CN1453822A - 使用包含粘合增进剂的混合物来涂覆半导体衬底的方法 - Google Patents

使用包含粘合增进剂的混合物来涂覆半导体衬底的方法 Download PDF

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Publication number
CN1453822A
CN1453822A CN03120153A CN03120153A CN1453822A CN 1453822 A CN1453822 A CN 1453822A CN 03120153 A CN03120153 A CN 03120153A CN 03120153 A CN03120153 A CN 03120153A CN 1453822 A CN1453822 A CN 1453822A
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CN
China
Prior art keywords
semiconductor substrate
coating
mixture
coating material
adhesion promoter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN03120153A
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English (en)
Chinese (zh)
Inventor
A·H·简斯
P·梅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of CN1453822A publication Critical patent/CN1453822A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Formation Of Insulating Films (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Materials For Photolithography (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN03120153A 2002-04-26 2003-03-10 使用包含粘合增进剂的混合物来涂覆半导体衬底的方法 Pending CN1453822A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/133724 2002-04-26
US10/133,724 US6762113B2 (en) 2002-04-26 2002-04-26 Method for coating a semiconductor substrate with a mixture containing an adhesion promoter

Publications (1)

Publication Number Publication Date
CN1453822A true CN1453822A (zh) 2003-11-05

Family

ID=28791024

Family Applications (1)

Application Number Title Priority Date Filing Date
CN03120153A Pending CN1453822A (zh) 2002-04-26 2003-03-10 使用包含粘合增进剂的混合物来涂覆半导体衬底的方法

Country Status (6)

Country Link
US (2) US6762113B2 (enExample)
EP (1) EP1357585A3 (enExample)
JP (1) JP2004006815A (enExample)
KR (1) KR20030084743A (enExample)
CN (1) CN1453822A (enExample)
TW (1) TW200305621A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101229536B (zh) * 2007-01-26 2011-02-16 中外炉工业株式会社 将涂层涂敷到衬底的方法
CN106406601A (zh) * 2015-07-28 2017-02-15 肖特股份有限公司 具有至少一个用户界面的操作面板、家用电器及其制造方法
CN108649192A (zh) * 2018-04-08 2018-10-12 河南大学 一种基于接触角测试制备电极材料表面均匀修饰层的方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6762113B2 (en) * 2002-04-26 2004-07-13 Hewlett-Packard Development Company, L.P. Method for coating a semiconductor substrate with a mixture containing an adhesion promoter
KR20060115323A (ko) * 2003-10-14 2006-11-08 마쯔시다덴기산교 가부시키가이샤 트랜지스터 집적 회로 장치 및 그 제조 방법
US7635919B1 (en) 2005-05-26 2009-12-22 Rockwell Collins, Inc. Low modulus stress buffer coating in microelectronic devices
US20070298268A1 (en) * 2006-06-27 2007-12-27 Gelcore Llc Encapsulated optoelectronic device
EP2577351B1 (en) 2010-05-24 2017-06-14 Koninklijke Philips N.V. Ct detector including multi-layer fluorescent tape scintillator with switchable spectral sensitivity
US8753460B2 (en) * 2011-01-28 2014-06-17 International Business Machines Corporation Reduction of edge chipping during wafer handling
DE102011114865B4 (de) * 2011-07-29 2023-03-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
EP2836800B1 (en) * 2012-04-11 2020-06-24 University Of Virginia Patent Foundation Gaseous flow sensor and related method thereof
EP4350759A1 (en) 2022-10-06 2024-04-10 Nexperia B.V. A semiconductor device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4183839A (en) 1976-04-08 1980-01-15 John V. Long Polyimide resin-forming composition
DE3107633A1 (de) 1981-02-27 1982-09-16 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung duenner polyimidschichten"
US4604644A (en) * 1985-01-28 1986-08-05 International Business Machines Corporation Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making
DE3606266A1 (de) * 1986-02-27 1987-09-03 Basf Ag Lichtempfindliches aufzeichnungselement
US5024922A (en) * 1988-11-07 1991-06-18 Moss Mary G Positive working polyamic acid/imide and diazoquinone photoresist with high temperature pre-bake
US5133840A (en) 1990-05-15 1992-07-28 International Business Machines Corporation Surface midification of a polyimide
DE4119444A1 (de) * 1991-06-13 1992-12-17 Wolff Walsrode Ag Beschichtungssystem fuer wasserquellbare materialien
US5742075A (en) * 1994-10-07 1998-04-21 Iowa State University Research Foundation, Inc. Amorphous silicon on insulator VLSI circuit structures
US5635240A (en) * 1995-06-19 1997-06-03 Dow Corning Corporation Electronic coating materials using mixed polymers
US5965679A (en) 1996-09-10 1999-10-12 The Dow Chemical Company Polyphenylene oligomers and polymers
US6300162B1 (en) 2000-05-08 2001-10-09 Rockwell Collins Method of applying a protective layer to a microelectronic component
US6762113B2 (en) * 2002-04-26 2004-07-13 Hewlett-Packard Development Company, L.P. Method for coating a semiconductor substrate with a mixture containing an adhesion promoter

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101229536B (zh) * 2007-01-26 2011-02-16 中外炉工业株式会社 将涂层涂敷到衬底的方法
CN106406601A (zh) * 2015-07-28 2017-02-15 肖特股份有限公司 具有至少一个用户界面的操作面板、家用电器及其制造方法
CN106406601B (zh) * 2015-07-28 2020-12-29 肖特股份有限公司 具有至少一个用户界面的操作面板、家用电器及其制造方法
CN108649192A (zh) * 2018-04-08 2018-10-12 河南大学 一种基于接触角测试制备电极材料表面均匀修饰层的方法

Also Published As

Publication number Publication date
US6762113B2 (en) 2004-07-13
US7071548B2 (en) 2006-07-04
US20040097097A1 (en) 2004-05-20
JP2004006815A (ja) 2004-01-08
KR20030084743A (ko) 2003-11-01
EP1357585A2 (en) 2003-10-29
EP1357585A3 (en) 2005-04-20
TW200305621A (en) 2003-11-01
US20030203621A1 (en) 2003-10-30

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WD01 Invention patent application deemed withdrawn after publication