CN1376726A - Polishing film and its preparing process - Google Patents
Polishing film and its preparing process Download PDFInfo
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- CN1376726A CN1376726A CN 01109908 CN01109908A CN1376726A CN 1376726 A CN1376726 A CN 1376726A CN 01109908 CN01109908 CN 01109908 CN 01109908 A CN01109908 A CN 01109908A CN 1376726 A CN1376726 A CN 1376726A
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Abstract
A polishing diamond film is prepared through dissolving powdered or granular resin in organic solvent, mixing with diamond microparticles or the microparticles of other abrasive material, coating the mixture on plastic film and drying. Its advantages are high mechanical strength and polishing effect, and low cost.
Description
The present invention relates to polished film, more particularly, is a kind of hybrid metal hard rock polished film.
The precision sizing of many high-tech components and parts all be unable to do without grinding and polishing, wherein utilize the processing mode of sand belt or polished section to be tending towards increasing, as disk, tape, magnetic head, fiber optic connector, fiber coupler, optical fiber terminator, monocrystalline silicon piece and other accurate hard device of various audio-visual data records; Polished film is not only grinding and polishing, but also foreign matter that can the cleaning device surface, all uses polished film as the clean on test probe, integrated package test jack and the LCD panel surface of semi-conductor silicon chip.
Normally used polished film is to be base band with the plastics film, be equipped with solvent and solidifying agent with Resin adhesive, and mix, be coated with then on it with abrasive, drying is made, and wherein the main raw of base band has: plastics films such as polyester, polyvinyl chloride, nylon, polyethylene, polypropylene; Resin adhesive comprises the one or more kinds of mixtures in polyester, polyvinyl chloride, urethane, nitrated silk floss, polyacrylic ester, the Resins, epoxy; Abrasive claims abrasive material again, mainly contains micro mists such as hundred corundum, silicon carbide, chromic oxide, ferric oxide, silicon oxide, cerium oxide, diamond.
Because diamond has the highest hardness, therefore the diamond polishing film has best mill efficiency and comprehensive polishing performance, but the natural diamond source is few, and is too expensive and can not be used for the abrasive material of polished film, and the man-made diamond relative price is lower, be processed into the diamond polishing film, aspect a lot of, have application, still, compare with abrasive materials such as white fused alumina and silicon carbide, price is still too high, causes grinding and polishing cost height, thereby the range of application field is restricted.
The objective of the invention is to overcome the shortcoming of prior art, propose a kind of excellent property, diamantiferous mixed type polished film that tooling cost is lower.
Realize the main technical schemes of the object of the invention: diamond abrasive and abrasive material commonly used are added in the Resin adhesive with certain proportion, abundant mixing, make coating, it is coated on equably promptly obtains hybrid metal hard rock polished film on the base band that comprises plastics film then.
Polished film provided by the invention is to be prepared by following method: powdery or granulous resin are dissolved in the organic solvent, make the Resin adhesive that contains the 10-90% resin, again with diamond abrasive and commonly used abrasive particle with 1-9: the amount of 9-1 weight ratio joins in the Resin adhesive, thorough mixing makes coating, at last coating is coated on equably the base band surface that thickness is 50-500 μ m, promptly obtains the adamantine polished film of mixed type.
The preparation method of polished film provided by the invention may further comprise the steps:
(1) powdery or granular resin are dissolved in the organic solvent, make the Resin adhesive that contains the 10-90% resin,
(2) with abrasive diamond and abrasive micro-powder commonly used with 1-9: the amount of 9-1 weight ratio is added in the Resin adhesive that step (1) makes, and disperses with ball mill, sand mill or ultrasonic dispersing machine thorough mixing, makes coating,
(3) coating that step (2) is made is coated with worker's machine with pulley type or spraying machine is coated in film surface equably, and described coat-thickness is 10-80 μ m.
Used base band comprises polyester film, polyurathamc film, non-woven fabrics, paper in the method for the present invention.
Abrasive diamond used in the method for the present invention comprises natural diamond or man-made diamond, adamantine granularity is 0.05-200 μ m, mix the abrasive material commonly used that uses with diamond and comprise hundred corundum, silicon carbide, silicon oxide, chromic oxide or cerium oxide, their granularity is the 50-90% of diamond grit.
Used resin comprises one or more mixtures of polyvinyl chloride, polyurethanes, Resins, epoxy in the method for the present invention.
Used solvent comprises one or more mixtures of toluene, dimethylbenzene, methylethylketone, vinyl acetic monomer, first isobutyl ketone in the method for the present invention.
The used equipment of method of the present invention all is known devices of using always.
Advantage of the present invention and effect:
Provided by the present invention is the mixing polished film that a kind of diamond and the abrasive material commonly used that comprises silicon carbide make, because the bigger diadust of granularity is dispersed among the less abrasive material commonly used of granularity, not only improved the abrasive material compactedness in the Resin adhesive, strengthened the physical strength of coating, and still keep the distinctive grinding polishing effect of diamond, reduce simultaneously the manufacturing cost of diamond polishing film again significantly, the final tooling cost that can reduce use diamond polishing film is convenient to applying of diamond polishing film.
Further specify characteristics of the present invention below by specific examples.
Example 1
Diadust that mean particle size is 6 microns and mean particle size are that 3 microns silicon carbide micro-powder mixes with 1: 1 weight ratio, take by weighing this mixture 2kg, add polyester glue (solid component content 30% of glue) 7kg, add toluene again, methylethylketone, the mixing solutions 0.8kg of vinyl acetic monomer (1: 1: 1), utilize ball mill that above-mentioned mixed solution was disperseed 24 hours, then viscosity is adjusted to 80CP, utilize the counter-drum formula to be coated with worker's machine, above-mentioned coating is applied on the polyester film of 75 micron thickness, after under 120 ℃ dry 2 minutes, form the coating of 10 micron thickness, promptly make hybrid metal hard rock polished film of the present invention.This polished film total thickness is 85 μ m, and surface roughness Ra is 1.4 μ m.
Example 2
Mean particle size is that diadust and the mean particle size of 10 μ m is that 8 microns silica powder mixes with 2: 8 weight ratio, take by weighing this mixture 1kg and add polyester glue (solid content 30% of glue) 4kg, the mixed solvent 0.5kg that adds toluene/methylethylketone/vinyl acetic monomer (1: 1: 1) again, utilize ball mill to disperse the back to adjust viscosity to 60cp with mixture, above-mentioned coating is coated on the polyester film of 100 μ m, form the thick coating of 20 μ m in 10 minutes 85 ℃ of dryings, promptly make mixing diamond polishing film of the present invention.
Example 3
Mean particle size is that diadust and the mean particle size of 10 μ m is that 5 microns hundred corundum mix with 7.5: 2.5 weight ratio, adopts the mixing and the coating process of example 2,100 ℃ of dryings 5 minutes, obtains the polished film of the thick coating of 16 μ m.
Example 4
This example is an application example.
Be cut into the disk of diameter 127mm, the SFP-50 shredder that utilizes the development of NSK skill to make, grind fiber optic connector, polished film of the present invention as the centre grinding, be used in the unitor that removes photoresist and become sphere, through polishing in 60 seconds, the reflected light loss can reach-20 to-30dB, meets general processing performance requirement.
Claims (5)
1. polished film, it is characterized in that this polished film is prepared by following method: powdery or granulous resin are dissolved in the organic solvent, make the Resin adhesive that contains the 10-90% resin, again with diamond abrasive and commonly used abrasive particle with 1-9: the amount of 9-1 weight ratio joins in the Resin adhesive, thorough mixing makes coating, at last coating is coated on equably the base band surface that thickness is 50-500 μ m, promptly obtains the adamantine polished film of mixed type.
2. the preparation method of the described polished film of claim 1 may further comprise the steps:
(1) powdery or granular resin are dissolved in the organic solvent, make the Resin adhesive that contains the 10-90% resin,
(2) abrasive diamond and abrasive micro-powder commonly used are added in the Resin adhesive that step (1) makes with 1: 9 amount to the 9-1 weight ratio, disperse, make coating with ball mill, sand mill or ultrasonic dispersing machine thorough mixing,
(3) coating that step (2) is made is coated with worker's machine with pulley type or spraying machine is coated in film surface equably, and described coat-thickness is 10-80 μ m.
3. the preparation method of the described polished film of claim 1, the granularity that it is characterized in that described diamond abrasive is 0.05-200 μ m, described abrasive material commonly used comprises hundred corundum, silicon carbide, silicon oxide, chromic oxide or cerium oxide, and its granularity is the 50-90% of diamond grit.
4. in accordance with the method for claim 1, it is characterized in that described resin comprises one or more mixtures of polyvinyl chloride, polyurethane, Resins, epoxy.
5. in accordance with the method for claim 1, it is characterized in that described organic solvent comprises one or more mixture of toluene, dimethylbenzene, methylethylketone, vinyl acetic monomer, first isobutyl ketone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01109908 CN1207328C (en) | 2001-03-22 | 2001-03-22 | Polishing film and its preparing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01109908 CN1207328C (en) | 2001-03-22 | 2001-03-22 | Polishing film and its preparing process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1376726A true CN1376726A (en) | 2002-10-30 |
| CN1207328C CN1207328C (en) | 2005-06-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01109908 Expired - Fee Related CN1207328C (en) | 2001-03-22 | 2001-03-22 | Polishing film and its preparing process |
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| CN (1) | CN1207328C (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100346451C (en) * | 2003-06-02 | 2007-10-31 | 株式会社东芝 | Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device |
| CN101607384B (en) * | 2009-07-10 | 2010-09-22 | 湖北玉立砂带集团股份有限公司 | Preparation method of UEA116 ultraprecise ground belt |
| CN101225281B (en) * | 2007-12-17 | 2012-02-22 | 河南省联合磨料磨具有限公司 | Polishing film and method for making same |
| CN102825561A (en) * | 2012-09-07 | 2012-12-19 | 北京国瑞升科技有限公司 | Water-base polishing film and preparation method thereof |
| CN104017329A (en) * | 2014-04-08 | 2014-09-03 | 张家口宣泰叁鑫机械制造有限责任公司 | High molecule polymerization and high wear-resistant material and processing method thereof |
| WO2015176639A1 (en) * | 2014-05-21 | 2015-11-26 | 华侨大学 | Superfine abrasive biomacromolecule flexible polishing film and preparation method therefor |
| WO2016045536A3 (en) * | 2014-09-26 | 2016-05-19 | 河南省联合磨料磨具有限公司 | Method for preparation of diamond polishing film |
| CN105773458A (en) * | 2016-05-16 | 2016-07-20 | 衢州学院 | High-solid-content nano spherical silicon dioxide polishing film and preparing method thereof |
| CN106147501A (en) * | 2016-07-20 | 2016-11-23 | 芜湖昊轩环保新材料有限公司 | fluorescent paint and preparation method thereof |
| CN106366637A (en) * | 2016-10-31 | 2017-02-01 | 湖南科技大学 | Method for preparing brown-fused-alumina-based polishing synthetic paper |
| CN108908142A (en) * | 2018-08-04 | 2018-11-30 | 乔斌 | Wear-resistant grinder |
| CN108927740A (en) * | 2018-08-03 | 2018-12-04 | 柴德维 | A kind of abrasive sheet and preparation method thereof |
| CN108942637A (en) * | 2018-08-03 | 2018-12-07 | 柴德维 | A kind of grinder with excellent stability |
| CN108994720A (en) * | 2018-08-03 | 2018-12-14 | 柴德维 | High stability abrasive sheet and preparation method thereof |
| CN108994721A (en) * | 2018-08-03 | 2018-12-14 | 柴德维 | Grinder with excellent stability |
| CN109015340A (en) * | 2018-08-04 | 2018-12-18 | 乔斌 | Wear-resistant grinder |
-
2001
- 2001-03-22 CN CN 01109908 patent/CN1207328C/en not_active Expired - Fee Related
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100346451C (en) * | 2003-06-02 | 2007-10-31 | 株式会社东芝 | Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device |
| CN101225281B (en) * | 2007-12-17 | 2012-02-22 | 河南省联合磨料磨具有限公司 | Polishing film and method for making same |
| CN101607384B (en) * | 2009-07-10 | 2010-09-22 | 湖北玉立砂带集团股份有限公司 | Preparation method of UEA116 ultraprecise ground belt |
| CN102825561A (en) * | 2012-09-07 | 2012-12-19 | 北京国瑞升科技有限公司 | Water-base polishing film and preparation method thereof |
| CN102825561B (en) * | 2012-09-07 | 2015-10-28 | 北京国瑞升科技股份有限公司 | Water-based polished film and preparation method thereof |
| CN104017329A (en) * | 2014-04-08 | 2014-09-03 | 张家口宣泰叁鑫机械制造有限责任公司 | High molecule polymerization and high wear-resistant material and processing method thereof |
| US10286524B2 (en) | 2014-05-21 | 2019-05-14 | Huaqiao University | Ultrafine abrasive biopolymer soft polishing film and manufacturing method thereof |
| WO2015176639A1 (en) * | 2014-05-21 | 2015-11-26 | 华侨大学 | Superfine abrasive biomacromolecule flexible polishing film and preparation method therefor |
| WO2016045536A3 (en) * | 2014-09-26 | 2016-05-19 | 河南省联合磨料磨具有限公司 | Method for preparation of diamond polishing film |
| CN105773458A (en) * | 2016-05-16 | 2016-07-20 | 衢州学院 | High-solid-content nano spherical silicon dioxide polishing film and preparing method thereof |
| CN105773458B (en) * | 2016-05-16 | 2017-08-29 | 衢州学院 | A kind of high solids content nanometer spherical silicon dioxide polishing film and preparation method thereof |
| CN106147501A (en) * | 2016-07-20 | 2016-11-23 | 芜湖昊轩环保新材料有限公司 | fluorescent paint and preparation method thereof |
| CN106366637A (en) * | 2016-10-31 | 2017-02-01 | 湖南科技大学 | Method for preparing brown-fused-alumina-based polishing synthetic paper |
| CN106366637B (en) * | 2016-10-31 | 2018-10-23 | 湖南科技大学 | A kind of preparation method of Brown Alundum base polishing synthetic paper |
| CN108927740A (en) * | 2018-08-03 | 2018-12-04 | 柴德维 | A kind of abrasive sheet and preparation method thereof |
| CN108942637A (en) * | 2018-08-03 | 2018-12-07 | 柴德维 | A kind of grinder with excellent stability |
| CN108994720A (en) * | 2018-08-03 | 2018-12-14 | 柴德维 | High stability abrasive sheet and preparation method thereof |
| CN108994721A (en) * | 2018-08-03 | 2018-12-14 | 柴德维 | Grinder with excellent stability |
| CN108908142A (en) * | 2018-08-04 | 2018-11-30 | 乔斌 | Wear-resistant grinder |
| CN109015340A (en) * | 2018-08-04 | 2018-12-18 | 乔斌 | Wear-resistant grinder |
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| CN1207328C (en) | 2005-06-22 |
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| ASS | Succession or assignment of patent right |
Owner name: BEIJING GUORUISHENG TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: WANG ZHENGUO Effective date: 20030509 |
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| C41 | Transfer of patent application or patent right or utility model | ||
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Effective date of registration: 20030509 Address after: 100081, Room 606, block A, 48 South Street, Zhongguancun, Beijing, Haidian District Applicant after: Beijing Grish Hitech Co., Ltd. Address before: 100036, No. 28, Fu Cheng Road, Beijing, Haidian District, No. 30, -451 Applicant before: Wang Zhenguo |
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| C14 | Grant of patent or utility model | ||
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Owner name: BEIJING GRISH HITECH CO., LTD. Free format text: FORMER NAME: BEIJING GUORUI SCIENCE AND TECHNOLOGY CO.,LTD. |
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| CP03 | Change of name, title or address |
Address after: 100085 Beijing, Haidian District, on the road to information on the ground floor, building 12, C402, C406 room, No. 1 Patentee after: BEIJING GRISH HITECH CO., LTD. Address before: Room 606, block A, No. 48 South Main Street, Beijing, Haidian District, Zhongguancun Patentee before: Beijing Grish Hitech Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050622 Termination date: 20170322 |