CN1355556A - 半导体晶片装置及其封装方法 - Google Patents
半导体晶片装置及其封装方法 Download PDFInfo
- Publication number
- CN1355556A CN1355556A CN00134164A CN00134164A CN1355556A CN 1355556 A CN1355556 A CN 1355556A CN 00134164 A CN00134164 A CN 00134164A CN 00134164 A CN00134164 A CN 00134164A CN 1355556 A CN1355556 A CN 1355556A
- Authority
- CN
- China
- Prior art keywords
- electric conductor
- conductive contact
- semiconductor chip
- film layer
- packing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000004020 conductor Substances 0.000 claims description 42
- 239000000758 substrate Substances 0.000 claims description 24
- 238000012856 packing Methods 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 239000003292 glue Substances 0.000 claims description 18
- 238000009434 installation Methods 0.000 claims description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 15
- 239000011135 tin Substances 0.000 claims description 15
- 229910052718 tin Inorganic materials 0.000 claims description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims description 3
- 238000011010 flushing procedure Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract 3
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000001259 photo etching Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (27)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB001341642A CN1149651C (zh) | 2000-11-30 | 2000-11-30 | 半导体晶片装置及其封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB001341642A CN1149651C (zh) | 2000-11-30 | 2000-11-30 | 半导体晶片装置及其封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1355556A true CN1355556A (zh) | 2002-06-26 |
CN1149651C CN1149651C (zh) | 2004-05-12 |
Family
ID=4596086
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB001341642A Expired - Fee Related CN1149651C (zh) | 2000-11-30 | 2000-11-30 | 半导体晶片装置及其封装方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1149651C (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101292330B (zh) * | 2004-05-11 | 2010-06-02 | 捷敏电子(上海)有限公司 | 化学增强的封装单分方法 |
CN102593018A (zh) * | 2011-01-11 | 2012-07-18 | 王琮淇 | 晶圆级半导体晶片封装方法及半导体晶片封装体 |
TWI460801B (zh) * | 2010-10-22 | 2014-11-11 | Tsung Chi Wang | A wafer-level semiconductor wafer packaging method and a semiconductor wafer package |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100445871C (zh) * | 2004-10-28 | 2008-12-24 | 探微科技股份有限公司 | 接合晶片的方法 |
US9496402B2 (en) * | 2014-10-17 | 2016-11-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Metal gate with silicon sidewall spacers |
-
2000
- 2000-11-30 CN CNB001341642A patent/CN1149651C/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101292330B (zh) * | 2004-05-11 | 2010-06-02 | 捷敏电子(上海)有限公司 | 化学增强的封装单分方法 |
TWI460801B (zh) * | 2010-10-22 | 2014-11-11 | Tsung Chi Wang | A wafer-level semiconductor wafer packaging method and a semiconductor wafer package |
CN102593018A (zh) * | 2011-01-11 | 2012-07-18 | 王琮淇 | 晶圆级半导体晶片封装方法及半导体晶片封装体 |
CN102593018B (zh) * | 2011-01-11 | 2016-04-20 | 王琮淇 | 晶圆级半导体晶片封装方法及半导体晶片封装体 |
Also Published As
Publication number | Publication date |
---|---|
CN1149651C (zh) | 2004-05-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: KAMEN INTERNATIONAL INVESTMENT LTD. Free format text: FORMER OWNER: CHEN YIMING Effective date: 20021018 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20021018 Address after: British Virgin Islands Applicant after: Carmen International Investment Co., Ltd. Address before: Taiwan, China Applicant before: Chen Yiming |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: IVY STOCK CO., LTD. Free format text: FORMER OWNER: KAMEN INTERNATIONAL INVESTMENT LTD. Effective date: 20040618 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20040618 Address after: British Virgin Islands Patentee after: Changchunteng Holding Co., Ltd. Address before: British Virgin Islands Patentee before: Carmen International Investment Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040512 Termination date: 20121130 |