CN1411328A - Flexible printed circuit board and mfg. method thereof - Google Patents
Flexible printed circuit board and mfg. method thereof Download PDFInfo
- Publication number
- CN1411328A CN1411328A CN02144063A CN02144063A CN1411328A CN 1411328 A CN1411328 A CN 1411328A CN 02144063 A CN02144063 A CN 02144063A CN 02144063 A CN02144063 A CN 02144063A CN 1411328 A CN1411328 A CN 1411328A
- Authority
- CN
- China
- Prior art keywords
- plate
- cut apart
- hole
- sticking tablet
- scolder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
A flexible printed circuit board includes a heat-resistant, flexible trunk and leader, through hole, and solder. The trunk and leader are made of an insulating material. The through hole is formed in the trunk. The solder is filled in the through hole to bond to each other the trunk and leader partially overlaid on each other. A manufacturing method for the flexible printed circuit board is also disclosed.
Description
Technical field
The present invention relates to insert flexible printed circuit board and manufacture method thereof in the electronic installation casing.
Background technology
Usually, in electronic installation, the printed circuit board (PCB) that is called printed board is inserted in its casing, and the electronic installation that electronic component and mechanical component are wanted with structure wherein is installed on described printed circuit board (PCB).For this printed board, what mainly use is hard plate, and still, that normal use is flexible printed circuit board (hereinafter referred to as FPC) in recent years.
FPC is the circuit board with high degree of flexibility, and its heat-resisting, pliable and tough resin material that uses polyimides and so on for example is as insulating material, and can be with electronic component mounted thereto, bendings such as mechanical component.When FPC inserts casing, it can use the space in the casing to connect up effectively, so electronic installation can be made miniaturization.
Make FPC by exploitation on flat board, with corresponding with the state (case of bending) that inserts electronic installation.In this case, expanded view (developed view) becomes complicated more, and the number of the FPC that obtains from a plate is just few more, and circuit substrate becomes expensive.These will describe in detail below.Shown in Fig. 5 A, FPC1 integral body has the last extended ligament 1-2 from body (trunk) 1-1.Therefore, the lead-in wire 1-2 joint of the lead-in wire 1-2 of a FPC1 and another FPC1, and only can obtain four FPC1, with corresponding with four angles of a square plate.
Summary of the invention
An object of the present invention is to provide a kind of flexible printed circuit board of cheapness, and manufacture method, wherein can increase the number of the flexible printed circuit board that obtains from a thin plate.
In order to achieve the above object, according to the present invention, a kind of flexible printed circuit board is provided, it comprises first and second heat-resisting, the pliable and tough plates of being made by insulating material of cutting apart, cut apart the through hole that forms on the plate and be used for filling vias first will be each other partly overlapping first and second to cut apart the scolder that hardens and lump together.
Description of drawings
Fig. 1 is the plane graph of the pliable and tough circuit board (FPC) of the embodiment of the invention;
Fig. 2 A shows body and the lead-in wire of formation FPC as shown in Figure 1;
Fig. 2 B shows the layout of using when obtaining the body shown in Fig. 2 A from a thin plate and going between;
Fig. 3 A is used for illustrating the method for using anchor clamps to make FPC as shown in Figure 1 to Fig. 3 F;
Fig. 4 A is the profile along Fig. 3 C cathetus I-I;
Fig. 4 B is the profile along Fig. 3 D cathetus II-II;
Fig. 4 C is the profile along Fig. 3 E cathetus III-III;
Fig. 4 D is the profile along Fig. 3 F cathetus IV-IV;
Fig. 4 E is the profile of trunk and lead-in wire sweep;
Fig. 5 A is the plane graph of conventional FPC;
Fig. 5 B shows the layout of using when the FPC that obtains from a thin plate shown in Fig. 5 A.
Embodiment
The present invention will be described below with reference to the accompanying drawings.
Fig. 1 shows the circuit board of one embodiment of the invention.As shown in Figure 1, FPC2 by body (first cuts apart plate) 2-1 and from body 2-1 extended ligament (second cuts apart plate) 2-2 constitute.Shown in Fig. 2 A, body 2-1 and lead-in wire 2-2 are separated from one another, and are bonded to each other by the scolder 2-3 that fills among the through hole H1 that forms on body 2-1.
About the layout of FPC2 on the thin plate, can constitute with lead-in wire 2-2 by each FPC2 being divided into body 2-1, shown in Fig. 2 B.Therefore, the number of the FPC2 that obtains on a thin plate can be increased to 6 from 4 (routines), has therefore reduced the cost of FPC2.
The following describes the cohesive process of body 2-1 and lead-in wire 2-2.At first, it is overlapping that body 2-1 goes up the part and the lead-in wire 2-2 part (end) that form through hole H1, and make lead-in wire 2-2 be in the below.Then, with scolder 2-3 filling vias and fusing, thereby the 2-2 that will go between is combined on the body 2-1.
Scolder 2-3 is full of through hole H1 by printing.In the present embodiment, the printing is here carried out synchronously with the printing of the scolder that is used for installing electronic component and mechanical component.The scolder 2-3 that fills carries out synchronously with the fusing of the scolder that is used for installing electronic component and mechanical component.In other words and since the combination of the body 2-1 and the 2-2 that goes between and electronic component with mechanical component the installation on FPC2 carry out according to identical method, so the manufacturing cost of FPC2 can not increase, so can suppress the increase of FPC2 manufacturing cost.
Make above-mentioned FPC2 by using anchor clamps.To 3F this manufacture process is described with reference to figure 3A., in 3F, will describe at Fig. 3 A, but in fact, use anchor clamps to make a plurality of FPC2 simultaneously a FPC2.
As shown in Figure 3A, many fastening screws (positioning pin) P is placed in as on the benchmark pinboard (reference pin board) of first anchor clamps.Fastening screw P stretches out from the upper surface of benchmark pinboard 3.
Shown in Fig. 3 B,, forming the hole PH that fastening screw will insert with the corresponding position of fastening screw P that is placed in the benchmark pinboard 3 as in the flexible board 4 of second anchor clamps.Being used for temporarily fixedly, the thin slice with viscosity (hereinafter referred to as the sticking tablet) S of FPC2 sticks on part necessary on the fixed head 4.In the present embodiment, the heat-resisting silicone rubber film with a small amount of low-molecular-weight siloxane is used as sticking tablet S.The position that sticking tablet S will paste on fixed head forms the recessed surfaces with the corresponding degree of depth of sticking tablet thickness, and therefore after pasting, it is concordant with fixed head 4 that the surface that sticking tablet S does not paste on the fixed head 4 becomes.
Fixed head 4 overlaps on the benchmark pinboard 3.At this moment, benchmark pinboard 3 and fixed head 4 aimed at, and fastening screw P inserts among the corresponding hole PH, and shown in Fig. 3 C and 4A, so they stretch out from the upper surface of fixed head 4.
Shown in Fig. 3 D and 4B, the lead-in wire 2-2 of FPC2 crosses sticking tablet S1 and S2 is placed on the fixed head 4.At this moment, lead-in wire 2-2 directs on the installation site of sticking tablet S1 and S2 by fastening screw P1 and P4.The lead-in wire 2-2 that is placed on sticking tablet S1 and the S2 is temporarily maintained static by the adhesive force of sticking tablet S1 and S2.
Shown in Fig. 3 E and 4C, the body 2-1 of FPC2 is placed in sticking tablet S2 on the fixed head 4 to S8.At this moment, body 2-1 is directed on the installation site of sticking tablet S2 to the S8 to P8 by fastening screw P3.Being placed in sticking tablet S2 is temporarily maintained static to the adhesive force of S8 by sticking tablet S2 to the body 2-1 on the S8.Under this temporary transient stationary state, the top that forms the part of through hole H1 and the 2-2 that goes between among the body 2-1 is overlapping, and makes lead-in wire 2-2 be in the below.
Shown in Fig. 3 F and 4D, benchmark pinboard 3 is removed from fixed head 4.At this moment, the fastening screw P1 of benchmark pinboard 3 is removed to P8, so does not stay any ridge on the fixed head 4.
Along with body 2-1 and lead-in wire 2-2 are temporarily fixed on the fixed head 4, use the welding paste print machine that welding paste is printed on body 2-1 and the lead-in wire 2-2.Therefore, can print the scolder that is used for fixing electronic component and mechanical component and scolder is filled among the through hole H1 simultaneously.
By the part installation unit electronic component and mechanical component are attached on the body 2-1, afterwards, use reflux unit (reflow soldering) by hot-air with solder fusing, therefore can carry out being connected of electronic component and mechanical component and combining of body 2-1 and the 2-2 that goes between simultaneously.
In reflow soldering, same heating sticks on the sticking tablet S on the fixed head 4.But, because sticking tablet S is heat-resisting, so they can not peel off from fixed head 4.Be used as sticking tablet S owing to have the heat-resisting silicone rubber film of a small amount of low-molecular-weight siloxane, a small amount of low-molecular-weight siloxane volatile quantity seldom.This can prevent to form insulation film because of the volatilization of low-molecular-weight siloxane at the place, contact.
In the time body 2-1 will being combined with lead-in wire 2-2, because the scolder of filling vias H1 is melted, the conductor 2-1a of body and the conductor 2-2a of lead-in wire are connected to each other by scolder, shown in Fig. 4 E, at this moment, the surface of the inwall of the through hole H1 of conductor 2-1a and edge and conductor 2-2a is electrically connected to each other by scolder.Therefore, body 2-1 and lead-in wire 2-2 physical connection and electrical connection each other.Because the surface tension that produces during scolder 2-3 fusing, body 2-1 closely contacts with the mating surface of lead-in wire 2-2.
Below the advantage that obtains because anchor clamps have the dual structure of benchmark pinboard and fixed head will be described.If benchmark pinboard 3 is not provided, but directly form fastening screw on fixed head 4, fastening screw should not have the protrusion amount that equals or exceeds FPC thickness, and this is because the printing of their meeting overslaugh scolders.In this case, fastening screw reduces from the protrusion amount that fixed head 4 stretches out, and when body 2-1 will temporarily be fixed on the fixed head 4 with lead-in wire 2-2, is easy to occurrence positions and moves.
Different therewith, according to present embodiment, anchor clamps have the dual structure of benchmark pinboard 3 and fixed head 4, and benchmark pinboard 3 was removed before solder printing.Therefore, can increase the height of fastening screw P1 to P8, thus increase fastening screw P1 to P8 from fixed head the 4 protrusion amounts of stretching out.Therefore, when body 2-1 will temporarily be fixed on the fixed head with lead-in wire 2-2, be not easy occurrence positions and move.
In the above-described embodiment, sticking tablet S combines with the necessary part of fixed head 4.The another kind of selection is that sticking tablet can be pasted on the whole surface that covers fixed head 4.In this case, can be selectively except the part of necessity on the surface of sticking tablet by laser beam or sandblast roughening so that form adhesive portion on fixed head 4, S1 is corresponding to S8 with sticking tablet.
In the above-described embodiment, on body 2-1, form through hole H1.The another kind of selection is to form through hole H1 on lead-in wire 2-2.FPC2 is made by two partitioning portions, promptly body 2-1 and the lead-in wire 2-2, but the number of circuit board partitioning portion can be increased to 3 or 4.The partitioning circuitry plate needn't two superimposed, but its number of plies can be increased to 3 layers or 4 layers.
As described the same according to the present invention, form through hole at least one circuit board of the flexible printed circuit board that is made of two or more a plurality of partitioning portion, and the scolder by filling vias is bonded to each other between the partitioning circuitry plate.Therefore, increase the number of the circuit board that can obtain from the thin plate, therefore reduced cost.
Because scolder comes filling vias by printing, so can come the combination of executive circuit plate and the installation of electronic component and mechanical component according to identical process.Therefore, do not increase step, so suppressed the increase of manufacturing cost.
Because anchor clamps have the dual structure of benchmark pinboard and fixed head, so the height of fastening screw can increase.Therefore, when flexible printed circuit board will temporarily be fixed on the fixed head, be not easy occurrence positions between them and move.
Claims (11)
1. flexible printed circuit board is characterized in that comprising:
By insulating material make first and second heat-resisting, pliable and tough cut apart plate (2-1,2-2);
Cut apart the through hole (H1) that forms on the plate described first; With
Be used for filling vias will be each other partly overlapping described first and second to cut apart the scolder (2-3) that hardens and lump together.
2. circuit board according to claim 1 is characterized in that described second cuts apart plate and use scolder and described first to cut apart to harden to close, so that it overlaps described first and cuts apart below the plate.
3. circuit board according to claim 1 is characterized in that described first and second cut apart plate and have conductor, and described first and second conductor dbus of cutting apart plate are crossed described scolder and are electrically connected to each other.
4. method of making flexible printed circuit board is characterized in that may further comprise the steps:
To be divided into by heat-resisting, the flexible printed circuit board that insulating material is made first and second cut apart plate (2-1,2-2);
Cut apart first and to form through hole (H1) on the plate; With
Scolder (2-3) inserted through hole and with its fusing, thereby will be each other partly overlapping first and second cut apart plate and mutually combine.
5. method according to claim 4 is characterized in that integrating step may further comprise the steps:
Make first and second to cut apart plate and overlap each other, so that second cut apart plate and be in the below,
With scolder (2-3) insert first cut apart plate through hole and
The scolder of through hole is inserted in fusing, is bonded to each other thereby cut apart plate with first and second.
6. method according to claim 5 is characterized in that filling step comprises by solder printing scolder is packed into step in the through hole, is used for that electronic component/mechanical component is connected first and cuts apart on the plate.
7. method according to claim 4 is characterized in that:
Method also be included in through hole temporarily fix after forming first and second cut apart plate step and
Filling step also comprises and will temporarily fixing first and second cut apart the step that plate mutually combines.
8. method according to claim 5 is characterized in that temporary transient fixing step may further comprise the steps:
To stretch out the benchmark pinboard (3) of a plurality of fastening screws (P1 is to P8) and have fixed head (4) mutual superposition of through hole (PH), so that fastening screw stretches out from the surface that fixed head has been pasted sticking tablet by through hole, wherein forming through hole (PH) with fastening screw and the corresponding position of the sticking tablet on the surface that sticks on via openings
By with fastening screw as guiding, with second cut apart plate be placed in fixed head stickup on the surface of sticking tablet, use sticking tablet temporarily to fix second and cut apart plate,
By sticking tablet is used as guiding, cut apart the zone that forms through hole on the plate with first and be placed in the surface of having pasted sticking tablet on the fixed head, so that it overlaps temporary transient fixing second cuts apart on the part of plate, and use sticking tablet temporarily fix first cut apart plate and
temporarily fix first and second cut apart plate after, the benchmark pinboard is removed from fixed head.
9. method according to claim 8 is characterized in that sticking tablet made by heat proof material.
10. method according to claim 9 is characterized in that sticking tablet made by the silicones that comprises a small amount of low-molecular-weight siloxane.
11. method according to claim 8 is characterized in that sticking tablet sticks on the fixed head according to the recess that falls in the corresponding degree of depth of sticking tablet thickness.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001304952 | 2001-10-01 | ||
| JP304952/2001 | 2001-10-01 | ||
| JP2001304952 | 2001-10-01 | ||
| JP2002085360 | 2002-03-26 | ||
| JP085360/2002 | 2002-03-26 | ||
| JP2002085360A JP3746013B2 (en) | 2001-10-01 | 2002-03-26 | Circuit board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1411328A true CN1411328A (en) | 2003-04-16 |
| CN1196386C CN1196386C (en) | 2005-04-06 |
Family
ID=26623515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021440638A Expired - Fee Related CN1196386C (en) | 2001-10-01 | 2002-09-29 | Flexible printed circuit board and mfg. method thereof |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3746013B2 (en) |
| KR (1) | KR20030028435A (en) |
| CN (1) | CN1196386C (en) |
| TW (1) | TW540258B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4831959B2 (en) * | 2004-04-09 | 2011-12-07 | 三洋電機株式会社 | Pickup and pickup for notebook personal computer |
| CN102893710B (en) * | 2010-04-26 | 2016-04-27 | 泰科电子服务股份有限公司 | PCB antenna layout |
| CN102510665A (en) * | 2011-10-20 | 2012-06-20 | 深圳市五株电路板有限公司 | Method for processing circuit board |
| KR101588498B1 (en) * | 2013-07-24 | 2016-01-25 | 주식회사 엘지화학 | Method for manufacturing structure of flexible printed circuit board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0936505A (en) * | 1995-07-20 | 1997-02-07 | Canon Inc | Flexible printed board original sheet |
| JP3599487B2 (en) * | 1996-06-17 | 2004-12-08 | キヤノン株式会社 | Flexible printed circuit board |
| KR100330584B1 (en) * | 1999-08-30 | 2002-03-29 | 윤종용 | flexible Printed Circuit Board and design method thereof |
| KR20030001773A (en) * | 2001-06-27 | 2003-01-08 | 삼신써키트 주식회사 | Method for designing and manufacturing about electronic parts and production jig |
-
2002
- 2002-03-26 JP JP2002085360A patent/JP3746013B2/en not_active Expired - Fee Related
- 2002-09-29 CN CNB021440638A patent/CN1196386C/en not_active Expired - Fee Related
- 2002-09-30 TW TW091122554A patent/TW540258B/en not_active IP Right Cessation
- 2002-10-01 KR KR1020020059754A patent/KR20030028435A/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003179322A (en) | 2003-06-27 |
| JP3746013B2 (en) | 2006-02-15 |
| KR20030028435A (en) | 2003-04-08 |
| TW540258B (en) | 2003-07-01 |
| CN1196386C (en) | 2005-04-06 |
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