CN1429065A - Method for making multi-layer circuit board with internal inserted passive component - Google Patents
Method for making multi-layer circuit board with internal inserted passive component Download PDFInfo
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- CN1429065A CN1429065A CN 01138638 CN01138638A CN1429065A CN 1429065 A CN1429065 A CN 1429065A CN 01138638 CN01138638 CN 01138638 CN 01138638 A CN01138638 A CN 01138638A CN 1429065 A CN1429065 A CN 1429065A
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Abstract
The present invention relates to a method for fabricating multilayer circuit board with inner film passive sub-unit which is formed from resistor, capacitor or inductor. A passive sub-unit such as risistance film or capacity film should be formed first on one face of a conductive foil when a resistor or a capacitor is embedded and a soft magnetic film should be formed on one face of conductive foil when the inductor is formed, of which the capacity film will be covered with a conductive layer acting as an electrode. Furthermore, the conductive foil together with passive unit will be applied into the fabrication of multilayer circuit board and the electrode, screw type of coil and circuit pattern of the passive sub-unit will be formed on the conductive foil simultaneously as another soft magnetic film also can be formed at the most top of the screw type of coil in order to increase properties of the inductor.
Description
Technical field
The present invention relates to a kind of method of making multilayer circuit board, be meant the method for making the multilayer circuit board that is embedded with passive component especially.
Background technology
Along with the trend that electronic product improves performance and develops to miniaturization, the lamination of circuit board (lamination) technology also just must possess thin thickness, multilayer number and highdensity characteristics.For further dwindling the space requirement of circuit board, so develop the multilayer circuit board that to be embedded with passive component, passive component is meant resistor, capacitor and inductor and voltage-controlled crystal oscillator (voltagecontrolled oscillators) etc.
At the multiple membranaceous passive component of a multilayer circuit board integration and making multiple diverse ways is arranged.For instance, thick film (thick film) resistor can utilize wire mark mode (screen printing) coating to be solidified to form again, its material can be silver powder (silver powder) or carbon granule (carbonparticle) intersperses among in the resin, or ruthenium-oxide (RuO2) and glass powder to be dispersed in a binding agent (binder) medium.Then can utilize sputter (sputtering), plating (electroplating) or electroless plating modes such as (electroless plating) to form with film (thin film) resistor, its material can be nickel chromium triangle (Ni-Cr), nickel phosphorus (Ni-P), nickel tin (Ni-Sn), chromium aluminium (Cr-Al) and titanium nitride (TaN) alloy etc.Selecting to use thick-film resistor or use thin film resistor, then is to decide according to the cost of making multilayer circuit board and the required electrical accuracy of passive component of making.
The method of many making passive component thick films or thin-film material has been well-known, but key is how at embedded this type of thick film of circuit board or film passive component, with regard to the manufacture method of multilayer circuit board, its key is that the making of film passive component must can be incorporated among the manufacture method of multilayer circuit board.Yet the prior art in this field, United States Patent (USP) U.S.patent No.3 for example, 857,683,5,243,320 and 5,683,928 etc., mostly be in multilayer circuit board manufacturing process, before forming a new lamination, form thick film or film passive component at the organic insulation laminar surface with wire mark and/or photoresistance etching modes such as (photoresist-etching) earlier.Yet these methods but can't form the metallic circuit pattern (often being copper wire) and the electrode (often being copper electrode) of passive component, and because the cause of bottom insulation layer rough surface injustice make that also electrical accuracy is not enough in same photoresistance etching step.
Summary of the invention
Therefore, the method for the main technical problem to be solved in the present invention for providing a kind of making to be embedded with the multilayer circuit board of passive component especially is embedded with the excellent electrically passive component of precision in multilayer circuit board, and the manufacture method of the good reliability of tool.
Another technical problem that the present invention will solve is embedded with the method for the multilayer circuit board of passive component for a kind of making is provided, this passive component is membranaceous (film type) passive component, as resistor, capacitor and inductor etc., all can inlay easily and be embedded in the multilayer circuit board.
The method of another technical problem for providing a kind of making to be embedded with the multilayer circuit board of membranaceous passive component that the present invention will solve is embedded in membranaceous passive component in the multilayer circuit board, and still has high-reliability.
For solving above technical problem, the invention provides the method that a kind of making is embedded with the multilayer circuit board of passive component, this passive component is a membranaceous resistor, this method at first forms a resistive film on the surface of a conductive foil, utilize an organic insulator as adhesion coating, (unitcircuit sheet) is superimposed with a unit circuit thin plate, and the electrode of this resistor and circuit pattern is formed in same one deck of conductive foil, and inlaying in a multilayer circuit board and burying being made in of a membranaceous resistor is to finish.
For solving above technical problem, the invention provides the method that a kind of making is embedded with the multilayer circuit board of passive component, this passive component is a membranaceous capacitor, this method at first forms a capactive film that is covered with conductive layer on the surface of a conductive foil, utilize an organic insulator as adhesion coating, superimposed with a unit circuit thin plate, another electrode of this resistor and circuit pattern is formed in same one deck of conductive foil, and inlaying in a multilayer circuit board and burying being made in of a membranaceous capacitor is to finish.
For solving above technical problem, the invention provides the method that a kind of making is embedded with the multilayer circuit board of passive component, this passive component is an inductor, this method at first forms a soft magnetic film on the surface of a conductive foil layer, utilize an organic insulator as adhesion coating, superimposed with a unit circuit thin plate, a helical coil, a circuit pattern and another electrode are formed in the conductive foil layer, and inlaying in a multilayer circuit board and burying being made in of an inductor is to finish.Also can form another soft magnetic film and cover this helical coil, to promote the performance of this inductor.
In sum, the inventive method can provide tool the excellent electrically passive component of accuracy in multilayer circuit board, and circuit board has good reliability, also can simplify the manufacturing process that edge is embedded with the multilayer circuit board of passive component.
Description of drawings
Fig. 1 and Fig. 2 are for being embedded with the schematic diagram of the stacking type multilayer board manufacture method of film shape resistor assembly in the embodiment of the invention.
Fig. 3 is provided with a matsurface and a surface in the embodiment of the invention at a conductive foil, and the schematic diagram of a passive component film crystallizing field.
Fig. 4 and Fig. 5 are for being embedded with the schematic diagram of the stacking type multilayer board manufacture method of membranaceous capacitance component in another embodiment of the present invention.
Fig. 6 and Fig. 8 are for being embedded with the structural representation of the stacking type multilayer board manufacture method of membranaceous Inductive component in another embodiment of the present invention.
The graphic simple declaration that only is of the present invention is not to describe according to actual size, therefore can not represent the actual size of each level in the multilayer circuit plate structure.
Embodiment
The present invention proposes a kind of method that edge is embedded with the multilayer circuit board of passive component of making, and utilizes an organic insulator as adhesion coating, is beneficial to lamination (laminate) and is covered with a conductive foil.Some passive component units, for example resistive film, capactive film, soft magnetic film etc. are formed on the one side of this conductive foil, and this conductive foil that has passive component unit then is applied to the making of multilayer circuit board; After superimposed, the electrode of circuit pattern and this passive component is formed on this conductive foil at last simultaneously, and the advantage of this method is for simplifying the manufacturing process that edge is embedded with the multilayer circuit board of passive component.
Fig. 1 and Fig. 2 are the schematic diagram of the first embodiment of the present invention.One organic insulator 1 at first is provided, and by epoxy resin (epoxy resin), policapram (polyimide), two butadiene dilute acid acid imide/three nitrogen traps (bismaleimide triazine-based) resin, and homologue is made; The surface of this insulating barrier 1 is provided with the circuit layer 2 of patterning, and this circuit layer 2 is made up of electric conducting material, for example metal, conducting polymer (conductive polymer), metal cream material (metal paste) or carbon paste material (carbon paste) etc.; One conductive foil 3, this conductive foil 3 one side at least are comparatively smooth, are made of copper (Cu), silver (Ag), aluminium (Al), platinum (Pt), palladium (Pd) or silver-colored palladium (Ag-Pd) etc.; And a resistive film 4 (resistive film), be deposited on the more smooth one side of this conductive foil 3, and can carry out suitable heating and make its sclerosis; One protection coating 5 covers resistive film 4; the resistance value of this resistive film can be more than 0.1 (ohm/square); described protection coating 5 can be insulation organic material or ceramic material; by epoxy resin (epoxy resin); policapram (polyimide); two butadiene dilute acid acid imides/three nitrogen traps (bismaleimide triazine-based); hydrocyanic ester (cyanate ester); aluminium oxide (aluminum oxide); glass or its homologue are made; this protection coating 5 can sputter (sputtering); roller spin coating (roller coating) or printing technology such as (printing) form; when this protection coating 5 is made of resin; it is preferable handing over refining reaction structure (partially crosslinked) with part; when superimposed, can further react again with other organic insulator.When this conductive foil 3 engages with resistive film 4, know technology through physics or chemical roughen industries such as (roughen) earlier, to increase its adherence; One organic insulator 6, can be epoxy resin, two butadiene dilute acid acid imide/three nitrogen traps or fibre strengthening epoxy resin etc., place between conductive foil 3 and the unit circuit thin plate 7, this insulating barrier 6 can be preimpregnation material (prepreg) or is coated on the aqueous resin on circuit board 7 surfaces; This circuit board 7 can be and comprises single layer board or the multilayer circuit board that is covered with conductive layer 2 and insulating barrier 1.
By heat-press step, this conductive foil 3 is superimposed together with this circuit board 7, and in superimposed process, the accuracy of aligning must be controlled well.Make conductive foil 3 define circuit pattern 9 and electrode 10 via the photoresistance etching step, wherein conductive foil 3 is referred to as assembly carrier conductive foil (component-carrying conductive foil) 8 through etching and resistive film 4 makers-ups, as shown in Figure 2, it is to finish that resistor assembly 11 edges are embedded in being made on the multilayer circuit board, so present embodiment has been simplified the method at multilayer circuit board edge buried resistor assembly.
And the method that forms described resistive film 4 includes plating (electroplating), electroless plating (electroless plating), sputter (sputtering) or printing modes such as (printing).When this resistive film 4 was made up of institutes such as nickel chromium triangle (Ni-Cr), nickel phosphorus (Ni-P), nickel tin (Ni-Sn), chromium aluminium (Cr-Al) or titanium nitride (Ta-N) alloys, available electro-deposition (electrodeposited) or sputter-deposited modes such as (sputter-deposited) formed; And to carbon paste (carbon paste), silver paste (Ag paste) or ruthenium-oxide glass cream (RuO
2-glasspaste) wait material to deposit with printing methods such as (printing).Wherein said carbon paste, silver paste promptly are that carbon or silver are dispersed in the middle formation of resin (also can be photo-hardening).Yet, above-mentioned resistive film 4 before the described protection coating 5 of deposition, need earlier with heating (heating) mode (for carbon paste or silver paste) or roasting (firing) mode (for the ruthenium-oxide glass cream) under atmosphere or inert gas environment with its curing.
As shown in Figure 3, a conductive foil 12 has a matsurface 13 and a surface 14, and this surface 14 can be made as matsurface or tabular surface according to need.On this conductive foil 12, also can utilize photoresistance microetch (photoresist-microetching) or polishing methods such as (polish) to carry out etching and remove oxide, form a little rough region 15 as the resistive film crystallizing field.With this case, this little rough region 15 can make follow-up resistive film maintain the excellent electrical property accuracy, and the good adhesion of 12 of resistive film and this conductive foils is provided simultaneously.In addition because after resistive film 4 deposition superimposed before, this conductive foil 12 needn't carry out the alligatoring step again, therefore feasible protection coating 5 as shown in Figure 1 and Figure 2 becomes nonessential component part.
As shown in Figure 4, a conductive foil 16 than tabular surface on form a capactive film 17 (capacitive film), described capactive film can be relative dielectric constant in the material more than 5.0, and this conductive foil 16 is by copper (Cu), silver (Ag), aluminium (Al), platinum (Pt), palladium (Pd) or silver-colored palladium formations such as (Ag-Pd).If necessary, can make its sclerosis to described capactive film 17 suitable heating.Deposit a conducting film 18 again, and cover partition capacitance film 17, this conducting film 18 can be by formations such as copper (Cu), silver (Ag), aluminium (Al), gold (Au), platinum (Pt), palladium, electroconductive polymer or elargol.And with a protection coating 19 covering whole capacitor films 17 and conducting film 18; this protection coating 19 is for insulation organic material or ceramic material, and is made as epoxy resin, policapram, two butadiene dilute acid acid imide/three nitrogen traps, hydrocyanic ester, aluminium oxide, glass or its homologue.Be made of resin as this protection coating 19, it is good then handing over refining reaction structure (partiallycrosslinked) with part, when superimposed, can further react with organic insulator again.
As Fig. 4 and shown in Figure 5; conductive foil 16, capactive film 17,19 makers-ups of conducting film 18 and protection coating are referred to as assembly carrier conductive foil (component-carrying conductivefoil) 20; this assembly carrier conductive foil 20 with an organic insulator 221 as adhesion coating; (unit circuit sheet) is superimposed with a unit circuit thin plate 21, and this circuit board 21 can comprise an insulating barrier 22 and conductive layer 23 formed single or multiple lift circuit boards.This insulating barrier 22 is made up of epoxy resin, two butadiene dilute acid acid imide/three nitrogen traps, policapram, hydrocyanic ester, polyphenyl and cyclobutane (polybenzocyclobutene) or its homologue; This conductive layer 23 then is an electric conducting material, as metal, conducting polymer, metal cream material or carbon paste material etc.This insulating barrier 221 can be resin, as epoxy resin, policapram, two butadiene dilute acid acid imide/three nitrogen traps, polyphenyl and cyclobutane (polybenzocyclobutene) etc., or be fiber-reinforced resin or fibre strengthening epoxy resin etc., it is to finish that capacitance component is embedded in being made in of multilayer circuit board.Wherein, conducting film 18 promptly defines the effective capacitance district with the zone 26 of electrode 24 overlays (overlap).Because circuit pattern 25 is conductive foil with the material of electrode 24, therefore simplified manufacture method at multilayer circuit board embedded capacitor assembly.
Described capactive film 17 is the high dielectric material, and its relative dielectric radio (relativedielectric constant) is more than 5, and modes such as available sputter or printing form.When selecting materials such as barium titanate (Ba-titanate), lead zirconium titanate (Pb-Zr-titanate), barium strontium titanate (Ba-Sr-titanate) heterogeneous body hydrocarbon for use, available sputter-deposited; And with the resin plaster material that is added with barium titanate (Ba titanate-resin paste, for example barium titanate powder intersperses among in the epoxy resin) and barium titanate-glass cream material (Ba titanate-glass paste, for example barium titanate powder and glass powder intersperse among in organic media) etc. during material, available mode of printing deposition.Yet capactive film 17 needed earlier with mode of heating (for barium titanate resin plaster material) or roasting (firing) mode (for barium titanate glass cream material) before the described protection coating 19 of deposition, under atmosphere or inert gas environment with its curing.
As shown in Figure 3, described capactive film can be deposited on the conductive foil 12, and this conductive foil 12 has a matsurface 13 and a surface 14, and should can be made as matsurface or tabular surface according to need in surface 14.On this conductive foil 12, also can utilize photoresistance microetch (photoresist-microetching) or polishing methods such as (polish), carry out etching and remove oxide, form a little rough region 15 as the capactive film crystallizing field.With this case, this little rough region 15 can make follow-up capactive film have the excellent electrical property accuracy, and the good adhesion of 12 of capactive film and this conductive foils is provided simultaneously.In addition because after the capactive film deposition superimposed before, conductive foil 12 needn't carry out the alligatoring step again, therefore making becomes nonessential component part as Fig. 4, protection coating 19 shown in Figure 5.
As shown in Figure 6, form a soft magnetic film 27 (softmagnet material film) at one of a conductive foil 28 on than tabular surface, this conductive foil 28 be materials such as copper (Cu), silver-colored (Ag), aluminium (Al), platinum (Pt) or palladium.And with the whole soft magnetic film 27 of a protection coating 29 coverings, this protection coating 29 is for insulation organic material or ceramic material, and is made by epoxy resin, policapram, two butadiene dilute acid acid imide/three nitrogen traps, hydrocyanic ester, aluminium oxide, glass or its homologue.Be made of resin as this protection coating 29, it is good then handing over refining reaction structure (partiallycrosslinked) with part.And be referred to as assembly carrier conductive foil (component-carrying conductive foil) 30 by conductive foil 28,29 makers-ups of soft magnetic film 27 and protection coating
As shown in Figure 7, as adhesion coating, (unit circuit sheet's this assembly carrier conductive foil 30) is superimposed with a unit circuit thin plate 31 with an organic insulator 32, and in superimposed process, the accuracy of aligning must be controlled well.This circuit board 31 can be and comprises an insulating barrier 33 and conductive layer 34 formed single or multiple lift circuit boards.This insulating barrier 33 can be epoxy resin, two butadiene dilute acid acid imide/three nitrogen traps, policapram, hydrocyanic ester, polyphenyl and cyclobutane (polybenzocyclobutene) or its homologue is formed; This conductive layer 34 then is an electric conducting material, as metal, conducting polymer, metal cream material or carbon paste material etc.This organic insulator 32 can be resin, such as epoxy resin, policapram, two butadiene dilute acid acid imide/three nitrogen traps, polyphenyl and cyclobutane (polybenzocyclobutene) etc. composition; Or be fiber-reinforced resin, as fibre strengthening epoxy resin etc.Be formed with helical coil 35 and circuit pattern 36 on the same one side of this conductive foil 28, wherein this helical coil 35 also can be circle, ellipse, square, rectangle or other polygon pattern.And be provided with a via 37 at an end points of this helical coil 35; As shown in Figure 8, another end points 38 of this helical coil 35 also is formed on the same one side of conductive foil 28.At last, a soft magnetic film 39 also can form and cover this helical coil 35, to increase inductance value (inductance).
Described soft magnetic film 27,39 is magnetic conductivity (permeability) greater than 1 soft magnetism material, modes such as it can sputter, spin coating (spin coating) or printing form, as manganese-zinc-iron oxygen magnet (Mn-Zn ferrite), nickel-manganese-zinc-iron oxygen magnet (Ni-Mn-Zn ferrite) or tri-iron tetroxide (magnetite) etc., can be by sputter-deposited (sputter-deposited); Add Ferrite-resin plaster material (ferrite-resin Opaste) and then can deposit by mode of printing, wherein this Ferrite-resin plaster material can be dispersed in the resin and make with manganese-zinc-iron oxygen magnet (Mn-Zn ferrite) powder.Similarly, the soft magnetic film 27 of above-mentioned printing moulding needed earlier with curing mode suitably with its sclerosis before the described protection coating 29 of deposition.
Return Fig. 3, in like manner, described soft magnetic film also can be deposited on the conductive foil 12, and this conductive foil 12 has a matsurface 13 and a surface 14, and should can be made as matsurface or tabular surface according to need in surface 14.On conductive foil 12, also can utilize methods such as photoresistance microetch or polishing, carry out etching and remove oxide, form a little rough region 15 as the soft magnetic film crystallizing field.With this case, this little rough region 15 can make follow-up soft magnetic film possess the excellent electrical property accuracy, and the good adhesion of 12 of soft magnetic film and this conductive foils is provided simultaneously.In addition because after the soft magnetic film deposition superimposed before, this conductive foil 12 needn't carry out the alligatoring step again, therefore making becomes nonessential component part as Fig. 6, protection coating 29 shown in Figure 7.
Making disclosed in this invention is embedded with the method for the multilayer circuit board of passive component; it has a special benefits; promptly when the passive component edge is embedded in the outermost layer of multilayer circuit board; because passive component is positioned at the circuit layer below, so this structure is with the coating of unlikely influence such as green lacquer protective layer (solder maskmaterial) etc.
In sum, the invention discloses the method that a kind of making is embedded with the multilayer circuit board of passive component, this method can provide tool the excellent electrically passive component of accuracy in multilayer circuit board, and circuit board has good reliability.
Certainly, the above only makes the preferred embodiment of the method for the multilayer circuit board that is embedded with passive component for the present invention, be not in order to limiting practical range of the present invention, anyly have the knack of the equivalent arrangements that this operator does without prejudice to spirit of the present invention, all should belong to scope of the present invention.
Claims (13)
1, a kind of making is embedded with the method for the multilayer circuit board of film shape resistor assembly, it is characterized in that may further comprise the steps:
(a) on a surface of a conductive foil, form a resistive film;
(b) utilize an organic insulator as sticker, this conductive foil and unit circuit thin plate that has resistive film is superimposed; And
(c) on another surface of described conductive foil, form electrode and circuit pattern.
2, make the method for the multilayer circuit board that is embedded with resistor assembly according to claim 1, it is characterized in that after the step that forms resistive film, also can comprise forming a protection coating to cover the step of this resistive film.
3, be embedded with the method for the multilayer circuit board of resistor assembly as making as described in the claim 2, it is characterized in that described protection coating is a kind of in insulating resin or the ceramic material.
4, make the method for the multilayer circuit board that is embedded with resistor assembly according to claim 1, the resistance value that it is characterized in that this resistive film is more than the 0.1ohm/square.
5, a kind of making is embedded with the method for the multilayer circuit board of membranaceous capacitance component, it is characterized in that may further comprise the steps:
(a) on a surface of a conductive foil, form a capactive film;
(b) on this capactive film, form a conducting film, and partly cover this capactive film, with electrode as this capacitance component;
(c) utilize an organic insulator as sticker, this conductive foil and unit circuit thin plate that has capactive film is superimposed; And
(d) on described conductive foil, form electrode and circuit pattern.
6, making as claimed in claim 5 is embedded with the method for the multilayer circuit board of capacitance component, it is characterized in that described step (b) afterwards, also can include a step: form a protection coating to cover this capactive film and conducting film.
7, be embedded with the method for the multilayer circuit board of resistor assembly as making as described in the claim 6, it is characterized in that a kind of in insulation organic material or the ceramic material of described protection coating.
8, be embedded with the method for the multilayer circuit board of capacitance component as making as described in the claim 5, it is characterized in that described capactive film is that relative dielectric constant is in the material more than 5.0.
9, a kind of making is embedded with the method for the multilayer circuit board of Inductive component, it is characterized in that may further comprise the steps:
(a) on a surface of a conductive foil, form a soft magnetic film;
(b) utilize an organic insulator as sticker, this described conductive foil and unit circuit thin plate that has soft magnetic film is superimposed; And
(c) on the another side of described conductive foil, form helical coil and circuit pattern.
10, making as claimed in claim 9 is embedded with the method for the multilayer circuit board of Inductive component, it is characterized in that forming after the step of soft magnetic film, also can comprise forming a protection coating to cover the step of this soft magnetic film.
11, be embedded with the method for the multilayer circuit board of resistor assembly as making as described in the claim 10, it is characterized in that a kind of in insulation organic material or the ceramic material of described protection coating.
12, making as claimed in claim 9 is embedded with the method for the multilayer circuit board of Inductive component, it is characterized in that described soft magnetic film is a magnetic conductivity greater than 1 soft magnetism material.
13, be embedded with the method for the multilayer circuit board of Inductive component as claim 9 or the described making of claim 10, it is characterized in that forming after the step of helical coil and circuit pattern, also can comprise forming the step that a soft magnetic film covers this helical coil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB01138638XA CN1194596C (en) | 2001-12-28 | 2001-12-28 | Method for making multi-layer circuit board with internal inserted passive component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB01138638XA CN1194596C (en) | 2001-12-28 | 2001-12-28 | Method for making multi-layer circuit board with internal inserted passive component |
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| Publication Number | Publication Date |
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| CN1429065A true CN1429065A (en) | 2003-07-09 |
| CN1194596C CN1194596C (en) | 2005-03-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB01138638XA Expired - Fee Related CN1194596C (en) | 2001-12-28 | 2001-12-28 | Method for making multi-layer circuit board with internal inserted passive component |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110049632A (en) * | 2018-01-16 | 2019-07-23 | 鹏鼎控股(深圳)股份有限公司 | Built-in type flexible circuit board and preparation method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100490612C (en) * | 2005-07-15 | 2009-05-20 | 日月光半导体制造股份有限公司 | Production of multi-layer circuit board of built-in passive assembly |
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2001
- 2001-12-28 CN CNB01138638XA patent/CN1194596C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110049632A (en) * | 2018-01-16 | 2019-07-23 | 鹏鼎控股(深圳)股份有限公司 | Built-in type flexible circuit board and preparation method thereof |
| CN110049632B (en) * | 2018-01-16 | 2022-04-15 | 鹏鼎控股(深圳)股份有限公司 | Embedded flexible circuit board and manufacturing method thereof |
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| Publication number | Publication date |
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| CN1194596C (en) | 2005-03-23 |
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Granted publication date: 20050323 Termination date: 20121228 |