CN1324615C

CN1324615C - High thermal conductivity insulating member and its manufacturing method, electromagnetic coil, and electromagnetic device

Info

Publication number: CN1324615C
Application number: CNB038157705A
Authority: CN
Inventors: 冈本彻志; 土屋宽芳; 泽史雄; 岩田宪之; 小山充彦; 铃木幸男; 铃木明彦; 大高彻; 石井重仁; 长野进
Original assignee: Toshiba Corp
Current assignee: Toshiba Corp
Priority date: 2002-07-04
Filing date: 2003-07-04
Publication date: 2007-07-04
Anticipated expiration: 2023-07-04
Also published as: DE60326072D1; EP1530223A1; EP1530223A4; EP1530223B1; WO2004006271A1; CN1666303A

Abstract

A tape- or sheet-shaped high thermal conductivity insulating member, its manufacturing method, an electromagnetic coil comprising the high thermal conductivity insulating member, and an electromagnetic device such as a power generator having the electromagnetic coil. It is necessary to improve the cooling performance of an electromagnetic coil of an electric device so as to enhance the efficiency and to reduce the size and manufacturing cost. For the enhancement, it has been tried to increase the thermal conductivity of a tape- or sheet-shaped insulating member of the electromagnetic coil. However, there have been problems that the thermal conductivity of conventional insulating members has been insufficient, and only special resin components can be used. To solve the above problems, according to the invention, the tape- or sheet-shaped insulating member is made of a material such that first particles having a thermal conductivity of 1 to 300 W/mK and second particles having a thermal conductivity of 0.5 to 300 W/mK are dispersed in a resin base.

Description

High thermal conductivity insulating member and manufacture method thereof, solenoid

Technical field

The present invention relates to a kind of banded or laminar high thermal conductivity insulating member and manufacture method thereof that is used for the solenoid of the such electromagnetic equipment of generator, motor, transformer, also relate to the solenoid and the electromagnetic equipment that adopt high thermal conductivity insulating member to make.

Background technology

In order to make electromagnetic equipment high efficiency, miniaturization, cost degradation, need to improve the cooling performance of solenoid.As one of method of the cooling performance that improves solenoid, be to make the banded or laminar parts of the electrical insulating property that the periphery at solenoid uses have high-termal conductivity.

The thermal conductivity of electrical insulating material in the past is in the scope of 3～37W/mK.In Japanese kokai publication hei 11-71498 communique, the thermal conductivity that discloses to improve electrical insulating material is a purpose, in order to increase the amount of filling material, changes the technology of the composition of matrix resin.But, the electrical insulating material thermal conductivity deficiency of this existing document, in addition, spendable resin is only limited in special composition.

In TOHKEMY 2002-93257 communique, the mica matrix material sheet of the high-termal conductivity with the inner lining material that contains inorganic powder is disclosed, as the electrical insulating material that is used for solenoid.But, the electrical insulating material of this existing document, owing to be used for material inner lining material, exhibits high thermal conductivity and do not have enough thermal conductivity, therefore as the insulating barrier of solenoid, the thermal conductivity deficiency.

In Japanese kokai publication hei 11-323162 communique, disclose to improving the thermal conductivity of insulating barrier, by in insulating barrier, adopting crystallinity epoxy resin, improve the technology of the thermal conductivity of resin.But, the crystallinity epoxy resin of this existing document, owing at room temperature be solid state, so its difficult treatment.

In Japanese kokai publication hei 10-174333 communique, the solenoid of the heat conduction thin slice of alternately reeling on the coiling conductor is disclosed to improving the thermal conductivity of insulating barrier.But, if adopt the solenoid of this existing document, because hot-fluid is heat insulation by mica layer, so be difficult to obtain high thermal conductivity.

So, adopt electrical insulating material in the past, existence can not obtain enough thermal conductivitys, its manufacturing takes a lot of work, time-consuming, increase problem such as cost.

Summary of the invention

The objective of the invention is to, provide a kind of can not be subjected to resinous principle restriction, thermal conductivity is high and that make, highly versatile easily high thermal conductivity insulating member and manufacture method thereof, in addition, also provide so solenoid of high thermal conductivity insulating member of a kind of employing.

High thermal conductivity insulating member of the present invention contains: reisn base material; The 1st particle is dispersed in the described reisn base material, has the thermal conductivity that 1W/mK is above, 300W/mK is following; And the 2nd particle, being dispersed in the described reisn base material, its particle diameter has the thermal conductivity that 0.5W/mK is above and 300W/mK is following smaller or equal to 0.15 times of the particle diameter of described the 1st particle.

By high thermal conductivity insulating member of the present invention and mica tape are in the past made up, the conductor that is used to wind the line (Cu coil) can provide the solenoid that has both good heat dissipation characteristics (cooling energy) and volume circle.Certainly, also can use high thermal conductivity insulating member of the present invention separately.

High thermal conductivity insulating member of the present invention, the reisn base material that will contain described the 1st particle and the 2nd particle is held as the liner material bed of material, the described liner material bed of material is sticked on form band shape or laminar on the mica layer.

High thermal conductivity insulating member of the present invention is the banded or laminar high thermal conductivity insulating member with mica layer and liner material bed of material, and described mica layer contains: mica paper (micapaper) is made of mica flake (mica scales); And the 2nd particle, being dispersed in the described mica paper, its particle diameter has the thermal conductivity that 0.5W/mK is above and 300W/mK is following smaller or equal to 0.15 times of the particle diameter of described the 1st particle.

The reason that the lower limit of the thermal conductivity λ of the 1st particle is set in 1W/mK is because if adopt the thermal conductivity λ that is lower than this value, can not obtain desired heat dissipation characteristics.The reason that the higher limit of the thermal conductivity λ of the 1st particle is set in below the 300W/mK is that because if filling has metal powder or carbon nano-tube greater than the thermal conductivity λ of this value, conductivity is excessive, diminishes the insulating properties of parts.

The reason that the lower limit of the thermal conductivity λ of the 2nd particle is set in 0.5W/mK is because if adopt the thermal conductivity λ that is lower than this value, can not obtain desired heat dissipation characteristics.The reason that the higher limit of the thermal conductivity λ of the 2nd particle is set in below the 300W/mK is, and is identical with the reason of described the 1st particle.But, be located at condition (with reference to Figure 30) below the 33.3vol% if satisfy volume containing ratio with the 2nd particle, as the 2nd particle, can limit metal or the carbon of ground filling as gold, copper, iron.If satisfy this condition, because do not have the misgivings of infringement parts insulate.

In the present invention, the particle diameter of the 2nd particle is smaller or equal to 0.15 times of the particle diameter of the 1st particle.Its reason is, if the size ratio of the 2nd particle and the 1st particle near 0.15, as shown in Figure 7, thermal conductivity λ reduces.

The particle diameter of the 1st particle preferably sets in (the scope of 50nm～105nm) more than the 0.05 μ m, below the 100 μ m.If the particle diameter of the 1st particle is less than 0.05 μ m, because be difficult to even dispersed particle in layer, the misgivings that have the electric insulation breakdown strength to reduce.On the contrary, if the particle diameter of the 1st particle greater than 100 μ m because the flatness of loss tape member or sheet material, thickness is inhomogeneous easily simultaneously.

In addition, the particle diameter of the 2nd particle is smaller or equal to 0.15 times of the diameter of scale.Its reason also is, if the size ratio of mica flake and the 2nd particle near 0.15, thermal conductivity λ reduces.

The 1st particle is by constituting more than a kind or 2 kinds of selecting from boron nitride, aluminium nitride, aluminium oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydride, diamond, diamond-like-carbon, carbon shape diamond, carborundum, clay of laminar silicate mineral and mica etc.Because the particle of these materials has the thermal conductivity λ more than the 1W/mK, below the 300W/mK under common state.

The 2nd particle is by constituting more than a kind or 2 kinds of selecting from boron nitride, carbon, aluminium nitride, aluminium oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydride, diamond, diamond-like-carbon, carbon shape diamond, carborundum, gold, copper, iron, clay of laminar silicate mineral and mica etc.Particularly, the 2nd particle most preferably is made of any in carbon or the aluminium oxide.The such carbon particle of carbon black very is fit to improve the thermal conductivity λ of parts of the present invention.In addition, even aluminium oxide particles at the thermal conductivity λ that improves parts of the present invention, does not damage the aspect of the insulating properties of parts simultaneously, is well suited for yet.

The content of the 2nd particle on the liner material bed of material preferably sets more than 0.5vol%.Because if increase the content of the 2nd particle, can improve thermal conductivity λ.Particularly because,, can improve thermal conductivity λ by leaps and bounds as Fig. 3 and shown in Figure 9 if contain the 2nd above particle of 1vol%.

The content of the 2nd particle with respect to the summation of the 2nd particle and resin, preferably sets below 33.3vol%, more preferably is set in below the 23vol%.Because if surplus contains the 2nd particle, conductivity is excessive.Particularly, if adopt the content of the 2nd particle that surpasses 33.3v0l%, as shown in figure 30, conductivity is excessive, reduces the insulating properties of parts.

The liner material bed of material can be located at the two sides of mica layer, also mica layer can be located at the two sides (with reference to Figure 15) of the liner material bed of material.

The width of the liner material bed of material can be greater than mica layer, and the width of mica layer also can be greater than the liner material bed of material (with reference to Figure 18).

The gross thickness of high thermal conductivity insulating member under the situation that is band, is set in 0.2～0.6mm, under the situation that is thin slice, is set in 0.2～0.8mm.The thickness ratio of the mica layer and the liner material bed of material preferably sets the scope at 6: 4～4: 6, more preferably is set in 11: 9～9: 11 scope.

The manufacture method of high thermal conductivity insulating member of the present invention, manufacturing has the banded or laminar high thermal conductivity insulating member of the mica layer and the liner material bed of material, may further comprise the steps: (a) mix the 1st particle with the above and thermal conductivity that 300W/mK is following of 1W/mK, particle diameter 0.15 times and the 2nd particle and the resin solution with the thermal conductivity below the above 300W/mK of 0.5W/mK smaller or equal to the particle diameter of described the 1st particle to scale; (b) with described impregnation mixture the dipping body in; (c) heat the described mixture that is immersed in the described dipping body and be cured, thereby obtain the liner material bed of material; (d) go up the bonding described liner material bed of material of fitting at mica paper (mica paper); (e) by exerting pressure from top and bottom, be shaped to the fit bonding described liner material bed of material and mica paper banded or laminar with roll-in (roller press).

Above-mentioned dipping body also can be any in glass fabric (glass cloth) or the resin film.Under the situation that adopts the glass fabric making liner material bed of material, according to process B shown in Figure 11 (operation S1～S3) carry out.Under the situation that adopts the resin film making liner material bed of material, according to process B shown in Figure 13 2 (operation S11～S12) carry out.In roll-in, preferably adopt the hot-rolling platen press.Roll-in generally is set at only 1 time single the pressure, but also can be the multistage roll-in of 2～3 roll-ins of repetition.

The manufacture method of high thermal conductivity insulating member of the present invention, manufacturing has the banded or laminar high thermal conductivity insulating member of the mica layer and the liner material bed of material, may further comprise the steps: (i) mix to stir the 2nd particle, mica flake (mica scales) and solvent with the above and thermal conductivity that 300W/mK is following of 0.5W/mK to scale, the particle diameter of described the 2nd particle is smaller or equal at least 0.15 times of the diameter of described mica flake; (ii) the filter with regulation filters described mixing stirring thing, carries out drying, obtains mica paper (mica paper) thus; The bonding described mica paper of (iii) on the liner material bed of material, fitting; , be banded or laminar (iv) with fit bonding described mica paper and inner lining material formable layer by exerting pressure from top and bottom with roll-in (roller press).

As described solvent, can adopt water or various alcohols, especially preferably adopt water.Adopting water to make under the situation of mica paper, carry out according to operation S21 shown in Figure 9～S23.Because the length-width ratio of mica flake is big, therefore aggegation is fixed easily, even after solvent evaporates, also can continue to keep its shape, keeps the high-termal conductivity particle with measuring.In addition, if add a spot of adhesive resin, improve shape maintains and particle retentivity more.

Solenoid of the present invention is by adopting above-mentioned banded high thermal conductivity insulating member, and insulation covers the coiling conductor and forms.

Electromagnetic equipment of the present invention has above-mentioned solenoid.

In this manual, so-called " band " is meant the overlapping elongated strip-shaped parts that is wrapped on the position that needs the insulation covering.

In this manual, so-called " thin slice " is meant not only overlapping being wrapped on the position that needs the insulation covering, but also covers the parts with Rack on this position.Heat insulating lamella, for example being used to insulate covers soldering connecting portion between the solenoid.

In this manual, so-called " mica " refers to except that from the natural mica of nature output, also comprises the synthetic mica that industrialization is made.About mica, sintering mica and two kinds on sintering mica are not arranged, but in the present invention, preferably adopt the sintering mica.This be because, the sintering mica, by using the set point of temperature sintering, it is laminar that its shape is squama more, thereby can improve electrical insulating property.

In this manual, so-called " mica paper (mica paper) " refers to solvent (water or alcohols) and mixes stirring mica flake (mica scales), filters this mixed liquor by the main points of copying paper, the film or the paper tinsel that obtain through super-dry.Become given size by inciting somebody to action so mica paper severing, obtain mica tape or splitting.

In this manual, so-called " carbon ", refer to by π in conjunction with the carbon-based material that has between each layer that forms by the structure of molecular separating force combination, be comprise carbon black, contact black, channel carbon black, roll carbon black, the general name of disk carbon black, thermal black, gas carbon black, stove carbon black, oil oven carbon black, naphthalene carbon black, anthracene carbon black, acetylene carbon black, animal carbon black, plant carbon black, superconduct carbon black (Ketjen Black), graphite.

In this manual, so-called " diamond " refers to except that from the natural mica of nature output, and the diamond that industrialization is made is meant the diamond that forms the crystallization tissue by sp3 in conjunction with the carbon atom that mutually combines.

In this manual, so-called " diamond-like-carbon " refers to the carbon-based material more approaching with the carbon ratio of above-mentioned definition, and major part is made of carbon, contains the diamond tissue of above-mentioned definition in its part.

In this manual, so-called " carbon shape diamond " refers to the carbon-based material more approaching with the diamond of above-mentioned definition, and the carbon of above-mentioned definition and diamond tissue mix and exist.

In this manual, so-called " adhesive resin " refers to and is used to make the high-termal conductivity particle to remain fixed in packing material on the liner material bed of material or the mica layer.Adopt parts of the present invention, the composition of specific resin not, but generally adopt any in epoxy resin, acrylic resin, the silicones (silicon rubber).

Description of drawings

Fig. 1 is the process chart of manufacture method of the high thermal conductivity insulating member of expression embodiments of the present invention.

Fig. 2 is the profile schema diagram of the high thermal conductivity insulating member of expression the 1st execution mode of the present invention.

Fig. 3 is that expression contains the performance diagram that concerns between the thermal conductivity of insulating tape of boron nitride and the carbon black additive effect.

Fig. 4 is the performance diagram of expression carbon black to the impact effect of insulating tape thermal conductivity.

Fig. 5 is the summary section of solenoid.

Fig. 6 is the enlarged drawing of expression the 1st particle and the 2nd particle.

Fig. 7 is the performance diagram that concerns between expression size ratio log (d2/d1) and the thermal conductivity λ.

Fig. 8 is the performance diagram that concerns between the thermal conductivity of expression aluminium oxide charging quantity and epoxy resin.

Fig. 9 is the process chart of the manufacture method of other execution mode of expression.

Figure 10 is the profile schema diagram of expression inner lining material (glass fabric of impregnating resin).

Figure 11 is the profile schema diagram of other inner lining material of expression (glass fabric of impregnating resin).

Figure 12 is the profile schema diagram of the high thermal conductivity insulating member of other execution mode of expression.

Figure 13 is the process chart of the manufacture method of other execution mode of expression.

Figure 14 is the profile schema diagram of the high thermal conductivity insulating member of other execution mode of expression.

Figure 15 is the profile schema diagram of the high thermal conductivity insulating member of other execution mode of expression.

Figure 16 is the profile schema diagram of the high thermal conductivity insulating member of other execution mode of expression.

Figure 17 is the profile schema diagram of the high thermal conductivity insulating member of other execution mode of expression.

Figure 18 is the profile schema diagram of the high thermal conductivity insulating member of other execution mode of expression.

Figure 19 is the equivalent circuit diagram of thermal conduction characteristic of the main insulating layer of representation of concept high thermal conductivity insulating member.

Figure 20 is the profile schema diagram of other high thermal conductivity insulating member of expression.

Figure 21 is the equivalent circuit diagram of thermal conduction characteristic of the main insulating layer of other high thermal conductivity insulating member of representation of concept.

Figure 22 is the profile schema diagram of the high thermal conductivity insulating member of other execution mode of expression.

Figure 23 is the profile schema diagram of the high thermal conductivity insulating member of other execution mode of expression.

Figure 24 is the profile schema diagram of the high thermal conductivity insulating member of other execution mode of expression.

Figure 25 is the profile schema diagram of the high thermal conductivity insulating member of other execution mode of expression.

Figure 26 is the profile schema diagram of the high thermal conductivity insulating member of other execution mode of expression.

Figure 27 is the profile schema diagram of the high thermal conductivity insulating member of other execution mode of expression.

Figure 28 is the cylindrical coordinates figure of expression effect of the present invention.

Figure 29 is that expression contains the performance diagram that concerns between the thermal conductivity of insulating tape of boron nitride and the carbon black additive effect.

Figure 30 is that expression research carbon particle content is respectively to the result's of the influence of thermal conductivity λ and conductivity performance diagram.

Figure 31 is the profile schema diagram of the high thermal conductivity insulating member of other execution mode of expression.

Figure 32 is the process chart of the manufacture method of other execution mode of expression.

Figure 33 is the profile schema diagram of the high thermal conductivity insulating member of other execution mode of expression.

Embodiment

Below, with reference to description of drawings all preferred implementations of the present invention.

(the 1st execution mode)

Below, the 1st execution mode of present embodiment is described with reference to Fig. 1～Fig. 8.

At first, with reference to Fig. 1, the making of the mica tape of present embodiment is described.

In mica flake 2.826g, allocate the water of 3000cc into, stir then (operation K1).In this case, as adhesive, also can add small amount of epoxy resin.

According to the main points of copying paper, make above-mentioned stirring the mixture by for example 0.5mm * 0.5mm grid, make base sheet (operation K2).This base sheet of heating makes its drying under set point of temperature, obtains mica paper 1 (operation K3) thus.

In the inner lining material manufacture craft B1 of present embodiment, at first, press mass ratio, with 24.7: 74.2: 1.1 ratio, batching adhesive resin, boron nitride particles, carbon black particle, and mix (operation S1).In the present embodiment, carbon black adopts the アサヒサ one マ Le (trade name) that Japanese rising sun power one ボ Application (carbon black) Co., Ltd. makes.The average grain diameter of carbon black is 90 μ m.Being shaped as of carbon black particle is spherical.In addition, in the present embodiment, the HP-1CAW (marque) that boron nitride adopts Japanese water island alloyed iron Co., Ltd. to make, its particle size distribution is at 14 μ m～18 μ m, and its average grain diameter adopts 16 μ m.The crystalline texture of boron nitride is hexagonal crystal, is shaped as squama laminar (scale).In addition, the HP-6 (marque) that also can adopt Japanese water island alloyed iron Co., Ltd. to make as boron nitride.

Above-mentioned mixture is coated on the glass fabric of thick 0.33mm (operation S2).The coating amount of the per unit area of mixture is set in 400g/m ²Heating is coated with application under 120 ℃ temperature, makes its curing, obtains inner lining material 2 (operation S3) thus.

Make described mica paper 1 and inner lining material 2 applyings (operation S4) with adhesive.Applying adhesive on either party of mica paper 1 or inner lining material 2 makes both stacked, carries out hot-rolling then and presses.Adhesive adopts epoxy resin.In hot-rolling is pressed, be heated to 150 ℃ of temperature, adhesive, mica paper 1 and inner lining material 2 are solidified, obtain splitting (operation S5) thus.Owing to carry out the processing of described operation S4 and S5 continuously, so splitting can form wide and long shape.So the splitting severing becomes wide 35mm, obtains mica tape shown in Figure 2 10 (operation S6) thus.So mica tape 10, the carbon black particle (the 2nd particle) that has disperseed to have the boron nitride particles (the 1st particle) of the thermal conductivity more than the 1W/mK simultaneously and have the thermal conductivity more than the 0.5W/mK in resin 4 in the liner material bed of material 2.

In the following description, in the evaluating and measuring of the thermal conductivity λ of tape member (or sheet material), adopt laser flash method.In the present embodiment, as the thermal conductivity measuring instrument, the TC-3000-NC that adopts Japanese vacuum science and engineering Co., Ltd. to make.Specifically be, rise, estimate thermal conductivity λ thus by the temperature of measuring opposing face (back side) in the one side irradiated with pulse laser of the sample of thick 1mm.

In addition, for the grain diameter measurement of particle, adopt laser analysis formula particle size distribution measurement instrument.In the present embodiment, as particle size measurer, adopt the LMS-24 of the セイシ of Co., Ltd. Application manufacturing of Japan.The particle diameter of measuring is an average grain diameter.

Fig. 3 is the performance diagram that concerns between expression thermal conductivity and the carbon black charging quantity, and transverse axis is the volume ratio (vol%) of carbon black, and the longitudinal axis is the thermal conductivity λ (W/mK) during carbon blacks in epoxy resin.Carbon black adopts the particle of thermal conductivity 1W/mK, average grain diameter 90nm.Boron nitride adopts the particle of thermal conductivity 60W/mK, average grain diameter 16 μ m.Result when the characteristic curve A among the figure marks on a map respectively and represents that percentage by volume 0%, 0.5%, 1%, 2%, 5% changes carbon black-filled amount, and link respectively to mark on a map and form.

A finds out from characteristic curve, by add micro-carbon black in epoxy resin, can obtain having the heat conduction thin slice of high thermal conductivity.Copy mica paper 1 applying that splitting is made with this heat conduction thin slice 2 with as inner lining material, by cutting apart the formation splitting.In this case, utilize the epobond epoxyn of bisphenol A-type to come bonding mica layer 1 and heat conduction thin slice 2 (inner lining material).

So the splitting of making (mica tape) owing to the thermal conductivity height of the liner material bed of material, so compare with the mica tape (product in the past) of a nitrogen boron, can access high thermal conductivity.

Table 1 illustrates the thermal conductivity index and the composition of the mica tape of making at 1: 1 with the thickness ratio of mica layer 1 and heat conduction thin slice 2.Herein, so-called " thermal conductivity index " refers to the relative value of the no unit that calculates as fiducial value 1 with comparative example 1.

Table 1

	Comparative example 1	Comparative example 2	Embodiment 1
	Comparative example 1	Comparative example 2	Embodiment 1	Boron nitride	0	60	60
Carbon black	0	0	5	Boron nitride	0	60	60
Carbon black	0	0	5	Resin	100	40	35
The thermal conductivity index	1	1.8	1.93	Resin	100	40	35

Comparative example 1,2 has been put down in writing side by side as inner lining material and has been adopted the band of polyethylene terephthaldehyde ester and only adopt the situation of the band of boron nitride.

The same not band of filling (comparative example 2) of the band of filling boron nitride (comparative example 1) is compared, and shows 1.8 times thermal conductivity λ, but adding in the band (embodiment 1) of carbon black in addition, shows 1.93 times high thermal conductivity λ.

Fig. 4 be expression with the carbon black pack completeness of Fig. 3 as parameter, obtain the performance diagram that concerns between mica tape thermal conductivity and the carbon black charging quantity, transverse axis is the volume ratio (vol%) of carbon black, the longitudinal axis is the thermal conductivity index of carbon black.Herein, so-called " thermal conductivity index " refers to the relative value with the no unit that calculates as fiducial value 1 at the comparative example shown in the table 22.

B finds out from characteristic curve, by adding carbon black, has improved the thermal conductivity of mica tape.Particularly,, when 1vol% is above, improved about 2.5% at the charging quantity of carbon black by the thermal conductivity index.Therefore, the thermal conductivity λ of mica tape improves pro rata with the thermal conductivity λ of inner lining material.

So,, the thin slice of high thermal conductivity can be accessed,, mica tape can be made with high thermal conductivity by this thin slice is used as inner lining material by in the complex of boron nitride and resin, adding carbon black again.

Below, the manufacture method of coil is described with reference to Fig. 5.

On the periphery of coiling conductor 5 (stick coil) with square-section, thickness coiling mica tape 10 in accordance with regulations, the somatotype band (not shown) of reeling in the above in addition.Push the baffle plate anchor clamps (not shown) of half-terete rubber system respectively to the four sides of coiling body.At this moment, between baffle plate anchor clamps and coiling body, insert the iron plate (not shown) of thick 2mm respectively.In addition, in the periphery of baffle plate anchor clamps, the mode package with overlapping 2/3 3 layers of heat-shrinkable T bush (not shown).The about 50mm of the diameter of heat-shrinkable T bush.This coiling body is immersed in the epoxy resin liquid epoxy resin-impregnated under vacuum atmosphere.Behind resin impregnation, with the coiling body heating furnace of packing into, with the heating conditions that keep 24 hours down at 150 ℃, cured epoxy resin.Unload heat-shrinkable T bush, baffle plate anchor clamps, iron plate, somatotype band, obtain solenoid.

The solenoid of making like this, because mica tape 10 has high thermal conductivity, the result forms the insulating barrier 6 with high thermal conductivity.So solenoid because cooling performance is good, can increase the electric current that flows through coiling conductor 5, so the efficient height.In addition, under the identical situation of efficient, owing to can reduce the sectional area of conductor 5 that winds the line, so can make the solenoid miniaturization.As a result, reduce the manufacturing cost of solenoid.

Therefore, in the generator of 300MW level, have the solenoid of described insulating barrier 6 by employing, the thermal conductivity of main insulation is raised to about 1W/mK from 0.22W/mK in the past.The temperature of solenoid can be risen and drop to 40K from 70K.Thus, the current density that in solenoid, flows can be improved, the use amount of copper can be reduced.Thus, can improve the current density that in solenoid, flows, the use amount of copper can be reduced about about 3 one-tenth.

In the present embodiment, can be simply and easily obtain the high tape member of thermal conductivity, in addition, by on the coiling conductor, reel, insulation covers this tape member, can make the solenoid and the electromagnetic equipment miniaturization of high heat conductionization, can cheaply make.

In above-mentioned,, use boron nitride particles and carbon black particle as the material of the inner lining material that forms high-termal conductivity.Realize the reason of high-termal conductivity, think and to realize by utilizing carbon black displacement resin bed.That is, the main packing material that can be by having high-termal conductivity and the carbon particle in its gap of landfill obtain high thermal conductivity.

In this case, when realizing high-termal conductivity, need the main packing materials (the 1st particle) of filling more,, importantly enter tight gap of having filled main packing material (the 1st particle) therefore for the 2nd particle, for example carbon black particle with high-termal conductivity.

, as shown in Figure 6, enter in the main high-termal conductivity packing material (the 1st particle) 7 of tight filling for this reason,, can realize having the high-termal conductivity of high thermal conductivity by limiting the particle diameter d2 of the 2nd packing material 8 for making the 2nd packing material (the 2nd particle) 8.

Fig. 7 is the performance diagram of expression thermal conductivity λ with respect to the size ratio variation of the 2nd particle and the 1st particle, and transverse axis is the logarithm of the size ratio (d2/21) of the 2nd particle and the 1st particle, and the longitudinal axis is thermal conductivity λ.Thus figure as can be seen, near the size ratio of the 2nd particle and the 1st particle scope less than 0.1 times, thermal conductivity raises.

Fig. 8 is result's the performance plot of expression research both sides relation of marking on a map, and transverse axis is the volume content (vol%) of the aluminium oxide particles in the epoxy resin, and the longitudinal axis is thermal conductivity λ., replace the carbon black particle of average grain diameter 90nm herein, but in epoxy resin, fill the aluminium oxide particles of average grain diameter 70nm.Scheme as can be seen thus, along with the charging quantity increase of aluminium oxide particles, thermal conductivity λ raises.Particularly in the material that has added the 3vol% aluminium oxide particles, obtain surpassing the thermal conductivity λ of 7W/mK.Distinguish thus,, can access high thermal conductivity by this material is used as inner lining material.In addition, compare, because therefore the resistance height of aluminium oxide particles forms the good band of insulation property with carbon black particle.

Aluminium oxide is that average grain diameter is the spherical particle of 70nm.In the present embodiment, aluminium oxide particles adopts Japanese シ one アイ to change into the NanoTekA1 2O3-HT (marque) that Co., Ltd. makes.

In the present embodiment, use boron nitride as the 1st particle, but, also can adopt aluminium nitride, aluminium oxide, magnesium oxide, silicon nitride, diamond, diamond-like-carbon, carborundum as its substitution material.Utilize these substitute materials, also can access the effect identical with present embodiment.

In addition, in the present embodiment, as the 2nd particle, carbon black and aluminium oxide have been used, but, also can adopt boron nitride, carbon, aluminium oxide, magnesium oxide, silicon nitride, diamond, diamond-like-carbon, carborundum, gold, copper, iron, clay of laminar silicate mineral, mica as its substitution material.Utilize these substitute materials, also can access the effect identical with present embodiment.

(the 2nd execution mode)

Below, with reference to Fig. 9～Figure 11 the 2nd execution mode is described.

In the parts of present embodiment, fill the high-termal conductivity particle at mica layer.Inner lining material adopts glass fabric 25.Allocate mica flake 2.83g and aluminium oxide particles 0.125g the water of 3000cc into, stir then (operation S21).In the present embodiment, aluminium oxide particles adopts Japanese シ one アイ to change into the NanoTekA1 2O3-HT (marque) that Co., Ltd. makes.The average grain diameter of aluminium oxide particles is 70 μ m.Being shaped as of aluminium oxide particles is spherical.Mica flake adopts the sintering mica.The average grain diameter of mica flake is 15 μ m.

According to the main points of copying paper, make above-mentioned stirring the mixture by for example 0.5mm * 0.5mm grid, make base sheet (operation S22).Heat this base sheet down at 120 ℃, make its drying, obtain mica paper (operation S23) thus.

Adopt adhesive this mica paper (operation S24) of on glass fabric 25, fitting.Adhesive adopts epoxy resin.In hot-rolling is pressed, be heated to 150 ℃ temperature, adhesive, mica paper 1 and inner lining material 2 are solidified, obtain splitting (operation S25) thus.Owing to carry out the processing of above-mentioned operation S24 and S25 continuously, so splitting can form wide and long shape.So the splitting severing becomes wide 35mm, obtains mica tape 11A (operation S26) shown in Figure 10 thus.

Figure 10 is the profile of the mica tape 11A of any decentralized configuration in glass fabric of the high-termal conductivity particle that utilizes above-mentioned execution mode to obtain.Impregnating resin in glass fabric 25 when making film or tape member, by making its particle that contains high-termal conductivity 26, can be made the band (film) of high-termal conductivity.In addition, use, can form the high mica tape of thermal conductivity by the band that will so make material as mica tape.

Figure 11 is the band of expression lamination a plurality of above-mentioned execution modes and the profile of the band 11B that forms.By partly use the material of high-termal conductivity at the resin of laminated member, can make laminated member with high thermal conductivity.

(the 3rd execution mode)

Below, with reference to Figure 12 the 3rd execution mode is described.In the mica tape 10A of present embodiment, in mica layer 9, fill the 1st particle that has disperseed to have the thermal conductivity more than the 0.5W/mK.In the present embodiment, press usual way and make mica layer 11, inner lining material adopts the heat conduction thin slice 9 with high thermal conductivity.In this case, compare with the liner material bed of material 9, because the thermal conductivity of mica layer 11 is little, so mica layer 11 plays thermal barrier.

When forming mica paper, average the aluminium oxide particles of particle diameter 70nm and mixing of mica paper herein.Specifically be, in distilled water, stir mica paper and aluminium oxide particles, be coated on the glass fabric of mesh,, form splitting through dried with 0.05 μ m.Splitting self has the thermal conductivity about 0.6W/mK, if but in only by the mica layer 11 of mica paper moulding impregnating resin, then thermal conductivity λ is 0.22W/mK.

In addition, the thermal conductivity of having filled the mica layer of aluminium oxide particles is 0.35W/mK, can infer that its reason is, because impregnating resin is clipped between the mica layer, the required phonon of heat conduction takes place at random, and the mean free path of phonon shortens.

Same with above-mentioned execution mode, bring the moulding solenoid by what adopt present embodiment, can form the high main insulating layer of thermal conductivity.

In mica tape 10A so, disperse the 2nd particle 3 by in mica layer 9, filling, can be simply and easily obtain the high tape member of thermal conductivity.In addition, cover mica tape 10A, can make the solenoid and the electromagnetic equipment miniaturization of high heat conductionization, can cheaply make by on coiling conductor 5, reeling, insulating.

(the 4th execution mode)

Below, illustrate that with reference to Figure 13 inner lining material adopts the 4th execution mode of film (substitute material of glass fabric).In the present embodiment, except that inner lining material manufacture craft B2, identical with above-mentioned the 1st execution mode in fact.Therefore, in the present embodiment, omit the explanation of mica paper production process K1～K3 and mica tape production process S4～S6.

In the inner lining material manufacture craft B2 of present embodiment, mixed adhesive resin 0.13g, boron nitride particles 2.83g and aluminium oxide particles 0.125g (operation S11).Utilize the hot-rolling press, hot-press solidifying mixture under 150 ℃ temperature obtains inner lining material (operation S12) thus.

(the 5th execution mode)

Below, with reference to Figure 14 the 5th execution mode is described.The parts 10B of present embodiment is that the liner material bed of material 2 of above-mentioned the 1st execution mode of combination and the mica layer 9 of above-mentioned the 3rd execution mode form.By so combination, the thermal conductivity λ of mica tape parts 10B improves more, and heat dissipation characteristics is good.The thermal conductivity of the mica tape parts 10B of present embodiment is estimated to reach about 0.66W/mK.

(the 6th execution mode)

Below, with reference to Figure 15 the 6th execution mode is described.In the parts 10C of present embodiment, be filled with the liner material bed of material 2 of the high-termal conductivity of the 1st particle and the 2nd particle in the applying of the two sides of mica layer 1.

If the employing present embodiment by all adopt the high material of thermal conductivity on the two sides in the liner material bed of material 2, can improve the thermal conductivity of mica tape 10C self.By this mica tape 10C that on coiling conductor 5, reels, can access the good solenoid of heat dissipation characteristics.

(the 7th execution mode)

Below, with reference to Figure 16 the 7th execution mode is described.In the present embodiment, expression utilizes mica tape 10 that the high thermal conductivity layer (the liner material bed of material of high-termal conductivity) 12 by low thermal conductive layer (mica layer) 13 and its one side constitutes, the width that staggers of interband is staggered by bandwidth W half (1/2) and the cross section of main insulating layer when being wound on the surface of coiling conductor 5.This main insulating layer is formed on the configuration that certain folder is established low thermal conductive layer 13 between high thermal conductivity layer 12 and the high thermal conductivity layer 12.In adopting this insulating barrier 6 that constitutes 10D, because the thermal conductivity of low thermal conductive layer 13 is low, so seldom arrive high thermal conductivity.

(the 8th execution mode)

Below, with reference to Figure 17 the 8th execution mode is described.

In the present embodiment, expression utilizes by low thermal conductive layer 13 with on its two sides and forms mica tape 10C that high thermal conductivity layer 12 constitutes, the width that staggers of interband is staggered by bandwidth W half (1/2) and the cross section of main insulating layer when being wound on the surface of the conductor 5 that winds the line.Constitute among the 10E at this, Yi Bian connect continuously mutually as the inner lining material of high heat conductive body, Yi Bian in main insulating layer, form thermal conducting path.So, form high thermal conductivity layer 12 by two sides at low thermal conductive layer 13, can access high thermal conductivity.

Mica paper by adopting manufacturing like this and the inner lining material shown in the 1st execution mode obtain having the mica tape of high thermal conductivity.

By so having 1st particle of thermal conductivity more than 1W/mK, can access the solenoid and the electromagnetic equipment of thermal conductivity height and high heat conductionization easy to manufacture on the two sides of low thermal conductive layer (mica layer).

In above-mentioned, as low thermal conductive layer, form formation with mica layer with the low relatively layer of high thermal conductivity layer clamping thermal conductivity, but under with the situation of mica layer as high thermal conductivity layer, the mica layer clamping liner material bed of material by with high thermal conductivity layer also can obtain high thermal conductivity.That is, by on the two sides of the liner material bed of material, form the mica layer that comprises 2nd particle of thermal conductivity more than 0.5W/mK, can access the solenoid and the electromagnetic equipment of thermal conductivity height and high heat conductionization easy to manufacture.

(the 9th execution mode)

Below, with reference to Figure 18 the 9th execution mode is described.

In the mica tape 10F of present embodiment, the width of the liner material bed of material 2 of high-termal conductivity is greater than mica layer 1.That is, the width W 2 of the liner material bed of material 2 is greater than the width W 1 of mica layer 1.

In the following description, when calculating the thermal conductivity of main insulating layer, can consider as Figure 19 and equivalent electric circuit shown in Figure 21.

Under the situation that forms main insulating layer, combination has the relative low layer with thermal conductivity of layer of high thermal conductivity, forms main insulating layer.Exist the reason of low thermal conductivity to be, main insulating layer formed in order to obtain electrical insulating property originally, used the high conductivity material of used packing material among the present invention, because the misgivings that exist the insulation breakdown characteristic to reduce, so, in the equipment that has, need to form simultaneously the layer that has thermal conductivity but also have high insulation breakdown characteristic.

As shown in Figure 3, by in inner lining material, adopting high heat conductive body, can realize having the formation of high thermal conductivity.So the equivalent electric circuit that constitutes as shown in figure 19, the thermal conductivity 14 of low thermal conductive layer and the thermal conductivity of high thermal conductivity layer 15 form series, mica layer plays thermal barrier, so when forming coil shape, be difficult to use mica layer heat conduction.

Therefore, as shown in figure 18, the width of the liner material bed of material 2 that makes high-termal conductivity just can access high thermal conductivity greater than the width of mica layer 1.

The section of the main insulating layer when Figure 20 represents that high thermal conductivity layer 12 is wideer than low thermal conductive layer 13.Because high thermal conductivity layer 12 is communicated with the coil main insulating layers, so think and to access high thermal conductivity.So the equivalent electric circuit that constitutes as shown in figure 21, the thermal conductivity 14 of the mica layer of the thermal conductivity 16 shunting low thermal conductive layers by widening portion can access high thermal conductivity.

In the table 2, the thermal conductivity of mica layer is set at 0.22W/mK, the thermal conductivity of the liner material bed of material is set at 4W/mK, the difference of the width of the liner material bed of material being widened 10% o'clock thermal conductivity index with respect to the width of mica layer is shown.With the band of the wider width of the liner material bed of material 2 of high-termal conductivity sample, be band 3 the sample as a comparative example of same widths with mica layer 1 and the liner material bed of material 2 as embodiment 2.Herein, so-called " thermal conductivity index ", the relative value of the no unit when referring to comparative example 3 as fiducial value 1.

Table 2

	Comparative example 3	Embodiment 2
	Comparative example 3	Embodiment 2	High heat conduction width/low heat conduction width	1	1.1
The thermal conductivity index	1	1.25	High heat conduction width/low heat conduction width	1	1.1

From this table 2 as can be known, the sample of having confirmed embodiment 2 shows the thermal conductivity index bigger than the sample of comparative example 3.

By adopting the mica tape of present embodiment, can access the solenoid and the electromagnetic equipment of thermal conductivity height and high heat conductionization easy to manufacture.

(the 10th execution mode)

Below, with reference to Figure 22～Figure 25 the 10th execution mode is described.

In the formation 10H of present embodiment, as solenoid, adopt any of 2 above-mentioned in the above-described embodiment mica tapes (among the figure illustration with 10), its top and bottom of reversing, and the width that staggers of interband is staggered by half (W/2) of bandwidth W, alternately reel.

In constituting 10H, if on conductor the mica parts of coiling applying low thermal conductive layer 13 and high thermal conductivity layer 12 and form main insulating layer be clamped between the high thermal conductivity layer owing to necessarily will have the layer of low heat conductivity, therefore have the layer blocking heat conduction of low heat conductivity.

Therefore, formation 10I as shown in figure 23 is such, adopts the band of 2 applying low thermal conductive layers 13 and high thermal conductivity layer 12, its top and bottom of reversing, and the width that staggers of interband staggered by half (W/2) of bandwidth W, alternately reel.Because the binding of the high thermal conductivity layer among Figure 22 forms by main insulating layer, therefore can access high thermal conductivity.

For example, will have the highly heat-conductive material of 4W/mK thermal conductivity above-mentioned in the 1st execution mode as inner lining material.As low thermal conductive layer,, obtain the thermal conductivity of 0.22W/mK if adopt mica.If adopt 2 bands that are fitted with these materials, form main insulating layer by identical on the conductor towards being wrapped in, then section as shown in figure 23, compare with the thermal conductivity of this moment, if adopt 2 bands and make its top and bottom towards opposite and with the width that staggers of interband by bandwidth W half (W/2) coiling alternately with staggering, then as shown in figure 22, Ci Shi thermal conductivity is 1.2 times.

Think that its reason is, high thermal conductivity layer forms thermal conducting path continuously by main insulating layer.

So constituting among the 10I, by adopting 2 any bands that above-mentioned execution mode is above-mentioned, its top and bottom of reversing, and the width that staggers of interband is staggered by half (W/2) of bandwidth W, alternately reel, can access the solenoid and the electromagnetic equipment of thermal conductivity height and high heat conductionization easy to manufacture.

In the method, the important point is how to form thermal conducting path in main insulating layer continuously.

In said method, adopt the band of 2 applying low thermal conductive layers 13 and high thermal conductivity layer 12, its top and bottom of reversing, and the width that staggers of interband is staggered by half (W/2) of bandwidth W and alternately reel, but as shown in figure 23, no matter be make fit opposite to each other mutually 2 between the low thermal conductive layer bring as 1 band and with this tape wrapping on conductor, still reel in the mode that forms main insulating layer section shown in Figure 24, can both realize.

For example, adopt as high thermal conductivity layer 12 and in epoxy resin, to fill boron nitride and to be coated in band on the glass fabric, paste the band that this band constitutes, can form the main insulating layer of regulation by the two sides that is wound on mica layer.

In addition, as high thermal conductivity layer 12, also can be different from mica tape and formation in addition.That is, as shown in figure 25, be with 13, itself and the high thermal conductive belt 16 with the thermal conductivity more than the 1W/mK alternately reeled the formation main insulating layer as what mica tape used above-mentioned execution mode.

So the section of the main insulating layer that forms as shown in figure 25.In such cases, as the thermal conductive belt with the thermal conductivity more than the 1W/mK, adopting at the different propylene that has added the 60vol% boron carbide is the band that adds the 4vol% aluminium oxide in the synthetic rubber.

In addition, compared the sample that uses the heat conduction thin slice and the thermal conductivity of the sample when not using, found that the former roughly is 1.25 times of the latter.

(the 11st execution mode)

Below, with reference to Figure 26 the 11st execution mode is described.

In the formation 10L of present embodiment, for the above-mentioned solenoid of above-mentioned execution mode, the width that staggers of the interband during the coiling mica tape is less than W/2.

Figure 16 is the section of the main insulating layer when staggering the W/2 coiling, and high thermal conductivity layer forms thermal conducting path continuously to the 2nd layer.

In addition, Figure 26 is the stagger sections of the main insulating layer (overlapping 3W/4 reels) of reeling of 1/4th (W/4) by bandwidth W, but high thermal conductivity layer forms thermal conducting path continuously to the 4th layer.If the thickness direction at main insulating layer forms long continuous path owing to form the low position of thermal conductivity such as impregnating resin, so be merely able to the high thermal conductivity of quoad hoc.

The width that staggers of the interband when contrast illustrates the coiling mica tape in the table 3 is that the coil sample (embodiment 3) of W/2 and the width that staggers are the thermal conductivity of the coil sample (embodiment 4) of W/4.Thermal conductivity index in this table is that thermal conductivity with the sample of embodiment 3 is the relative value of the no unit that calculates of fiducial value 1.

Table 3

	Embodiment 3	Embodiment 4
	Embodiment 3	Embodiment 4	Tape error is opened width	W/2	W/4
The thermal conductivity index	1	1.1	Tape error is opened width	W/2	W/4

It can be seen from the table, the thermal conductivity of embodiment 4 (width that staggers of W/4) is compared with the thermal conductivity of embodiment 3 (W/2), reaches 1.1 times.Therefore, the cooling performance of solenoid can be improved more, the electromagnetic equipment miniaturization can be made more.

In addition, as electromagnetic equipment, whirler, generator, transformer are arranged.In No. 4760296 communiques of United States Patent (USP), illustrate motor as whirler.In addition, in the document, also illustrate transformer.In addition, in United States Patent (USP) 6452294B1 communique, illustrate generator as whirler.

(the 12nd execution mode)

Below, with reference to Figure 27 and Figure 28 the 12nd execution mode is described.

In the parts 21 of present embodiment, compound composite material and the 2nd particle 23 that comprises the 1st particle 22 and resin 21.The 1st particle 22 is the materials that have the above thermal conductivity λ of 1W/mK at least.The 2nd particle 23 is the materials with the kind different with the 1st particle 22 or different particle diameter.

Adopt boron nitride as the 1st particle 22.Adopt carbon black as the 2nd particle 23.Adopt epoxy resin 21 as resin 21.

For estimating so thermal conductivity λ of parts 21,, utilize laser flash method to measure thermal conductivity λ to 2 samples by following making.The 1st sample, carbon black 23, only are made of boron nitride 22 and epoxy resin 1.Boron nitride particles 22, its independent thermal conductivity illustrates the value about 60W/mK, and average grain diameter is 16 μ m, when disperse boron nitride 22 with percent by volume 70% in epoxy resin 21 after, for example utilizes hot press that its cure under pressure is thick to 1.5mm.In addition, in the present embodiment,, only adopt 1 time hot pressing, but also can adopt 2 times or 3 inferior multistage hot pressing repeatedly for the cure under pressure sample.

Measured the thermal conductivity λ of the 1st sample of the not carbon black that so obtains, the result is 3.22W/mK as shown in figure 28.

In contrast to this, the 2nd sample is made of carbon black 23, boron nitride 22 and epoxy resin 21.Ratio by volume, with respect to the boron nitride 60vol% of average grain diameter 16 μ m, stir with blender and carbon black (the rising sun サ one マ Le (trade name) that Japanese rising sun power one ボ Application (carbon black) Co., Ltd. makes) 5vol% to be distributed in the epoxy resin 21 as packing material in 2 minutes.

Measured the thermal conductivity λ of the 2nd sample that contains carbon black that so obtains, the result is 6.2W/mK as shown in figure 28.

Think that its reason is, the thermal conductivity that the particle of carbon black 23 replenishes between the boron nitride 22 for the epoxy resin part that enters into the material that is filled with boron nitride 22 exists.

By above above-mentioned learning, compare with the sample that only constitutes by boron nitride, just can make thermal conductivity bring up to roughly 2 times by the carbon black 23 that only adds trace.

In addition, in the present embodiment, epoxy resin 22 is used as the surface conditioning agent that improves associativity, for example adhesive resin (couplant), but also be not limited to this, owing in any resins such as for example silicon coefficient fat, also can use, not rely on resinous principle and versatility high-termal conductivity parts high, that have high thermal conductivity so can provide.

In addition, in the present embodiment, adopted boron nitride particles as the 1st particle 22, but, also can adopt the pottery more than the 1W/mK that from the arbitrary substance of aluminium nitride, aluminium oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydride, diamond, diamond-like-carbon, carbon shape diamond, carborundum, clay of laminar silicate mineral and mica etc., selects as its substitute.

In addition, adopt carbon black particle as the 2nd particle 23, but also be not confined to this, also can adopt the boron nitride particles of the different for example average grain diameter 3 μ m of particle diameter.In addition, as the 2nd particle 23, also can adopt more than a kind or 2 kinds of selection from aluminium nitride, aluminium oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydride, diamond, diamond-like-carbon, carbon shape diamond, carborundum, gold, copper, iron, clay of laminar silicate mineral and mica etc.(the 13rd execution mode)

Below, with reference to Figure 27 the 13rd execution mode is described.

The parts of present embodiment, its 2nd particle 23 have the above thermal conductivity of 0.5W/mK at least.In the parts 21 of above-mentioned execution mode, can increase substantially the principal element of thermal conductivity λ, think because the gap that enough the 2nd particle 23 landfills of energy produce under the state of filling the 1st particle 22.If according to this inference, as the preferred thermal conductivity λ material higher that adopt of the 2nd particle 23 than resin 21.

For example, the thermal conductivity λ of aluminium nitride (AlN) is 100W/mK.Therefore, by in the composite material that constitutes by boron nitride and resin, adding aluminum nitride particle again, can improve the thermal conductivity λ of parts 21 more as the 2nd particle 23.

(the 14th execution mode)

Below, with reference to Figure 27 and Figure 29 the 14th execution mode is described.

The parts of present embodiment adopt boron nitride as the 1st particle 22, adopt epoxy resin as adhesive resin 21.In addition, use carbon blacks (the rising sun サ one マ Le (trade name) that Japanese rising sun power one ボ Application Co., Ltd. makes) as the 2nd particle 23, and the content of carbon black reaches more than the 0.5vol%.

By formation like this, discovery can further improve thermal conductivity λ.Figure 29 represents to study the result of thermal conductivity λ of the parts of present embodiment, and transverse axis is a carbon black volume content (vol%) of removing the volume of boron nitride relatively, and the longitudinal axis is thermal conductivity λ (W/mK).Characteristic curve E among the figure represents the variation of thermal conductivity λ.

As can be seen from Figure 29, the zone more than 1vol% is compared with the sample of carbon black particle not, and the significant thermal conductivity that confirms more than 2 times rises.Herein, the rising of this thermal conductivity λ does not rely on the kind of adhesive, realizes by composite filled boron nitride and carbon black particle.

(the 15th execution mode)

Below, with reference to Figure 30 and Figure 31 the 15th execution mode is described.

In the parts 20A of present embodiment, the content of carbon black particle 24 with respect to the summation of resin 21 and carbon black particle 24 below 33.3vol%.

For parts 20A so, because the conductivity height of carbon black particle 24, as under the situation of electrical insulating material, the raising of conductivity influences the performance of product, so do not expect.

Figure 30 represents the performance diagram of the result of study of above-mentioned relation, and transverse axis is the volume content (vol%) with respect to the carbon particle of the volume summation of resin and carbon particle, and the longitudinal axis in left side is thermal conductivity λ (W/mK), and the longitudinal axis on right side is conductivity (S/m).Characteristic curve F among the figure represents the variation of thermal conductivity λ, and characteristic curve G represents the variation of conductivity.In addition, the unit of conductivity is the west door subvalue (S=Ω-1) of unit length (m).

Find out from this figure,, then form the low and stable zone of resistivity if add more than the 33.3vol%.Think that its reason is, carbon particle forms unlimited group (Network ラス one) in sample, causes the event of so-called diafiltration phenomenon.About this phenomenon, the inventor understands fully by the research of carrying out in the past.

Form unlimited this phenomenon of group, that is, carbon black by coupling together, as shown in figure 31, owing to connect sample inside in the mode of not clamping resin bed, therefore, forms very undesirable state for insulation property in sample.The kind of this phenomenon and adhesive resin is irrelevant, by the dispersity decision of physics.

For this reason, in the present embodiment, adjust content that sample makes carbon black particle with respect to the summation of epoxy resin 21 and carbon black particle below 33.3vol%, form with the composition of epoxy resin 21 irrespectively highly versatile, have high thermal conductivity and have both the high-termal conductivity parts of insulation property.

(the 16th execution mode)

Below, with reference to Figure 31 the 16th execution mode is described.

In the parts of present embodiment, likening to as the aluminum nitride particle of the 2nd particle 24 (particle diameter be below 1 micron～nanometer) is that the boron nitride particles (1 micron～100 microns of particle diameters) of the 1st particle 22 is little.

The purity of aluminium nitride is that 3N, molecular weight are 41.0.In an embodiment, aluminium nitride adopts the ALI04PB (marque) that Japanese high-purity chemical Co., Ltd. makes.In addition, as aluminium nitride, also can adopt the commodity of the キオ of Co., Ltd. Application manufacturing of Japan.

In this case, can infer that aluminum nitride particle 24 imbeds formed epoxy resin 21 accumulations place of boron nitride, find high thermal conductivity λ thus.But,, therefore cause the reduction of thermal conductivity λ if the particle diameter of aluminum nitride particle 24 greater than boron nitride 22, then is cut off the influential thermal conducting path of boron nitride particles 22 formed thermal conductivity λ.

Therefore, in the present embodiment, the particle diameter by making aluminum nitride particle 24 is less than the particle diameter of boron nitride particles 22, and the composition of tube epoxy resin is not how, can both form highly versatile, have the high-termal conductivity parts of high thermal conductivity.

(the 17th execution mode)

Below, flowchart text the 17th execution mode of employing Figure 32.

Drop among the operation S31 at raw material, when in make-up machine (not shown), dropping into boron nitride particles 22 and carbon black particle 23, drop into couplant described later (adhesive resin) simultaneously.

In stirring drying process S32, stir and the dry raw material that in raw material input operation S31, obtain.

In mixed processes S33, stirring under the dry status, in raw material, inject the epoxy resin host of two liquid mixed types, carry out and the mixing of raw material etc.

In mixed processes S34, in the epoxy resin host of the admixture of mixing in mixed processes S33, the secondary agent of blending epoxy is a curing agent again.

Among hot-press solidifying operation S35s, carry out hot-press solidifying thereafter.At last, obtain the operation S36 of goods, taking out the goods that in hot-press solidifying operation S35, obtain.

As specific embodiment, for example, by volume ratio stirs 2 minutes carbon black particles (the rising sun サ one マ Le (trade name) that Japanese rising sun power one ボ Application Co., Ltd. makes) to the boron nitride particles of average grain diameter 16 μ m with blender, divide therein to be dropped in the solution 3g that is dissolved with 1% silane coupling agent A189 (Japanese ユニカ one company make) in the ethanol for 3 times, continue to stir.Then, air dry 24 hours is made and has been implemented the packing material that coupling is handled.This packing material is dispersed in the epoxy resin prepares burden, make boron nitride and carbon black add the 65vol% that together volume ratio reaches total amount, utilize hot pressing to carry out cure under pressure,, produce the thick sheet material of 1.5mm thus.

Measured the thermal conductivity λ of the plate member that so obtains, the result is 6.8W/mK.This result compares with the situation in the past of not using couplant, and thermal conductivity λ improves about 0.5W/mK.Think that its reason is, strengthened adhesion between packing material, promoted the transmission of phonon by resin.So, by when throwing the λ raw material, dropping into the processing couplant simultaneously, can form high-termal conductivity parts with high thermal conductivity.

In addition, as couplant,, be not silane coupling agent, even zirconium system or titanium system also have same effect, this is self-evident.In the present embodiment, consider by the epoxy resin processing that is coupled, but, react to each other, directly improve adhesion, also have good effect by making them with carboxyl or hydroxyl modified packing material surface.

(the 18th execution mode)

Below, with reference to Figure 33 the 18th execution mode is described.

In the present embodiment, adopt the parts of above-mentioned execution mode to form band shape or film like.The parts of present embodiment are the parts of finding high-termal conductivity by the physics dispersity of packing material, are the very high parts of versatility.

The for example particle of mix polyethylene 27, boron nitride particles 22 and carbon black particle 23, with its be configured in 2 push plate 28 between, by utilizing hot press (not shown), form band or film with high thermal conductivity to its heating and pressurizing.

Herein, the material that uses in the film is not limited to polyethylene, also can use any in various thermoplastic resins, heat-curing resin, the elastomeric material etc.

As elastomeric material, if use for example isoprene elastomeric material, it is compared with thermoplastic resin or heat-curing resin, because the spring rate height, so can access the good film article of pliability etc.

In this case, as the 1st particle, can adopt the particle of from boron nitride, aluminium nitride, aluminium oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydride, diamond, diamond-like-carbon, carbon shape diamond, carborundum, clay of laminar silicate mineral and mica etc., selecting more than a kind or 2 kinds.In addition, as the 2nd particle, can adopt the particle of from boron nitride, carbon, aluminium nitride, aluminium oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydride, diamond, diamond-like-carbon, carbon shape diamond, carborundum, gold, copper, iron, clay of laminar silicate mineral and mica etc., selecting more than a kind or 2 kinds.

(the 19th execution mode)

Below, the 19th execution mode is described.With any insulating element in the above-mentioned execution mode, cover the coiling conductor 5 that is used for die casting formula transformer (cast resin transformer).About the structure of die casting formula transformer, for example on the books in No. 4760296 communiques of United States Patent (USP).

In die casting formula transformer, its injection molding resin adopts the material that mixes 40vol% boron nitride, 1vol% carbon black in the epoxy resin heat-curing resin.As a result, can make the thermal conductivity λ of insulating barrier improve about 1.5 times.Thus, can improve the cooling effectiveness of solenoid, can make the current density that flows through coil improve about 2 one-tenth.In addition, can dwindle the size of coil.As a result, can make the casting resin transformer of miniaturization.

If employing the present invention can provide the high thermal conductivity insulating member of a kind of thermal conductivity λ height, fine heat radiation property.In addition, if adopt the present invention, can provide a kind of highly versatile and

The manufacture method of high thermal conductivity insulating member easy to manufacture.In addition, if adopt the present invention, can provide a kind of heat dissipation characteristics good small-sized solenoid.

Claims

1. a high thermal conductivity insulating member is characterized in that, contains: reisn base material; The 1st particle is dispersed in the described reisn base material, has the thermal conductivity that 1W/mK is above and 300W/mK is following; And the 2nd particle, being dispersed in the described reisn base material, its particle diameter has the thermal conductivity that 0.5W/mK is above and 300W/mK is following smaller or equal to 0.15 times of the particle diameter of described the 1st particle.

2. high thermal conductivity insulating member as claimed in claim 1 is characterized in that, the reisn base material that will contain described the 1st particle and the 2nd particle is held as the liner material bed of material, the described liner material bed of material is sticked on form band shape or laminar on the mica layer.

3. insulating element as claimed in claim 1 is characterized in that,

Described the 1st particle is by constituting more than a kind or 2 kinds of selecting from boron nitride, aluminium nitride, aluminium oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydride, diamond, diamond-like-carbon, carbon shape diamond, carborundum, clay of laminar silicate mineral and mica etc.

4. insulating element as claimed in claim 1 is characterized in that,

Described the 2nd particle is made of any in carbon or the aluminium oxide.

5. insulating element as claimed in claim 2 is characterized in that,

The content of described the 2nd particle in the described liner material bed of material is more than or equal to 0.5vol%.

6. insulating element as claimed in claim 1 is characterized in that,

With respect to the summation of the 2nd particle and described resin, the content of described the 2nd particle is below 33.3vol%.

7. insulating element as claimed in claim 2 is characterized in that,

The described liner material bed of material is located at the two sides of described mica layer.

8. insulating element as claimed in claim 2 is characterized in that,

Described mica layer contains: mica paper is made of mica flake; And the 2nd particle, be dispersed in the described mica paper, have the thermal conductivity that 0.5W/mK is above and 300W/mK is following.

9. insulating element as claimed in claim 2,

The width of the described liner material bed of material is bigger than the width of described mica layer.

10. a high thermal conductivity insulating member is the banded or laminar high thermal conductivity insulating member with mica layer and liner material bed of material, and it is characterized in that described mica layer contains: mica paper is made of mica flake; And the 2nd particle, being dispersed in the described mica paper, its particle diameter has the thermal conductivity that 0.5W/mK is above and 300W/mK is following smaller or equal at least 0.15 times of the diameter of described mica flake.

11. insulating element as claimed in claim 10 is characterized in that,

Described the 2nd particle is by constituting more than a kind or 2 kinds of selecting from boron nitride, carbon, aluminium nitride, aluminium oxide, magnesium oxide, silicon nitride, chromium oxide, aluminum hydride, diamond, diamond-like-carbon, carbon shape diamond, carborundum, gold, copper, iron, clay of laminar silicate mineral and mica etc.

12. insulating element as claimed in claim 10 is characterized in that,

Described the 2nd particle is made of any in carbon or the aluminium oxide.

13. insulating element as claimed in claim 10 is characterized in that,

Described mica layer is located at the two sides of the described liner material bed of material.

14. insulating element as claimed in claim 10 is characterized in that,

The described liner material bed of material contains: reisn base material; The 1st particle is dispersed in the described reisn base material, has the thermal conductivity that 1W/mK is above and 300W/mK is following; And the 2nd particle, be dispersed in the described reisn base material, have the thermal conductivity that 0.5W/mK is above and 300W/mK is following.

15. insulating element as claimed in claim 10,

The width of described mica layer is bigger than the width of the described liner material bed of material.

16. the manufacture method of a high thermal conductivity insulating member is made the banded or laminar high thermal conductivity insulating member with mica layer and liner material bed of material, it is characterized in that, may further comprise the steps:

(a) mix the 1st particle with the above and thermal conductivity that 300W/mK is following of 1W/mK, particle diameter 0.15 times and the 2nd particle and resin solution to scale with the thermal conductivity below the above 300W/mK of 0.5W/mK smaller or equal to the particle diameter of described the 1st particle;

(b) with described impregnation mixture the dipping body in;

(c) heat the described mixture that is immersed in the described dipping body and be cured, thereby obtain the liner material bed of material;

(d) the bonding described liner material bed of material of applying on mica paper;

(e) by exerting pressure from top and bottom, be shaped to the fit bonding described liner material bed of material and mica paper banded or laminar with roll-in.

17. method as claimed in claim 16,

Described dipping body is glass fabric or resin film.

18. the manufacture method of a high thermal conductivity insulating member is made the banded or laminar high thermal conductivity insulating member with mica layer and liner material bed of material, it is characterized in that,

(i) mix to stir the 2nd particle, mica flake and the solvent with the above and thermal conductivity that 300W/mK is following of 0.5W/mK to scale, the particle diameter of described the 2nd particle is smaller or equal at least 0.15 times of the diameter of described mica flake;

(ii) the filter with regulation filters described mixing stirring thing, carries out drying, obtains mica paper thus;

The bonding described mica paper of (iii) on the liner material bed of material, fitting;

, be banded or laminar (iv) with fit bonding described mica paper and inner lining material formable layer by exerting pressure from top and bottom with roll-in.

19. a solenoid utilizes insulating element to insulate and covers the coiling conductor, described insulating element contains: reisn base material; The 1st particle is dispersed in the described reisn base material, has the thermal conductivity that 1W/mK is above and 300W/mK is following; The 2nd particle is dispersed in the described reisn base material, and its particle diameter is smaller or equal to 0.15 times of the particle diameter of described the 1st particle, and has the thermal conductivity that 0.5W/mK is above and 300W/mK is following; The liner material bed of material contains described the 1st particle and the 2nd particle; And banded or laminar mica layer, be pasted with the described liner material bed of material.

20. a solenoid utilizes insulating element to insulate and covers the coiling conductor, described insulating element is the banded or laminar high thermal conductivity insulating member with mica layer and liner material bed of material, and described mica layer contains: mica paper is made of mica flake; And the 2nd particle, being dispersed in the described mica paper, its particle diameter is smaller or equal at least 0.15 times of the diameter of described mica flake, and has the thermal conductivity that 0.5W/mK is above and 300W/mK is following.

21. a solenoid is characterized in that, utilizes 2 insulating elements, make its top and bottom towards opposite and with between insulating element stagger width in accordance with regulations width alternately be wound on the conductor that winds the line with staggering, described insulating element contains: reisn base material; The 1st particle is dispersed in the described reisn base material, has the thermal conductivity that 1W/mK is above and 300W/mK is following; The 2nd particle is dispersed in the described reisn base material, and its particle diameter is smaller or equal to 0.15 times of the particle diameter of described the 1st particle, and has the thermal conductivity that 0.5W/mK is above and 300W/mK is following; The liner material bed of material contains described the 1st particle and the 2nd particle; And banded or laminar mica layer, be pasted with the described liner material bed of material.

22. solenoid as claimed in claim 21 is characterized in that, the high thermal conductance insulating element of the band shape contain above-mentioned mica layer of reeling, the width that staggers of the interband when being mica tape, 1/2 little than bandwidth W.

23. solenoid, it is characterized in that, utilize 2 insulating elements, make its top and bottom towards opposite and with interband stagger width in accordance with regulations width alternately be wound on the conductor that winds the line with staggering, described insulating element is the banded or laminar high thermal conductivity insulating member with mica layer and liner material bed of material, described mica layer contains: mica paper is made of mica flake; And the 2nd particle, being dispersed in the described mica paper, its particle diameter is smaller or equal at least 0.15 times of the diameter of described mica flake, and has the thermal conductivity that 0.5W/mK is above and 300W/mK is following.

24. solenoid as claimed in claim 23 is characterized in that, the width that staggers of the high thermal conductance insulating element of the band shape contain above-mentioned mica layer of reeling, the interband when being mica tape 1/2 little than bandwidth W.

25. a solenoid is characterized in that, utilizes 2 insulating elements, makes its top and bottom fit and be wound on the coiling conductor, described insulating element contains: reisn base material; The 1st particle is dispersed in the described reisn base material, has the thermal conductivity that 1W/mK is above and 300W/mK is following; The 2nd particle is dispersed in the described reisn base material, and its particle diameter is smaller or equal to 0.15 times of the particle diameter of described the 1st particle, and has the thermal conductivity that 0.5W/mK is above and 300W/mK is following; The liner material bed of material contains described the 1st particle and the 2nd particle; And banded or laminar mica layer, be pasted with the described liner material bed of material.

26. solenoid, it is characterized in that, utilize 2 insulating elements, make its top and bottom fit and be wound on the coiling conductor, described insulating element is the banded or laminar high thermal conductivity insulating member with mica layer and liner material bed of material, described mica layer contains: mica paper is made of mica flake; And the 2nd particle, being dispersed in the described mica paper, its particle diameter is smaller or equal at least 0.15 times of the diameter of described mica flake, and has the thermal conductivity that 0.5W/mK is above and 300W/mK is following.