CN1423249A - Liquid crystal display device and wafer packaged film cutting method - Google Patents
Liquid crystal display device and wafer packaged film cutting method Download PDFInfo
- Publication number
- CN1423249A CN1423249A CN 01139617 CN01139617A CN1423249A CN 1423249 A CN1423249 A CN 1423249A CN 01139617 CN01139617 CN 01139617 CN 01139617 A CN01139617 A CN 01139617A CN 1423249 A CN1423249 A CN 1423249A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- distribution
- circuit layer
- circuit
- directly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The method is suitable for cutting the packaging film setup on the circuit board. Based on changing the structure of zonal load-beairng packaging piece, the phenomena of the short circuit occurred at the press fitting place of the circuit layers can be avoided effectively. The circuit layer of the board possesses the first wiring, which includes the straight part along the preset direction and the unparallel non-straight part. The packaging film possesses the second wiring along the present direction. The process includes following steps. First, when the packaging film is cut, the part of the second wiring of removed so as to form the gap. Finally, the packaging film is setup on the circuit layer, making the second witing contact the straight part, and the non-straight part expose on the gap.
Description
Technical field
The present invention relates to the LCD Technology field, especially a kind of LCD and wafer packaged film cutting method, this method can avoid the array of packaged film in the LCD and its pressing circuit on glass to be short-circuited.
Background of invention
General LCD comprises panel, driving circuit and control circuit three parts.Driving circuit is in order to the pixel on the driving display panel (pixe1), and the image of counter plate is controlled and control circuit is in order to the control Driver Circuit plate.In the existing LCD, driving circuit is located on the banded carrying packaging part (tape carrier package below is referred to as TCP) usually, and control circuit then is arranged at a control circuit board in addition.Liquid crystal screen is coupled to panel with TCP during fabrication, and control circuit board is coupled to TCP.
Consult Fig. 1, Fig. 1 shows the partial circuit diagram of traditional TCP.As shown in Figure 1, the circuit of TCP is manufactured on film 10, comprises driving wafer 11, in order to the drive signal of panel to be provided.One end of the plural output terminal 12 of TCP (TCP OLB) is coupled to and drives wafer 11, and the other end is coupled to corresponding testing cushion 14 separately.By the testing electrical property of testing cushion 14, whether the output terminal 12 that can detect TCP correctly electrically connects with driving wafer 11, and the situation that is not short-circuited or breaks.After finishing testing electrical property, can carry out the action of cutting to film 10.The rectangular area that the part of cutting such as label 16 are indicated, after cutting, remaining part has not comprised testing cushion 14.
Consult Fig. 2, Fig. 2 shows that tradition is arranged at circuit layer trace-diagram between the cell filters 20 of liquid crystal screen and the array glass 21.The cabling of the output terminal 220 of traditional circuit layer 22 (Cell OLB Pad) generally speaking is all the cabling of straight line as shown in Figure 2.
Next, with output terminal 220 corresponding the coupling of output terminal 12 with the corresponding traditional circuit layer 22 of the TCP circuit 16 after the cutting, finished the electric connection of driving wafer 11 and display panels.
Yet because circuit is complicated gradually and the consideration in saving space, output terminal 220 cablings of traditional circuit layer 22 have been not suitable for disposing with linear fashion fully, for example must dispose cabling in horizontal or oblique mode in some part.Consult Fig. 3, Fig. 3 shows that tradition is arranged at the another kind of trace-diagram of circuit layer between the cell filters 20 of liquid crystal screen and the array glass 21.As shown in Figure 3, the cabling of the output terminal 320 of traditional circuit layer 32 (Cell OLB Pad) can be divided into the cabling 321A of straight line configuration and the cabling 321B of horizontal or oblique configuration.
Therefore, if with the output terminal 12 of the TCP circuit 16 after the cutting shown in Figure 1 output terminal 320 corresponding coupling, the situation that will be short-circuited with corresponding traditional circuit layer 32.Consult Fig. 4, Fig. 4 shows that tradition is arranged at the synoptic diagram of the traditional circuit layer 32 of liquid crystal screen with TCP circuit 16, and wherein the zone that indicated of label 40 is a TCP circuit 16 and the pressing zone of traditional circuit layer 32.And the situation that the cabling 321B of the output terminal 12 that the zone that label 42 is indicated is TCP circuit 16 and the horizontal or oblique configuration of traditional circuit layer 32 is short-circuited.
At present conventional art is normally changed the configuration of circuit layer 32 in order to solve the above problems, and makes TCP circuit 16 and the fashionable unlikely situation that is short-circuited of traditional circuit lamination.Yet under the situation more and more littler for the area of cabling layout, the degree of difficulty of the phenomenon of avoiding in the above described manner being short-circuited will be more and more higher.
Summary of the invention
In view of this, in order to address the above problem, fundamental purpose of the present invention is to provide a kind of LCD and wafer packaged film cutting method, and nationality is by the structure that changes banded carrying packaging part TCP, the phenomenon that can effectively avoid pressing place with circuit board to be short-circuited.
For obtaining above-mentioned purpose, the wafer packaged film cutting method of LCD of the present invention, be applicable to that cutting is arranged at the packaged film of a circuit layer, circuit layer has first distribution, above-mentioned first distribution comprise along set direction configuration directly to portion and uneven non-directly to portion with it, and packaged film has along second distribution of set direction configuration, comprise the following steps: at first when the cutting packaged film, part second distribution is excised, to form a breach, last, packaged film is arranged at circuit layer, and make second distribution only with directly contact, and expose above-mentioned non-by above-mentioned breach directly to portion to portion.
In addition, the present invention proposes a kind of LCD, comprising: a panel; One circuit layer has one first distribution, above-mentioned first distribution comprise along set direction configuration directly to portion and with above-mentioned directly uneven non-directly to portion to portion; And a packaged film, have a breach, and along second distribution of above-mentioned set direction configuration, above-mentioned packaged film is arranged at the foregoing circuit layer, and directly contacts and expose above-mentioned non-by above-mentioned breach with above-mentioned directly to portion to portion by above-mentioned second distribution.
The present invention also proposes a kind of LCD, and it comprises: a panel; One circuit layer, second distribution that has one first distribution and be coupled to above-mentioned first distribution; And a packaged film, having a breach and the 3rd distribution, above-mentioned packaged film is arranged at the foregoing circuit layer, and contacts with above-mentioned first distribution and expose above-mentioned second distribution by above-mentioned breach by above-mentioned the 3rd distribution.
Wherein above-mentioned first distribution and second distribution are one-body molded.
Wherein above-mentioned first distribution and above-mentioned second distribution are not parallel.
In above-mentioned packaged film comprise that more one drives wafer, be coupled to above-mentioned second distribution, and in order to drive above-mentioned panel.
Description of drawings
Fig. 1 shows the circuit diagram of traditional TCP;
Fig. 2 shows that tradition is arranged at circuit layer trace-diagram between the cell filters 20 of liquid crystal screen and the array glass 21;
Fig. 3 shows that tradition is arranged at the another kind of trace-diagram of circuit layer between the cell filters 20 of liquid crystal screen and the array glass 21;
Fig. 4 shows that tradition is arranged at TCP circuit 16 synoptic diagram of the traditional circuit layer 32 of liquid crystal screen;
Fig. 5 shows the outside drawing according to the described LCD of the embodiment of the invention;
Fig. 6 shows that the TCP circuit 60 that cuts according to the embodiment of the invention is arranged at the synoptic diagram of the circuit layer 32 of liquid crystal screen;
Fig. 7 shows that the TCP circuit 70 that cuts according to the embodiment of the invention is arranged at the synoptic diagram of another example of the circuit layer 32 of liquid crystal screen.
Embodiment
Consult Fig. 5, Fig. 5 shows the outside drawing according to the described LCD of the embodiment of the invention.Comprise a display panels 50 according to the described LCD of the embodiment of the invention.Display panels 50 has a circuit layer 32 in the zone that label 500 is indicated, be arranged between the cell filters 20 and array glass 2 of liquid crystal screen in the display panels.The cabling that has plural output terminal 320 (Cell OLB Pad) on it can be divided into the cabling 321A of straight line configuration and laterally or material to the cabling 32IB (consulting Fig. 3) of configuration.
Consult Fig. 1, as shown in Figure 1, the circuit of TCP is manufactured on film 10, comprises driving wafer 11, in order to the drive signal of panel to be provided.One end of the plural output terminal 12 of TCP (TCP OLB) is coupled to and drives wafer 11, and the other end is coupled to corresponding testing cushion 14 separately.By the testing electrical property of testing cushion 14, whether the output terminal 12 that can detect TCP correctly electrically connects with driving wafer 11, and the situation that is not short-circuited or breaks.After finishing testing electrical property, can carry out the action of cutting to film 10.
According to the embodiment of the invention to film 10 cutting after, form a TCP circuit 60.Consult Fig. 6, Fig. 6 shows that the TCP circuit 60 that cuts according to the embodiment of the invention is arranged at the synoptic diagram of the circuit layer 32 of liquid crystal screen.According to the embodiment of the invention, the difference of TCP circuit 60 and conventional art is that it forms a breach (scope that is indicated as label 65) in ad-hoc location.Next, with output terminal 220 corresponding the coupling of output terminal 12 with the corresponding circuit layer 32 of the TCP circuit 60 after the cutting, finished the electric connection of driving wafer 11 and display panels.
When TCP circuit 60 and circuit layer 32 pressings, will expose the cabling 321B of horizontal or oblique configuration.By the design of this breach 65, make the output terminal of TCP circuit 60 can not extend to the cabling 321B of the horizontal or material of circuit layer 32 to configuration, therefore can effectively avoid the phenomenon that in the pressing district 40 of TCP circuit 60 and circuit layer 32, is short-circuited.
In addition, consult Fig. 7, Fig. 7 shows that the TCP circuit 70 that cuts according to the embodiment of the invention is arranged at the synoptic diagram of another example of the circuit layer 32 of liquid crystal screen.According to the embodiment of the invention to film 10 cutting after, form a TCP circuit 70.At this, the difference of TCP circuit 70 and TCP circuit 60 is that point of interface along the cabling 321B of the cabling 321A of straight line configuration and horizontal or oblique configuration extends in the edge of formed breach 75 for it, when TCP circuit 70 and circuit layer 32 pressings, the cabling 321B that will expose horizontal or oblique configuration, make the output terminal of TCP circuit 70 can not extend to the cabling 321B of the horizontal or oblique configuration of circuit layer 32 equally, therefore can effectively avoid the phenomenon that in the pressing district 40 of TCP circuit 70 and circuit layer 32, is short-circuited.
According to the embodiment of the invention, need not change the trace configurations of circuit layer, only, can avoid TCP circuit and the circuit layer short circuit that engages easily by the structure that changes the TCP circuit.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limiting scope of the present invention, anyly has the knack of this skill person, without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking the claim scope person of defining.
Claims (8)
1. the wafer packaged film cutting method of a LCD, it is characterized in that: be applicable to that cutting is arranged at the packaged film of a circuit layer, the foregoing circuit layer has one first distribution, above-mentioned distribution comprise along set direction configuration directly to portion and with above-mentioned directly uneven non-directly to portion to portion, and above-mentioned packaged film has along second distribution of above-mentioned set direction configuration, comprises the following steps:
When the above-mentioned packaged film of cutting, with above-mentioned second distribution excision of part, to form a breach; And
Above-mentioned packaged film is fixed in the foregoing circuit layer, and makes above-mentioned second distribution only directly contact, and see through above-mentioned breach and expose above-mentioned non-directly to first distribution of portion to portion with above-mentioned first distribution.
2. LCD is characterized in that: comprising:
One panel;
One circuit layer, second distribution that has one first distribution and be coupled to above-mentioned first distribution; And
One packaged film has a breach and the 3rd distribution, and above-mentioned packaged film is arranged at the foregoing circuit layer, and contacts with above-mentioned first distribution and expose above-mentioned second distribution by above-mentioned breach by above-mentioned the 3rd distribution.
3. LCD as claimed in claim 2 is characterized in that: wherein above-mentioned first distribution and second distribution are one-body molded.
4. LCD as claimed in claim 3 is characterized in that: wherein above-mentioned first distribution and above-mentioned second distribution are not parallel.
5. LCD as claimed in claim 4 is characterized in that: wherein above-mentioned packaged film comprises that more one drives wafer, is coupled to above-mentioned second distribution, and in order to drive above-mentioned panel.
6. LCD is characterized in that: comprising:
One panel;
One circuit layer has one first distribution, above-mentioned distribution comprise along set direction configuration directly to portion and with above-mentioned directly uneven non-directly to portion to portion; And
One packaged film has a breach, and along second distribution of above-mentioned set direction configuration, above-mentioned packaged film is arranged at the foregoing circuit layer, and directly contacts and expose above-mentioned non-directly to portion by above-mentioned breach to portion with above-mentioned by above-mentioned second distribution.
7. LCD circuit as claimed in claim 6 is characterized in that: wherein above-mentioned directly to portion and non-directly one-body molded to portion.
8. LCD circuit as claimed in claim 7 is characterized in that: wherein above-mentioned packaged film comprises that more one drives wafer, is coupled to above-mentioned second distribution, and in order to drive above-mentioned panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01139617 CN1236413C (en) | 2001-11-23 | 2001-11-23 | Liquid crystal display device and wafer packaged film cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01139617 CN1236413C (en) | 2001-11-23 | 2001-11-23 | Liquid crystal display device and wafer packaged film cutting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1423249A true CN1423249A (en) | 2003-06-11 |
| CN1236413C CN1236413C (en) | 2006-01-11 |
Family
ID=4675316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01139617 Expired - Fee Related CN1236413C (en) | 2001-11-23 | 2001-11-23 | Liquid crystal display device and wafer packaged film cutting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1236413C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111252728A (en) * | 2020-01-22 | 2020-06-09 | 上海应用技术大学 | Batch processing method of MEMS piezoelectric devices |
-
2001
- 2001-11-23 CN CN 01139617 patent/CN1236413C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111252728A (en) * | 2020-01-22 | 2020-06-09 | 上海应用技术大学 | Batch processing method of MEMS piezoelectric devices |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1236413C (en) | 2006-01-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7172915B2 (en) | Optical-interference type display panel and method for making the same | |
| US11804493B2 (en) | Array substrate, manufacturing method thereof, and display device | |
| CN102346321B (en) | Display panel and cutting method of mother board of display panel | |
| KR20080040828A (en) | Method for making electrode terminal in polymer dispersed liquid crystal display | |
| CN100346200C (en) | Display assembly and assembling method thereof | |
| US12034011B2 (en) | Array substrate, manufacturing method thereof, and display device | |
| CN110632790A (en) | Backlight module, preparation method thereof and display device thereof | |
| CN1236413C (en) | Liquid crystal display device and wafer packaged film cutting method | |
| CN1104655C (en) | Liquid crystal display element and maufacture method thereof | |
| CN1755465A (en) | Liquid crystal display device | |
| JP2007279096A (en) | Liquid crystal device | |
| JP4275937B2 (en) | Liquid crystal device and manufacturing method thereof | |
| CN213401194U (en) | Mini LED lamp panel | |
| JP2001166704A (en) | Display device | |
| CN1243273C (en) | Display panel with improved electricity connection by by-pass wiring | |
| CN1797076A (en) | Composite crystal structure of glass, and LCD of using the composite crystal structure of glass | |
| JPH08254708A (en) | Production of tape carrier package | |
| CN2763834Y (en) | Glass compound crystal structure and LCD using same | |
| US6778247B2 (en) | Method for cutting tape carrier packages of a LCD and LCD structure | |
| CN2814454Y (en) | Liquid crystal display device with double-screen | |
| JPH08160446A (en) | Tape carrier and its production and liquid crystal display device formed by using this tape carrier | |
| CN102508371A (en) | Tape winding substrate with flexible chip-on-board structures of liquid crystal panel | |
| CN1308742C (en) | Coiling tape type carrier capsulation piece | |
| CN100346198C (en) | Repairable wire structure | |
| WO2023197352A1 (en) | Display backplane and display apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060111 Termination date: 20151123 |