CN1422978A - Clamp of contactless fixture mode for cavity surface evaporating coating of semiconductor laser - Google Patents
Clamp of contactless fixture mode for cavity surface evaporating coating of semiconductor laser Download PDFInfo
- Publication number
- CN1422978A CN1422978A CN 02151295 CN02151295A CN1422978A CN 1422978 A CN1422978 A CN 1422978A CN 02151295 CN02151295 CN 02151295 CN 02151295 A CN02151295 A CN 02151295A CN 1422978 A CN1422978 A CN 1422978A
- Authority
- CN
- China
- Prior art keywords
- stainless steel
- slit
- anchor clamps
- evaporation
- bars
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Laser Beam Processing (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention refers to untouchable fixing clamp which is used in semiconductor laser antrum face plating, its character lies in that it uses untouchable fixing and avoid from mechanism damage. The clamp is produced by cutting many slots with 0.15-0.25 mm width and 2-3 mm interval on a stainless steel plate. It is fixed when bars are put into slots. Because the slots width is bigger than the thickness of bars and small than the width of bars, and sets net frame under stainless steel plate, so the bars can't drop from slot and the bars is still in standing state, the surface is flatly downwards. The clamp can assembly many bars, and the process is very easy.
Description
Technical field
The present invention relates to a kind of special fixtures that is used for plating films on cavity surfaces of semiconductor lasers, or rather, the invention provides a kind of coating clamp that is used for fixing the noncontact fixed form of semiconductor laser chip cleavage bar, belong to semiconductor laser Technology field.
Background technology
Since semiconductor laser in 1962 comes out, little with its volume, in light weight, the power height, the life-span is long, and is easy to use and gain great popularity.Semiconductor laser forms the resonator cavity of laser apparatus because of himself cleavage surface, the reflectivity of cleavage surface only about 30%, and projection ratio nearly 70%, thus the laser that device produces has 2/3rds to slattern from rear facet because of projection.For this reason, the normal laser cavity surface coating technique that adopts in device technology, i.e. rear facet evaporation highly reflecting films make the total reflection of trying one's best of light on the rear facet; Front facet evaporation antireflective coating makes the complete as far as possible projection of light on the front facet, thereby further improves laser output power, reduces threshold current, improves device performance.Owing to single semiconductor laser tube core small-sized (being generally 400 μ m * 300 μ m * 100 μ m), in the laser cavity surface coating process, generally take the form of cleavage bar.As shown in Figure 1, cleavage bar very thin thickness (being generally about 100 μ m), width (being that the chamber is long) very narrow again (being generally 200 μ m~800 μ m), (be generally 1cm~3cm) and length is long, so hardness is very little, very easily fractureed, but the also necessary maintenance level of end face, and can not stain, in the face evaporate process of chamber, need to make accurately fixing cleavage bar of a special-purpose specimen holder for this reason.Yet, this special-purpose specimen holder that uses in the present laboratory at home and abroad, major part is design voluntarily all, though the form that specimen holder adopted has nothing in common with each other, but a common ground is all arranged, and that is exactly to fix it to the external force that the cleavage bar itself applies a certain size, as shown in Figure 2.And this dependence applies the fixing means of external force, finds by a large amount of experiments, has a lot of inevitably shortcomings.At first because cleavage bar hardness is very little,, must produce many or little stress and physical abuse to it no matter how to apply the power of appropriateness; Next is because this fixing means needs accurately to control the size that applies external force, so the structure of anchor clamps and operation are very complicated, and unreliable; In addition, if there is small thickness difference (being generally 1%~10%) between the cleavage bar, then can not fixes many cleavage bars simultaneously on anchor clamps, thereby be difficult to satisfy batch production requirements.
Summary of the invention
For the incompatibility batch production requirements that exists on the structure that overcomes existing anchor clamps and the shortcoming of complicated operation, it is more reasonable that the present invention has designed a kind of structure, operate easy again plating films on cavity surfaces of semiconductor lasers anchor clamps, further the existing laser cavity surface coating process of standard.Round do not apply external force as far as possible to sample, do not damage the purpose of end face again, we have designed a kind of coating clamp of noncontact fixed form.These anchor clamps are 0.15mm~0.25mm by width, and spacing is that many slits of 2mm~3mm constitute.Slit bar number is by the decision of stainless steel plate size, and slit length and stainless steel plate size are determined by needs fixed cleavage bar length.According to the difference that filming equipment requires, stainless steel plate can be taked different shapes, generally is circular or square.Because slit width is bigger than cleavage bar thickness, the endways cleavage bar of putting into is certain to fall down in the slit, has fixed several Stainless Steel Wires that diameter is very thin below slit for this reason, relies on its holding power to fix the cleavage bar.Obviously, a cleavage bar needs the support of two Stainless Steel Wires at least, between the used Stainless Steel Wire diameter 0.05-0.10mm.The fixing means of Stainless Steel Wire is also very simple, earlier on the slit edge of an end on the stainless steel plate, it is tightened, again the other end on the other end edge of slit, as long as assurance is close to below the slit stage casing it.Because the diameter of Stainless Steel Wire is little compared with the laser cavity surface width, the steel wire area occupied of making grid below is also few, thus during evaporation shield portions seldom, during use as long as the cleavage bar is thrown away in slit one by one according to vertical direction.Because slit width is littler than the width (being that the chamber is long) of cleavage bar, the cleavage bar always is positioned at upright state in slit, thereby has guaranteed that cleavage bar end face (being the chamber face) remains level state down.In anchor clamps, adorned after all samples, anchor clamps have been fixed on the evaporation source along horizontal direction, just can carry out evaporation a chamber face of laser apparatus.Steamed after the chamber face, the evaporation of another chamber face also carries out easily, and using the same method is fixed on several Stainless Steel Wires above the slit, and the anchor clamps that sample is housed are turned around installation, can finish the position transposing of two chamber faces.
As mentioned above, owing in whole assembling process, sample is not applied any external force, anchor clamps provided by the invention have the following advantages:
1. do not damage sample (being the cleavage bar) surface, do not stain the sample end face again.
2. shelve simply, structure is uncomplicated, handling ease.
3. the sample fitted capacity is big, and sample size is unrestricted, is fit to very much production application.
4. safe and reliable, be not easy to damage long service life.
5. can use chemical solution cleans, guarantee indeformablely, not corrode.
Description of drawings
Fig. 1 is a cleavage bar synoptic diagram.
Fig. 2 is the cavity surface film coating anchor clamps that use at present.
Fig. 3 is cavity surface film coating anchor clamps provided by the invention.Among the figure: 1-wants two chamber faces of evaporation, two power-on and power-off pole-faces of 2-, and 3-cleavage bar, the 4-metal strip, the 5-slit, the 6-stainless steel plate, the 7-Stainless Steel Wire, the 8-Stainless Steel Wire is around point.
Embodiment
Suppose four inches laser apparatus extension chips, and it separates a lot of cleavage strips that coelosis length is 250 μ m along the cleavage surface steering handle with scribing machine.For this reason,, designed a kind of cavity surface film coating anchor clamps, utilized these anchor clamps just can finish the cavity surface film coating of whole cleavage bars several times according to above-mentioned conception.As shown in Figure 3, these anchor clamps are that to leave width on the Φ 100m stainless steel plectane of 2mm be 0.18mm by thickness, and spacing is that a lot of slits of 3mm are made.During use 4~5 Φ 0.08mm Stainless Steel Wires, according to cleavage bar length, adjust its spacing, be bundled in below the slit, put the cleavage bar in the slit one by one with tweezers, and a slit is filled up, prevent that effectively the cleavage bar from sliding and falling down with slit direction along parallel, guarantees that simultaneously each cleavage bar is on two point of suppon. as far as possibleFill in the anchor clamps after the cleavage bar, use the same method, 4~5 Φ 0.08mm Stainless Steel Wires are bundled in above the slit, prevent that the cleavage bar from missing above slit.Plated after the one side, anchor clamps are turned around installation, the plated film of another chamber face can be carried out down in the other end that makes the cleavage bar.After all having plated untie Stainless Steel Wire on the two sides, just is easy to a cleavage bar in the anchor clamps and unloads down.
Claims (5)
1, a kind of anchor clamps that are used for the noncontact fixed form of films on cavity surfaces of semiconductor lasers evaporation is characterized in that:
(1) anchor clamps are 0.15mm-0.25mm by width, and spacing is that many slits of 2mm-3mm constitute, and slit bar number is by the decision of stainless steel plate size, and slit length and stainless steel plate size are determined by needs fixed cleavage bar length;
(2) have at least two fixed Stainless Steel Wires to support below each slit, thereby form grid.
2,, it is characterized in that described stainless steel plate is circular or square by the described anchor clamps that are used for the noncontact fixed form of films on cavity surfaces of semiconductor lasers evaporation of claim 1.
3,, it is characterized in that fixing is 0.05-0.10mm with the Stainless Steel Wire diameter by the described anchor clamps that are used for the noncontact fixed form of films on cavity surfaces of semiconductor lasers evaporation of claim 1.
4, by claim 1 or the 3 described anchor clamps that are used for the noncontact fixed form of films on cavity surfaces of semiconductor lasers evaporation, what it is characterized in that Stainless Steel Wire fixedly is earlier tightening on the slit edge of an end on the stainless steel plate, again the other end on the other end edge of slit, be close to the slit stage casing below.
5, by the described anchor clamps that are used for the noncontact fixed form of films on cavity surfaces of semiconductor lasers evaporation of claim 1, it is characterized in that slit width greater than cleavage bar thickness the width less than the cleavage bar.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 02151295 CN1198954C (en) | 2002-12-13 | 2002-12-13 | Clamp of contactless fixture mode for cavity surface evaporating coating of semiconductor laser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 02151295 CN1198954C (en) | 2002-12-13 | 2002-12-13 | Clamp of contactless fixture mode for cavity surface evaporating coating of semiconductor laser |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1422978A true CN1422978A (en) | 2003-06-11 |
CN1198954C CN1198954C (en) | 2005-04-27 |
Family
ID=4751980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 02151295 Expired - Fee Related CN1198954C (en) | 2002-12-13 | 2002-12-13 | Clamp of contactless fixture mode for cavity surface evaporating coating of semiconductor laser |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1198954C (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1300373C (en) * | 2004-03-24 | 2007-02-14 | 长春理工大学 | Flexible clamp in use for filming face of cavity of semiconductor laser |
CN101741011B (en) * | 2009-12-24 | 2011-05-04 | 中国科学院上海微系统与信息技术研究所 | Low-stress encapsulating device and method for semiconductor laser to reliably work in wide temperature region |
CN103225069A (en) * | 2013-04-28 | 2013-07-31 | 上海华力微电子有限公司 | Metal plating tray of metal evaporation plating apparatus |
CN106025790A (en) * | 2016-06-30 | 2016-10-12 | 西安立芯光电科技有限公司 | Assembling structure and assembling method for facet film-plating clamp of semiconductor laser |
CN110434549A (en) * | 2018-05-02 | 2019-11-12 | 靖江佳仁半导体科技有限公司 | A kind of processing method of the V-groove of the stainless steel components for semiconductor |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103167734B (en) * | 2011-12-09 | 2016-02-24 | 景硕科技股份有限公司 | Thin plate support jig |
-
2002
- 2002-12-13 CN CN 02151295 patent/CN1198954C/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1300373C (en) * | 2004-03-24 | 2007-02-14 | 长春理工大学 | Flexible clamp in use for filming face of cavity of semiconductor laser |
CN101741011B (en) * | 2009-12-24 | 2011-05-04 | 中国科学院上海微系统与信息技术研究所 | Low-stress encapsulating device and method for semiconductor laser to reliably work in wide temperature region |
CN103225069A (en) * | 2013-04-28 | 2013-07-31 | 上海华力微电子有限公司 | Metal plating tray of metal evaporation plating apparatus |
CN103225069B (en) * | 2013-04-28 | 2015-05-20 | 上海华力微电子有限公司 | Metal plating tray of metal evaporation plating apparatus |
CN106025790A (en) * | 2016-06-30 | 2016-10-12 | 西安立芯光电科技有限公司 | Assembling structure and assembling method for facet film-plating clamp of semiconductor laser |
CN106025790B (en) * | 2016-06-30 | 2022-02-25 | 西安立芯光电科技有限公司 | Semiconductor laser cavity surface coating clamp assembling structure and assembling method thereof |
CN110434549A (en) * | 2018-05-02 | 2019-11-12 | 靖江佳仁半导体科技有限公司 | A kind of processing method of the V-groove of the stainless steel components for semiconductor |
Also Published As
Publication number | Publication date |
---|---|
CN1198954C (en) | 2005-04-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9583668B2 (en) | Semiconductor device | |
TWI693400B (en) | Pulsed laser and bioanalytic system | |
Willeke et al. | A simple and effective light trapping technique for polycrystalline silicon solar cells | |
ES2367690T3 (en) | ENGRAVING PASTS FOR SURFACES AND LAYERS OF SILICON. | |
EP1124263A3 (en) | Solar cell and fabrication method thereof | |
JP2004526298A5 (en) | ||
AU2002220348A1 (en) | Semiconductor wafer processing to increase the usable planar surface area | |
CN1422978A (en) | Clamp of contactless fixture mode for cavity surface evaporating coating of semiconductor laser | |
AU2002252197A1 (en) | Separating of optical integrated modules and structures formed thereby | |
Bender et al. | Polycrystalline silicon solar cells with a mechanically formed texturization | |
Fath et al. | Mechanical wafer engineering for high efficiency solar cells: An investigation of the induced surface damage | |
WO2009098109A1 (en) | Method of manufacturing a thin silicon slice | |
EP1178940A1 (en) | Vacuum assisted walking beam apparatus | |
JP2002026069A5 (en) | ||
CN108385168A (en) | A kind of method of surface of crystalline silicon making herbs into wool | |
Preu et al. | Innovative and efficient production processes for silicon solar cells and modules-SOLPRO IV | |
AU2007202917A1 (en) | Process for decreasing the reflectivity of a semiconductor material | |
CN109300779A (en) | A kind of processing method and processing device of silicon wafer | |
JP2003179001A (en) | Method for manufacturing semiconductor device | |
CN116803654A (en) | Method for cutting substrate element | |
AU2013201557A1 (en) | Process for decreasing the reflectivity of a semiconductor material | |
KR20070053910A (en) | Cutting structure label-strip plate | |
JPS5420662A (en) | Semiconductor wafer cleavaging device | |
TWI268401B (en) | Method for cutting substrate with film | |
TH73412B (en) | Feed mechanism for the grips of an integrated circuit breaker |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050427 Termination date: 20100113 |