CN1391506A - Conditioner for polishing pad and method for manufacturing the same - Google Patents
Conditioner for polishing pad and method for manufacturing the same Download PDFInfo
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- CN1391506A CN1391506A CN00815709A CN00815709A CN1391506A CN 1391506 A CN1391506 A CN 1391506A CN 00815709 A CN00815709 A CN 00815709A CN 00815709 A CN00815709 A CN 00815709A CN 1391506 A CN1391506 A CN 1391506A
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- substrate
- adjuster
- groove
- polishing underlay
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
Abstract
The present invention discloses a conditioner for polishing pad and a method for manufacturing the same. The conditioner comprises a substrate having formed with a plurality of geometrical protrusions of a uniformed height on at least one of its sides, and a cutting portion having a diamond layer of a uniformed thickness formed substantially on a whole surface of the side of the substrate having the geometrical protrusions. The geometrical protrusions have a flat upper surface or the upper surface may comprise a plurality of smaller geometrical protrusions formed by recessed grooves. The substrate is made from ceramic or cemented carbide materials and has a shape of a disk, a plate having multiple corners, a cup, a segment, or a doughnut with flattened upper and lower surfaces. The conditioner may further comprise a body portion being fixedly attached to the substrate at a side opposite to the side having formed with geometrical protrusions for linking the cutting portion to conditioning equipment. The cutting portion of the conditioner realized by having above shapes and structures makes line and surface contacts with polishing pad surface. The diamond layer coated on the cutting surface strengthens the structural integrity of the cutting surface to increase the cutting performance and imparts anti-wear and anti-corrosive properties to render the conditioner with a prolonged lifetime usage.
Description
Technical field
The present invention relates to a kind of method that is used for the adjuster of polishing underlay and makes this adjuster, especially relate to a kind of being used in the adjuster of the employed polishing underlay of chemically mechanical polishing (CMP) process and the method for making this adjuster.
Background technology
Usually, chemically mechanical polishing is widely used in the process of semiconductor device, to obtain the wafer surface of smooth peace.Typically, a polished wafer is fixed by a carrier that is positioned on the polishing underlay that is arranged on the rotary table (not shown), exert pressure by use cutting fluid on this liner with to this carrier then, thereby polish this wafer by the relative motion of workbench and carrier.The traditional polishing underlay that is used for CMP process comprises usually: a plurality of apertures that are used to show the pumping effect with 30-70m diameter dimension, when when polishing underlay is exerted pressure to obtain higher removal.Yet, after long-time the use, this hole just to some extent wearing and tearing and polished residue block, this will make the surface irregularity of polishing underlay.Consequently, the ability that it is used for polished wafer reduces as time passes, and the efficient of the CMP process of the flat wafer surface of acquisition unanimity also will reduce.
In order to regain polishing performance, and the not plane surface of repairing this polishing underlay, in the CMP process, adopt usually and regulate process, and in regulating process, use is used to remove the adjuster of the not plane surface of polishing underlay.
The structure of the diamond adjuster that is used to regulate polishing underlay has been shown among Figure 1A to Fig. 1 C, and wherein this polishing underlay is made by the conditional electronic deposition process.This diamond adjuster is typically made by an electroplated diamond disk, and wherein diamond particles 16 is dispersed on the stainless steel body 10, and carries out electronic deposition by the bonded metal 18 of for example nickel; Or make by the diamond disc of a brazing, wherein diamond particles 18 is fixed on the body 10 by the bonded metal 18 of fusing.
Yet the adjuster made of the method for electronic deposition and brazing thus will have the cutting surface of differing heights, and this is because the irregular distribution of the diamond particles 16 in the cutting portion 12 as shown in Fig. 1 C causes with different sizes.Particularly, have the diamond particles above the 150-250m diameter dimension in the cutting surface of adjuster, this will cause a undesirable surface roughness.
In addition, owing to have the form polished wafer of the adjuster of said structure with the partial points contact, and because the blunt cutting angle of diamond particles is therefore low by the stock-removing efficiency that this adjuster obtained.Similarly, in order to improve stock-removing efficiency, be necessary in traditional adjustment process, to apply higher pressure.Have that traditional polishing underlay of dual gasket construction normally made by polyurethane material, CMP is finished by upper liner, and bottom liner will provide adjustment process needed pressure.When be applied to the pressure of upper liner when higher by adjuster in adjustment process, because the compressibility of this bottom liner, this adjustment process can not successfully be implemented.Therefore, equating polishing underlay surface will become a large order.
In addition, by the adjuster that the method for electronic deposition and brazing is made, be not used in the groove or the groove of discharging particle from polishing underlay.Consequently, residual particles deposits and accumulates on the adjuster surface, regulates efficient thereby further reduce.
Traditionally, this adjustment process can be carried out simultaneously with the CMP process, instant like this adjustment process is divided into oxide or metal CMP process according to the employed cutting fluid kind of polishing process, and this cutting fluid typically is made up of polishing materials such as silica, aluminium oxide or cerias.The cutting fluid that is used for oxide CMP has the pH value of a 10-12 usually, and the cutting fluid that is used for metal CMP has the pH value less than 4, and the bonded metal 18 that is used for fixed diamond particle 16 on the cutting surface of adjuster is nickel, chromium or metalloid.In the Field adjustment process of implementing oxide or metal CMP, because this polishing process and adjustment process are carried out simultaneously, the bonded metal 18 of fixing this diamond particles 16 also is subjected to the influence of cutting fluid, result to cause diamond particles 16 to come off continually from the adjuster surface.In addition, in metal CMP Field adjustment process, be used for this process and have very highly acid cutting fluid, have the trend that corrosion bonded metal 18 weakens adhesive effect, this will finally cause coming off of diamond particles 16.
On the diamond particles 18 common surfaces attached to polishing underlay that come off, and in polishing process wafer surface is had serious scuffing, this will cause very high defect rate in semiconductor fabrication processes.Therefore, this polishing underlay must be redressed continually.
In addition, in metal CMP Field adjustment process, isolate metal ion often on the metal wire attached to the wafer loop from the bonded metal 18 that is corroded, this will cause short circuit.In addition, isolated metal ion is gone up the metal ion pollution owing to wafer substantially from this Field adjustment process, and owing to the semiconductor defect that should be caused by pollution just can be found in the following process stage, therefore the industrial influence that is lost in that is caused by this defective is appreciable.
Summary of the invention
In view of this, the purpose of this invention is to provide a kind of adjuster that is used for polishing underlay, this polishing underlay has good with consistent surface roughness, be used to prevent coming off and the pollution of metal ion and the defective that causes by diamond particles, and be used for the CMP process of semiconductor wafer, under the situation that lacks high pressure, regulate this polishing underlay effectively.
Second purpose of the present invention provides the method that a kind of manufacturing is used for the adjuster of polishing underlay, and this adjuster has the characteristic and the function of above-mentioned adjuster.
According to the invention provides the adjuster that is useful on polishing underlay, it comprises: have a substrate that forms the geometry projection of a large amount of consistent height at least in a side of substrate; With diamond layer, be formed on basically on the whole surface that substrate has how much projections, one sides with thickness.
Preferably, above-mentioned how much projections have rectangle or columniform shape, and have flat upper surface.Selectively, the upper surface of this geometry projection can have a large amount of by the diagonal cross recesses of a pair of U or V-shaped section or by the formed less geometry projection of the halved belt groove of a plurality of U or V-shaped section.The less geometry projection that is formed on the upper surface of how much projections has the shape of the plan view of a triangle, rectangle or rectangle pyramid.
A large amount of geometry projections that on substrate surface, form, the halved belt of the groove by U or V-shaped section has the form of a halved belt; Wherein the section shape of this U or V-arrangement is to be limited by the sidepiece of how much projections and the bottom of groove.The halved belt of this groove all has the identical width and the degree of depth, and perhaps selectively, a groove with big width and/or degree of depth can form with the halved belt form of interval some grooves, and cuts apart groove as a regionality.
This substrate is not limited to Any shape, as long as a large amount of geometry projections can form just passable in its surface.For example, this substrate can have following shape: disk; Annulus; Or has a dish type in a plurality of zones; Or the outer annular portion in the middle part of the side formation one of substrate is higher than, to obtain to have the substrate of a cup section shape.Selectively, this annular substrate can have an outer strap that is formed with the subsection part that a plurality of grooves that radially extend from the center of substrate cut apart, and wherein can be formed with a large amount of how much projections on this substrate.
This diamond layer is that the method by chemical vapor deposition (CVD) thinly, flatly is deposited on the lip-deep of this substrate.
Preferably, this substrate is made by pottery or bonding carbide material.
Adjuster of the present invention further comprises: be formed on the body on the opposite side with how much projections, its function is to be used for this adjuster is connected to conditioning equipment.Preferably, this body is made by stainless steel, engineering plastics or ceramic material.
Another preferred form of the present invention, this adjuster has a segmented shape, and wherein this body has the annulus section shape of a flat upper and lower surface or the section shape of a cup.This adjusting also comprises a plurality of independent segmented cutting portion of cutting apart at a certain distance, and is arranged on securely on the surface of this body, to present the shape of a belt; Wherein, this independent segmented cutting portion is arranged on respectively on the substrate of being made by pottery or bonding carbide material.In addition, the diamond layer with thickness basically forms on the whole surface of substrate.
The adjuster that the present invention has various planforms is to be made by such method, the method includes the steps of: a) pass through for example high-rate cutting wheel of diamond wheel of use one, and have the halved belt that forms groove on the substrate of definite shape, thereby the form with the unanimity height forms a large amount of how much projections on the surface of this substrate; And b) by the method for chemical vapor deposition (CVD), forms diamond layer, cover substantially on the whole surface by finished this substrate of step a) with thickness.
At implementation step b) before, this method selectively comprises: by grinding and/or cutting process, with the step of predetermined crisscross formation some grooves, thereby the form with the unanimity height forms a large amount of less geometry projections on the surface of this geometry projection.
Formed substrate with groove can have the multiple shape of having described as the front, and this geometry projection is to realize by the depressed part of grinding and/or the formed groove of cutting process.The groove that forms with the halved belt form makes this geometry projection that is produced on substrate surface have the form of a halved belt.
In implementation step a) before, more preferably this method further comprises: make substrate stand to finish grind step with the attrition process process, obtaining consistent surface at least one side of substrate, and obtain substantially parallel substrate surface.
Selectively,, can finish, wherein inject predetermined molded composition earlier, and in the mould of the substrate shape that has how much projections, cool off by the mould process process as the step of in step a), being summarized that on substrate surface, forms how much projections.
This method can further be included in the step that a body is set on the opposite side that substrate is formed with how much projections, is used for adjuster is connected to conditioning equipment.
More preferably, this substrate is made by pottery or bonding carbide material, and this body is made by stainless steel, engineering plastics, pottery or similar material.
Description of drawings
Describe the preferred embodiments of the present invention in conjunction with the drawings in detail, above-mentioned purpose of the present invention and other superiority will be more obvious.
Describe other embodiments of the invention in conjunction with the drawings in detail, above-mentioned purpose of the present invention and other superiority will be more obvious.
A kind of conventional regulator that is used for polishing underlay has been shown among Figure 1A to Fig. 1 C, and wherein Figure 1A is a plane, and Figure 1B is the cutaway view along A-A ' line among Figure 1A, and Fig. 1 C is the amplification view of the part of conventional regulator;
A kind of adjuster that is used to polish the liner of being made by a substrate according to first preferred embodiment of the present invention has been shown among Fig. 2 A to Fig. 2 D, this substrate has disc-shape, wherein Fig. 2 A is a plane, Fig. 2 B is the cutaway view along B-B ' line among Fig. 2 A, and Fig. 2 C and Fig. 2 D are respectively the plane enlarged drawing and the cutaway view of this adjuster body and cutting portion;
Fig. 2 E is that this substrate has disc-shape according to the plane of the adjuster of being made by a substrate of another preferred embodiment of the present invention;
Fig. 2 F is that this substrate has disc-shape according to the adjuster body of being made by a substrate of another preferred embodiment of the present invention and the amplification view of cutting portion;
Illustrated among Fig. 3 A and Fig. 3 B according to of the present invention and have an adjuster of being made by the substrate of toroidal, wherein Fig. 3 A is a plane, and Fig. 3 B is the cutaway view along C-C ' line among Fig. 3 A;
The adjuster of being made by a toroidal substrate according to another preferred embodiment again of the present invention has been shown among Fig. 4 A and Fig. 4 B, this substrate its one of have a plurality of scallop of isolating on the surface of side by concave portion, wherein Fig. 4 A is a plane, and Fig. 4 B is the cutaway view along D-D ' line among Fig. 4 A;
Illustrated among Fig. 5 A and Fig. 5 B and have one according to another preferred embodiment again of the present invention and the cup-shaped adjuster that a body is made is set by going in ring one on the substrate, wherein Fig. 5 A is a plane, and Fig. 5 B is along the cutaway view of E-E ' line among Fig. 5 A;
Illustrated among Fig. 6 A and Fig. 6 B according to another preferred embodiment again of the present invention by form the adjuster that fan-shaped cutting portion with a band shape is made on the substrate surface that goes in ring, wherein Fig. 6 A is a plane, and Fig. 6 B is along the cutaway view of F-F ' line among Fig. 6 A;
Fig. 7 A and Fig. 7 B are the enlarged perspective and the cutaway views of the adjuster shown in Fig. 2 E, wherein show the surface texture of the cutting portion with how much projections of a large amount of consistent rectangles of arranging;
Fig. 8 A and Fig. 8 B are the enlarged perspective and the cutaway views of the adjuster shown in Fig. 2 A, wherein show the surface texture of the cutting portion with how much projections of the regional rectangle of forming;
Fig. 9 A and Fig. 9 B are the enlarged perspective and the cutaway views of a kind of adjuster of the present invention, wherein show the surface texture of the cutting portion with regional cylindrical geometric projection of forming;
Figure 10 A and Figure 10 B are the enlarged perspective and the cutaway views of how much projections of rectangle of a kind of adjuster of the present invention, wherein show the surface texture with the geometry projection that is formed by a plurality of little how much projections of rectangle;
Figure 11 A and Figure 11 B are the enlarged perspective and the cutaway views of how much projections of rectangle of a kind of adjuster of the present invention, wherein show the surface texture of the geometry projection that is formed by a plurality of little geometry projections, and described little geometry projection has the rectangle pyramidal shape;
Figure 12 A and Figure 12 B are the enlarged perspective and the cutaway views of how much projections of rectangle of a kind of adjuster of the present invention, wherein show the surface texture of the geometry projection that is formed by a plurality of little triangle geometry projections, described little triangle geometry projection is divided into by a pair of diagonal cross recesses;
Figure 13 A to Figure 13 D is the cutaway view according to the manufacture method of the cutting portion of a kind of adjuster of the present invention;
Illustrated among Figure 14 and be used to make a substrate and be arranged on diamond wheel on the polissoir;
Figure 15 is the practical photograph by the cutting portion of a kind of adjuster of method manufacturing of the present invention;
Figure 16 A and Figure 16 B are the side view of how much projections of rectangle of forming on the cutting portion by a kind of adjuster of method manufacturing of the present invention and the electron micrograph of top view;
Figure 16 C is the electron micrograph of the side view of rectangle how much projections, in order being distinguished the part on it to be cut away, and to show the diamond layer that forms on the substrate by method manufacturing of the present invention.
The specific embodiment
To describe the preferred embodiments of the present invention in detail below, and the embodiment that provides will further specify the present invention, and be not to limit scope of the present invention.
At first, can a kind ofly realize adjuster of the present invention by from a series of difformities and structure arranged, selecting, and below will describe the preferred embodiment of making, having the adjuster of various versions according to the present invention in detail.
With reference to Fig. 2 A, one body 20 is to be made by a kind of material with anticorrosive property and chemical stability, for example (be not limited to) polytetrafluoroethylene (PTFE) (teflon) or stainless steel, and by turning or grinding or pass through a kind of shape that mould process obtains this body 20.
This body 20 that securely connects or be provided with a cutting part 22 is to be used for adjuster of the present invention is connected on the motor rotating part (not shown) of conditioning equipment, and this body 20 can have different shape.For example, if when this body 20 is connected on the cutting portion 22 of the geometry projection with the surface that is higher than this body 20, then this body 20 has a kind of cup-shaped or annular and have a shape of smooth upper surface and lower surface.Yet this body 20 and its function are for realizing that the present invention is not essential the requirement, and in fact, in one of the preferred embodiment, this cutting portion 22 can be directly connected on the conditioning equipment with body 20 therein.Therefore, the preferred embodiments of the present invention consider that the structure of cutting portion 22 makes, and consider that more especially the shape of its surface texture and arrangement make.
(1) preferred embodiment 1
A kind of adjuster with disc-shape according to first preferred embodiment of the invention has been shown among Fig. 2 A to Fig. 2 F, and this adjuster comprises a body 20, a cutting part 22 and a substrate 50.
Shown in Fig. 2 A to Fig. 2 D, this cutting portion 22 has how much projections 28 of rectangle of the regional unit of a large amount of formation halved belt forms on the surface of substrate 50, Fig. 8 A and Fig. 8 B are perspective view and the cutaway views that amplifies, and wherein closely show the halved belt form of how much projections 28 of rectangle of this cutting portion 22.
This substrate 50 preferably has a disc-shape, but it can be the plate shape with a plurality of angles, and it is important that this substrate 50 has surface smooth, consistent roughness, owing on the whole surface of substrate 50, form after the diamond layer 52, the shape that also must keep how much projections of rectangle is to obtain a kind of adjuster with high-efficient cutting ability.
How much projections 28 of rectangle with consistent height are that the groove 24 and 26 by the halved belt of the depression with U-shaped section is formed on the side surface of substrate 50.More particularly, recessed trench 24 and 26 side and bottom have a circular shape, and their width little by little reduces to bottom direction, to give how much projections of rectangle 28 1 wideer and thicker base portions.Consequently, how much projections 28 of this rectangle have such structure, are the desired rigidity and the characteristic of fragility to strengthen for substrate surface.Selectively, this groove 24 and 26 has the cutaway view of a V-arrangement.
Groove 24 is Region Segmentation grooves, and groove 26 to be unit that are partitioned into how much projections 28 of each rectangle on substrate surface cut apart groove.Shown in Fig. 2 A to Fig. 2 D, cutting apart Region Segmentation groove 24 that groove 26 has the bigger width and/or the degree of depth than the unit is to be provided with at interval regularly according to the some that groove 26 is cut apart in the unit.For example, shown in Fig. 2 A to Fig. 2 D, groove 24 can two crisscross on form setting, regionally how much projections of this rectangle are separated into 4 * 4 group every four grooves.Here, groove 24 and 26 effect are to discharge remaining particle from polishing underlay in adjustment process.
Shown in Fig. 2 A, the region separation groove 25 that has the bigger width and/or the degree of depth than groove 24 and 26 can be arranged on the center of substrate surface with the form of halved belt, thereby more effectively discharges remaining particle.
The whole lip-deep diamond layer 52 that covers substrate 50 is formed on the surface of how much projections 28 of rectangle of cutting portion 22 and groove 24,25,26 thinly and as one man.
Figure 10 is the practical photograph of the cutting portion 22 made by said method, and diameter that this cutting portion 22 has and thickness are 100 * 4t.
Figure 16 A to Figure 16 C is the electron micrograph of the rectangular protrusions that is coated with diamond layer 52 28 with cutting portion 22 of preferred embodiment, Figure 16 A and Figure 16 B show the side view and the top view of how much projections of this rectangle, and another side views of how much projections 28 of rectangle has been shown among Figure 16 C, in order visually to be distinguished the part on it is cut away, and show the lip-deep diamond layer 52 of the cutting portion 22 that is formed on substrate 50, from electron micrograph, as can be seen, be deposited on how much projections 28 of rectangle and the groove 24 of substrate 50,26 lip-deep diamond layer 52 has very thin and consistent thickness.
(2) preferred embodiment 2
In this embodiment, the various and selectable spread patterns that had on substrate surface of how much projections can realize by the layout of groove and the change of structure.Shown in Fig. 2 E, identical shaped groove can be formed on the cutting portion 22a in the substrate surface with the identical width and/or the degree of depth.Enlarged perspective and cutaway view by formed how much projection arrangement of the groove among Fig. 2 E have been shown among Fig. 7 A and Fig. 7 B.For this spread pattern, preferably make groove 26a have the bigger width and/or the degree of depth, to discharge the residue of polishing underlay effectively from the surface of cutting portion 22a than the groove shown in Fig. 2 A 26.
(3) preferred embodiment 3
In this embodiment, the different shape of how much projections can be realized.The shape of how much projections 28 is not limited only to rectangular shape, and selectively, shown in Fig. 2 F, the geometry projection 28b that is formed on the cutting portion 22b has a cylindrical shape.Enlarged perspective and cutaway view with the cutting portion 22b that is formed by cylindrical geometry projection 28b has been shown among Fig. 9 A and Fig. 9 B, similar with substrate with how much projections of rectangle, on its cutting portion 22b, have the substrate that forms by cylindrical geometry projection 28b and also have a diamond layer 52.The design of this cylindrical geometry projection 28b is arranged can have identical spread pattern with first and second preferred embodiments, perhaps can realize by having the form of radially extending band from the center of substrate.
(4) preferred embodiment 4
The geometry projection of front preferred embodiment has a smooth upper surface, but in this embodiment, the upper surface of how much projections is formed by a plurality of how much projections 40 of less rectangle with halved belt form.The perspective view and the cutaway view that have the how much projection 28a of rectangle that formed by how much projections 40 of little rectangle in its surface have been shown among Figure 10 A and Figure 10 B, as shown in the figure, groove 26 identical with shown in the embodiment of front, and a diamond layer 52 also covers on the surface of substrate 50.
The halved belt of how much projections 40 of this less rectangle by groove 42 is formed on the upper surface of how much projection 28a of rectangle of substrate 50, and similar to groove, this groove 42 is a circular arc at its sidepiece and bottom, and has the section profile of a U-shaped.The width of groove 42 successively decreases to its bottom direction, to give how much projections of less rectangle 40 1 wideer and thicker base portions.Rectangle how much projection 28a and less how much projections 40 of rectangle all have the characteristic of such one wide base structure, to strengthen for the desired stiffness characteristics of substrate surface.Selectively, groove 42 can have the cutaway view of a V-arrangement.The residue of polishing underlay will be more effectively discharged in the existence of how much projections 40 of this less rectangle from the surface of the adjuster that is produced, to improve the efficient of adjustment process.
The shape of this groove and groove preferably has the section shape of U-shaped with respect to V-shaped groove.Usually, groove and groove with U-shaped section shape are more effective when discharging the adjusting residue from substrate surface, and this is because their bottom is broader.In addition, except the section shape of this groove and groove, above-mentioned discharge efficient also is subjected to the size of this groove and groove and the influence of design form.Therefore, can realize that the various combinations of above-mentioned factor are to obtain a desired discharge efficient.
(5) preferred embodiment 5
In the present embodiment, the less geometry projection 44 that has the rectangle pyramidal shape in a large number forms on the upper surface of how much projection 28b of rectangle of substrate 50, shown in Figure 11 A and Figure 11 B, the upper prong of how much projections 44 of less rectangle pyramid is to form the groove 42a that is adjacent to each other by the form with halved belt to obtain.Here, the upper prong of less how much projections 44 of rectangle pyramid makes this tip contact with the polishing underlay surface in adjustment process.
The stock-removing efficiency of adjuster with rectangle how much projections that have flat upper surface by the form that contacts with line or surface with the polishing underlay surface is with respect to the stock-removing efficiency height with the adjuster of a contact form, yet, owing to how much projections 44 of the less rectangle pyramid on the upper surface that is formed on how much projections of rectangle have consistent height and size, therefore it is different that this cutting surface with the conventional regulator shown in Fig. 1 C has irregular height, by not being the stock-removing efficiency that is lower than significantly with the adjuster of line or surface contact with a stock-removing efficiency of the adjuster that present embodiment was produced that contacts with the polishing underlay surface.
(6) preferred embodiment 6
In this embodiment, have on the upper surface of how much projection 28c of each rectangle that groove 42b that four triangular shaped less geometry projections 46 intersect by diagonal and 42c be formed on substrate 50.Figure 12 A and Figure 12 B are the perspective view and the cutaway views of present embodiment, according to discharge efficient and with the contact form on polishing underlay surface, present embodiment with the how much projection 28c of rectangle that are formed with less triangle geometry projection 46 in its surface, show than how much projections 28 of the rectangle with flat upper surface better discharge effect is arranged, and make and to compare the contact area bigger with 28b with contacting of polishing underlay surface than having the rectangle geometry projection 28a that are formed with how much projections 40 of less rectangle and less how much projections 44 of rectangle pyramid respectively.
(7) preferred embodiment 7
Among the embodiment in front, how much projections 28,28a, 28b and 28c are formed on the side surface of the disc-shape substrate 50 with a plurality of zones.Yet the present invention also can realize by having difform substrate.In the present embodiment, substrate 50a has the toroidal of a flat upper and lower surface.
Plane and the cutaway view of substrate 50a with a toroidal cutting portion 22c have been shown among Fig. 3 A and Fig. 3 B, on cutting portion 22c, be formed with previously described how much projections 28,28a, 28b or 28c, selectively, substrate can have the annulus that the one open surface is sealed and be rendered as the shape of a cup.
Fig. 5 A and Fig. 5 B are plane and the cutaway views with adjuster of a cup-shape, wherein have on toroidal and the upper surface be arranged on the body 20a with a cup-shape at the substrate 50c that is formed with a diamond layer 52c on the surface of cutting portion 22e of a flat upper and lower surface.
(8) preferred embodiment 8
In the present embodiment, can realize having the adjuster of segmentation cutting portion.Shown in Fig. 4 A and Fig. 4 B, substrate 52b toroidal or the toroidal that the one open surface is sealed with flat upper and lower surface has by the formed a plurality of segmentation cutting portion 22d of the groove that radially extends from the center of substrate 52b.Be formed with projection 28,28a, 28b or 28c on this segmentation cutting portion 22d how much, and this substrate 52b further comprises a diamond layer 52d.
The another kind of version of segmentation cutting portion has been shown among Fig. 6 A and Fig. 6 B.Constitute by their substrate 50d respectively and separated at a certain distance to each other a large amount of independently segmentation cutting portion 22f is arranged on the surface of body 20b regularly to present the shape of a belt.Body 20b has a kind of toroidal of flat upper and lower surface, or the toroidal sealed of a kind of one open surface, and each the substrate 50d with segmentation cutting portion 22f is covered by a diamond layer 52d.
In the preferred embodiment, for example understood geometry projection in the above with rectangle or cylinder form.Yet this geometry projection can be realized by the shape of other broad range, as leg-of-mutton or hexagonal.Similarly, in the preferred embodiment, for example understood how much projections of rectangle that preferably have square shape, yet this geometry projection can be realized also, as rhombus by tetragonal other various forms.
Below, will be described with reference to the accompanying drawings a kind of method of preferred embodiment that is used in the adjuster of polishing underlay according to the present invention that is used to make.
At first, below explanation is used to make method according to first preferred embodiment of adjuster of the present invention.
Figure 13 A to Figure 13 D is the cutaway view that is used to make the method for a cutting part 22, shown in Figure 10 A and Figure 10 B, has the how much projection 28a of rectangle that are formed with how much projections 40 of less rectangle on the surface of cutting portion 22.
At first, the substrate 50 with a disc-shape is made by above-mentioned ceramic material or bonding carbide material.This substrate 50 obtains its diameter through a manufacture process and thickness is 100 * 4t then.
Secondly, a side of the cutting portion that is formed with on this substrate 50 is carried out Surface Machining by corase grind and the correct grinding process of using a diamond wheel equipment, to obtain consistent and well surface roughness, flatness and the depth of parallelism.Then, this substrate 50 carries out the double-side grinding process by using a milling apparatus (not shown), and here, a cutting surface that will be formed with the substrate 50 of how much projections of rectangle will be by correct grinding to good degree, up to the flatness that obtains 1m.
Once more, shown in Figure 13 B, the halved belt of region separation groove 24 ' and unit separation groove 26 ' forms on the cutting surface of substrate 50 by using the diamond wheel equipment shown in Figure 14.Diamond wheel equipment comprises a motor 152, axle 154a and 154b, and comprise diamond wheel 156a, be arranged on the wheel assembly 156 of the dividing plate 156b between the diamond wheel 156a, and the flange 157a and the 157b that are arranged on wheel assembly 156 two ends.The thickness of diamond wheel 156a is by the decision of the width of formed groove 24 ' and 26 ', and the shape of diamond wheel 156a should be circular, to give the section shape of groove 24 ' and 26 ' U-shaped.Therefore, groove 24 ' and 26 ' width successively decrease to its bottom direction, and give formed how much projection 28a a thicker and wideer base portion, this will cause strengthening the rigidity of the substrate of being made by ceramic material or bonding carbide material 50 and the characteristic of fragility.In addition, groove 24 ' and 26 ' circular arc U-shaped section also provide the additional function of discharging the polishing pad residue from the cutting surface of adjuster.
Representative, diamond wheel 156a has by metal or resin bonding in the diamond blade portion of the diamond particles of its disking body end, and when using the diamond wheel of resin bonding, can obtain good this diamond wheel 156a desired circular arc curvature in diamond layer, can also more effectively obtain circular arc curvature by the method for in the cavetto process, using grinding stone to remove resin bonding material and diamond particles.
Form groove 24 ' and 26 ' by substrate 50 is arranged on the processing platform 164 regularly, the processing platform that substrate 50 is housed then moves up to be cut towards the direction of the diamond wheel 156a of rotation.After grinding, substrate revolved turn 90 degrees and be fixed on once more on the processing platform 164, and the working angles that repeats the front is to form the halved belt of this groove 24 ' and 26 '.Here, in order to form Region Segmentation groove 24 ', cut apart the diamond wheel 156a that this diamond wheel 156a of groove 26 ' has big thickness and use than being used to form the unit.The width of how much projection 28a of formed rectangle is controlled by the gap between the diamond wheel 156a.Especially, when the gap between the diamond wheel 156a reduces, can form how much projection 28a of narrower rectangle.Yet, preferably the distance in this gap must not be arranged to thickness less than diamond wheel 156a, rupture in manufacture process to prevent how much projections 28 of this rectangle.Illustrated among Figure 10 A by how much projection 28a (being pre-formed diamond layer) of the formed consistent rectangle that is provided with of above-mentioned processing.Figure 15 one is formed on the practical photograph of rectangle how much projections on a cutting part.How much projections of this rectangle have the 190m of being of a size of (length) * 190m (wide) * 200m (height).
With reference to accompanying drawing 13C, the halved belt of groove 42 ' is formed on the surface of rectangle how much projections 28 ', has a diamond wheel 156a of little thickness by use, with form a large amount of each have how much projections 40 ' of less rectangle of 30m * 30m * 30m size.Here, length, the width of how much projections 40 ' of this less rectangle and highly have identical value, and it is similar with how much projections 28 ' of rectangle, how much projections 40 ' of this less rectangle have the base portion of a thicker and broad, to strengthen and the more weak rigidity of the substrate that compensation is made by ceramic material.
By the cutting edge of how much projections 40 ' of less rectangle with consistent height of above-mentioned process processing, will be by the form that contact with line with the polishing underlay surface, the further cutting power of the adjuster that produced of raising; Meanwhile, how much projections 40 ' of less rectangle can also be by helping the discharge from cutting surface of cutting fluid and particle residue, to increase the discharge efficient of adjuster.In addition, how much projections 28 ' of rectangle with how much projections 40 ' of less like this rectangle can make cutting fluid shunt fifty-fifty in the adjustment process on the spot effectively.
Shown in Figure 13 D, forming how much projections 40 ' of less rectangle afterwards, this substrate is processed to form a diamond layer 52 through chemical vapor deposition (CVD) then.Utilize a widely used traditional C VD equipment, be used to have the CVD processing of the following condition described in table 1, and use four inches Si
3N
4Substrate to deposit this diamond layer 52.
Table 1: the condition that is used for CVD processing
| Gas and flow rate | H2 gas (1000ml/min), CH 4Gas (20ml/min) |
| Chamber pressure | ????10Torr |
| Filament temperature | ????2200℃ |
| Working voltage | ????+100Volt |
| Sedimentation time | Greater than 8 hours |
This will obtain one be bonded in substrate 50 securely lip-deeply have a diamond layer 52 thin and thickness.Because diamond layer 52 has thin and consistent thickness, therefore after deposition process, can keep the surface texture of substrate 50.Follow the above-mentioned condition of chemical vapor deposition processes just can be applied to one of many suitable condition of CVD process in the present invention.
Form on substrate surface after the diamond layer 52, a body 20 of making in advance is arranged on the substrate 50 regularly.The function of this body 20 is that the adjuster that is used for being produced is connected to conditioning equipment, to control the process of cutting polishing underlay better.Selectively, do not have the compensate function of body 20, can realize the adjuster that does not have body 20 as preferred embodiment is described yet.
The method of the adjuster that is used to make first preferred embodiment of the present invention has been described above.Yet those skilled in the art can make the adjuster of other preferred embodiment, the preferred embodiment shown in Fig. 2 E, 3A, 4A and 5A by said method.Especially, the preferred embodiment of adjuster as shown in Figure 6A with segmentation cutting portion, after can be on substrate 50 covering diamond layer, again by substrate 50 is realized through the correct grinding process, to obtain high-caliber surface with desired consistent roughness by the CVD process.Then, the substrate 50 with this diamond layer is cut into independently segmentation cutting portion, and this cutting portion is provided with on the surface of body 20 securely with the spread pattern shown in Fig. 6 A.
In addition, how much projections 44 of the less rectangle pyramid shown in Figure 11 A and Figure 11 B can obtain by being chosen in the diamond wheel 156a that its outside diamond layer has the curvature of suitable thickness and circular arc.Similarly, the less triangle geometry projection 46 shown in Figure 12 A and Figure 12 B can obtain by using a suitable diamond wheel 156a.How much projections of the rectangle with flat surface as shown in Fig. 7 A, 7B, 8A and 8B can directly cover diamond layer, and needn't be through the process shown in Figure 13 C.
On the other hand, the cylindrical geometry projection 28b shown in Fig. 9 A and 9B can obtain by molded with the integrally formed substrate of cylindrical geometry projection 28b in it more effectively by molded acquisition.The cylindrical geometry projection 28b of substrate is through the correct grinding process then, continue directly by chemical vapor deposition processes to cover diamond layer.Similarly, the substrate with rectangle how much projections also can be obtained by molding process.
In addition, the present invention has the groove of V-shaped section and groove can be by using a diamond wheel with rectangular end, and obtain by processed substrate rotation 45 degree are processed.
Demonstrate uncommon cutting power by adjuster provided by the present invention, with and approach adamantine wear-resisting and anti-corrosion property and make this adjuster have a service life that has prolonged.The geometry projection of this cutting portion also has the function as cutting edge except it carries out the premiere feature of line contact, and allows this adjuster and polishing underlay to put and the contacting of face.The diamond layer that forms on cutting surface provides uncommon rigidity and fragility characteristic for this adjuster.Particularly, this diamond layer has strengthened the structural intergrity of cutting surface, with the wearing and tearing of the sharp keen cutting edge of cutting edge that reduces to bring owing to the polishing particle in the cutting fluid (as aluminium oxide, silica and ceria).In addition, by having the diamond layer that covers on the cutting surface, can eliminate to be prevalent in the conventional regulator diamonds separated particle from the cutting surface, and can prevent in the metal CMP process metal ion pollution in the wafer loop of bringing by the bonded metal of corrosion from the surface of conventional regulator.In addition, have thin and diamond layer thickness, in the grinding capacity that increases adjuster, also provide consistent cutting ability.Once more, have the groove of U or V-shaped section and groove by discharging residual particles effectively, and further improve the stock-removing efficiency of adjuster from cutting surface.
Industrial usability
Therefore, make by adjuster provided by the present invention to obtain and to control a desired cutting ability to become possibility, and a kind of superior form of not using high pressure just can realize efficient adjusting is provided.Consequently, can obtain to have the polishing underlay on consistent adjusting surface, to reduce the generation of trickle cut on wafer surface, thereby adjuster that can the application of the invention is regulated polishing underlay, to prolong the life-span of this polishing underlay, and improve the productivity ratio of semiconductor wafer and reduce production costs.
It is quite simple to be used to the method made according to adjuster of the present invention, and has in the adjuster process of cutting portion of difformity and size in manufacturing, has the distinguished superiority of being limited to is arranged.Owing to the surface roughness difference of the polishing underlay that is used for the polished wafer loop and the wafer of making by kinds of materials, therefore by method provided by the present invention by regulating and the size of how much projections of control, distance, distance between the groove and the thickness of diamond layer between the groove, make the possibility that creates of the adjuster that is applicable to polishing underlay with different surface roughness.Therefore, the method that is used for the adjuster of polishing underlay according to manufacturing of the present invention has more flexibility and adaptability than the method for conditional electronic deposition and brazing.
Wherein certain embodiments of reference is passed through in the front, the present invention has been carried out detailed displaying and explanation; Be appreciated that the present invention is not limited only to these preferred embodiments, but those skilled in the art as below the spirit and scope of the invention that claim limited in, can carry out variations and modifications.
Claims (36)
1. adjuster that is used for polishing underlay, it comprises: a substrate is formed with the geometry projection of a large amount of consistent height at least in the one side; With a diamond layer, the diamond layer with thickness is formed on the whole surface of substrate one side with how much projections basically.
2. the adjuster that is used for polishing underlay according to claim 1 is characterized in that: this geometry projection has a cylindrical shape.
3. the adjuster that is used for polishing underlay according to claim 1 is characterized in that: this geometry projection has a rectangular shape.
4. the adjuster that is used for polishing underlay according to claim 3 is characterized in that: this geometry projection is formed with the diagonal cross recesses of a pair of U of having or V-arrangement on their upper surface.
5. the adjuster that is used for polishing underlay according to claim 3 is characterized in that: this geometry projection is formed with the halved belt of the groove of a plurality of U of having or V-arrangement on their upper surface.
6. the adjuster that is used for polishing underlay according to claim 5 is characterized in that: the halved belt of this groove forms at each interval, to form the less geometry projection with consistent height on the upper surface of how much projections.
7. the adjuster that is used for polishing underlay according to claim 5 is characterized in that: the halved belt of this groove forms with being adjacent to each other, to form the less geometry projection with consistent height on the upper surface of how much projections.
8. the adjuster that is used for polishing underlay according to claim 1 is characterized in that: the geometry projection that is formed on the substrate surface has the form of a halved belt, this by the groove with U or V section shape halved belt produced.
9. the adjuster that is used for polishing underlay according to claim 1, it is characterized in that: the geometry projection that is formed on the substrate surface has the form of halved belt, this is to realize by the halved belt of second groove of the halved belt of first groove and the bottom width by having broad than first groove, this second groove is that the compartment of terrain forms with first groove of some, and first and second grooves all have the section shape of U or V-arrangement.
10. the adjuster that is used for polishing underlay according to claim 1 is characterized in that: have at least the substrate that is formed with how much projections in the one side and have the disk in a plurality of zones or the shape of dish type.
11. the adjuster that is used for polishing underlay according to claim 1, it is characterized in that: this substrate has the disk in a plurality of zones or the shape of dish type, and the inside and one that is formed with a depression in the one side is higher than this inner outer annular portion, to give this substrate one cup-shaped section, wherein this outer annular portion can have other geometry except that toroidal, and is formed on on-chip how much projections and is positioned on the upper surface of this outer annular portion.
12. the adjuster that is used for polishing underlay according to claim 1 is characterized in that: have at least in the one side and be formed with the toroidal that the substrate of how much projections has flat upper and lower surface.
13. the adjuster that is used for polishing underlay according to claim 1, it is characterized in that: this substrate has the disk in a plurality of zones or the shape of dish type, and the inside and one that is formed with a depression in the one side is higher than this inner outer annular portion, to give this substrate one cup-shaped section, wherein this outer annular portion can have other geometry except that toroidal, and have a plurality of subsection parts of cutting apart by the groove that radially extends from the center of substrate, and be formed on on-chip how much projections and be positioned on the upper surface of this subsection part.
14. the adjuster that is used for polishing underlay according to claim 1 is characterized in that: this diamond layer is formed by chemical vapor deposition (CVD).
15. the adjuster that is used for polishing underlay according to claim 1 is characterized in that: this substrate is made by pottery or bonding carbide material.
16. the adjuster that is used for polishing underlay according to claim 1 is characterized in that: this adjuster further comprises a body, this body be arranged on securely with the substrate that is formed with the opposite sides of how much projections on.
17. the adjuster that is used for polishing underlay according to claim 16, it is characterized in that: this body has the annulus section shape of flat upper and lower surface, or the annulus section shape sealed of the open surface of one end, and have a plurality of isolated at a certain distance independent segmented portions, and be arranged on securely on the surface of body, to present the shape of a belt.
18. the adjuster that is used for polishing underlay according to claim 16 is characterized in that: this body is made by a kind of material of selecting from following one group of material at least, and they comprise: stainless steel, engineering plastics and pottery.
19. an adjuster that is used for polishing underlay, it comprises: a substrate, be formed with a large amount of consistent geometry projections highly in the one side, and wherein this geometry projection has the halved belt by the groove of U or V-shaped section, has the form of a halved belt and form; With a diamond layer, this diamond layer with thin thickness is by chemical vapor deposition (CVD), covers substantially on the whole surface that substrate has how much projection one sides.
20. the adjuster that is used for polishing underlay according to claim 19, it is characterized in that: the halved belt form of this geometry projection comprises one first groove and one second groove, this second groove has the bigger degree of depth and/or width than first groove, and wherein this second groove is provided with the formal rule ground between this first groove of some.
21. the adjuster that is used for polishing underlay according to claim 19 is characterized in that: this substrate is to be made by pottery or bonding carbide material.
22. adjuster that is used for polishing underlay, it comprises: a substrate, be formed with the geometry projection of a large amount of consistent height in the one side, wherein this geometry projection has the halved belt by the groove of U or V-shaped section, have the form of a halved belt and form, and on their upper surface, have the less geometry projection that forms by the groove band in a large number; With a diamond layer, this diamond layer with thin thickness is by chemical vapor deposition (CVD), covers substantially on the whole surface that substrate has how much projection one sides.
23. the adjuster that is used for polishing underlay according to claim 22, it is characterized in that: be formed on the less geometry projection on the upper surface of this geometry projection, at least have the shape of a plan view of selecting from following one group of shape, these shapes comprise triangle, rectangle and rectangle pyramid.
24. the adjuster that is used for polishing underlay according to claim 22 is characterized in that: this substrate is to be made by pottery or bonding carbide material.
25. the adjuster that is used for polishing underlay according to claim 22, it is characterized in that: this geometry projection is formed on: a) have on the surface of at least one side of substrate of the disk in a plurality of zones or disc shape, b) be higher than on the surface of ring part of substrate inside with a cup-shape, c) have on the surface of at least one side of substrate of flat upper and lower surface toroidal, or d) have on the surface of formed subsection part on the ring part of substrate of a cup-shape or on the surface of the formed subsection part of a side of annular substrate.
26. the adjuster that is used for polishing underlay according to claim 22 is characterized in that: formed groove has the form of a halved belt or the form that a diagonal intersects on the upper surface of how much projections.
27. an adjuster that is used for polishing underlay, it comprises: the body with an annular or cup-shape; A plurality of independent segmented cutting portions, this cutting portion is spaced apart at a certain distance, and is arranged on securely on the surface of this body, to be rendered as a band shape; One has the substrate on flat surface, is formed with independent segmented cutting portion on it respectively, and wherein this substrate is to be made by pottery or bonding carbide material; With a diamond layer, the diamond layer with thickness covers on the whole surface of substrate substantially.
28. a manufacturing is used for the method for the adjuster of polishing underlay, it comprises following steps: a) have the halved belt that forms groove on the substrate of definite shape, thereby the form with the unanimity height forms a large amount of how much projections on the surface of this substrate; And b) by the method for chemical vapor deposition (CVD), forms diamond layer, cover substantially on the whole surface by finished this substrate of step a) with thickness.
29. manufacturing according to claim 28 is used for the method for the adjuster of polishing underlay, it is characterized in that: this geometry projection is formed on: a) have on the surface of at least one side of substrate of the disk in a plurality of zones or disc shape, b) be higher than on the surface of ring part of substrate inside with a cup-shape, c) have on the surface of at least one side of substrate of flat upper and lower surface toroidal, or d) have on the surface of formed subsection part on the ring part of substrate of a cup-shape or on the surface of the formed subsection part of a side of annular substrate.
30. manufacturing according to claim 28 is used for the method for the adjuster of polishing underlay, it is characterized in that: this geometry projection has the shape of a rectangle, and arranges with the form of halved belt.
31. manufacturing according to claim 30 is used for the method for the adjuster of polishing underlay, it is characterized in that: further comprise in the step a) by grinding and/or cutting process, with the step of predetermined crisscross formation some grooves, thereby the form with the unanimity height forms a large amount of less geometry projections on the surface of this geometry projection.
32. manufacturing according to claim 28 is used for the method for the adjuster of polishing underlay, it is characterized in that:, be that the grinding and/or the cutting process of the high-rate cutting wheel of diamond wheel form by for example using at groove on the substrate surface and the groove on the geometry protrusion surface.
33. manufacturing according to claim 32 is used for the method for the adjuster of polishing underlay, it is characterized in that: this method is being carried out the step a) first being processed, further comprise and make substrate stand to finish grind step with the attrition process process, obtaining consistent surface, and obtain substantially parallel substrate surface at least one side of substrate.
34. manufacturing according to claim 28 is used for the method for the adjuster of polishing underlay, it is characterized in that: step a) is finished by the mould process process, wherein inject predetermined molded composition earlier, and in the mould of the substrate shape that has how much projections, cool off.
35. manufacturing according to claim 28 is used for the method for the adjuster of polishing underlay, it is characterized in that: this substrate is made by pottery or bonding carbide material.
36. manufacturing according to claim 28 is used for the method for the adjuster of polishing underlay, it is characterized in that: this method further is included in the step that a body is set on the opposite side that substrate is formed with how much projections, is used for adjuster is connected to conditioning equipment.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019990021946U KR200175263Y1 (en) | 1999-10-12 | 1999-10-12 | The structure of the conditioner for CMP(Chemical Mechanical Polishing) Pad in CMP process |
| KR1999/21946U | 1999-10-12 | ||
| KR10-2000-0007082A KR100387954B1 (en) | 1999-10-12 | 2000-02-15 | Conditioner for polishing pad and method of manufacturing the same |
| KR2000/7082 | 2000-02-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1391506A true CN1391506A (en) | 2003-01-15 |
| CN1193863C CN1193863C (en) | 2005-03-23 |
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ID=26635414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB00815709XA Expired - Lifetime CN1193863C (en) | 1999-10-12 | 2000-10-10 | Conditioner for polishing pad and method for manufacturing the same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3829092B2 (en) |
| KR (1) | KR100387954B1 (en) |
| CN (1) | CN1193863C (en) |
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| CN102612734A (en) * | 2009-09-01 | 2012-07-25 | 圣戈班磨料磨具有限公司 | Chemical mechanical polishing conditioner |
| CN103403844A (en) * | 2011-03-07 | 2013-11-20 | 二和钻石工业股份有限公司 | Conditioner for fragile pad and method for manufacturing same |
| CN103460370A (en) * | 2011-02-16 | 2013-12-18 | 德克斯化工高新产品私人股份有限公司 | Single and dual stage wafer cushion |
| CN103534790A (en) * | 2011-05-17 | 2014-01-22 | 二和钻石工业股份有限公司 | Cmp pad conditioner, and method for producing the cmp pad conditioner |
| CN103782372A (en) * | 2011-09-15 | 2014-05-07 | 东丽株式会社 | Polishing pad |
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| US5536202A (en) * | 1994-07-27 | 1996-07-16 | Texas Instruments Incorporated | Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish |
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2000
- 2000-02-15 KR KR10-2000-0007082A patent/KR100387954B1/en active IP Right Grant
- 2000-10-10 JP JP2001529909A patent/JP3829092B2/en not_active Expired - Fee Related
- 2000-10-10 CN CNB00815709XA patent/CN1193863C/en not_active Expired - Lifetime
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20000024453A (en) | 2000-05-06 |
| JP3829092B2 (en) | 2006-10-04 |
| CN1193863C (en) | 2005-03-23 |
| KR100387954B1 (en) | 2003-06-19 |
| JP2003511255A (en) | 2003-03-25 |
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