CN1433030A - Metal sheet type resistor making process and structure - Google Patents
Metal sheet type resistor making process and structure Download PDFInfo
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- CN1433030A CN1433030A CN 02101731 CN02101731A CN1433030A CN 1433030 A CN1433030 A CN 1433030A CN 02101731 CN02101731 CN 02101731 CN 02101731 A CN02101731 A CN 02101731A CN 1433030 A CN1433030 A CN 1433030A
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Abstract
The metal sheet type resistor includes electrodes formed at two ends of substrate through thick film electroplating, head dissipating layer formed through painting, and heat dissipating metal sheet adhered to the painted layer. The making process includes rolling metal plate, punching, electroplating, cutting carving slots, painting and fixing head dissipating sheet. The electroplating course to produce electrodes can increase the contact area between the electrode and the substrate, increase current capacity of the electrode and reduce contact resistance to 0.0001 ohm. The head dissipating sheet on the substrate results in ever high head dissipating effect, high resistor precision and high power.
Description
Technical field
The present invention relates to electronic component technology, specifically is manufacture method and structure thereof about a kind of metal sheet type resistor.
Background technology
Metal sheet type resistor (Metal Strip Resistors) mainly applies to surface adhesion type (SMD) resistance on the PC plate, often in high electric current, high-power environment, use, therefore generally can be referred to as current detection resistor device (Current Sensing Resistors) again, mostly be the matrix end greatly and in the mode of solid welding electrode be set and practise formula SMD resistance, its structure can be obtained to understand by following graphic and narration.
See also Figure 1A and be depicted as habit formula resistance three-dimensional exploded view, practise formula resistance 91 for formed (about more than 2000 ℃ usually) by the set block type electrode 912 mat high temperature electric welding of a matrix 911 and both sides, its combination back is just like shown in Figure 1B; The combination back is in matrix 911 surface coated, one application layers 913 (shown in Fig. 1 C).Only its problem is, when resistance 91 was implemented on the PC plate, block type electrode 912 was too small with the contact-making surface of bottom PC plate 90, the magnitude of current that passes through thereby be restricted, and fixed effect also is affected.
See also Fig. 2 A and be depicted as another and practise formula resistance three-dimensional exploded view, resistance 92 is for to be formed by the set plate electrode 922 mat high temperature electric welding of a matrix 921 and both sides, and after electric welding in matrix 921 surface coated one application layer 923, shown in Fig. 2 B.This is that scale copper electrode 922 is formed C type structure in the bending back downwards, shown in Fig. 2 C.By this resistance 92 when implementing with bigger contact area of PC plate 90 generations and preferable fixed effect.But its problem is that scale copper electrode 922 volumes at template resistance two ends are little, and bending process is rather difficult, and pad edge instability, and its magnitude of current and resistance still are subjected to restriction to a certain degree.In addition, also just like shown in Fig. 2 D, electrode 922 is with high temperature spot welding mode and matrix 921 weldings, and its shortcoming is except effective contact-making surface is difficult to accurately grasp, and the contact effect changes during cold shrinkage and thermal expansion can influence the resistance value accuracy.
See also the matrix that Figure 3 shows that habit formula resistance and the fixedly enlarged diagram of electrode, the mode of habit formula high-temperature soldering technology fixed electrode, during the course often with tin cream 93 (or silver paste) as media, tin cream 93 itself easily has bubble, therefore under microcosmic, can find all to have little gas bag or air chamber formation between matrix 911 (921) or electrode 912 (922) contacts, this is easy to generate oxidative phenomena; Moreover tin cream 93 (or silver paste) heatproof is low, resistance is high, can reduce the energising effect that the expection contact-making surface can reach.Secondly, the electric welding extreme temperatures easily causes matrix 911 (921) or electrode 912 (922) at electric welding process mesometamorphism, and especially near pad, the rotten resistance error that can make of matrix increases, and accuracy is affected.
Summary of the invention
In view of this, main purpose of the present invention is, overcomes the shortcoming of habit formula metal sheet type resistor, thereby reaches high electric current, low resistance, high-power result of use.
Metal sheet type resistor structure of the present invention, its characteristic is: form electrode at matrix (resistance alloys board) two ends with the thick film plating mode, distribution of electrodes more can be distributed in and arranged on left and right sides and side with increased area outside the upper and lower faces of matrix two ends, the floor length of electrode can be long than top board; Have the application layer of heat sinking function in addition in the matrix surface coating, more fixing cooling fins is adhesively fixed by the application layer between fin and matrix to promote radiating effect on the application laminar surface, and fin can be materials such as copper, aluminum metal.
Metal sheet type resistor manufacture method of the present invention is as follows:
Two ends at matrix directly form electrode with the thick film plating mode in two ends, use making electrode package be overlying on the both ends of matrix, be the tight closed state between electrode and matrix, make the contact-making surface of the two certain and make, so that the magnitude of current that passes through increases, produce lower resistance value.Its recipe step comprises:
Step 1 (plate rolls): the metallic matrix plate rolled be strip;
Step 2 (punching): the strip matrix is the limit trellis with die stamping, and produces location hole in matrix central authorities;
Step 3 (plating): the two sides and the both sides that will be the strip metal matrix form electrode with low temperature thick film plating mode;
Step 4 (cutting): the strip metal matrix after will electroplating cuts into bulk;
Step 5 (dissected valley): the metallic matrix dissected valley after will cutting is determined resistance;
Step 6 (application): be coated with an application layer at matrix surface, the electrode that only keeps the end exposes, and coating is mining height heat radiation, high temperature resistant, the coating that meets the UL standard;
Step 7 (fixing cooling fins): treating that coating is half-dried places metal fin on the coating when solid, and mat coating is done and promptly reached fixed effect after solid, so promptly finishes template resistance and makes.
After treating that above-mentioned steps is finished, errorless after testing, can encapsulate shipment, provide industry to use and supply perfect metal sheet type resistor.
The present invention produces electrode with the thick film plating mode at the matrix two ends, owing to be to form with cold galvanising, so matrix and electrode are not perishable, contact area is between the two strengthened; Again electrode be integral coating in the matrix end, than the habit formula only can with the area of single face electric welding and matrix bond increase 2-4 doubly more than.Be the tight closed state between electrode and matrix, can not produce little gas bag or air chamber, more non-oxidation effect makes both contact-making surfaces more certain, can make the magnitude of current that passes through higher by this, can make lower resistance value and reach 0.0001 Ω.
Moreover electrode and matrix contact area are big, can produce better heat radiating effect; Outside the coating tool radiating effect, the setting of going up fin more makes that the resistance heat radiation is faster again, and low because of the temperature rising during use, resistance precision is difficult for distortion, so effectively reduce error amount, improves and uses power.
Description of drawings
Figure 1A is the three-dimensional exploded view of habit formula resistance (one);
Figure 1B is the three-dimensional combination figure of habit formula resistance (one);
Fig. 1 C is the cutaway view of habit formula resistance (one);
Fig. 2 A is the three-dimensional exploded view of habit formula resistance (two);
Fig. 2 B is the manufacturing schematic diagram of habit formula resistance (two);
Fig. 2 C is the enforcement schematic diagram of habit formula resistance (two);
Fig. 2 D is the schematic perspective view of habit formula resistance (three);
Fig. 3 is the matrix and the interelectrode microcosmic schematic diagram of habit formula resistance;
Fig. 4 is the manufacturing flow chart of resistance of the present invention;
Fig. 5 A-Fig. 5 H is the manufacture process schematic diagram of resistance of the present invention;
Fig. 6 is Fig. 5 G's (6～6) cutaway view;
Other plants the electric resistance structure profile to Fig. 7 for the present invention;
Fig. 8 is the temperature comparison diagram of habit formula and resistance of the present invention;
Fig. 9 is the power comparison diagram after habit formula and resistance temperature of the present invention rise;
Figure 10 does not have the power comparison diagram that fin and the present invention have fin for the habit formula.
Embodiment
Following foundation embodiment shown in the drawings is described in further detail the present invention.
See also Fig. 4, Fig. 5 A-Fig. 5 H, wherein Figure 4 shows that the manufacturing flow chart of resistance of the present invention, Fig. 5 A-Fig. 5 H is the manufacture process schematic diagram of resistance of the present invention.The manufacture process that discloses metal sheet type resistor 10 among the figure is:
Step 1: plate rolls into type 61, is strip (as Fig. 5 A) for resistance alloys board 1 plate is rolled;
Step 2: punching 62 goes out equidistant limit lattice 11 with strip matrix 1 with die stamping, and produces location hole 12 (as Fig. 5 B) in central authorities;
Step 3: electroplate 63, strip metal matrix 1 two side ends is formed electrode 2 (as Fig. 5 C) with low temperature thick film plating mode;
Step 4: cut 64, the strip metal matrix 1 that forms electrode 2 is equidistantly cut into bulk (as Fig. 5 D) along limit lattice 11 and location hole 12;
Step 5: dissected valley 65, reguline metal matrix 1 is cut out dissected valley 13 more than at least one, determining its resistance, and dissected valley forms after handle 14 by sandblasting and remove that burr and corner angle (as Fig. 5 E) or other are removed burr and corner angle or milled processed;
Step 6: application 66 be coated with out the application layer with coating 3 on matrix 1 surface, but the electrode 2 at reservation two ends is the state of exposing, and coating 3 is mining height heat radiation, resistant to elevated temperatures coating (as Fig. 5 F);
Step 7: fixing cooling fins 67, when treating that coating 3 is half-dried solid state, fin 4 is placed on (as Fig. 5 G) on the coating 3, treat that coating is done and promptly reach fixed effect after solid, finish product and become a metal sheet type resistor 10.
After treating that above-mentioned steps is finished, errorless after testing the getting final product of the product of finishing encapsulates shipment (as Fig. 5 H) after 5 (for prior art) are sealed on the surface, uses so that industry to be provided.
Metal sheet type resistor 10 after abovementioned steps four is finished is the preliminary formation structure of resistance of the present invention, and become enforceable state, therefore as long as form the method for making of electrode 2 at block matrix 1 two ends with the thick film plating mode or forms electrode 2 with the thick film plating mode and cut into the method for making of bulk, all should contain and belong in the category of the present invention by strip matrix 1 two ends.
See also 6～6 cutaway views that Figure 6 shows that Fig. 5 G, disclose resistance 10 structures among the figure and be the two ends of a matrix 1 and electroplate out electrode 2 with thick film, and evenly be coated with application layer 3 on matrix 1 surface (containing the upper and lower both sides), more fixing by the fin 4 of insulation processing on application layer 3.Wherein, electrode 2 directly depends on matrix 1 surface, so matrix 1 becomes being connected of no gap, no gas bag with 2 at electrode.Moreover, by finding among Fig. 5 D that electrode 2 is coated on the upper and lower surface at matrix 1 two ends, two sides, the left and right sides and side, in the resistance of the formula of habit, electrode can only coat the side or the top and side at matrix two ends, can not coat the bottom and the left and right sides, therefore the present invention increases 2-4 doubly with the area that matrix 1 contacts with electrode 2 than the contact of habit formula single face, therefore practising the formula resistance value can only be 0.005 Ω-0.5 Ω, and the present invention can produce precision 0.0005 Ω-0.5 Ω resistance value, relatively can make power ascension.Coating 3 mining heights of the present invention again heat radiation, high temperature resistant, the coating that meets the UL standard so resistance 10 heat radiations are good, can be controlled the resistance error effectively and be lower than below 0.1%, and precision is promoted.Secondly, electrode 2 base plates 21 are plane, can obtain good contact effect when being fixed on the PC plate.
Other plants resistance section enforcement illustration to Figure 7 shows that the present invention, this figure is the elongated end than length and width with different being in the base plate 22 of two end electrodes 2 of Fig. 6, and base plate 22 length than top board 23 for long, so the area that contacts with the PC plate can be bigger, so can produce more good contact effect.
Figure 8 shows that the temperature comparison diagram of habit formula and resistance of the present invention, figure bend R1 is that expression habit formula resistance is 155 ℃ in 100 watt-hour temperature, oblique line R2 among the figure is 120 ℃ for resistance of the present invention in 100 watt-hour temperature, and the temperature that obvious the present invention produces under equal-wattage is low than the habit formula.
Figure 9 shows that habit formula and resistance of the present invention power comparison diagram after temperature rises, oblique line R3 among the figure is that the power of expression habit formula resistance when rising to 100 ℃ is about 0.4 watt, oblique line R4 among the figure is that the power of expression resistance of the present invention when rising to 100 ℃ is about 0.8 watt, and the power of obvious the present invention after temperature rises is excellent than the habit formula still.
Therefore by earlier figures 8, Fig. 9 as can be known, the matrix 1 two end electrodes 2 of the present invention method for making of electroplating with thick film is being all the superior than the method for making of habit formula welding electrode aspect heat radiation and the power two.
Figure 10 shows that the power comparison diagram when the habit formula does not have fin and the present invention and has fin again, the curve R5 among the figure is that performance number promptly descended gradually after habit formula resistor power value in the time of 70 ℃ was 100%, 70 ℃; When the curve R6 among the figure implemented as fin with aluminum metal for the present invention, performance number just descended gradually after the resistor power value in the time of 70 ℃ was 140%, 70 ℃; When the curve R7 among the figure was fin enforcement for the present invention with the copper metal again, performance number just descended gradually after the resistor power value in the time of 70 ℃ was 170%, 70 ℃.Hence one can see that, and resistance of the present invention is after having fixed aluminium matter or copper metal fin, and it is good that its resistor power value does not have fin more than the habit formula, and copper radiating rib is better than aluminium radiator fin again.
Electroplate the manufacture method that forms electrode at the matrix two ends by low temperature thick film of the present invention, electrode and matrix contact area are strengthened, the magnitude of current that passes through is increased, produce lower resistance value; Again, set up the design of heating panel on the matrix, can make better heat-radiation effect, be difficult for causing the resistance precision distortion, can promote and use power, because method for making and structure meet value on the industry, so propose patent application in accordance with the law.
Claims (16)
1. metal sheet type resistor method for making, it is characterized in that: this method for making is:
Two ends at matrix directly form electrode with the thick film plating mode in two ends, use making electrode package be overlying on the both ends of matrix, be the tight closed state between electrode and matrix, make the contact-making surface of the two certain and make, so that the magnitude of current that passes through increases, produce lower resistance value.
2. resistance method for making as claimed in claim 1, it is characterized in that: wherein recipe step comprises:
Plate rolls into type, the metallic matrix plate is rolled be strip;
Electroplate, strip metal matrix both sides low temperature thick film is electroplated, make both side ends form electrode;
Cut, the rectangular matrix behind the electroplated electrode is cut becomes block template resistance.
3. resistance method for making as claimed in claim 2 is characterized in that: wherein the strip matrix can stamp out equidistant limit lattice and centrally-located hole before electroplating.
4. as claim 2 or 3 described resistance method for makings, it is characterized in that: can cut out the dissected valley more than at least one after wherein electroplating at the matrix place.
5. resistance method for making as claimed in claim 4 is characterized in that: wherein can impose at matrix surface after the cutting and sandblast or milled processed.
6. resistance method for making as claimed in claim 5 is characterized in that: wherein at matrix surface coating one deck heat radiation application layer.
7. resistance method for making as claimed in claim 6 is characterized in that: fixing metal fin again on matrix surface application layer wherein.
8. as claim 2 or 3 described resistance method for makings, it is characterized in that: wherein at matrix surface coating one deck heat radiation application layer.
9. resistance method for making as claimed in claim 8 is characterized in that: fixing metal fin again on matrix surface application layer wherein.
10. as claim 2 or 3 described resistance method for makings, it is characterized in that: fixing metal fin again behind matrix surface application one deck application layer wherein.
11. a metal sheet type resistor structure, it is characterized in that: it comprises:
Matrix is resistance alloys board;
Be fixed in the electrode at matrix two ends; And
Be fixed on the fin on the matrix;
By the metal sheet type resistor of aforementioned combination, can make better heat-radiation effect, be difficult for causing the resistance precision distortion, can promote and use power.
12. electric resistance structure as claimed in claim 11 is characterized in that: wherein electrode package is overlying on upper and lower surface, the left and right sides and the side at matrix two ends.
13. as claim 11 or 12 described electric resistance structures, it is characterized in that: wherein the floor length of electrode is long than top board.
14. electric resistance structure as claimed in claim 11 is characterized in that: wherein fin is the copper metal that insulation processing is crossed.
15. electric resistance structure as claimed in claim 11 is characterized in that: wherein fin is the aluminum metal that insulation processing is crossed.
16. electric resistance structure as claimed in claim 11 is characterized in that: wherein be to be adhesively fixed between fin and matrix by the application layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02101731 CN1433030A (en) | 2002-01-14 | 2002-01-14 | Metal sheet type resistor making process and structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02101731 CN1433030A (en) | 2002-01-14 | 2002-01-14 | Metal sheet type resistor making process and structure |
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| Publication Number | Publication Date |
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| CN1433030A true CN1433030A (en) | 2003-07-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02101731 Pending CN1433030A (en) | 2002-01-14 | 2002-01-14 | Metal sheet type resistor making process and structure |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101026028B (en) * | 2006-02-24 | 2011-01-12 | Koa株式会社 | Electronic device equipped with resistance component and its making method |
| CN101523522B (en) * | 2005-11-09 | 2011-01-26 | 谢清雄 | An electroplating method in the manufacture of the surface mount precision metal resistor |
| CN101523523B (en) * | 2006-08-10 | 2011-10-05 | 釜屋电机株式会社 | Method for manufacturing rectangular plate type chip resistor and rectangular plate type chip resistor |
| CN103201801A (en) * | 2010-09-21 | 2013-07-10 | 釜屋电机株式会社 | Method for producing metal plate low-resistance chip resistor |
| CN108351257A (en) * | 2015-11-02 | 2018-07-31 | 埃普科斯股份有限公司 | Sensor element and method for manufacturing sensor element |
| CN110520942A (en) * | 2017-05-23 | 2019-11-29 | 松下知识产权经营株式会社 | Metal plate resistance device and its manufacturing method |
| CN110931195A (en) * | 2019-12-17 | 2020-03-27 | 苏州聚永昶电子科技有限公司 | Production and processing system for alloy resistor |
| CN111739703A (en) * | 2020-07-07 | 2020-10-02 | 江门市钧崴电子科技有限公司 | Metal block chip resistor, manufacturing method thereof and integrated circuit |
| RU219963U1 (en) * | 2023-03-14 | 2023-08-16 | Федеральное государственное автономное образовательное учреждение высшего образования "Омский государственный технический университет" | DESIGN OF RESISTIVE SENSOR FOR DIAGNOSTICS OF SUPPORT AND PIN INSULATORS OF OVERHEAD POWER LINE |
-
2002
- 2002-01-14 CN CN 02101731 patent/CN1433030A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101523522B (en) * | 2005-11-09 | 2011-01-26 | 谢清雄 | An electroplating method in the manufacture of the surface mount precision metal resistor |
| CN101026028B (en) * | 2006-02-24 | 2011-01-12 | Koa株式会社 | Electronic device equipped with resistance component and its making method |
| CN101523523B (en) * | 2006-08-10 | 2011-10-05 | 釜屋电机株式会社 | Method for manufacturing rectangular plate type chip resistor and rectangular plate type chip resistor |
| US8058968B2 (en) | 2006-08-10 | 2011-11-15 | Kamaya Electric Co., Ltd. | Method for manufacturing rectangular plate type chip resistor and rectangular plate type chip resistor |
| CN103201801A (en) * | 2010-09-21 | 2013-07-10 | 釜屋电机株式会社 | Method for producing metal plate low-resistance chip resistor |
| CN103201801B (en) * | 2010-09-21 | 2016-03-30 | 釜屋电机株式会社 | The manufacture method of metal plate low-resistance chip resistor |
| CN108351257A (en) * | 2015-11-02 | 2018-07-31 | 埃普科斯股份有限公司 | Sensor element and method for manufacturing sensor element |
| US10788377B2 (en) | 2015-11-02 | 2020-09-29 | Epcos Ag | Sensor element and method for producing a sensor element |
| US10908030B2 (en) | 2015-11-02 | 2021-02-02 | Epcos Ag | Sensor element and method for producing a sensor element |
| CN110520942A (en) * | 2017-05-23 | 2019-11-29 | 松下知识产权经营株式会社 | Metal plate resistance device and its manufacturing method |
| CN110520942B (en) * | 2017-05-23 | 2021-08-10 | 松下知识产权经营株式会社 | Metal plate resistor and manufacturing method thereof |
| CN110931195A (en) * | 2019-12-17 | 2020-03-27 | 苏州聚永昶电子科技有限公司 | Production and processing system for alloy resistor |
| CN111739703A (en) * | 2020-07-07 | 2020-10-02 | 江门市钧崴电子科技有限公司 | Metal block chip resistor, manufacturing method thereof and integrated circuit |
| RU219963U1 (en) * | 2023-03-14 | 2023-08-16 | Федеральное государственное автономное образовательное учреждение высшего образования "Омский государственный технический университет" | DESIGN OF RESISTIVE SENSOR FOR DIAGNOSTICS OF SUPPORT AND PIN INSULATORS OF OVERHEAD POWER LINE |
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