CN1459517A - Film plating device and film plating method - Google Patents
Film plating device and film plating method Download PDFInfo
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- CN1459517A CN1459517A CN02120248A CN02120248A CN1459517A CN 1459517 A CN1459517 A CN 1459517A CN 02120248 A CN02120248 A CN 02120248A CN 02120248 A CN02120248 A CN 02120248A CN 1459517 A CN1459517 A CN 1459517A
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Abstract
An apparatus for coating film is composed of turntable rotating regularly, masking plate designed according to the particular thickness of coated film, and coating material opposite to said turntable. A method for coating film includes such steps as arranging substrate on regularly rotating turntable, arranging the masking plate near the substrate, and using coating material to coat one or more films on the substrate.
Description
Technical field
The invention relates to a kind of film coating apparatus and film coating method, particularly a kind of film coating apparatus and film coating method that forms the coatings of two or more specific thicknesses.
Background technology
As everyone knows, film-plating process is extremely wide in the application of industry member, and general normal use is in metal-processing industry, semi-conductor industry and opto-electronics etc.In recent years, again because developing rapidly of semi-conductor industry and opto-electronics makes coating technique that great progress also be arranged.
In coating technique, on same substrate, plate the coatings of two or more different thickness, or even the gradual change rete of specific gradual change slope, it is to have the certain difficulty degree.In the conventional art, a kind of film coating apparatus 4 is to comprise a pedestal 41, on this pedestal 41, place the target 42 of desire plating, above target 42, place a substrate 43, utilize the vacuum evaporation or the mode of sputter to carry out plated film, as shown in Figure 1, the placement location of substrate 43 is not parallel with pedestal 41, but tilt to be an angle, that is substrate 43 is inclined in the top of pedestal 41.Because the thickness of coatings 44 and pedestal 41 to the 1.5-1.9 power of distance between the substrate 43 is inversely proportional to, (different and different according to board) are so near more substrate 43 parts of pedestal 41, its rete is thick more; Otherwise from pedestal 41 substrate 43 parts far away, its rete is thin more.Its major defect is:
With regard to above-mentioned film coating apparatus and method, distance between substrate and the sputter source is to be certain relation with the thickness of coatings in theory, but in fact the dealer can't accurately control the thickness of coatings each several part on substrate, only can utilize the method for inclination substrate, control coatings certain thickness of 2 on substrate is more undesirable.In other words, can't control the thickness of coatings in these 2 centres or exterior portion arbitrarily, such result has limited the application of this film coating apparatus and method, and can't satisfy the accurate day by day demand of specification.For example, this plated film is applied in the gradual change type optical light filter of projector, this optics spectro-film can't become three primary colors with the light clean cut separation, and then makes the color distortion of projector, and light utilization efficiency also reduces.
Summary of the invention
The purpose of this invention is to provide a kind of film coating apparatus and film coating method, overcome the drawback of prior art, be able to accurately control coating film thickness, make it on a substrate, form the purpose of the coatings of two or more specific thicknesses.
The object of the present invention is achieved like this: a kind of film coating apparatus is characterized in that: it comprises the rotating disk of energy rule rotation; The shield that designs according to the specific thicknesses of coatings is arranged at the position near substrate; Reach relative with this rotating disk and plating source that establish, this shield is arranged between this plating source and this rotating disk.
This rotating disk is to rotate with a fixed angles speed.The shape of this shield is made of most bar concentric arc lines, and the radian of this concentric arc line is the specific thicknesses of this coatings of control.This plating source is a vapor deposition source.This plating source is the sputter source.This plating source is a target.
The present invention also provides a kind of film coating method, and it is the coatings that forms two or more specific thicknesses on a substrate, and it comprises the steps:
Substrate is arranged on the rotating disk of energy rule rotation; To be arranged at position according to the shield that specific thicknesses was set as of this coatings near this substrate; And this coatings is plated on this substrate by plating source.
Compare with conventional art, film coating apparatus provided by the present invention and film coating method, can accurate control coatings on the thickness of every bit; Owing to present method is the shield that utilizes a process accurate calculation to be set as, can control the thickness of coatings every bit, can change the shape of shield according to the thickness of required coatings, moreover the change that sees through thicknesses of layers also can change its spectrographic characteristic.
Describe in detail below in conjunction with preferred embodiment and accompanying drawing.
Description of drawings
Fig. 1 is the synoptic diagram of traditional film coating apparatus.
Fig. 2 is the synoptic diagram of film coating apparatus of the present invention
Fig. 3-Figure 10 is the synoptic diagram of the coatings relation of shield shape of the present invention and formation.
Figure 11 is the step synoptic diagram of film coating method of the present invention.
Embodiment
Consult shown in Figure 2, film coating apparatus 1 of the present invention, it is the coatings 3 that is used on the substrate 2 to form two or more specific thicknesses, film coating apparatus 1 comprises a rotating disk 11, a shield 12 and a plating source 13.Wherein, rotating disk 11 is rule to rotate; Shield 12 is to be set as according to the specific thicknesses of coatings 3, is arranged at the position near substrate 2; Plating source 13 is relative with rotating disk 11 and establish, and this shield 12 is arranged between the two.
In the present embodiment, rotating disk 11 is with fixed angles speed rotation, in other words, is that angle is used as distance, and the cycle is used as the time, that is is identical around all institutes time spent whenever.
The shape of shield 12 is to design according to the specific thicknesses of coatings 3, particularly, the shape of shield 12 is made of most bar concentric arc lines, the radian of this concentric arc line is the specific thicknesses of control coatings 3, research by experiment, shield 12 can be represented with following equation with the specific thicknesses of coatings 3:
Tn＝(1-θn/360)×T n≥2
Wherein, Tn represents at formed coatings 3 thickness of the n bar camber line of shield 12, and when T representative did not have shield 12, rotating disk 11 formed coatings 3 thickness that rotate a circle, θ n were represented the angle at the pairing angle of camber line that n bar concentric(al) circles hidden by shield 12.
Consult Fig. 3-shown in Figure 4, substrate 2 is to be arranged on the rotating disk 11, and shield 12 is arranged at the position near substrate 2, the shape of shield 12 as shown in Figure 3, in illustrated shield 12, the pairing angle of the camber line that A is ordered is 0, and calculate gained as can be known according to equation: coatings 3 thickness at A point place are T; The pairing angle of camber line of ordering at B is 90 degree, and coatings 3 thickness that calculate B point place according to equation are 3/4T; And be 0 in the pairing angle of camber line that C is ordered, so coatings 3 thickness at C point place are T.Wherein, the thickness of T is decided by the number of plating source 13 material that plates.
As shown in Figure 4, the coatings 3 of utilizing this shield 12 to be plated out is the thicker and middle thin gradual change type rete in both sides.
Consult Fig. 5-shown in Figure 6, in illustrated shield 12, the pairing angle of the camber line that A is ordered is 90, calculates gained according to equation, and coatings 3 thickness at A point place are 3/4T as can be known; The pairing angle of camber line of ordering at B is 0, calculates gained as can be known according to equation, and coatings 3 thickness at B point place are T; And be 90 in the pairing angle of camber line that C is ordered, so coatings 3 thickness at C point place are 3/4T.As shown in Figure 6, the coatings 3 of utilizing this shield 12 to be plated out is the thin middle thicker gradual change type rete in both sides.
Consult Fig. 7-shown in Figure 8, in illustrated shield 12, the pairing angle of the camber line that A is ordered is 0, calculates gained as can be known according to equation, and coatings 3 thickness at A point place are T; The pairing angle of camber line of ordering at B is 45, calculates gained as can be known according to equation, and coatings 3 thickness at B point place are 7/8T; And be 90 in the pairing angle of camber line that C is ordered, so coatings 3 thickness at C point place are 3/4T.As shown in Figure 8, the coatings 3 of utilizing this shield 12 and being plated out for by the A point to C point thickness gradual change type rete decrescence.
Consult Fig. 9-shown in Figure 10, the present invention also can plate out the rete of terraced variant, and in illustrated shield 12, the pairing angle of the camber line of A section is 0, and coatings 3 thickness that calculate the A section according to equation are T; In the pairing angle of the camber line of B section is 45, and coatings 3 thickness that calculate the B section according to equation are 7/8T; And be 90 in the pairing angle of the camber line of C section, coatings 3 thickness of C section are 3/4T.As shown in figure 10, the coatings 3 of utilizing this shield 12 to be plated out is the rete of terraced variant.
By the foregoing description as can be known, be required any form by the coatings that shape was plated to 3 of selecting shield 12, no matter be that gradual change type rete, abrupt change formula rete or terraced variant rete can use present method to implement out.Wherein the method for design of this shield 12 is in the separate case application, so do not describe in detail.
In addition, the plating source 13 of present embodiment can be changed according to different demands.If when utilizing the vacuum evaporation mode, its plating source 13 can be the vapor deposition source (Source) that places high-temperature crucibles (Crucible), also can be the vapor deposition source of utilizing electron beam (Electron Beam) heating simultaneously; When utilizing sputtering way, its plating source 13 can be one and is positioned at the cathode targets that direct current is starched (DC Plasma).Certainly, plating source 13 also can be the ejaculation device that is filled with the plating material.
Consult shown in Figure 11, film coating method of the present invention, it is the coatings 3 that is used on the substrate 2 to form two or more specific thicknesses, wherein comprises the following step:
In the present embodiment, all elements and feature thereof are all identical with embodiment 1, and it is to utilize the film coating apparatus of embodiment 1 to plate the method for the coatings of different thickness on substrate.
In sum, film coating apparatus provided by the present invention and film coating method are to utilize a shield to control the thickness of coatings every bit, and this shield is to utilize an equation accurate calculation gained.That is, the shield shape that can come designing institute to use according to required coatings thickness.Compare with conventional art, the present invention can accurate control and the definition coatings on the thickness of every bit, in other words, the present invention can define two or more different thickness, make gradual change type, abrupt change formula or the controllable rete of terraced variant equal thickness according to this, have worth in fact in industrial application.
Above-mentioned only is preferred embodiment, but not is restriction the present invention, any spirit of the present invention and category of not breaking away from, and to its equivalent modifications of carrying out or change, all should be contained among protection scope of the present invention.
Claims (13)
1, a kind of film coating apparatus is characterized in that: it comprises and can rule drive the rotating disk that substrate rotates; The shield that is set as according to the specific thicknesses of coatings is arranged at the position near this substrate; Reach relative with this rotating disk and plating source that establish, this shield is arranged between this plating source and this rotating disk.
2, film coating apparatus according to claim 1 is characterized in that: this rotating disk is to rotate with a fixed angles speed.
3, film coating apparatus according to claim 1 is characterized in that: the shape of this shield is made of most bar concentric arc lines, and the radian of this concentric arc line is the specific thicknesses of this coatings of control.
4, film coating apparatus according to claim 1 is characterized in that: this plating source is a vapor deposition source.
5, film coating apparatus according to claim 1 is characterized in that: this plating source is the sputter source.
6, film coating apparatus according to claim 1 is characterized in that: this plating source is a target.
7, a kind of film coating method, it is the coatings that forms two or more specific thicknesses on a substrate, it comprises the steps:
Substrate is arranged on the rotating disk of energy rule rotation; To be arranged at position according to the shield that specific thicknesses was set as of this coatings near this substrate; And this coatings is plated on this substrate by plating source.
8, film coating method according to claim 7 is characterized in that: this rotating disk is to rotate with a fixed angles speed.
9, film coating method according to claim 7 is characterized in that: the shape of this shield is made of most bar concentric arc lines, and the radian of this concentric arc line is the specific thicknesses of this coatings of control.
10, film coating method according to claim 7 is characterized in that: this plating source is a vapor deposition source.
11, film coating method according to claim 7 is characterized in that: this plating source is the sputter source.
12, film coating method according to claim 7 is characterized in that: this plating source is a target.
13, film coating method according to claim 7 is characterized in that: this shield is to be arranged between this plating source and this rotating disk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021202486A CN1261616C (en) | 2002-05-17 | 2002-05-17 | Film plating device and film plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021202486A CN1261616C (en) | 2002-05-17 | 2002-05-17 | Film plating device and film plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1459517A true CN1459517A (en) | 2003-12-03 |
| CN1261616C CN1261616C (en) | 2006-06-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021202486A Expired - Fee Related CN1261616C (en) | 2002-05-17 | 2002-05-17 | Film plating device and film plating method |
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| CN (1) | CN1261616C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100543172C (en) * | 2005-04-15 | 2009-09-23 | 鸿富锦精密工业（深圳）有限公司 | Optical coating device |
| CN102436126A (en) * | 2011-12-20 | 2012-05-02 | 杭州科汀光学技术有限公司 | Baffle for correcting gradient film thickness of projection display color analyzer |
| TWI396761B (en) * | 2008-07-04 | 2013-05-21 | Hon Hai Prec Ind Co Ltd | Optical coating device |
| CN104155710A (en) * | 2014-09-05 | 2014-11-19 | 山东理工大学 | Method for manufacturing large-area and high-accuracy thin film type grating device through whole butterfly wing |
| WO2019037235A1 (en) * | 2017-08-22 | 2019-02-28 | 武汉华星光电半导体显示技术有限公司 | Evaporation source apparatus |
| WO2020113849A1 (en) * | 2018-12-05 | 2020-06-11 | 武汉华星光电半导体显示技术有限公司 | Evaporation cavity structure and baffle plate structure |
-
2002
- 2002-05-17 CN CNB021202486A patent/CN1261616C/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100543172C (en) * | 2005-04-15 | 2009-09-23 | 鸿富锦精密工业（深圳）有限公司 | Optical coating device |
| TWI396761B (en) * | 2008-07-04 | 2013-05-21 | Hon Hai Prec Ind Co Ltd | Optical coating device |
| CN102436126A (en) * | 2011-12-20 | 2012-05-02 | 杭州科汀光学技术有限公司 | Baffle for correcting gradient film thickness of projection display color analyzer |
| CN102436126B (en) * | 2011-12-20 | 2013-07-31 | 杭州科汀光学技术有限公司 | Baffle for correcting gradient film thickness of projection display color analyzer |
| CN104155710A (en) * | 2014-09-05 | 2014-11-19 | 山东理工大学 | Method for manufacturing large-area and high-accuracy thin film type grating device through whole butterfly wing |
| WO2019037235A1 (en) * | 2017-08-22 | 2019-02-28 | 武汉华星光电半导体显示技术有限公司 | Evaporation source apparatus |
| WO2020113849A1 (en) * | 2018-12-05 | 2020-06-11 | 武汉华星光电半导体显示技术有限公司 | Evaporation cavity structure and baffle plate structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1261616C (en) | 2006-06-28 |
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Granted publication date: 20060628 |