CN1446775A - Method for restraining contraction in sintering ceramics under low temperature and prevent coating - Google Patents
Method for restraining contraction in sintering ceramics under low temperature and prevent coating Download PDFInfo
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Abstract
A method for suppressing the low-temp sinter shrinkage of ceramic features that a suppressing layer is applied to the raw ceramic blank with heterogous material, said suppressing layer is perforated at the positions correspondent to said heterogous material, and the size of hole and the gap between holes, must meet a certain condition.
Description
Invention field
The present invention relates to suppress the method that the low-temp ceramics sintering shrinks, the use of the inhibition layer of punchinging by a specific tool, and effectively suppress the contraction of low-temp ceramics agglomerating X-Y direction, but there is not prior art in firing the required problem that removes step or influence the ceramic surface planeness in back, thereby reduce processing procedure, reduce cost, and can make high-quality, multiwalled ceramic.
Background of invention
For in response to electron correlation product now to light, thin, little needs, it is necessary that the interconnection system circuit board process has become.This interconnection system circuit card is can be mutually with electrical or mechanical type banded circuit, or with the formed subsystem of minimum circuit element, usually it can be positioned in the interconnection system circuit card in conjunction with multi-form combination of circuits next-door neighbour, reach electrically connect each other and reach the physical property separation, and/or extend the banded purpose in the circuit card since then.
In the interconnection system circuit card, complicated circuit need be placed in conductor respectively many different interlayers usually, and separates with insulation layer each other.And in insulation layer, connecting the path of conductor between these different layers, we are referred to as through hole (via).See through this multiwalled structure, can make circuit tightr, and reduce shared space.
In the method for making multilayer circuit, United States Patent (USP) the 4th, 654, the processing procedure of multilayer ceramic module is provided for No. 095: it is at the unsintered ceramic green embryo surface of slices, stamp printing ink with screen painting with dissimilar materials such as resistance, electric capacity or conductor furnishing, and with through hole connection levels circuit, down that the ceramic green embryo after the contraposition layer by layer is bonding in proper temperature and pressure, and mat adds organism such as binding agent and fluidizer in the heat abstraction ceramic green embryo and becomes a single structure body, so that all potteries and dissimilar materials densified sintering product.This method has many advantages, except that can once finish fire, and reduced the time and the labour of assembling electronic element, can limit more that electronic component moves and the generation of lowering short circuit greatly; So on the other hand, differing materials is not quite similar because of the contraction that sintering caused, and fires condition and be difficult to control, and wherein X-Y direction agglomerating uncertainty forms dislocation with making when assembling big and complicated circuit.
The technology that is developed at present is to absorb all contractions with the Z direction, reaches to suppress the purpose that the X-Y direction is shunk.The 5th, 130, No. 067 those disclosed herein of United States Patent (USP) of No. the 5th, 085,720, the United States Patent (USP) of these technology such as E.I.Du Pont Company and IBM Corporation, these patents and in herein, for your guidance.
United States Patent (USP) the 5th, 085, No. 720, be to apply one at the superiors of ceramic green embryo and the lowest layer to remove layer and form one " sandwich " structure, in degreasing and sintering process, use uniaxial tension if necessary in this " sandwich " body structure surface, the gas that is produced because of the organic substance cracking in the ceramic green embryo is then by the hole loss that removes layer up and down.When cause is fired, remove layer and do not shrink, suppress the effect that ceramic green embryo X-Y direction is shunk thereby produce.Because this removes layer is that the whole district covers the ceramic green embryo, must add to remove step together after sintering is intact, can print on the top layer of ceramic green embryo and fire conductor resistance, electric capacity, this will improve cost of manufacture.In addition, be contained in and remove penetration range, contact angle and viscosity thereof, porosity and the pore size of the interior mineral binder bond of layer the ceramic green embryo, all can remove in layer process in removal influences ceramic surface, and printing causes product bad thereon to make circuit be difficult for equably.In addition, be to be added on the ceramic green embryo the superiors and the lowest layer because this removes layer, in (for example making the high number of plies, greater than 6 layers) product the time, integrated stress inequality (that is, the stress in levels and middle layer has substantial difference), and the ceramic green embryo of the number of plies shrinks in the middle of can't suppressing.
United States Patent (USP) the 5th, 130, No. 067 case has disclosed three kinds and has suppressed the method that ceramic green embryo X-Y direction is shunk.First method is to apply inhibition in ceramic green embryo outer rim, and the passage that gas evaporation and oxygen enter when sintering is provided; Second method is to use a porous plate or apply air cushion power so that stretching force altogether to be provided in whole ceramic green embryo surface; The third method is then for providing one by not sintering or the formed frictional force of non-shrinking porousness contact plate, to suppress the contraction of ceramic green embryo in sintering procedure.This contact plate material is to be selected from can keep porousness when firing, do not merge into heat-staple material with the ceramic green embryonic knob, make thus and do not shrink when firing or extend, to keep structural integrity and rigidity, so contact plate still can be kept its two-dirnentional structure and suppress the contraction of ceramic green embryo when sintering, behind sintering, utilize methods such as the polishing do not injure ceramic surface, scraped finish to remove this contact plate again.The first method of this invention is a strength of utilizing anchor clamps to produce, and the contraction that produces when suppressing sintering, but because of loading pressure divides inhomogeneous, easily cause ceramic structure to shrink, and then influence wire shape and ceramic surface Flatness, and the reduction quality, second and third kind method then needs to add in addition the step that removes together after firing, and improves cost of manufacture and can influence the planeness of ceramic flat surface.
In order to address the above problem, the present invention is a kind of novel method that the low-temp ceramics sintering shrinks that suppresses of exploitation, in the hope of saving cost and improving product quality.
Summary of the invention
Therefore, the present invention relates to a kind of method that the low-temp ceramics sintering shrinks that suppresses, it comprises and piles up one and suppress layer in a ceramic green embryo top with dissimilar materials, to suppress the contraction of this ceramic green embryo, it is characterized in that this inhibition layer have with this ceramic green embryo on corresponding the punchinging in dissimilar materials position, make these dissimilar materialss pile up Shi Buhui and be suppressed layer covering in ceramic green embryo and inhibition layer, the minimum length of side that wherein suppresses layer is L, the circumradius of respectively punchinging is c, the spacing of adjacent circumscribed circle is a, and outermost is punchinged and the Edge Distance that suppresses layer is b, c＜0.5L, a＞0.1c, b＞0.1c.
The present invention relates to a kind of method that the low-temp ceramics sintering shrinks that suppresses in addition, it comprises and piles up one and suppress layer in a ceramic green embryo top with dissimilar materials, to suppress the contraction of this ceramic green embryo, wherein this inhibition layer have with this ceramic green embryo on printed corresponding the punchinging in dissimilar materials position, and contain adhesive glass in this ceramic green embryo and/or the inhibition layer, or use an adhesive glass layer in addition in ceramic green embryo and inhibition interlayer.
The present invention relates to a kind of method that the low-temp ceramics sintering shrinks that suppresses again, it comprises and piles up one and suppress layer in a ceramic green embryo top with dissimilar materials, to suppress the contraction of this ceramic green embryo, wherein this inhibition layer have with this ceramic green embryo on printed corresponding the punchinging in dissimilar materials position, and after piling up the ceramic green embryo and suppressing layer, when firing, other applies the pressure of a Z axle.
The present invention relates to a kind of inhibition layer again, it is to be used to be stacked in a ceramic green embryo with dissimilar materials, to suppress the contraction of this ceramic green embryo, wherein this inhibition layer have with this ceramic green embryo on corresponding the punchinging in dissimilar materials position, make these dissimilar materialss pile up Shi Buhui and be suppressed layer covering in ceramic green embryo and inhibition layer, wherein, the minimum length of side that suppresses layer is L, the circumradius of respectively punchinging is c, the spacing of adjacent circumscribed circle is a, and outermost is punchinged and the Edge Distance that suppresses layer is b, c＜0.5L, a＞0.1c, b＞0.1c.
Brief description of drawings
The present invention will further specify with following diagram, wherein
Fig. 1 represents to be applied to the synoptic diagram that the present invention suppresses a specific embodiment of layer, and wherein, L is for suppressing the minimum length of side of layer, and c is for suppressing the circumradius of punchinging of layer, and a is the spacing of adjacent circumscribed circle, and b is that outermost is punchinged and the distance that suppresses layer edge;
Fig. 2 represents that high temperature sintering suppresses the temperature one shrinking percentage figure of layer and low-temp ceramics material; And
Fig. 3 represents that low-temperature sintering suppresses the temperature one shrinking percentage figure of layer and low-temp ceramics material.
Detailed description of the invention
The present invention provides a kind of method that the X-Y direction is shunk when suppressing the low-temp ceramics sintering, and its advantageous applications is on the ceramic multilayer circuit that the conducting metal with elements such as conductor, resistance is assembled into. The present invention can reduce uncertainty on the ceramic structure to prevent the formed dislocation of structural deformation.
Ceramic green embryo of the present invention is to be a mixture, and it comprises solid ceramic grain and the sintered inorganic binder that is scattered in the careful and separation in the transpirable polymer-binder. In sintering procedure, polymer-binder is heated to a sufficient temp and after evaporating, the inorganic constituents in the ceramic green embryo just begins sintering. When sintering, the ceramic green embryo of the special Porous of tool begins to change its structure, comprises the change of increase, hole matter shape, size and the quantity of particle size, and agglomeration usually can reduce hole matter and make the particle consolidation.
The present invention comprises stacking one and suppresses layer in a ceramic green embryo top with dissimilar materials, to suppress the contraction of this ceramic green embryo, preferably in up and down two surfaces of this ceramic green embryo all stacking have suppress layer and become stacked body, it is characterized in that suppressing having on the layer with the ceramic green embryo on the dissimilar materials of institute's wire mark and/or corresponding the punchinging in position of putting conductor, resistance or electric capacity.
With reference to figure 1, directly punching as the inhibition layer of L forms in the minimum length of side in the mode of burrowing, being connected to radius in this is punchinged and can be is the interior any shape of circle of c, wherein, the adjacent two circumscribed circle spacings of punchinging are a, and it is b that outermost is punchinged with suppressing layer Edge Distance, c＜0.5L, a＞0.1c, b＞0.1c. In the present invention, the circumradius of respectively punchinging can be not identical, as long as the dissimilar materials that has on the punch position of inhibition layer and the ceramic green embryo is corresponding such as the position of conductor, resistance or electric capacity etc., get final product and can not cover these dissimilar materials in stacking process thereafter. Suppress layer thickness (L1) be sandwiched in the two ceramic green flake thickness degree (L that suppress interlayers2) relevant, if its ratio L2/L
1Be about below 3.1, then can make shrinkage rates reach about below 0.5%. When firing the product of high-layer, suppress the layer except applying up and down at the integral stacked body, can add in addition between the ceramic green germinal layer and suppress layer, the ceramic green embryo of the number of plies also can keep not shrinkage character in the middle of making. The thickness that imposes on the inhibition layer between the ceramic green germinal layer is the thickness (L that is not less than dissimilar materials printed on the ceramic green embryo, conductor, resistance or electric capacity etc.3), preferably, L1＝L
3, so that stacked body overall structure uniformity is better.
The inventive method is applicable to when firing, and exerts pressure or use adhesive glass when not exerting pressure.Arbitrary mode that the present invention can adopt industry to commonly use is exerted pressure, on the stacked body of ceramic green embryo and inhibition layer, to apply a vertical pressure, its power is that enough ambassadors suppress layer and the ceramic green embryonic breeding is touched, and all in fact contractions are betided on the Z axle perpendicular to the stacked body surface, so the structure of X-Y plane is not because of having fired substantial contraction.The present invention also can adopt the mode of not exerting pressure, and only then need use an adhesive glass this moment.Adhesive glass can the adhesive glass layer form be applied to the ceramic green embryo and suppress between the layer, also can directly make an addition to the ceramic green embryo and/or suppress in the layer.Should directly add use, can when making the ceramic green embryo and suppressing layer, directly be added in the material, note just that its consumption should not shrink to the inhibition layer is produced by height, maybe can't provide the degree of institute's desire bonding benefit.Say it for example, when in aluminum oxide (Al
2O
3) when suppressing to use borosilicate glass in the layer material, preferred borosilicate glass amount of application is 1 to 10 weight %.The formation of adhesive glass layer then can transfer version to be printed on ceramic green embryo or the inhibition layer via appropriate solvent and glass powder are deployed into printing ink again, or is added on the ceramic green embryo and suppresses interlayer directly to be coated with evaporation or spraying plating mode.Certainly, also can when exerting pressure, use adhesive glass (layer) simultaneously.The needs of the visual actual processing procedure of the present invention and select different adhesive glass for use.
The inventive method contains or does not contain the ceramic circuit through the fire-resistant matrix liner of pre-burned applicable to production.This liner can be through or without metallized, if through the metallization then can through or without pre-burned.If use liner, then be earlier the ceramic green germinal layer to be placed on the liner, apply thereon again and suppress layer, thereafter whole fired body is placed and suppress mould or exert pressure and then fire, if do not use liner, then can apply and suppress layer in ceramic green germinal layer two surfaces up and down.
Method of the present invention has multiple advantage: does not shrink in the X-Y direction because of suppress layer in sintering process (1), existence that can be by adhesive glass or bringing pressure to bear on to reach on the stacked body suppresses the agglomerating characteristic; (2) after firing, need not remove and suppress layer, can avoid fully in the known techniques being stranded and remove that porous is pulled or contact plate and influence ceramic green embryo surface planeness, the ceramic of firing by revealing method of the present invention, the surface is very smooth, its planeness can reach Ra＜0.2mm, back manufacturing electric capacity, the resistance that not only can improve, the size precision that covers brilliant unicircuit, and save the cost of the process that removes; (3) suppress punchinging on the layer and can be used as the through hole of ceramic green embryo gas loss in sintering procedure; (4), can avoid the ceramic green embryo and fire between mould because of being in contact with one another the pollution that causes because of this isolation that suppresses layer; (5) existence because of punchinging suppresses layer and can use in addition between two ceramic green germinal layers, make the finished product of the high number of plies ceramic layer of tool by this; (5) directly printed conductor and electronic component and are fired finished product on the ceramic green embryo.The solid ceramic grain
Be common to the solid ceramic grain in the ceramic green embryo of the present invention, be not limited to specific combinations of substances, just it is not had chemically reactive and a following physical property of tool for the other materials in the system and gets final product: (1) its sintering temperature is higher than mineral binder bond; And (2) its in the not sintering of firing in the step of the present invention.In the preferred embodiment of the present invention, this solid ceramic grain is generally metal oxide for agglomerating inorganic metal not in firing.In another preferred embodiment, the solid ceramic that dystectic inoganic solids can be among the present invention is slightly formed, and in another preferred embodiment, the glass with high softening-point can be used as the solid ceramic grain.In addition, also visual its dielectric of the material of solid ceramic grain and hot expansion property and select.Therefore, any base material mixture that meets thermal expansion character all can become solid ceramic grain of the present invention.Mineral binder bond
Mineral binder bond used in the present invention needs not have a chemically reactive with respect to other materials in the native system, and preferably has following physical properties: (1) sintering temperature is lower than solid ceramic grain; And (2) carry out the viscosity phase sintering at firing temperature of the present invention.Be applicable to that mineral binder bond of the present invention is generally glass, it can be crystallization or noncrystalline kenel in the condition of firing.Polymer-binder
Polymer-binder is that mineral binder bond and solid ceramic grain are scattered wherein, also can be if necessary in wherein adding as materials such as fluidizer, anti-suppository, wetting agents.Be suitable for using any among the present invention in the polymer-binder of making low-temp ceramics.The ceramic green embryo
The employed ceramic green embryo of the inventive method is for by the thick mineral binder bond of above-mentioned solid ceramic, obtained with the dielectric materials system of polymer-binder, comprises glass and ceramic system and glass one ceramic system.
The main component of pottery is to be aluminum oxide (Al in glass and the ceramic system
2O
3), for reducing the sintering temperature of aluminum oxide, the glass ingredient that adds with the high frequency characteristics of keeping system comprises K usually
2O, B
2O
3, SiO
2, CaO, BaO, SrO or V
2O
5
The main component of glass one ceramic system is Mg-AlSi and Ca-AlSi series material, and it is noncrystal with in the bare glass, produces the ceramic crystallization gained of part by the process of heating.Suppress layer
The material that suppresses layer is any material that prevents that the ceramic green embryo from shrinking in sintering process, and it comprises:
(1) high temperature sintering suppresses layer: referring to Fig. 2, it comprises the ceramic strip of high temperature sintering, as aluminum oxide (sintering temperature＞1400 ℃).General low-k low-temp ceramics material sintering temperature is given near 900 ℃, when these low temperature glass stupaliths begin sintering, because of this high temperature sintering suppresses its sintering temperature of layer no show still, so itself does not shrink.This is to utilize this high temperature sintering to suppress layer non-shrinking characteristic of X-Y direction when 900 ℃ of sintering, to suppress the contraction of low-k low-temp ceramics material X-Y direction.These high temperature sinterings suppress the material of layer and say it for example, as United States Patent (USP) the 5th, 085, remove floor in No. 720, and this removes layer is that nonmetal inorganic careful grain is scattered in the transpirable organic substrate.Just it is applied to need not consider penetrating and contact angle of inorganic some knot agent when of the present invention, removes step after more need not considering; Also can adopt United States Patent (USP) the 5th, 130, the contact plate material in No. 067 is as the Kong Zhisheng plate of aluminium, glass, uncrystallized glass/ceramic;
(2) low-temperature sintering suppresses layer: referring to Fig. 3, the high temperature sintering that is different from (1) suppresses layer, this low-temperature sintering inhibition layer is the interpolation by strong sintering aid, its sintering temperature is reduced, so before low-k low temperature glass stupalith began the sintering contraction, this low temperature shrinkage suppression layer had promptly been finished sintering.When the low temperature shrinkage suppression layer begins sintering, because this low-k low-temp ceramics material does not shrink in this temperature range, can play the part of the role who suppresses layer as the high temperature sintering in (1), the contraction of X-Y direction when suppressing the layer material sintering to suppress this low-temperature sintering; And when temperature was elevated to low-k low-temp ceramics material and begins to shrink, having finished the agglomerating low-temperature sintering this moment suppressed layer and no longer shrinks, and can suppress the contraction of low-k low-temp ceramics material, and can reach the non-shrinking purpose of X-Y direction.Say it for example, when using aluminum oxide to suppress layer as this low temperature shrinkage suppression layer, this strong sintering aid can be vanadium oxide or other materials, and in a preferred embodiment, the amount of application of vanadium oxide is 1 to 10 weight %.
The material that suppresses layer is preferably hole matter, and except that former punchinging of having can provide the volatilization through hole of ceramic green embryo when firing, gas also can pass through hole matter loss.Itself do not shrink when sintering owing to suppress layer, in the bonding of the adhesive glass that suppresses to form between layer and ceramic green embryo or via pressuring method, reach and suppress pottery during by sintering.Give birth to embryo in the non-shrinking effect of X-Y direction.Adhesive glass
In the inventive method, can add adhesive glass if necessary in ceramic green embryo and inhibition interlayer, with further combined with this two, preferably on the inhibition layer that tool is punchinged, use adhesive glass, to suppress layer again is applied on the ceramic green embryo, so, except that can saving the adhesive glass consumption, adhesive glass also can not touch positions such as dissimilar materials on the ceramic green embryo, conductor, resistance, electric capacity.Therefore, so for the purpose of the present invention, whether this adhesive glass can or suppress layer and react unimportant with the ceramic green embryo.In sintering process, adhesive glass has and partly melts and be diffused in this ceramic green embryo, suppresses layer and two kinds of materials bondings of ceramic green embryo together and make.Method
Generally speaking, can followingly use the method that inhibition low-temp ceramics sintering of the present invention shrinks:
(a) provide a ceramic green embryo and to suppress layer, it is that raw material is filled in the tumbling barrel, interpolation water is in bucket and keep solids content about 60 to about 70 weight %, making its median size by the barreling effect is about 0.9 to about 0.7 μ m, further add organic tackiness agent (as PVA), fluidizer (as PEG), utilize the scraper moulding to make ceramic green embryo or inhibition layer again;
(b1) punching on the minimum length of side is the inhibition layer of L, make the circumradius of punchinging be not more than c, wherein, the spacing of adjacent circumscribed circle is a, and it is b that outermost is punchinged with suppressing layer Edge Distance, c＜0.5L, a＞0.1c, b＞0.1c;
(b2) at this ceramic green embryo surface in the screen painting mode, stamp the dissimilar materials of furnishing printing ink and/or add conductor, resistance or electric capacity if necessary in the top layer; Being included in the printing of ceramic green germinal layer inserts conductor, is printed in designed circuit pattern on this ceramic green embryo and adds that resistance or electric capacity are in the ceramic green embryo surface, wherein, the punch position of this inhibition layer is corresponding with the position of printed dissimilar materials, conductor, resistance or electric capacity etc. on the ceramic green embryo, makes these conductors, circuit pattern, resistance or electric capacity can not be suppressed layer in the process of piling up subsequently and covers;
(c) on the ceramic green embryo surface position of printing any dissimilar materials, conductor, resistance or electric capacity etc. maybe this inhibition laminar surface apply an adhesive glass layer with screen painting, direct coating, spraying plating or evaporation mode;
(d) pile up this ceramic green embryo and become a stacked body with the inhibition layer, stack manner can be the interlace mode that suppresses layer-(single or multiple lift) ceramic green embryo-inhibition layer-(single or multiple lift) ceramic green embryo-inhibition layer, wherein, the ceramic green embryo accounts for all ceramic green embryos at most and suppresses about 40 to about 60% of layer, can strengthen and suppress the effect that sintering shrinks, and the one-piece construction homogeneity is increased, and make the agglomerating number of plies unrestricted.When making ceramic multilayer circuit, go up most or lowest layer ceramic green embryo also can pile up a surface not the ceramic green embryo of any dissimilar materials of tool, conductor, resistance or electric capacity etc. add and suppress layer as tectum;
(e) on stacked body, impose the pressure of a Z axle;
(f) under sufficient temp and time, fire, so that evaporation of the polymer-binder of ceramic green embryo and sintered ceramic are given birth to the mineral binder bond in the embryo, say it for example, can carry out heating in about 24 to about 38 hours to remove mineral binder bond in about 300 to about 350 ℃, carry out about 30 minutes to about 4 hours sintering in about 850 to about 920 ℃ again, optionally;
(g) cooling fired body; Optionally;
(h) at this ceramic green embryo outside surface in the screen painting mode, stamp resistance, the electric capacity of furnishing printing ink; And optionally
(i) directly cut according to printed circuit pattern;
Wherein step (c) with (e) be to select one or apply simultaneously.
But the pottery that the present invention makes plated with nickel/tin electrolytic coating.And the module after will finishing, layer is placed required unicircuit, MLCC, Resistor SMD thereon, and measures qualification rate simultaneously.
Now described in detail the present invention with the following example, just do not meaned the content that the present invention only is confined to these embodiment and is disclosed.
Embodiment 1
With ceramic green embryo material C a-AlSi or suppress the layer material aluminum oxide and the borosilicate glass raw material is filled in the tumbling barrel, add water in bucket and keep the about 65wt% of solids content, it is about 0.8 μ m that the barreling effect by the 2mmYTZ ball makes its median size.Ceramic green embryo and thickness that further interpolation organic tackiness agent (PVA), fluidizer (PEC) utilize the scraper moulding to make the about 80 μ m of thickness are L
1The inhibition layer.In the present embodiment, suppressing punchinging on the layer is directly to form in the mode of burrowing, and the position of punchinging is to be the part that prints electrode, and each is punchinged is the square of 1 centimetre of 1 cm x, distance between each is punchinged is 0.65 centimetre, and outermost is punchinged and the distance that suppresses layer edge is 1.2 centimetres.
Designed circuit pattern is printed on this ceramic green embryo becomes electrode layer.With the above-mentioned ceramic green embryo that has printed with suppress a layer contraposition hot pressing, stack manner is given birth to germinal layer-inhibition layer for suppressing layer-multilayer ceramic, wherein, the total thickness of middle ceramic green germinal layer is L
2
The inventive method is employed fires condition for carrying out heating in about 24 to about 38 hours to remove mineral binder bond in about 300 ℃, carries out about 30 minutes sintering in about 880 ℃ again, closes and goes the stove fire cooling, and the cooked flake behind the sintering can directly cut according to printed circuit pattern.
According to different L
1With L
2The result who measures the contraction of ceramic green embryo X-Y direction is as shown in table 1 below:
Table 1
Embodiment 2
| ????L 2/L 1 | X-Y direction shrinking percentage (%) |
| ????0.0 | ????0.1 |
| ????3.1 | ????0.5 |
| ????4.4 | ????0.8 |
| ????4.8 | ????1.0 |
| ????6.4 | ????1.6 |
| ????6.6 | ????1.4 |
| ????11.0 | ????3.8 |
Its making method is similar to embodiment 1, and making thickness is the ceramic green embryo of about 300 μ m and the inhibition layer that thickness is respectively about 145 μ m and about 10 μ m.
An above-mentioned ceramic green embryo and the contraposition of inhibition layer are piled up, and stack manner suppresses layer (10 a μ m) overlapping-ceramic green germinal layer-inhibition layer (145 μ m) for suppressing layer (145 μ m)-(m+1) layer ceramic green embryo and m layer.
The result who complies with different m value measurement ceramic green embryo X-Y direction contractions is shown in following table:
Table 2
Embodiment 3
| ????M | X-Y direction shrinking percentage (%) |
| ????0 | ????1.84 |
| ????1 | ????1.77 |
| ????2 | ????1.69 |
Its making method is similar to embodiment 1, and the ceramic green embryo and the thickness that make thickness and be about 800 μ m are the inhibition layer of about 250 μ m, wherein suppresses to contain in the layer borosilicate glass of n%.
The result who measures the contraction of ceramic green embryo X-Y direction according to different n values is as shown in table 3 below:
Table 3
| ????M | X-Y direction shrinking percentage (%) |
| ????0 | ????0.68 |
| ????2 | ????0.28 |
| ????4 | ????0.36 |
| ????6 | ????0.48 |
The foregoing description only is explanation principle of the present invention and effect thereof, and unrestricted the present invention.Therefore, practise the modification of the foregoing description being made in the personage of this technology and change still spirit without prejudice to this creation.Interest field of the present invention claims as described later is listed.
Claims (20)
1, a kind of method that suppresses the ceramic post sintering contraction, it comprises and piles up one and suppress layer in a ceramic green embryo top with dissimilar materials, to suppress the contraction of this ceramic green embryo, it is characterized in that suppressing layer and be having with this ceramic green embryo on corresponding the punchinging in dissimilar materials position, make these dissimilar materialss pile up Shi Buhui and be suppressed layer covering in ceramic green embryo and inhibition layer, wherein, the minimum length of side that suppresses layer is L, the circumradius of respectively punchinging is c, the spacing of adjacent circumscribed circle is a, and outermost is punchinged and the Edge Distance that suppresses layer is b, c＜0.5L, a＞0.1c, b＞0.1c.
2, method according to claim 1 is wherein used an adhesive glass layer in addition in ceramic green embryo and inhibition interlayer.
3, method according to claim 2, wherein this adhesive glass comprises borosilicate glass.
4, method according to claim 1 wherein is to contain adhesive glass in this ceramic green embryo and/or inhibition layer.
5, method according to claim 4, wherein this inhibition layer comprises the adhesive glass of 1 to 10 weight %.
6, method according to claim 4, wherein this inhibition layer comprises the adhesive glass of 1 to 6 weight %.
7, method according to claim 1, wherein this inhibition layer suppresses layer for the high temperature sintering that sintering temperature is higher than this ceramic green embryo.
8, method according to claim 7, wherein this high temperature sintering suppresses layer material and comprises Al
2O
3
9, method according to claim 1, wherein this inhibition layer suppresses layer for the low-temperature sintering that sintering temperature is lower than this ceramic green embryo.
10, method according to claim 9, wherein this low-temperature sintering suppresses the strong sintering aid that layer material comprises the reduced inhibition layer sintering temperature of 1 to 10 weight %.
11, method according to claim 10, wherein this strong sintering aid is a vanadium oxide.
12, method according to claim 1, it is to apply this inhibition layer in this ceramic green embryo below.
13, method according to claim 12 is wherein in the ceramic green embryo total thickness (L of two inhibition interlayers
2) and suppress layer thickness (L
1) ratio (L
2/ L
1) be less than 3.5.
14, method according to claim 12, wherein this ceramic green embryo of the superiors and undermost tool dissimilar materials and this inhibition interlayer comprise a ceramic green embryo of not having a dissimilar materials.
15, method according to claim 1, wherein after piling up the ceramic green embryo and suppressing layer, when firing, the side applies the pressure of a Z axle thereon in addition.
16, method according to claim 1, wherein the ceramic green embryo is to suppress layer-(single or multiple lift ceramic green embryo-inhibition layer-single or multiple lift ceramic green embryo) with suppressing layer
nOne interlace mode that suppresses layer piles up, and wherein n is an integer.
17, method according to claim 1, the wherein thickness (L of inhibition layer
1) be the thickness (L that is not less than printed dissimilar materials, conductor, circuit or electric capacity etc. of ceramic green embryo top
3).
18, method according to claim 17, wherein L
1=L
3
19, method according to claim 1, wherein the ceramic green embryo accounts for all ceramic green embryos and suppresses 40 to 60% of layer.
20, a kind of inhibition layer, it is to be used to be stacked in a ceramic green embryo with dissimilar materials, to suppress the contraction of this ceramic green embryo, it is characterized in that this inhibition layer be have with this ceramic green embryo on the dissimilar materials position corresponding punching make these dissimilar materialss in the ceramic green embryo with suppress layer and pile up Shi Buhui and be suppressed layer and cover, wherein, the minimum length of side that suppresses layer is L, the circumradius of respectively punchinging is c, the spacing of adjacent circumscribed circle is a, outermost is punchinged and the Edge Distance that suppresses layer is b, c＜0.5L, a＞0.1c, b＞0,1c.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02107820 CN1446775A (en) | 2002-03-21 | 2002-03-21 | Method for restraining contraction in sintering ceramics under low temperature and prevent coating |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102544746A (en) * | 2011-10-31 | 2012-07-04 | 深圳光启高等理工研究院 | Packaging method of metamaterials |
| CN104253884A (en) * | 2013-06-28 | 2014-12-31 | 深圳富泰宏精密工业有限公司 | Shell and method for manufacturing same |
| CN110128112A (en) * | 2019-06-04 | 2019-08-16 | 如皋市煜腾金属材料科技有限公司 | A kind of ceramic material sintering method |
-
2002
- 2002-03-21 CN CN 02107820 patent/CN1446775A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102544746A (en) * | 2011-10-31 | 2012-07-04 | 深圳光启高等理工研究院 | Packaging method of metamaterials |
| CN102544746B (en) * | 2011-10-31 | 2015-04-22 | 深圳光启高等理工研究院 | Packaging method of metamaterials |
| CN104253884A (en) * | 2013-06-28 | 2014-12-31 | 深圳富泰宏精密工业有限公司 | Shell and method for manufacturing same |
| CN110128112A (en) * | 2019-06-04 | 2019-08-16 | 如皋市煜腾金属材料科技有限公司 | A kind of ceramic material sintering method |
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