JPH08254708A - Production of tape carrier package - Google Patents

Abstract

PURPOSE: To provide a process for producing a tape carrier package which prevents the occurrence of shorting defects and electrolytic corrosion between connecting leads. CONSTITUTION: This process comprises producing the tape carrier package formed with many conductor patterns constituting user areas 5 including connecting lead parts 3 on the front surface of an insulating substrate 1 by providing the outer side of the user areas of this insulating substrate 1 with test terminals 2 integrally molded with the respective connecting leads and cutting away the test terminal 2 side of the conductor patterns by pressing to form the user areas 5 including the connecting lead parts 3. The width (d) of the cutting parts 3a of the conductor patterns of the user areas 5 and the conductor patterns of the test terminals 2 is at least set narrower than the width D of the conductor patterns of the parts formed as the connecting lead parts 3. Press blanking is executed along the narrow width parts.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a tape carrier package for connecting various signal terminals of a liquid crystal panel constituting a liquid crystal display device to a drive circuit board or conductively connecting connection pads between the drive circuit boards. Regarding

[0002]

2. Description of the Related Art In a liquid crystal display device, various signal terminals of a liquid crystal panel are called connecting parts called tape carrier package in which a semiconductor chip is mounted between a signal circuit terminal and a driving circuit board installed near the periphery or the back surface of the liquid crystal panel. Connected via.

The drive circuit boards are also connected to each other using a flat cable called a joiner or a tape carrier package similar to the above.

It is to be noted that, here, all the connecting components for connecting the panel and the substrate, or the substrate, including the above-mentioned joiner, will be described as a tape carrier package.

Such a tape carrier package has a large number of connection leads formed by patterning a conductive thin film. The pitch of the connection leads is becoming finer as the resolution of the liquid crystal display device becomes higher.

The tape carrier package is formed by forming a predetermined conductor pattern on a long insulating film substrate, mounting a semiconductor chip on it, or in the case of a joiner, cutting it as it is into a required user area size by pressing. However, if the pitch of the connecting leads becomes finer, the tips of the connecting leads will deform during press punching, resulting in poor contact between adjacent connecting leads, and indeterminate shapes and fractures in the cut section. Innumerable protrusions or debris are dispersed and adhered to the portion, which forms an unnecessary current path between the pad of the connection partner or the adjacent lead and causes electrolytic corrosion in the connection portion. FIG. 5 is a plan view showing an example of an intermediate product of a tape carrier package to which the present invention is applied, before the tape carrier package is pressed, 1 is a long insulating film (hereinafter, referred to as a substrate), 1a is a perforation, 2 is a test terminal, 3 and 3'are connection leads, 4
Is a punching position, 5 is a user area (tape carrier package: TCP), and CHI is a semiconductor chip.

The intermediate product of the illustrated tape carrier package is obtained by press molding a number of tape carrier packages from an insulating film which is long in the direction of the arrow, and the insulating film is fed and positioned at both ends of the insulating film. For perforation 1a is formed.

In the tape carrier package having such a structure, among the connection leads, the pitch on the connection lead 3 side, which is the so-called outer lead on the output side, is made finer, for example, its width is 0.1 mm, Pitch 0.3
It is less than mm.

Therefore, when the user area is punched out from the intermediate product of such a tape carrier package, the above-mentioned problem is likely to occur in the connection lead 3 which is the outer lead. The same applies to the case where the connection lead 3'is made finer. FIG. 6 is a schematic partial plan view for explaining a conventional method for manufacturing a tape carrier package, in which 1 is an insulating film substrate (hereinafter referred to as a substrate) before press punching, 2 is a test terminal, 3 is a connection lead, and 4 is a This is the punching position.

The test terminal 2 and the connecting lead 3 are the substrate 1
A copper foil adhered to the substrate with an adhesive is formed by a patterning technique such as a photolithography technique.

The intermediate product thus formed is punched out at a punching position 4 which is a predetermined user area, the test terminal portion is removed, and a tape carrier package (TCP) is formed.
Get.

[0012]

FIG. 7 is a schematic diagram for explaining the press removal of the tape carrier package.
a is an upper die of the press, 6b is a lower die of the press, and 6c is a workpiece restraining member.

In FIG. 1, the intermediate product of the tape carrier package is a lower die 6 for pressing the conductor pattern 3'side.
It is placed on a and positioned by the perforation and fixed by a work piece restraining member 6a.
Is lowered in the direction of arrow A and the user area is punched at the punching position 4 to obtain a tape carrier package.

The intermediate product of the tape carrier package is manufactured by successively punching the tape carrier package while continuously moving in the direction indicated by B, for example.

8A and 8B are schematic diagrams for explaining the deformation of the conductor pattern that occurs in the conventional punching, where FIG. 8A is a plan view and FIG. 8B is a front view of a cut surface of the conductor pattern by the punching. Is.

As shown in FIG. 1A, when the die on the press abuts against the punching position 4 and shears during the punching, the conductor pattern serving as the connecting lead 3 is deformed, for example, as shown in FIG. As shown in 3a, it laterally protrudes, or debris as shown in 3b remains.

FIG. 2B shows a cut surface after shearing along the punching position 4 in FIG. 1A, and as shown in the drawing,
This may cause the deformed portion 3a to short-circuit with the adjacent conductor pattern, the conductor fragment 3b generated by shearing to remain between the conductor patterns to cause a short circuit defect, or cause electrolytic corrosion in the product after connection.

It is an object of the present invention to provide a method for manufacturing a tape carrier package which solves the above-mentioned problems of the prior art and prevents the occurrence of short-circuiting defects or electrolytic corrosion between connecting leads.

[0019]

In order to achieve the above object, the present invention provides a conductor pattern at a punching position for punching a user area from an intermediate product of a tape carrier package by cutting the conductor pattern by the punching. The deformation of the parts is achieved by forming a shape such that contact between adjacent conductors does not occur and no electrolytic corrosion occurs.

Hereinafter, in order to clarify the correspondence with the embodiment, the reference numerals of the embodiment will be given and described.

That is, according to the first aspect of the present invention, a large number of conductor patterns forming the user area 5 including the connection lead portion 3 are formed on the surface of the insulating substrate 1, and the outside of the user area of the insulating substrate 1 is formed. And a test terminal 2 integrally formed with each of the connection leads, and the test terminal 2 side of the conductor pattern is cut and removed by press punching to form a user area 5 including the connection lead portion 3. In the manufacturing method, the width d of the cut portion 3a between the conductor pattern of the user area 5 and the conductor pattern of the test terminal 2 is set to be narrower than the width D of the conductor pattern of at least the connection lead portion 3. It is characterized in that the punching is performed along the narrow portion.

[0022]

In the above structure of the present invention, the width d of the cut portion 3a with the conductor pattern is made narrower than the width D of the conductor pattern in the portion to be the connection lead portion 3, whereby the connection lead is sheared by punching by a press. Even if the surface is deformed, the deformation of the conductor does not reach the adjacent connection lead, and the short circuit failure does not occur. In addition, since the amount of conductor fragments scattered during the press removal is significantly reduced, electrolytic corrosion does not occur in the product after connection.

[0023]

Embodiments of the present invention will now be described in detail with reference to the drawings.

FIG. 1 is a schematic partial plan view illustrating a method of manufacturing a tape carrier package according to the present invention.
Reference numeral a denotes a cutting portion, and the same portions as those in FIG. 6 are designated by the same reference numerals.

In the figure, the intermediate product (before pressing) of the tape carrier package has a large number of conductive patterns forming the user area 5 including the connecting lead portions 3 on the surface of the insulating substrate 1 made of a long insulating film. Formed.

A test terminal 2 integrally formed with each of the connection leads is provided on the edge side of the insulating substrate 1, and the user including the connection lead portion 3 is formed by cutting the test terminal 2 side of the conductor pattern by press punching. Area 5 is formed.

The above-mentioned test terminal is a portion to which the probe of the inspection device is applied in the inspection process before entering the punching process of the user area 5, and is an unnecessary part in the tape carrier package as the final product.

The intermediate product of the tape carrier package which has undergone the inspection step is passed to the press-extracting step and punched along the cut portion 3a between the conductor pattern of the user area 5 and the conductor pattern of the test terminal 2.

The width d of the cut portion 3a between the conductor pattern of the user area 5 and the conductor pattern of the test terminal 2 is made narrower than the width D of the conductor pattern of at least the connection lead portion 3. And press-cut along this narrow portion.

As a result, even if the shearing surface of the connecting lead is deformed by punching by the press, even if the conductor is deformed as described with reference to FIG. There is nothing to do. In addition, since the amount of conductor fragments scattered during the press removal is significantly reduced, electrolytic corrosion does not occur in the product after connection.

FIG. 2 is a cross-sectional view for explaining an example of the structure of the tape carrier package manufactured in this embodiment. The tape carrier package TCP has a semiconductor chip CHI which constitutes a scanning signal driving circuit and an Endo signal driving circuit. It is installed.

This tape carrier package is composed of a substrate BF1 made of polyimide (corresponding to 1 in FIG. 1),
A connection lead TTB (corresponding to 3'in FIG. 5) connected to the input of the semiconductor chip CHI on one side, and a connection lead TTM connected to the output of the semiconductor chip CHI on the other side.
(Corresponding to 3 in FIG. 5) is the adhesive BIN (1b in FIG. 8B).
Corresponding to each bonding pad PAD of the semiconductor chip CHI.

The SRS is a solder resist film that prevents excessive solder from adhering to unnecessary portions during soldering.

FIG. 3 is a sectional view of an essential part for explaining a state in which the tape carrier package manufactured in this embodiment is connected to an external lead terminal of a liquid crystal display panel.

In FIG. 1, a liquid crystal display panel LCD has a liquid crystal LC sandwiched between a lower glass substrate SUB1 on which switching elements such as thin film transistors (TFTs) are formed and an upper glass substrate SUB2 on which black or BM or color filters are formed. , And is sealed with a sealing material SL.

A part of the drive signal supply pattern of the thin film transistor formed on the lower glass substrate SUB1 and other patterns for voltage application are extended from the sealing material SL to the outside to form the external lead-out terminal DTM.

The connection lead TTM of the tape carrier package TCP is one substrate (TF) of the liquid crystal display panel LCD.
T board) External lead-out terminal DTM formed on SUB1
Is connected via an anisotropic conductive film ACF.

As a result, the tape carrier package T
A drive signal from the semiconductor chip CHI mounted on the CP is applied to the thin film transistor of the liquid crystal display panel LCD to display pixels.

Epoxy resin EPX is filled in the gap between the upper and lower glass substrates outside the seal material SL, and the exposed portion of the protective film PSV1 between the tape carrier package TCP and the seal material SL is made of silicone resin. SI
L is filled.

The above-mentioned silicone resin SIL is for preventing the moisture of the outside air from entering the connecting portion between the tape carrier package TCP and the liquid crystal display panel LCD.

By using the tape carrier package of this embodiment, from the protective film PSV1 portion to the connection lead TTM portion which is the connection terminal 3 of the tape carrier package TCP, an irregular type which is one of the causes of electrolytic corrosion is formed. Since no current passage is formed, it is possible to prevent electrolytic corrosion even if moisture enters.

In the figure, POL1 is a polarizing plate, SIO is a silicon oxide film, DL is a video signal line, and d.
1, d2 and d3 are signal patterns for driving thin film transistors.

According to the liquid crystal display panel using the tape carrier package according to this embodiment, neither short circuit between conductors nor electrolytic corrosion occurs.

FIG. 4 is an exploded perspective view of a liquid crystal display module to which the present invention is applied. MDL is a liquid crystal display module, SHD is a metal shield case, WD is a display window, and I
NSI and INS2 are insulating sheets, PCBI is a drain side circuit board, PCB2 is a gate side circuit board, TCP1 and T
CP2 is a tape carrier package, JN1, JN2
JN3 is a joiner, GC is a rubber cushion, LP is a fluorescent tube, LS is a light source reflection sheet, GB is a rubber bush, B
L is a backlight, LPC is a lamp cable, RFS is a reflection sheet, GLB is a light guide plate, MO is a light guide plate installation opening, MCA is a lower case, SPS is a diffusion sheet, and PRS.
Is a prism sheet, ILS is a light-shielding spacer, PCB3 is an interface substrate, INS3 is an insulating sheet BAT is a double-sided adhesive tape, and PNL is a liquid crystal display panel.

In the figure, the tape according to the present invention is provided between the external lead-out terminals of the liquid crystal display panel PNL and the connection leads of the drain side circuit board PCBI, the gate side circuit board PCB2, and the interface board PCB3 installed on the periphery of the panel. Connected by a carrier package, the drain side circuit board PCBI, the gate side circuit board PC
B2 and the interface board PCB3 are also connected to each other by the tape carrier package (in this case, a flat cable on which a semiconductor chip is not mounted) according to the present invention.

According to the above embodiment, a liquid crystal display module having high reliability can be obtained without causing a short circuit defect or electrolytic corrosion between the conductors at the connecting portion between the tape carrier package and the liquid crystal display panel. .

[0047]

As described above, according to the present invention,
Even if the sheared surface of the connection lead is deformed by punching by a press, the conductor does not reach the adjacent connection lead due to this deformation, and a short circuit failure does not occur. Also,
It is possible to provide a highly reliable liquid crystal display panel and a liquid crystal display module using the same, because the amount of conductor fragments scattered during press removal is significantly reduced and electrolytic corrosion does not occur in the product after connection. .

[Brief description of drawings]

FIG. 1 is a schematic partial plan view illustrating a method of manufacturing a tape carrier package according to the present invention.

FIG. 2 is a cross-sectional view illustrating an example of the structure of the tape carrier package manufactured in this example.

FIG. 3 is a cross-sectional view of essential parts for explaining a state in which the tape carrier package manufactured in this example is connected to an external lead-out terminal of a liquid crystal display panel.

FIG. 4 is a developed perspective view of a liquid crystal display module to which the present invention is applied.

FIG. 5 is a plan view illustrating an example of an intermediate product of a tape carrier package to which the present invention is applied before the tape carrier package press is removed.

FIG. 6 is a schematic partial plan view illustrating a method of manufacturing a conventional tape carrier package.

FIG. 7 is a schematic diagram for explaining the press removal of the tape carrier package.

FIG. 8 is a schematic diagram for explaining the deformation of the conductor pattern that occurs during conventional press punching.

[Explanation of symbols]

1 Long insulating film (hereinafter referred to as substrate) 1a Perforation 2 Test terminal 3, 3'connection lead 4 Punching position 5 User area (tape carrier package: TC
P) CHI semiconductor chip.

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Masanori Takamori 3681 Hayano, Mobara-shi, Chiba Hitachi Device Engineering Co., Ltd.

Claims (1)

[Claims] 1. A test in which a large number of conductor patterns forming a user area including a connection lead portion are formed on the surface of an insulating substrate, and which is integrally formed with each of the connection leads outside the user area of the insulating substrate. A method of manufacturing a tape carrier package comprising a terminal, wherein the test terminal side of the conductor pattern is cut and removed by press punching to form a user area including the connection lead portion, wherein a conductor pattern of the user area and the test terminal are formed. The width d of the cut portion with the conductor pattern is at least narrower than the width D of the conductor pattern of the portion to be the connection lead portion,
A method of manufacturing a tape carrier package, characterized in that the tape carrier package is punched along the narrow portion.