dispersed in dual space (on the given plane that the shape that for example coexists, size can be held for conducting wire frame structure) or three-dimensional space (in the designated space that the shape that for example coexists, size can be held for conducting wire frame structure), no matter be the lead frame of above-mentioned which kind of situation, all in the present patent application claim.
Four of invention typical example of the present invention is a kind of lead frames that are used for the integrated circuit encapsulation, and it comprises:
It is inwardly terminal that a plurality of lead foots, this lead foot comprise at least one outside end and; And
The zone that one quadrangle is surrounded, this tetragonal first limit is parallel with the 3rd limit, this tetragonal second limit is parallel with the 4th limit, this tetragonal first limit presss from both sides into an obtuse angle (greater than the right angle) with second limit, the position of the inside end of these lead foots is divided into two groups, and each is evenly distributed in this second limit and the 4th limit, make the respectively adjacent spaces of the inside end of this lead foot thus, bigger compared with prior art (as shown in Figure 1 191), respectively the interior pin pin of this lead foot can be bigger apart from (equaling the same group of respectively adjacent spaces of the inside end of this lead foot at least) also just to make same group.
As the lead frame of aforementioned each typical example of the present invention, in four the lead frame of invention typical example of the present invention, these two groups inwardly terminal pairing outside ends can stretch out with phase XOR even opposite direction respectively.
Description of drawings
For further specifying long-pending body content of the present invention, after being described in more detail in below in conjunction with embodiment and accompanying drawing, wherein:
Fig. 1 looks (top view) schematic diagram on the conducting wire frame structure of existing LOC (lead frame be positioned at chip type integrated circuit top) type integrated circuit encapsulation usefulness;
Shown in Figure 2 be one of embodiment of the invention conducting wire frame structure on look (top view) schematic diagram;
Shown in Figure 3 be the embodiment of the invention two conducting wire frame structure on look (top view) schematic diagram;
Shown in Figure 4 be the embodiment of the invention three conducting wire frame structure on look (top view) schematic diagram;
Shown in Figure 5 be the embodiment of the invention four conducting wire frame structure on look (top view) schematic diagram.
Embodiment
Shown in Figure 2 be one of inventive embodiments of the present invention a kind of lead frame 2 of being used for the integrated circuit encapsulation on look (top view) schematic diagram, it comprises:
One first group of a plurality of lead foot 21;
One second group of a plurality of lead foot 22 of lead foot; And
The zone 27 that one quadrangle is surrounded (zone corresponding to the size or the shape of integrated circuit (IC) wafer to be packaged for example, or a zone corresponding to the solder side of integrated circuit (IC) wafer to be packaged);
Above-mentioned this lead foot 21,22 respectively comprise at least one outside terminal 23,24 and one inside terminal 25,26, these lead foots 21,22 inside terminal 25, the zone 27 that 26 all are positioned at this quadrangle is surrounded, inside terminal 26 of inside terminal 25 and this second group of each lead foot 22 of this first group of each lead foot 21, across a kind of distance 28 and relatively, this tetragonal first limit 271 is vertical with 272 one-tenth on second limit, this tetragonal first limit 271 is parallel with the 3rd limit 273, this first group and this second group each lead foot 21,22 inside terminal 25,26, intersperse among one by one respectively between this first limit 271 and the 3rd limit 273, these are end 25 inwardly, 26 far away more apart from this first limit 271, just near more apart from this second limit 272, plant to arrange to make the same group of respectively adjacent spaces 291 of the inside end of this lead foot (inside terminal 25 or second groups of a plurality of lead foots 22 of first group of a plurality of lead foot 21 inside terminal 26) thus, 292, bigger compared with prior art (as shown in Figure 1 191), respectively the interior pin pin of this lead foot is apart from 293 or 294 can be bigger also just to make same group, and this 293 or 294 equals the same group of respectively adjacent spaces 291 or 292 of the inside end of this lead foot at least.
When above-mentioned lead frame 2 is used for the LOC encapsulation, inside terminal 25 and this second group of each lead foot 22 of this first group of each lead foot 21 inside terminal 26 between this kind distance 28, be for the ease of carry out between these lead foots 21,22 and the integrated circuit below it be electrically connected operation (for example install bonding wire 20 in these inwardly terminal 25,26 and each weld pad 100 of at least one integrated circuit between).This kind distance 28 can be a fixed value, also can not be fixed value and along with respectively should inwardly terminal position and become, unique conditional be that this kind distance 28 will allow the operation that is electrically connected between these each weld pads 100 of lead foot 21,22 and integrated circuit be convenient to execution.A kind of mode that designs this kind distance 28 is, this kind distance 28 is compared with a distance setting value, and its difference is less than a range error feasible value.
In the above-mentioned lead frame 2, this first group of lead foot 21 stretches out towards a first direction 111 and a second direction 112 respectively with outside terminal 23,24 of this second group of lead foot 22, this second direction 112 and this first direction 111 different (for example a kind of situation: these second direction 112 back ofs the body are towards this first direction 111).
In the above-mentioned lead frame 2, inside terminal 25 position of this first group of each lead foot 21 can coexist on one first straight line (not being shown in figure), on one second straight line (not being shown in figure), this second straight line can parallel this first straight line and inside terminal 26 position of this second group of each lead foot 22 can coexist.
In the above-mentioned lead frame 2, inside terminal 25 of this first group of each lead foot 21 scatters respectively with inside terminal 26 of this second group of each lead foot 22 one by one, between this first limit 271 and the 3rd limit 273, and evenly be scattered in, inside terminal 26 adjacent spaces distance 292 (can equal 291) of inside terminal 25 the adjacent spaces distance 291 of this first group of each lead foot 21 and this second group of each lead foot 22, compare with a gap set point, its difference is less than a gap error feasible value.
Shown in Figure 3 be inventive embodiments of the present invention a kind of lead frame 3 that is used for integrated circuit encapsulation of two on look (top view) schematic diagram, it comprises:
One first group of a plurality of lead foot 31;
One second group of a plurality of lead foot 32 of lead foot; And
The zone 37 that one hexahedron is surrounded, the zone 37 that this hexahedron surrounded is to belong to the three-dimensional space, for example a shape, size can be held for lead frame 3 structures, or its lower surface (not being shown in figure) is corresponding to the size or the shape of integrated circuit (IC) wafer to be packaged, or the solder side corresponding to integrated circuit (IC) wafer to be packaged, shown in Figure 3ly only look schematic diagram on it;
This lead foot 31 among above-mentioned Fig. 3,32 respectively comprise at least one outside terminal 33,34 and one inside terminal 35,36, these lead foots 31,32 inside terminal 35, the zone 37 that 36 all are positioned at this hexahedron is surrounded, inside terminal 36 of inside terminal 35 and this second group of each lead foot 32 of this first group of each lead foot 31, across a kind of distance 38 and relatively, this hexahedral first (its top edge is 371) becomes vertical with second (its top edge is 372), this hexahedral first (top edge is 371) is parallel with the 3rd (its top edge is 373), this first group and this second group each lead foot 31,32 inside terminal 35,36, intersperse among all one by one respectively between this first and the 3rd, these are end 35 inwardly, 36 far away more apart from this first, just near more apart from this second, make the same group of respectively adjacent spaces 391 or 392 of the inside end of this lead foot thus, bigger compared with prior art (as shown in Figure 1 191), respectively the interior pin of this lead foot is apart from 393 or 394 can be bigger also just to make same group, and this 393 or 394 equals the same group of respectively adjacent spaces 391 or 392 of the inside end of this lead foot at least.
One lead frame 2 as inventive embodiments of the present invention, in two the lead frame 3 of the invention described above inventive embodiments, this kind distance 38 can be a fixed value, also can not be fixed value and along with respectively should be inwardly position of terminal 35,36 and becoming, condition is that this kind distance 38 will allow the operation that is electrically connected between these each weld pads 100 of lead foot 31,32 and integrated circuit be convenient to execution.
As the lead frame 2 of one of inventive embodiments of the present invention, in two the lead frame 3 of the invention described above inventive embodiments, a kind of design of this kind distance 38 is, this kind distance 38 is compared with a distance setting value, and its difference is less than a range error feasible value.
As one lead frame 2 of inventive embodiments of the present invention, in two the lead frame 3 of the invention described above inventive embodiments, outside terminal 33,34 of this first group of lead foot and this second group of lead foot stretches out towards different directions respectively, also can stretch out in the opposite direction.
In two the lead frame 3 of the invention described above inventive embodiments, inside terminal 35 position of this first group of each lead foot 31 can be on same straight line, but be dispersed in dual space (on the given plane that the shape that for example coexists, size can be held for lead frame 3 structures), and inside terminal 36 position of this second group of each lead foot 32 also can be on same straight line, but is dispersed in dual space (on other given plane that the shape that for example coexists, size can be held for lead frame 3 structures).
In two the lead frame 3 of the invention described above inventive embodiments, inside terminal 35 of this first group of each lead foot 31 scatters respectively with inside terminal 36 of this second group of each lead foot 32 one by one, between this hexahedral first (its top edge is 371) and the 3rd (its top edge is 373), and the adjacent spaces distance 392 of the inside end of the adjacent spaces of the inside end of this first group of each lead foot distance 391 and this second group of each lead foot, compare with a gap set point, its difference is less than a gap error feasible value.
Shown in Figure 4 be inventive embodiments of the present invention a kind of lead frame 4 that is used for integrated circuit encapsulation of three on look (top view) schematic diagram, it comprises:
A plurality of lead foots 41, this lead foot 41 comprise at least one outside terminal 43 and one inside terminal 45; And
(for example one corresponding to the build of integrated circuit (IC) wafer to be packaged or the zone of size in the zone 47 that one quadrangle is surrounded, or the zone corresponding to the solder side of integrated circuit (IC) wafer to be packaged), this tetragonal first limit 471 is vertical with 472 one-tenth on second limit, and this tetragonal first limit 471 is parallel with the 3rd limit 473;
The zone 47 that inside terminal 45 of these lead foots 41 all are positioned at this quadrangle and are surrounded, and be distributed in one by one between this first limit 471 and the 3rd limit 473, these inwardly terminal 45 far away more apart from this first limit 471, just near more apart from this second limit 472, arrange to make inside terminal 45 adjacent spaces 491 of this lead foot 41 respectively thus, be able to bigger compared with prior art (as shown in Figure 1 191), also just make the interior pin pin of this lead foot 41 respectively apart from 493 can be bigger, this 493 adjacent spaces 491 of inside terminal 45 that equals this lead foot 41 respectively at least.Outside terminal 43 directions of stretching out of these lead foots 41 can be identical, with suit (for example lead frame only has a row outwards terminal, and it stretches out in the same direction, is electrically connected the application that maybe will save the plane connection space to adapt to single direction).Outside terminal 43 directions of stretching out of these lead foots 41 also can be different (for example vertical these tetragonal second limits 472, parallel this tetragonal second limit 472 of another person), to cooperate another special applications.Because the present invention's invention can provide bigger lead foot 41 inside terminal 45 adjacent spaces 491 in certain zone, also just can in certain zone, provide bigger lead foot pin distance 493, so, realize that the degree of difficulty of the outside terminal application i that stretches out of whole lead foots of lead frame is greatly reduced in the same direction.
Apparently, above-mentioned shown in Figure 4 be in three the lead frame 4 of inventive embodiments of the present invention, inside terminal 45 of these lead foots 41, also can be according to inside terminal 35,36 of each lead foot 31,32 of two of above-mentioned Fig. 3 inventive embodiments of the present invention, its position can be on same straight line, but is dispersed in dual space (on the given plane that the shape that for example coexists, size can be held for lead frame 3 structures).
Shown in Figure 5 be inventive embodiments of the present invention a kind of lead frame 5 that is used for integrated circuit encapsulation of four on look (top view) signal, it comprises:
A plurality of lead foots 51, this lead foot 51 comprise outwards terminal 53 and one inside end 55 of Wang Shaoyi;
A plurality of lead foots 52, this lead foot 52 comprise at least one outside terminal 54 and one inside terminal 56; And
(for example one corresponding to the build of integrated circuit (IC) wafer to be packaged or the zone of size in the zone 57 that one quadrangle is surrounded, or the zone corresponding to the solder side of integrated circuit (IC) wafer to be packaged), this tetragonal first limit 571 is parallel with the 3rd limit 573, this tetragonal second limit 572 is parallel with the 4th limit 574, this tetragonal first limit 571 presss from both sides into an obtuse angle (greater than the right angle) with second limit 572, this tetragonal second limit 572 and the 4th limit 574 are separated by one apart from 58, these lead foots 51 and inside terminal 55 of these lead foots 52,56 position be divided into two groups each evenly distributed in this second limit 572 with the 4th limit 574, arrange to make respectively this lead foot 51 thus, 52 inside terminal 55,56 adjacent spaces 591 or 592, be able to bigger compared with prior art (as shown in Figure 1 191), respectively the interior pin of this lead foot is apart from 593 or 594 can be bigger also just to make same group, and this 593 or 594 equals same group of respectively this lead foot 51 or 52 inside terminal 55 or 56 adjacent spaces 591 or 592 at least.
Above-mentioned this kind distance 58 will allow these lead foots 51,52 be convenient to carry out with the operation that is electrically connected between each weld pad of integrated circuit.
Invent the lead frame of each embodiment as aforementioned the present invention, these two groups inwardly terminal 55,56 pairing outside terminal 53,54 can be stretched out with the direction of different (or opposite) respectively among Fig. 5.
More than explanation is for understanding the preferable or up to the present actual embodiment of the present invention.Spirit of the present invention and scope are not subject to the above-mentioned embodiment that discloses, and be opposite, and it can contain various modifications of lid or approximate schemes.
Claims (26)
1. a lead frame is used to encapsulate at least one integrated circuit, it is characterized in that, this lead frame comprises:
One first group of lead foot, it comprises a plurality of lead foots;
One second group of lead foot, it also comprises a plurality of lead foots; And
The zone that one quadrangle is surrounded; It is inwardly terminal that this lead foot comprises at least one outside end and, the zone that the inside end of these lead foots all is positioned at this quadrangle and is surrounded, the inside end of this first group of each lead foot and the inside end of this second group of each lead foot, across a kind of distance and relatively, this tetragonal first limit becomes vertical with second limit, this tetragonal first limit is parallel with the 3rd limit, this the first group inside end with this second group of each lead foot, intersperse among one by one respectively between this first limit and the 3rd limit, these are inwardly terminal far away more apart from this first limit, just near more apart from this second limit, respectively the adjacent spaces of the inside end of this lead foot is bigger to make same group thus.
2. lead frame as claimed in claim 1 is characterized in that, wherein the outside end of this first group of lead foot and this second group of lead foot stretches out towards a first direction and a second direction respectively, and this second direction and this first direction are different.
3. lead frame as claimed in claim 1 is characterized in that, wherein the outside end of this first group of lead foot and this second group of lead foot stretches out towards a first direction and a second direction respectively, and this second party supports or opposes towards this first direction.
4. lead frame as claimed in claim 1 is characterized in that, wherein the position of the inside end of this first group of each lead foot coexists on one first straight line, and the position of the inside end of this second group of each lead foot coexists on one second straight line.
5. lead frame as claimed in claim 1, it is characterized in that, wherein the position of the inside end of this first group of each lead foot coexists on one first straight line, and the position of the inside end of this second group of each lead foot coexists on one second straight line, and this first straight line of this second straight line parallel.
6. lead frame as claimed in claim 1 is characterized in that, wherein the inside end of the inside end of this first group of each lead foot and this second group of each lead foot between this kind distance, respectively should become inwardly terminal position with work.
7. lead frame as claimed in claim 1 is characterized in that, wherein the inside end of the inside end of this first group of each lead foot and this second group of each lead foot between this kind distance, compare with a distance setting value, its difference is less than a range error feasible value.
8. lead frame as claimed in claim 1, it is characterized in that, wherein the adjacent spaces distance of the inside end of the adjacent spaces of the inside end of this first group of each lead foot distance and this second group of each lead foot is compared with a gap set point, and its difference is less than a gap error feasible value.
9. lead frame as claimed in claim 1 is characterized in that, wherein the zone that this quadrangle surrounded is a kind of zone corresponding to this integrated circuit build.
10. lead frame as claimed in claim 1 is characterized in that, wherein the zone that this quadrangle surrounded is a kind of zone of the solder side corresponding to this integrated circuit.
11. a lead frame is used to encapsulate at least one integrated circuit, it is characterized in that, this lead frame comprises:
One first group of lead foot, it comprises a plurality of lead foots;
One second group of lead foot, it also comprises a plurality of lead foots; And
The zone that one hexahedron is surrounded: it is inwardly terminal that this lead foot comprises at least one outside end and, the zone that the inside end of these lead foots all is positioned at this hexahedron and is surrounded, the inside end of this first group of each lead foot and the inside end of this second group of each lead foot, across a kind of distance and relatively, this hexahedral first becomes vertical with second, this hexahedral first parallel with the 3rd, this the first group inside end with this second group of each lead foot, intersperse among one by one respectively between this first and the 3rd, these are inwardly terminal apart from this first person far away more, just near more apart from this second, respectively the adjacent spaces of the inside end of this lead foot is bigger to make same group thus.
12. lead frame as claimed in claim 11 is characterized in that, wherein the outside end of this first group of lead foot and this second group of lead foot stretches out towards a first direction and a second direction respectively, and this second direction and this first direction are different.
13. lead frame as claimed in claim 11 is characterized in that, wherein the outside end of this first group of lead foot and this second group of lead foot stretches out towards a first direction and a second direction respectively, and this second party supports or opposes towards this first direction.
14. lead frame as claimed in claim 11 is characterized in that, wherein the position of the inside end of this first group of each lead foot coexists on one first given plane, and the position of the inside end of this second group of each lead foot coexists on one second given plane.
15. lead frame as claimed in claim 11, it is characterized in that, wherein the position of the inside end of this first group of each lead foot coexists on one first given plane, and the position of the inside end of this second group of each lead foot coexists on one second given plane, parallel this first given plane of this second given plane.
16. lead frame as claimed in claim 11 is characterized in that, wherein the inside end of the inside end of this first group of each lead foot and this second group of each lead foot between this kind distance, respectively should become inwardly terminal position with work.
17. lead frame as claimed in claim 11 is characterized in that, wherein the inside end of the inside end of this first group of each lead foot and this second group of each lead foot between this kind distance, compare with a distance setting value, its difference is less than a range error feasible value.
18. lead frame as claimed in claim 11 is characterized in that, wherein the adjacent spaces distance of the inside end of this first group of each lead foot is compared with a gap set point, and its difference is less than a gap error feasible value.
19. lead frame as claimed in claim 11 is characterized in that, wherein the zone that this hexahedron surrounded is a kind of zone of the solder side corresponding to this integrated circuit.
20. lead frame as claimed in claim 11 is characterized in that, wherein the zone that this hexahedron surrounded is the zone of a kind of its lower surface corresponding to a solder side of this integrated circuit.
21. a lead frame is used for the integrated circuit encapsulation, it is characterized in that this lead frame comprises:
It is inwardly terminal that a plurality of lead foots, this lead foot comprise at least one outside end and; And
The zone that one quadrangle is surrounded, this tetragonal first limit becomes vertical with second limit, and this tetragonal first limit is parallel with the 3rd limit;
The zone that the inside end of these lead foots all is positioned at this quadrangle and is surrounded, and intersperse among one by one between this first limit and the 3rd limit, these are inwardly terminal apart from this first limit person far away more, and just near more apart from this second limit, making respectively thus, the adjacent spaces of the inside end of this lead foot is able to bigger.
22. lead frame as claimed in claim 21 is characterized in that, wherein vertical this tetragonal second limit of the outside end of these lead foots direction of stretching out.
23. lead frame as claimed in claim 21, it is characterized in that, vertical this tetragonal second limit of the outside end of these lead foots direction of stretching out wherein, but the inside end of these lead foots is divided into two groups to be listed between this first limit and the 3rd limit, and these two groups inwardly terminal pairing outside ends stretch out with opposite direction respectively.
24. a lead frame is used for the integrated circuit encapsulation, it is characterized in that this lead frame comprises:
It is inwardly terminal that a plurality of lead foots, this lead foot comprise at least one outside end and; And
The zone that one quadrangle is surrounded, this tetragonal first limit is parallel with the 3rd limit, this tetragonal second limit is parallel with the 4th limit, this tetragonal first limit presss from both sides into an obtuse angle with second limit, the inside end of these lead foots is divided into two groups, and each is evenly distributed in this second limit and the 4th limit, and making respectively thus, the adjacent spaces of the inside end of this lead foot is able to bigger.
25. lead frame as claimed in claim 24 is characterized in that, wherein these two groups inwardly terminal pairing outside ends stretch out with different direction respectively.
26. lead frame as claimed in claim 24 is characterized in that, wherein these two groups inwardly terminal pairing outside ends stretch out with opposite direction respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021405832A CN1467835A (en) | 2002-07-10 | 2002-07-10 | Lead frame adapting to integrate circuit miniaturization trend |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021405832A CN1467835A (en) | 2002-07-10 | 2002-07-10 | Lead frame adapting to integrate circuit miniaturization trend |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1467835A true CN1467835A (en) | 2004-01-14 |
Family
ID=34147620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA021405832A Pending CN1467835A (en) | 2002-07-10 | 2002-07-10 | Lead frame adapting to integrate circuit miniaturization trend |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1467835A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102751258A (en) * | 2011-04-21 | 2012-10-24 | 海力士半导体有限公司 | Semiconductor integrated circuit |
-
2002
- 2002-07-10 CN CNA021405832A patent/CN1467835A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102751258A (en) * | 2011-04-21 | 2012-10-24 | 海力士半导体有限公司 | Semiconductor integrated circuit |
| CN102751258B (en) * | 2011-04-21 | 2017-05-03 | 海力士半导体有限公司 | Semiconductor integrated circuit |
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